Product Data Sheet SWA0Y1XA - WICOP-B Amber Applicable for automotive exterior light WICOP-B Amber SWA0Y1XA RoHS AEC-Q101 Product Brief Description Features and Benefits • • The Compact LED series is designed for high current operation and high flux output applications. • It incorporates state of the art SMD design and low thermal resistant material. • The Compact LED is ideal light sources for automotive applications and mobile flash, general lighting. • • • • Key Applications • Rev1.5, Aug 25, 2015 Super high Flux output and high Luminance Designed for high current operation SMT solderable Lead Free product Compact module design available. 1 Automotive Exterior Lighting www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Table of Contents Index • Product Brief 1 • Table of Contents 2 • Performance Characteristics 3 • Characteristics Graph 5 • Color Bin Structure 11 • Reliability Test 13 • Mechanical Dimensions 14 • Recommended Solder Pad 15 • Reflow Soldering Characteristics 16 • Emitter Tape & Reel Packaging 17 • Product Nomenclature 19 • Handling of Silicone Resin for LEDs 20 • Precaution For Use 21 • Company Information 24 Rev1.5, Aug 25, 2015 2 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Performance Characteristics Table 1. Characteristics, IF = 350mA, Tj = 25ºC Value Parameter Symbol Unit Min. Typ. Max. Forward Voltage [1],[2],[4] VF 2.75 3.13 3.5 V Luminous Flux [1],[3],[4] ΦV 60 75 90 lm Luminous Flux [1],[3],[4] @1A (Reference only) ΦV 135 165 - lm CIEx 0.57 CIEy 0.42 Viewing Angle 2θ1/2 120 Real Thermal resistance Rth JS 5.0 7.0 K/W Electrical Thermal resistance Rth JS 4.0 6.0 K/W Temperature coefficient of VF -40℃ ≤ T ≤ 135 ℃ TCv -2.5 mV/K TCx -0.05 10-3/K TCy -0.05 10-3/K Chromaticity Coordinates [1],[4],[5] Temperature coefficient of color coordinates -40℃ ≤ T ≤ 135 ℃ deg. Notes : [1] Tolerance : VF :±0.05V, ΦV :±8%, CIEx, CIEy:±0.005 [2] LEDs are to be classified in forward voltage groups if requested by Customer. Minimum and maximum values include all tolerances. [3] LEDs are to be classified in luminous flux groups. The ratio of the group limits (ΦV,max/ΦV,min) must not [4] Parameter has to be checked by 100% in the production process. [5] LEDs are to be classified in colour bins if requested by Customer. Colour bins and tolerances are program specific and will be agreed by sample evaluation between SSC and the customer. The colour coordinates of the application have to fulfil ECE /SAE legislation, whereby the binning range must not exceed 0.02 typically. Minimum and maximum values include all tolerances. Rev1.5, Aug 25, 2015 3 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Performance Characteristics Table 2. Absolute Maximum Ratings Parameter Symbol Value Unit Forward Current (Ta=25℃) IF 50 ~ 1000 mA Operating Temperature Topr -40 ~ +125 ℃ Storage Temperature Tstg -40 ~ +125 ℃ Junction Temperature Tj 135 ℃ Soldering Temperature Tsld Reflow Soldering : 260 ℃ for 10sec. Hand Soldering : 315 ℃ for 4sec. ESD (HBM) (R=1.5kΩ, C= 100pF) Max 8 kV Notes : [1] LEDs are to be classified in forward voltage groups if requested by Customer. Minimum and maximum values include all tolerances. [2] LEDs are to be classified in luminous flux groups. The ratio of the group limits (ΦV,max/ΦV,min) must not exceed 1,6 including measurement tolerances. Minimum and maximum values include all tolerances. [3] LEDs are to be classified in color bins if requested by Customer. Color bins and tolerances are program specific and will be agreed by sample evaluation between SSC and the customer. The color coordinates of the application have to fulfill ECE /SAE legislation, whereby the binning range must not exceed 0.02 typically. Minimum and maximum values include all tolerances. [4] Subject to Human Body Model / JESD22-A114. [5] Parameter has to be checked by 100% in the production process. Rev1.5, Aug 25, 2015 4 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Characteristics Graph Fig 1. Relative Intensity vs. Wavelength, IF =350mA, Tj = 25ºC Relative luminous intensity [%] 1.2 1.0 0.8 0.6 0.4 0.2 0.0 380 480 580 680 780 Wavelength [nm] Rev1.5, Aug 25, 2015 5 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Characteristics Graph Fig 2. Relative