Product Data Sheet SAW0LA0A - Acrich MJT 5050 Superior high Flux for High Voltage System Acrich MJT– 5050 Series SAW0LA0A (Cool, Neutral) RoHS Product Brief Description Features and Benefits • • The MJT series of LEDs are designed for AC & DC(High Voltage) operation and high flux output applications. • MJT’s thermal management performance exceeds other power LED solutions by incorporating state-of-theart SMD design and use of specialized thermal emission material. • MJT is an ideal light source for general purpose illumination applications. • • • • Super high Flux output and high Luminance 31V typical forward voltage @40mA Dimension : 5.0x5.0x0.65mm High Color Quality with CRI Min. 70 SMT solderable Key Applications • • • • • • • • Architectural Retail Display Commercial Industrial - High/Low bay Outdoor area - Street & tunnel light parking light Off-grid Safety & Security Table 1. Product Selection Table CCT Part Number Color Min. Typ. Max. Cool White 4700K 5600K 7000K Neutral White 3700K 4200K 4700K SAW0LA0A Rev1.1, Sep 9, 2015 1 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Table of Contents Index • Product Brief 1 • Table of Contents 2 • Performance Characteristics 3 • Characteristics Graph 4 • Color Bin Structure 10 • Mechanical Dimensions 14 • Recommended Solder Pad 15 • Reflow Soldering Characteristics 16 • Emitter Tape & Reel Packaging 17 • Product Nomenclature 19 • Handling of Silicone Resin for LEDs 20 • Precaution For Use 21 • Company Information 24 Rev1.1, Sep 9, 2015 2 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Product Performance & Characterization Guide Table 2. Characteristics, IF=40mA , Tj=25ºC, RH30% Value Parameter Symbol Unit Min. Typ. Max. 40 80 mA Forward Current IF Forward Voltage VF 28.5 31 33.5 V Luminous Flux [1] ФV [2] 154 180 - lm Correlated Color Temperature [3] CCT 3,700 - 7,000 K Ra 70 - 80 - Viewing Angle 2Θ1/2 - 120 - deg. Power Dissipation PD - 1.24 2.01 W Junction Temperature Tj - - 125 ºC Operating Temperature Topr - 40 - + 85 ºC Storage Temperature Tstg - 40 - + 100 ºC Thermal resistance (J to S) [5] RθJ-S - 6.0 - ℃/W ESD Sensitivity(HBM) - Color Rendering Index [4] Class 3A JESD22-A114-E Notes : [1] Acrich series maintains a tolerance of 7% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integration sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. *Color coordinate: 0.005, CCT: 5% [4] Tolerance is 2.0 on CRI measurements. [5] Thermal resistance: RthJS (Junction to Solder) • • • LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. Thermal resistance can be increased substantially depending on the heat sink design/operating condition, and the maximum possible driving current will decrease accordingly. All measurements were made under the standardized environment of Seoul Semiconductor. Rev1.1, Sep 9, 2015 3 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Characteristics Graph Fig 1. Color Spectrum, Tj = 25ºC, IF=40mA 1.0 Relative Spectral Power Distribution Cool White Netural White 0.8 0.6 0.4 0.2 0.0 350 400 450 500 550 600 650 700 750 800 Wavelength(nm) Fig 2. Radiant Pattern, Tj = 25ºC, IF=40mA 1.0 Relative Luminous Flux 0.8 0.6 0.4 0.2 0.0 -90 -60 -30 0 30 60 90 Angle [deg.] Rev1.1, Sep 9, 2015 4 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Characteristics Graph Fig 3. Forward Voltage vs. Forward Current, Tj = 25ºC 0.08 0.07 Forward Current [A] 0.06 0.05 0.04 0.03 0.02 0.01 0.00 0 5 10 15 20 25 30 35 Forward Voltage [V] Fig 4. Forward Current vs. Relative Luminous Intensity, Tj = 25ºC 1.8 Relative Luminous Flux 1.5 1.2 0.9 0.6 0.3 0.0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 Forward Current (A) Rev1.1, Sep 9, 2015 5 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Characteristics Graph Fig 5. Forward Current vs. CIE x, y Shift, Ta=25℃ 0.358 0.356 0.354 CIE y 10mA 20mA 0.352 40mA 0.350 60mA 80mA 0.348 0.346 0.344 0.338 0.339 0.340 0.341 0.342 0.343 CIE x Rev1.1, Sep 9, 2015 6 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Characteristics