Z-Power LED X10490 Technical Data Sheet Specification STW8Q2PA SSC Drawn CUSTOMER Approval Approval Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Description 2. Absolute Maximum Ratings 3. Electro-Optical Characteristics 4. Optical characteristics 5. Reliability Test 6. Color & Binning 7. Bin Code Description 8. Outline Dimension 9. Reel Structure 10. Packing 11. Soldering 12. Precaution for use 13. Handling of Silicone Resin LEDs Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet STW8Q2PA 1. Description This surface-mount LED comes in standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability. Features • Pb-Free Reflow soldering application • RoHS compliant • White colored SMT package • Suitable for all SMT assembly and soldering methods • High Reliability (silicone resin) • High CRI = Ra 80 (Typ.) Applications • Electric Signs and Signals • Interior automotive • Office Automation, Electrical Appliances, Industrial Equipment Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter [1] Symbol Value Unit Power Dissipation Pd 592 mW Forward Current IF 160 mA IFM [2] 300 mA Operating Temperature Topr -40~+85 ℃ Storage Temperature Tstg -40~+100 ℃ Junction Temperature Tj 125 ℃ Peak Forward Current [1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. [2] IFM was measured at Tw≤1 msec of pulse width and D≤1/10 of duty ratio. [3] LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. 3. Electro-Optical characteristics Parameter [1] Forward Voltage * Reverse Voltage Luminous Intensity* (2600~3700K) [2] Luminous Intensity*[2] (3700~7000K) Color Correlated Temperature Viewing Angle [3] Color Rendering Index* Symbol Condition Min. Typ. Max. Unit VF IF=100mA 2.9 3.2 3.4 V VR IR=5mA - 0.9 1.2 V Iv IF=100mA - 8.5 cd Iv IF=100mA - 9.0 - CCT IF=100mA 2,600 - 7,000 K 2Θ1/2 IF=100mA - 120 - deg. Ra IF=100mA 75 80 - - 1.5kΩ;100pF 1 - - KV IF=100mA - 15 - ºC/W ESD (HBM) Thermal resistance [4] RthJS [1] Forward current is 50mA per die for parallel inner circuit. Package Total Forward Current is 100mA [2] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. [3] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [4] Thermal resistance: RthJS (Junction / solder) * Tolerance : VF :±0.1V, IV :±10%, Ra :±3, x,y :±0.01 [Note] All measurements were made under the standardized environment of SSC. Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Forward Voltage vs. Forward Current Forward Current vs. Relative Luminous Intensity Ta=25℃ Ta=25℃ 1.6 1.4 Relative Luminous Intensity Forward Current IF [mA] 100 10 1 1.2 1.0 0.8 0.6 0.4 0.2 0.0 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 0 20 40 Forward Voltage VF [V] 60 80 100 120 140 160 Forward Current IF [mA] Forward Current vs. Chromaticity Coordinate Directivity Ta=25℃ Ta=25℃ 0.368 0 -30 0.366 30 y 20mA 60mA 100mA 0.364 -60 150mA 60 200mA 0.362 -90 0.360 0.336 0.337 0.338 0.339 0.340 90 0.341 x Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet Relative Light Output vs. Junction Temperature Forward Voltage Shift vs. Junction Temperature IF=100mA 1.0 1.0 0.8 0.8 Relative Light Output Relative Forward Voltage IF=100mA 0.6 0.4 0.6 0.4 0.2 0.2 0.0 0.0 25 50 75 100 125 25 50 75 100 125 O Ju n ctio n tem pe ratu re Tj( C ) O Ju n ctio n te m p e ra tu re Tj( C ) Junction Temperature (℃) vs. Chromaticity Coordinate IF=100mA 0.335 0.330 25 0.325 y 45 65 0.320 85 105 0.315 0.310 0.315 