SEOUL CAWT722-T

Z-Power LED
X10490
Technical
Data
Sheet
Specification
CAWT722-T
SSC
Drawn
Approval
CUSTOMER
Approval
Rev. 01
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
CONTENTS
1.
Feature & Application
2.
Absolute Maximum Ratings
3.
Electro Characteristics
4.
Optical characteristics
5.
Color & Binning
6.
Rank of CAWT722-T
7.
Outline Dimension
8.
Packing
9.
Soldering
10. Precaution for use
11. Handling of Silicone Resin LEDs
12. Reliability Test Item and Condition
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
CAWT722-T
Features
Description
This surface-mount LED comes
in PLCC standard package
dimension. It has a substrate
made up of a molded plastic
reflector sitting on top of a bent
lead frame. The die is attached
within the reflector cavity and
the cavity is encapsulated by
epoxy or silicone.
The package design coupled
with careful selection of
component materials allow these
products to perform with high
reliability in a larger
temperature range -40℃ to
100℃. The high reliability
feature is crucial to Automotive
interior and Indoor ESS.
CAWT722-T
사진
•
White colored SMT
package.
• Material : InGaN/SiC
• Encapsulating Resin :
Silicon Resin
• Suitable for all SMT
assembly methods ;
Suitable for all
soldering methods
• RoHS Compliant
Applications
• Interior automotive
• Office Automation,
Electrical Appliances,
Industrial Equipment
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
2. Absolute maximum ratings
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
342
mW
Forward Current
IF
90
mA
100
mA
Peak Forward Current
IFM
*2
Reverse Voltage (per die)
VR
5
V
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric & Optical characteristics
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Forward Voltage (per die)
VF
IF =20 mA
2.9
3.2
3.6
V
Reverse Current (per die)
IR
VR=5V
-
-
10
µA
IV
IF =60 mA
-
5100
-
mcd
Luminance Flux
ΦV
IF =60 mA
-
12.7
-
lm
Color Temperature
CCT
IF =60 mA
2500
-
4600
K
0.3545
-
0.4970
0.3408
-
0.4466
Luminance Intensity
*1
Color Coordinate
X
Y
IF =60 mA
-
*2
2θ½
IF =60 mA
-
120
-
deg
Optical Efficiency
ηop
IF =60 mA
-
66
-
lm/W
Color Rendering Index
Ra
IF =60 mA
-
95
-
-
Viewing Angle
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned
with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[Note] All measurements were made under the standardized environment of SSC.
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
Forward Current vs. Forward Voltage (per die)
(Ta=25 OC )
Forward Current [mA]
10
1
2.0
2.5
3.0
3.5
4.0
Forward Voltage[V]
Relative Luminous Intensity vs Forward Current
(Ta=25 OC )
2.0
1.8
1.6
Relative Luminosity(a.u.)
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
15
30
45
60
75
90
105
120
Forward Current IF[mA]
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
Ambient Temperature vs. Allowable Forward Current (per die)
35
30
Forward Current IF[mA]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
25
20
15
10
5
0
-25
0
25
50
75
100
O
Ambient temperature Ta( C)
Radiation Diagram
(Ta=25 OC )
0
-30
-60
-90
30
60
90
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
Spectrum
(TA=25℃, IF=60mA)
1.0
Relative Emission Intensity[a.u.]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