Graph Fig 6. Junction Temperature vs. Relative Light Output, IF=40mA Relative Luminous Intensity 1.0 0.8 0.6 0.4 0.2 0.0 25 50 75 100 125 o Junction Temperature [ C] Fig 7. Junction Temperature vs. Relative Forward Voltage, IF=40mA 0 Forward Voltage Shift [V] -2 -4 -6 -8 -10 -12 -14 25 50 75 100 125 o Junction Temperature [ C] Rev1.1, Sep 9, 2015 7 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Characteristics Graph Fig 8. Junction Temperature vs. CIE x, y shift, IF=40mA 0.35 0.34 25℃ CIE y 55℃ 85℃ 0.33 105℃ 125℃ 0.32 0.31 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 CIE x Rev1.1, Sep 9, 2015 8 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Characteristics Graph Fig 9. Ambient Temperature vs. Maximum Forward Current, Tj_max = 125℃ 0.08 0.07 Max. Current [A] 0.06 0.05 o RjaT=40 C/W 0.04 o RjaT=30 C/W o 0.03 RjaT=20 C/W 0.02 0.01 0.00 0 25 50 75 100 125 o Ambient Temperature [ C] Rev1.1, Sep 9, 2015 9 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Color Bin Structure Table 3. Bin Code description, Tj=25℃, IF=40mA Luminous Flux (lm) Part Number SAW0LA0A Bin Code Min. Max. W1 154 177 W2 177 200 X1 200 230 Forward Voltage (Vf) Color Chromaticity Coordinate Bin Code Min. Max. A 28.5 30.0 B 30.0 31.5 C 31.5 33.5 Refer to page.11 Table 4. Luminous Flux rank distribution CCT CIE Flux Rank 7000 ~ 6000K A W1 W2 X1 6000 ~ 5300K B W1 W2 X1 5300 ~ 4700K C W1 W2 X1 4700 ~ 4200K D W1 W2 X1 4200 ~ 3700K E W1 W2 X1 Available ranks Not yet available ranks Rev1.1, Sep 9, 2015 10 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Color Bin Structure CIE Chromaticity Diagram Tj=25℃, IF=40mA 0.44 0.42 3700K 4000K 4200K 0.40 4500K 4700K 5000K 5300K CIE y 0.38 C 6000K 6500K 0.34 D 5600K 0.36 E B 7000K A 0.32 0.30 0.28 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 CIE x *Notes : • Measurement Uncertainty of the Color Coordinates : ± 0.005 Rev1.1, Sep 9, 2015 11 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Color Bin Structure CIE Chromaticity Diagram (Cool white), Tj=25℃, IF=40mA 4700K 0.38 5000K C1 5300K 0.36 C0 5600K B1 C2 B0 B3 C4 B2 B5 CIE y 6000K 6500K 0.34 7000K A0 A2 0.32 A1 A3 C3 C5 B4 A5 A4 0.30 0.30 0.32 0.34 0.36 CIE x A0 CIE x 0.3028 0.3041 0.3126 0.3115 A1 CIE y 0.3304 0.3240 0.3324 0.3393 CIE x 0.3115 0.3126 0.3210 0.3205 CIE y 0.3324 0.3256 0.3334 0.3408 CIE x 0.3055 0.3068 0.3146 0.3136 CIE y 0.3462 0.3389 0.3461 0.3539 CIE x 0.3292 0.3293 0.3373 0.3376 CIE y 0.3461 0.3384 0.3451 0.3534 CIE x 0.3217 0.3222 0.3294 0.3293 CIE y 0.3616 0.3534 0.3601 0.3687 CIE x 0.3463 0.3456 0.3539 0.3552 CIE y 0.3601 0.3514 0.3578 0.3669 CIE x 0.3369 0.3366 0.3440 0.3448 A3 CIE x 0.3126 0.3136 0.3216 0.3210 Rev1.1, Sep 9, 2015 CIE y 0.3539 0.3461 0.3534 0.3616 CIE x 0.3212 0.3217 0.3293 0.3293 CIE y 0.3316 0.3243 0.3306 0.3384 CIE x 0.3293 0.3294 0.3366 0.3369 CIE y 0.3687 0.3601 0.3669 0.3760 CIE x 0.3373 0.3369 0.3448 0.3456 CIE y 0.3451 0.3369 0.3428 0.3514 CIE x 0.3448 0.3440 0.3514 0.3526 CIE y 0.3256 0.3187 0.3261 0.3334 B2 CIE y 0.3389 0.3316 0.3384 0.3461 B5 CIE y 0.3384 0.3306 0.3369 0.3451 C2 C4 12 CIE y 0.3240 0.3177 0.3256 0.3324 A5 C1 C3 CIE x 0.3456 0.3448 0.3526 0.3539 CIE x 0.3136 0.3146 0.3221 0.3216 B4 C0 CIE x 0.3376 0.3373 0.3456 0.3463 CIE y 0.3177 0.3113 0.3187 0.3256 B1 B3 CIE x 0.3293 0.3293 0.3369 0.3373 CIE x 0.3041 0.3055 0.3136 0.3126 A4 B0 CIE x 0.3207 0.3212 0.3293 0.3292 A2 CIE y 0.3393 0.3324 0.3408 0.3481 CIE y 0.3534 0.3451 0.3514 0.3601 C5 CIE y 0.3514 0.3428 0.3487 0.3578 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Color Bin Structure CIE Chromaticity Diagram (Neutral white), Tj=25℃, IF=40mA 0.42 3700K 4000K 0.40 4200K CIE y 4500K 4700K 0.38 D1 D0 D2 0.36 E1 E0 D3 E2 E3 E5 E4 D5 D4 0.34 0.32 0.34 0.36 0.38 0.40 0.42 CIE x D0 CIE x 0.3548 0.3536 0.3625 0.3641 D1 CIE y 0.3736 0.3646 0.3711 0.3804 CIE x 0.3641 0.3625 0.3714 0.3736 CIE y 0.3711 0.3616 0.3677 0.3775 CIE x 0.3524 0.3512 0.3590 0.3608 CIE y 0.3874 0.3775 0.3855 0.3958 CIE x 0.3869 0.3842 