Intensity vs. Angle, Tj = 25ºC Relative luminous intensity [a.u.] 1.2 1 0.8 0.6 0.4 0.2 0 -100 -75 -50 -25 0 25 50 75 100 Beam angle [degree] Fig 3. Distribution of color coordinates vs. Radiation Angle, Tj = 25ºC Relative color coordinates [a.u.] 0.01 1E-17 -0.01 -0.02 Cx Cy -0.03 -100 -75 -50 -25 0 25 50 75 100 Beam angle [degree] Rev1.5, Aug 25, 2015 6 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Characteristics Graph Fig 4. Forward Current vs. Forward Voltage, Tj = 25ºC 1.2 Forward Current [A] 1.0 0.8 0.6 0.4 0.2 0.0 0 1 2 3 4 5 Forward Voltage [V] Fig 5. Forward Current vs. Relative Luminous Flux, Tj = 25ºC Relative luminous intensity [%] 250% 200% 150% 100% 50% 0% 0.00 0.20 0.40 0.60 0.80 1.00 1.20 IF [A] Rev1.5, Aug 25, 2015 7 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Characteristics Graph Fig 6. Forward Current vs. CIE X, Y Shift , Tj = 25ºC Color coordinates shift [a.u.] 0.010 0.008 Cx 0.006 Cy 0.004 0.002 0.000 -0.002 -0.004 -0.006 -0.008 -0.010 0.0 0.2 0.4 0.6 0.8 1.0 1.2 IF [A] Rev1.5, Aug 25, 2015 8 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Characteristics Graph Fig 7. Junction Temperature vs. Relative Light Output, IF=350mA Relative luminous intensity [%] 140% 120% 100% 80% 60% 40% 20% 0% -40 -20 0 20 40 60 80 100 120 140 120 140 Temperature [℃] Fig 8. Junction Temperature vs. CIE X, Y Shift, Tj = 25ºC 0.1 Color coordinates shift [a.u.] 0.08 0.06 0.04 0.02 0 -0.02 -0.04 Cx -0.06 Cy -0.08 -0.1 -40 -20 0 20 40 60 80 100 Temperature [℃] Rev1.5, Aug 25, 2015 9 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Characteristics Graph Fig 9. Ambient temperature vs. Forward Voltage. 0.8 0.35A 0.6 0.7A Forward voltage [V] 0.4 1A 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 -60 -40 -20 0 20 40 60 80 100 120 140 160 Temperature [℃] Fig 10. Maximum Forward Current vs. Ambient Temperature, Tj(max.) = 135℃ 1.2 Forward Current [A] 1.0 0.8 0.6 Rth(j-a)=25℃/W Rth(j-a)=35℃/W 0.4 Rth(j-a)=45℃/W 0.2 0.0 0.0 25.0 50.0 75.0 100.0 125.0 150.0 Ambient Temperature [℃] Rev1.5, Aug 25, 2015 10 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Color Bin Structure Table 3. Bin Code description, IF =350mA, Tj = 25ºC Luminous Flux (lm) Part Number WICOP-B amber Rev1.5, Aug 25, 2015 Bin Code Min. Max. S2 60 70 T1 70 80 T2 80 90 Color Chromaticity Coordinate Refer to page.12 11 Forward Voltage (VF) Bin Code Min. Max. G 2.75 3.00 H 3.00 3.25 I 3.25 3.50 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Color Bin Structure CIE Chromaticity Diagram, Tj=25℃, IF=350mA A B A Rev1.5, Aug 25, 2015 B CIE x CIE y CIE x CIE y 0.5680 0.4315 0.5763 0.4054 0.5634 0.4269 0.5833 0.4075 0.5833 0.4075 0.5634 0.4269 0.5901 0.4094 0.5557 0.4192 12 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Reliability Test Test Item Standard Test Method Test Condition Duration / Cycle Number Of Test External Visual JESD22 B-101 Visual inspection - 77 D.P.A AEC-Q101-004 Random Sample H3TRB,HAST,TC - 5 Vibration JESD22 B-103 0.06 inch displacement, 20 to 100 Hz, 50 g 100 Hz to 2kHz, 4 times 30 ESD JESD22 A-114 Human-body mode, R=1.5㏀, C = 100pF 3 times Negative/ Positive 30 Physical Dimension JESD22 B-100 Verify physical dimensions against device mechanical drawing 3 times 30 Mechanical Shock JESD22 B-104 1500 g's for 0.5 ms, 5 blows, 3 orientations 3 times 30 Parametric Verification JESD22 A-108 25℃, 1000 hours @350mA 1000hrs 77 Temperature cycling JESD22 A-104 Tc= -40°∼100°C, 30 min. dwell, 5 min transfer, 1000 cycles 1000hrs 77 Power Temperature Cycle JESD22 A-105 Ta=-40℃~85℃, If =1A, 20 min dwell / 20 min transition (1 hour cycle), 2 min ON / 2 min OFF 1000hrs 77 High Humidity High Temp. Operating Life JESD22 A-101 85℃/85% RH, @ 350mA 1000hrs 77 High Temperature Operating Life JESD22 A-108C Ta= 85°C, If =1A 1000hrs 77 Low Temperature Operating Life JESD22 A-108C Ta= -40°C, If = 1A 1000hrs 77 Low Temperature Storage Life JESD22 A-119 Ta=-40°C, non-operating 1000hrs 77 High Temperature Storage Life JESD22 A-103B Ta=125°C, non-operating 1000hrs 77 Thermal Shock JESD22 A-104 -40°C ~ 100°C, 20 min. dwell, <10 second transfer, 1000 cycles 1000hrs 77 Criteria for Judging the Damage Criteria for Judgment Item Symbol Condition MIN MAX Forward Voltage VF IF =350mA - Initial × 1.2 Luminous Intensity IV IF =350mA Initial × 0.8 - Rev1.5, Aug 25, 2015 13 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Mechanical Dimensions Top view Bottom view (+) Side view (-) Circuit Anode(+) Cathode(-) Notes : 1. 