0.8
0.6
0.4
0.2
0.0
400
500
600
700
800
Wavelength[nm]
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
5. Color & Binning
0.9
515
0.8
520 525
530
510
535
0.7
540
545
550
555
505
560
0.6
565
570
575
580
585
590
595
600
CIE (y)
500
0.5
0.4
0.3
0.2
0.1
0.0
0.0
495
610
620
630
830
490
485
480
475
470
460
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
CI E(x)
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
0.46
2700K
0.44
3000K
0.40
S0
R1
0.38
R0
RA
0.36
SA
V0
T0
S1
4500K
W0
T1
4000K
TA
W1
V1
3500K
0.42
Y
Z-Power LED
X10490
Technical
Data
Sheet
5. Color & Binning
VA
WA
WB
VB
TB
SB
RB
0.34
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
X
● COLOR RANK
<IF=20mA, Ta=25℃>
4500K
RB
X
0.3515
0.35
0.3649
0.3676
RA
Y
0.3487
0.34
0.3482
0.36
X
0.3531
0.3515
0.3676
0.3704
R0
Y
0.3605
0.3487
0.36
0.3725
X
0.3546
0.3531
0.3704
0.3733
R1
Y
0.3717
0.3605
0.3725
0.3855
X
0.3562
0.3546
0.3733
0.376
Y
0.3855
0.3725
0.3881
0.402
X
0.376
0.3733
0.3997
0.4044
Y
0.3983
0.3843
0.3991
0.4127
X
0.4037
0.3985
0.4283
0.4356
Y
0.4127
0.3991
0.4058
0.422
X
0.4356
0.4283
0.4541
0.4617
Y
0.422
0.4058
0.415
0.43
X
0.4617
0.4541
0.4867
0.497
Y
0.3826
0.3717
0.3855
0.3974
4000K
SB
X
0.3676
0.3649
0.3866
0.391
SA
Y
0.36
0.3482
0.3618
0.375
X
0.3704
0.3676
0.391
0.3952
S0
Y
0.3725
0.36
0.375
0.3881
X
0.3733
0.3704
0.3952
0.3997
S1
Y
0.3974
0.3855
0.402
0.416
3500K
TB
X
0.3898
0.386
0.4106
0.4158
TA
Y
0.3716
0.36
0.372
0.3841
X
0.394
0.3898
0.4158
0.4225
T0
Y
0.3843
0.3716
0.3841
0.3991
X
0.3985
0.394
0.4225
0.4283
T1
Y
0.414
0.3983
0.4127
0.4294
3000K
VB
X
0.4158
0.4106
0.4307
0.4381
VA
Y
0.3841
0.372
0.3768
0.391
X
0.4225
0.4158
0.4381
0.4457
V0
Y
0.3991
0.3841
0.391
0.4058
X
0.4283
0.4225
0.4457
0.4541
V1
Y
0.4294
0.4127
0.422
0.4371
2700K
WB
WA
X
Y
X
Y
X
0.4381
0.391
0.4457
0.4058
0.4541
0.4307
0.3768
0.4381
0.391
0.4457
0.4588
0.3838
0.467
0.3979
0.478
0.467
0.3979
0.478
0.415
0.4867
* Measurement Uncertainty of the Color Coordinates : ± 0.01
*The single bin is not acceptable in the same group of CCT.
(At least, 2 bins required to take when ordering)
W0
W1
Y
0.4371
0.422
0.43
0.4466
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
5. Color & Binning
0.46
2700K
0.44
3000K
0.40
S0
R1
0.38
R0
RA
0.36
SA
V0
T0
S1
4500K
W0
T1
4000K
Y
V1
3500K
0.42
TA
W1
VA
VB
WA
WB
TB
SB
RB
0.34
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
X
0.46
0.44
0.42
Y
2500K
2900K
0.40
3200K
3700K
0.38
4200K
0.36
4700K
0.34
0.34
0.36
0.38
0.40
0.42
X
0.44
0.46
0.48
0.50
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Rank of CAWT722-T
▣ Rank Name Table
X1
X2
IV
X3
CIE VF
▣ Forward Voltage [V]
▣ Intensity value[mcd]
Color : R,S
Rank
Name
MIN
MAX
▣ CIE (Color Rank)
L8
3800
4500
Rank Name
M5
4500
5500
N5
5500
6800
Rank
Name
Color : T, V, W
MIN
MAX
L5
3500
4200
M2
4200
5100
N1
5100
6300
4500K
Rank
Name
MIN
MAX
Y3
2.9
3.0
Z1
3.0
3.1
Z2
3.1
3.2
Z3
3.2
3.3
A1
3.3
3.4
A2
3.4
3.5
A3
3.5
3.6
4000K 3500K 3000K 2700K
R1
S1
T1
V1
W1
R0
S0
T0
V0
W0
RA
SA
TA
VA
WA
RB
SB
TB
VB
WB
Available Rank
[Note] All measurements were made under the standardized environment of SSC.
In order to ensure availability, single color rank will not be orderable.
