Z-Power LED X10490 Technical Data Sheet Specification SWT821-S SSC Drawn Approval CUSTOMER Approval Rev.05 March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Description 2. Absolute Maximum Ratings 3. Electro-Optical Characteristics 4. Optical characteristics 5. Reliability Test 6. Color & Binning 7. Bin Code Description 8. Outline Dimension 9. Reel Structure 10. Packing 11. Soldering 12. Precaution for use 13. Handling of Silicone Resin LEDs Rev.05 March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet SWT821-S 1. Description SWT821-S Features • This surface-mount LED comes in standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by silicone. White colored SMT package. • Pb-free Reflow Soldering Application • Suitable for all SMT assembly methods ; Suitable for all soldering methods • RoHS Compliant The package design coupled with careful selection of component materials allow these products to perform with high reliability. Applications • Interior lighting • General lighting • Indoor and out door displays • Architectural / Decorative lighting Rev.05 March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter [1] Symbol Value Unit Power Dissipation Pd 324 mW Forward Current IF 90 mA Operating Temperature Topr -40~+85 ℃ Storage Temperature Tstg -40~+100 ℃ Junction Temperature Tj 125 ℃ [1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. * LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. 3. Electro-Optical characteristics Parameter Forward Voltage Reverse Voltage Luminous Intensity* [1] Color Correlated Temperature Viewing Angle [2] Color Rendering Index* ESD (HBM) Symbol Condition Min. Typ. Max. Unit VF IF=20mA 2.8 3.2 3.8 V IR VF=5V - - 10 μA Iv IF=60mA 4.0 5.5 - cd CCT IF=60mA 4,800 - 10,000 K 2Θ1/2 IF=60mA - 120 - deg. Ra IF=60mA 62 68 - - 1.5kΩ;100pF 1 - - KV [1] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. [2] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [3] Thermal resistance: RthJS (Junction / solder) * Tolerance : VF :±0.1V, IV :±10%, Ra :±3, x,y :±0.01 [Note] All measurements were made under the standardized environment of SSC. Rev.05 March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Forward Current vs. Relative Luminous Intensity Forward Voltage vs. Forward Current Ta=25℃ Ta=25℃ 0.6 60 Relative Luminous Intensity 40 30 20 10 0 2.6 2.8 3.0 3.2 3.4 3.6 3.8 0.4 0.2 0.0 0 10 20 30 Forward Current IF [mA] Forward Voltage VF [V] Directivity Ambient Temperature vs. Maximum Forward Current 35 Ta=25℃ 30 Forward Current IF[mA] Forward Current IF [mA] 50 0 25 -30 30 20 -60 15 60 10 -90 5 0 -25 0 25 50 75 O Ambient temperature Ta( C) 90 100 Rev.05 March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00) Spectrum Ta=25℃, IF=60mA 1.0 Relative Emission Intensity Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 0.5 0.0 300 400 500 600 700 800 Wavelength [nm] Rev.05 March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Reliability Test Item Reference Test Conditions Duration / Cycle Number of Damaged Thermal Shock EIAJ ED-4701 Ta =-40oC(30min) ~ 100oC(30min) 100 Cycle 0/22 High Temperature Storage EIAJ ED-4701 Ta =100oC 1000 Hours 0/22 High Temp. High Humidity Storage EIAJ ED-4701 Ta =60oC, RH=90% 1000 Hours 0/22 Low Temperature Storage EIAJ ED-4701 Ta =-40oC 1000 Hours 0/22 Operating Endurance Test Internal Reference Ta =25oC, IF =60mA 1000 Hours 0/22 High Temperature High Humidity Life Test Internal Reference Ta =60oC, RH=90%, IF =60mA 500 Hours 0/22 High Temperature Life Test Internal Reference Ta =85oC, IF =60mA 500 Hours 0/22 Low Temperature Life Test Internal Reference Ta =-40oC, IF =60mA 1000 Hours 0/22 ESD(HBM) MIL-STD883D 1KV at 1.5kΩ; 100pF 3 Time 0/22 Reflow Tsol 260℃< 10sec. Reflow Soldering 3 Time 0/22 □ CRITERIA FOR JUDGING THE DAMAGE Item Symbol Condition Forward Voltage VF Luminous Intensity IV Criteria for Judgment MIN MAX IF =60mA - USL [1] × 1.2 IF =60mA LSL [2] × 0.7 - Note : [1] USL : Upper Standard Level [2] LSL : Lower Standard Level Rev.05 March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning 0.38 4800K 5600K 0.36 f2 6200K e2 0.34 CIE Y 7000K 0.32 8200K 10000K 0.30 c2 b2 d2 f1 e1 d1 c1 b1 0.28 0.26 0.24 0.27 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 CIE X ● COLOR RANK <IF=60mA, Ta=25℃> b2 X Y X Y 0.292 0.27 0.286 0.282 0.3 0.281 0.295 0.295 0.295 0.295 0.289 0.312 0.286 0.282 0.279 0.297 d1 d2 X Y X Y 0.31 0.2935 0.3065 0.3104 0.32 0.306 0.318 0.325 