2. 3. All dimensions are in millimeters. Scale : none Undefined tolerance is ±0.1mm Rev1.5, Aug 25, 2015 14 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Recommended Solder Pad (-) (+) (-) (+ ) (-) (+) Cathode Anode <Recommended solder pad> <Recommended stencil pattern> Notes : 1. 2. 3. 4. All dimensions are in millimeters. Scale : none This drawing without tolerances are for reference only Undefined tolerance is ±0.1mm Rev1.5, Aug 25, 2015 15 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Reflow Soldering Characteristics IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Caution 1. 2. 3. 4. 5. Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. Die slug is to be soldered. When soldering, do not put stress on the LEDs during heating. After soldering, do not warp the circuit board. Rev1.5, Aug 25, 2015 16 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Emitter Tape & Reel Packaging 180 11.4 +0 -3 9 ±0.2 60 +0.2 -0 2 ±0.3 22 13 ±0.2 Label ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : max 2000pcs/Reel (Can be blank , less than 20) (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev1.5, Aug 25, 2015 17 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Emitter Tape & Reel Packaging Please refer to the next page for the 'Labeling Information' and 'Product Nomenclature'. Rev1.5, Aug 25, 2015 18 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Product Nomenclature Table 4. Part Numbering System : X1X2X3X4X5X6X7X8 Part Number Code Description Part Number Value X1 Company S SSC X2 Package Type W WICOP X3X4 Color A0 AMBER X5 Chip Type Y - X6X7 Chip Number 1X 1CHIP X8 Product Revision A - Table 5. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17 Lot Number Code Description Y1Y2 Year Y3 Month Y4Y5 Day Y6 Top View LED series Y7Y8Y9Y10 Mass order Y11Y12Y13Y14Y15Y16Y17 Internal Number Rev1.5, Aug 25, 2015 Lot Number 19 Value www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Handling of Silicone Resin for LEDs 1. During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. 2. In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. 3. When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. 4. Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5. Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 6. Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. 7. Avoid leaving fingerprints on silicone resin parts. Rev1.5, Aug 25, 2015 20 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Precaution for Use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant. The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 1 year (MSL_2) or the color of the desiccant changes, components should be dried for 10-12hr at 60±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. Rev1.5, Aug 25, 2015 21 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Precaution for Use (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) The slug is electrically isolated. (15) Attaching LEDs, do not use adhesives that outgas organic vapor. (16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (17) Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Rev1.5, Aug 25, 2015 22 www.seoulsemicon.com Product Data Sheet SWA0Y1XA - WICOP-B Amber Precaution for Use Environmental controls: - Humidity control (ESD gets worse in a dry environment) b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subje cted to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circ uit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to e lectrical overstress as the failure modes have been investigated to vary, but there are some common s igns that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires - This damage usually appears due to the thermal stress produced during the EOS event c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device Rev1.5, Aug 25, 2015 23 www.seoulsemicon.com Product Data Sheet SWA0O11A - WICOP-A AMBER Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. Rev1.1, Aug 10 ,2015 24 www.seoulsemicon.com