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
7.Outline Dimension
Package Outlines
Package
Marking
(Cathode)
6
5
4
1
2
3
Front View
Right View
Rear View
( Tolerance: ±0.2, Unit: mm )
Recommended
Solder Pad
Circuit Diagram
Warm White Anode
5
6
W1
W2
1
4
W3
2
3
Warm White Cathode
* MATERIALS
PARTS
MATERIALS
Package
Heat-Resistant Polymer
Encapsulating Resin
Silicon Resin
Electrodes
Ag Plating Copper Alloy
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November 2008
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
8. Packing
Package
Marking
( Tolerance: ±0.2, Unit: mm )
1)Quantity : 700pcs/Reel
2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is
turned off from the carrier tape at the angle of 10 to the carrier tape
4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
● Reel Packing Structure
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
c
a
b
245 220 102
7inch
245 220 142
TYPE
1 SIDE
c
TUV
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
MADE IN KOREA
Acriche
1
Semiconductor EcoLight
b
RoHS
a
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
9. Soldering
(1) Lead Solder
Lead Solder
Lead Solder
2.5~5 o C / sec.
Pre-heat
120~150℃
Pre-heat time
120 sec. Max.
Peak-Temperature
240℃ Max.
Soldering time
Condition
10 sec. Max.
2.5~5 C / sec.
Pre-heating
120~150 oC
240 oC Max.
10 sec. Max.
60sec. Max.
Above 200 oC
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
1~5 o C / sec.
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec. Max.
Peak-Temperature
260℃ Max.
Soldering time
Condition
10 sec. Max.
1~5 o C / sec.
Pre-heating
150~200 o C
260 oC Max.
10 sec. Max.
60sec. Max.
Above 220 oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the
encapsulated part.
So when using the chip mounter, the picking up nozzle that does not
affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
10. Precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or
a desiccator) with a desiccant. Otherwise, to store them in the following environment is
recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 65%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop. Attention in followed;
a. After opened and mounted the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 30%
(3) In the case of more than 1 week passed after opening or change color of indicator
on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply during
cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent
etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3
months or more after being shipped from SSC, a sealed container with a nitrogen
atmosphere should be used for storage.
(11) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(12) Repack unused products with anti-moisture packing, fold to close any opening and
then store in a dry place.
(13) The appearance and specifications of the product may be modified for improvement
without notice.
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
11. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as
possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies
to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on the
surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to
standard encapsulants, silicone is generally softer, and the surface is more likely to
attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles cannot be
guaranteed, a suitable cleaning solution must be applied to the surface after the
soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED.
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
12. Reliability Test Item and Condition
Item
Reference
Test Condition
Duration
/ Cycle
Number
of
Damage
Thermal Shock
EIAJ ED4701
Ta =-40oC (30MIN) ~ 100oC
(30MIN)
100
Cycle
0/22
Temperature
Cycle
EIAJ ED4701
Ta =-40oC (30MIN) ~ 25oC (5MIN)
~ 100oC (30MIN) ~ 25oC (5MIN)
100
Cycle
0/22
High
Temperature
Storage
High
Temperature
High Humidity
Storage
Low
Temperature
Storage
EIAJ ED4701
Ta =100oC
1000
Hours
0/22
EIAJ ED4701
Ta =85oC, RH=85%
1000
Hours
0/22
EIAJ ED4701
Ta =-40oC
1000
Hours
0/22
Operating
Endurance Test
Internal
Reference
Ta =25oC, IF =20mA
1000
Hours
0/22
Internal
Reference
Ta =85oC, RH=85%, IF =15mA
300
Hours
0/22
Internal
Reference
Ta =85oC, IF =20mA
500
Hours
0/22
Internal
Reference
Ta =-40oC, IF =20mA
1000
Hours
0/22
MIL-STD883D
1KV at 1.5kΩ; 100pF
3 Time
0/22
High
Temperature
High Humidity
Life Test
High
Temperature
Life Test
Low
Temperature
Life Test
ESD(HBM)
Criteria for Judging the Damage
Item
Symbol
Condition
Forward Voltage
VF
Reverse Current
Luminous
Intensity
Criteria for Judgement
MIN
MAX
IF =20mA
-
USL*1 × 1.2
IR
VR=5V
-
USL*1 × 2.0
IV
IF =20mA
LSL*2 × 0.5
-
Note : *1 USL : Upper Standard Level
*2 LSL : Lower Standard Level
Rev. 01
November 2008
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SSC-QP-7-07-24 (Rev.00)