0.318 0.325 0.316 0.343 0.3065 0.3104 0.303 0.329 f1 f2 X Y X Y 0.33 0.318 0.33 0.338 0.344 0.335 0.345 0.353 0.345 0.353 0.346 0.374 0.33 0.338 0.33 0.358 b1 c1 X 0.3 0.31 0.3065 0.295 X 0.32 0.33 0.33 0.318 Y 0.281 0.2935 0.3104 0.295 e1 Y 0.306 0.318 0.338 0.325 c2 X 0.295 0.3065 0.303 0.289 Y 0.295 0.3104 0.329 0.312 e2 X 0.318 0.33 0.33 0.316 Y 0.325 0.338 0.358 0.343 Rev.05 March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 7. Bin Code Description Bin Code Forward Voltage Luminous Intensity Color Rank Z1 M0 b1 4,700K ~ 7,000K Color Rank @ IF = 60mA Luminous Intensity [mcd] *[1] @ IF = 60mA M0 4000 4600 M5 4600 5000 N0 5000 5500 N5 5500 6000 P0 6000 6500 b1 b2 c1 c2 d1 d2 e1 e2 f1 f2 Forward Voltage [V] @ IF = 60mA RANK Min. Max. Z1 3.0 3.1 Z2 3.1 3.2 Z3 3.2 3.3 A1 3.3 3.4 Available ranks Not yet available ranks CCT IV Rank 6,000~7,000 K M0 M5 N0 N5 P0 5,300~6,000 K M0 M5 N0 N5 P0 4,700~5,300 K M0 M5 N0 N5 P0 [Note] All measurements were made under the standardized environment of SSC. In order to ensure availability, single color rank will not be orderable. [1] Classification criteria : Luminous intensity IV [2] Please use for only reference. Rev.05 March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00) 2.80 1.9 0.75 3 1 2 0.85 0.80 4 1.50 3.20 2.40 Z-Power LED X10490 Technical Data Sheet 8.Outline Dimension Packing Mark (Anode) 0.50 0.15 ( Tolerance: ±0.2, Unit: mm ) Circuit Diagram Anode 1 4 2 3 Cathode Cathode Cathode <Circuit diagram> Rev.05 March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00) 1.55 ± 0.05 1.75±0.1 2.0±0.05 4.0±0.1 0.22±0.05 3.83±0.1 5° 3.5±0.1 8±0.1 1.0±0.1 8° 3.1±0.1 2.22±0.1 11.4 ± 0.1 180 +0 -3 9.0 ± 0.3 LABLE 2.0 ± 0.2 13 ±0.2 30° 10 60 Z-Power LED X10490 Technical Data Sheet 9. Reel Structure 22 ( Tolerance: ±0.2, Unit: mm ) 1)Quantity : 1,000pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev.05 March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. Packing Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) a c b 245 220 102 7inch 245 220 142 TYPE 1 SIDE c TUV QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. MADE IN KOREA Acriche 1 Semiconductor EcoLight b RoHS a Rev.05 March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 11. Soldering (1) Lead Solder Lead Solder Lead Solder Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 o C / sec. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-free Solder Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 1~5 oC / sec. 1~5 o C / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. (5) It is recommended that the customer use the nitrogen reflow method. (6) Repairing should not be done after the LEDs have been soldered. (7) Reflow soldering should not be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. [Note] In case that the soldered products are reused in soldering process, we don’t guarantee theRev.05 products. March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 12. Precaution for use 1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH 2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% 3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. 4) Silver plating might be tarnished in the environment that contains corrosive gases and materials. Also any product that has tarnished lead might be decreased the solder-ability and optical-electrical properties compare to normal ones. Please do not expose the product in the corrosive environment during the storage. 5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. 6) Quick cooling shall be avoided. 7) Components shall not be mounted on warped direction of PCB. 8) Anti radioactive ray design is not considered for the products. 9) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. 10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. 11) The LEDs must be soldered within seven days after opening the moisture-proof packing. 12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 13) The appearance and specifications of the product may be modified for improvement without notice. Rev.05 March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 13. Handling of Silicone Resin LEDs 1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. 2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. 3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. 4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. Rev.05 March 2011 www.seoulsemicon.com SSC-QP-7-07-24 (Rev.00)