0.3970 0.4006 CIE y 0.3855 0.3751 0.3825 0.3935 CIE x 0.3692 0.3670 0.3783 0.3813 D3 CIE x 0.3625 0.3608 0.3692 0.3714 Rev1.1, Sep 9, 2015 CIE y 0.3555 0.3465 0.3521 0.3616 CIE x 0.3608 0.3590 0.3670 0.3692 CIE y 0.3958 0.3855 0.3935 0.4044 CIE x 0.3714 0.3692 0.3813 0.3842 CIE y 0.3677 0.3578 0.3646 0.3751 CIE x 0.3813 0.3783 0.3898 0.3934 CIE y 0.3616 0.3521 0.3578 0.3677 E2 E4 13 CIE y 0.3646 0.3555 0.3616 0.3711 D5 E1 E3 CIE x 0.3842 0.3813 0.3934 0.3970 CIE x 0.3536 0.3524 0.3608 0.3625 D4 E0 CIE x 0.3736 0.3714 0.3842 0.3869 D2 CIE y 0.3804 0.3711 0.3775 0.3874 CIE y 0.3775 0.3677 0.3751 0.3855 E5 CIE y 0.3751 0.3646 0.3716 0.3825 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Mechanical Dimensions < Top View > < Bottom View > Cathode < Side view> Cathode Anode < Inner Circuit Diagram> Anode Cathode ESD Protection Device Notes : (1) (2) (3) (4) All dimensions are in millimeters. Scale : none Undefined tolerance is ±0.1mm The appearance and specifications of the product may be changed for improvement without notice. Rev1.1, Sep 9, 2015 14 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Recommended Solder Pad Notes : (1) (2) (3) (4) All dimensions are in millimeters. Scale : none Undefined tolerance is ±0.1mm The appearance and specifications of the product may be changed for improvement without notice. Rev1.1, Sep 9, 2015 15 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Reflow Soldering Characteristics IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Caution (1) Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. (2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. (3) Die slug is to be soldered. (4) When soldering, do not put stress on the LEDs during heating. (5) After soldering, do not warp the circuit board. Rev1.1, Sep 9, 2015 16 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Emitter Tape & Reel Packaging Notes : (1) Quantity : 7 inch reel type ( 1,800 pcs / Reel ) (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. Rev1.1, Sep Rev1.0, September 9, 20159, 2015 17 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Emitter Tape & Reel Packaging Rev1.1, Sep 9, 2015 18 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Product Nomenclature Table 5. Part Numbering System : X1X2X3X4X5X6X7X8 Part Number Code Description Part Number Value X1 Company S SSC X2 Acrich LED series A X3X4 Color Specification W0 CRI70 X5 Package series L L series X6 Chip A X7 PCB type 0 Emitter X8 Revision A rev0 Table 6. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17 Lot Number Code Description Y1Y2 Year Y3 Month Y4Y5 Day Y6 Top View LED series Y7Y8Y9Y10 Mass order Y11Y12Y13Y14Y15Y16Y17 Internal Number Rev1.1, Sep 9, 2015 Lot Number 19 Value www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space. Rev1.1, Sep 9, 2015 20 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Precaution for Use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing / Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant changes, components should be dried for 10-12hr at 60±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from Seoul Semiconductor. A sealed container with a nitrogen atmosphere should be used for storage. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. Rev1.1, Sep Rev1.0, September 9, 20159, 2015 21 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Precaution for Use (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) The slug is electrically isolated. (15) Attaching LEDs, do not use adhesives that outgas organic vapor. (16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (17) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) Rev1.1, Sep Rev1.0, September 9, 20159, 2015 22 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device Rev1.1, Sep Rev1.0, September 9, 20159, 2015 23 www.seoulsemicon.com Product Data Sheet SAW0LA0A - Acrich MJT 5050 Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. Rev1.1, Sep Rev1.0, September 9, 20159, 2015 24 www.seoulsemicon.com