0.320 0.325 0.330 x Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Spectrum Ta=25℃, IF=100mA 200 2600~3700K 3700~4700K 4700~7000K 180 160 1.0 Relative Emission Intensity Forward Current IF[mA] Z-Power LED X10490 Technical Data Sheet Ambient Temperature vs. Maximum Forward Current 140 o R th J-A = 1 0 0 C /W 120 100 80 60 0.5 40 20 0 -4 0 -20 0 20 40 60 80 O A m b ie n t te m p e ra tu re T a ( C ) 100 0.0 300 400 500 600 700 800 Wavelength [nm] Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 5. Reliability Test Item Reference Test Conditions Duration / Cycle Number of Damaged Thermal Shock EIAJ ED-4701 Ta =-40oC(30min) ~ 100oC(30min) 100 Cycle 0/22 High Temperature Storage EIAJ ED-4701 Ta =100oC 1000 Hours 0/22 High Temp. High Humidity Storage EIAJ ED-4701 Ta =60oC, RH=90% 1000 Hours 0/22 Low Temperature Storage EIAJ ED-4701 Ta =-40oC 1000 Hours 0/22 Operating Endurance Test Internal Reference Ta =25oC, IF =100mA 1000 Hours 0/22 High Temperature High Humidity Life Test Internal Reference Ta =60oC, RH=90%, IF =100mA 500 Hours 0/22 High Temperature Life Test Internal Reference Ta =85oC, IF =100mA 500 Hours 0/22 Low Temperature Life Test Internal Reference Ta =-40oC, IF =100mA 1000 Hours 0/22 ESD(HBM) MIL-STD883D 1KV at 1.5kΩ; 100pF 3 Time 0/22 Reflow Tsol 260℃< 10sec. Reflow Soldering 3 Time 0/22 □ CRITERIA FOR JUDGING THE DAMAGE Item Symbol Condition Forward Voltage VF Luminous Intensity IV Criteria for Judgment MIN MAX IF =100mA - USL [1] × 1.2 IF =100mA LSL [2] × 0.5 - Note : [1] USL : Upper Standard Level [2] LSL : Lower Standard Level Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning 0.9 515 0.8 520 525 530 535 540 510 545 0.7 550 555 505 560 0.6 565 570 500 575 580 585 590 595 600 CIE Y 0.5 0.4 0.3 0.2 495 610 620 630 830 490 485 480 0.1 0.0 0.0 475 470 460 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 CIEX Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning 0.46 0.44 Energy Star Rank 2700K 3000K 0.40 4700K CIE Y 5000K 0.38 0.36 0.34 B8 6500K 7000K A1 A0 A2 0.32 D2 C3 B3 C4 B5 A5 B6 D4 C5 D5 E4 E1 F3 F2 E0 G4 G6 F4 H3 H5 H4 G5 F5 E3 H2 G3 G2 F0 E8 E2 G0 G7 H7 H6 F7 E5 F6 E7 E6 D7 D6 C7 C6 A7 A4 A6 A9 A8 0.30 0.28 0.28 B0 B2 B4 B7 D3 C1 C0 B1 C2 A3 D1 D0 C8 B9 6000K D8 C9 5300K 5600K 4200K 4500K D9 G1 F1 E9 H1 H0 F9 F8 4000K G9 G8 3500K 3700K H9 H8 3200K 0.42 2600K 2900K 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 CIE X Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK <IF=100mA, Ta=25℃> 6500~7000K A0 A2 A4 A6 A8 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3028 0.3304 0.3041 0.324 0.3055 0.3177 0.3068 0.3113 0.3082 0.3046 0.3041 0.324 0.3055 0.3177 0.3068 0.3113 0.3082 0.3046 0.3096 0.298 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.3155 0.312 0.3164 0.3046 0.3115 0.3393 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.3155 0.312 6000~6500K A1 A3 A5 A7 A9 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3115 0.3393 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.3155 0.312 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.3155 0.312 0.3164 0.3046 0.321 0.3408 0.3216 0.3334 0.3221 0.3261 0.3225 0.319 0.323 0.311 0.3205 0.3481 0.321 0.3408 0.3216 0.3334 0.3221 0.3261 0.3225 0.319 5600~6000K B0 B2 B4 B6 B8 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3207 0.3462 0.3212 0.3389 0.3217 0.3316 0.3222 0.3243 0.32 0.3572 0.3212 0.3389 0.3217 0.3316 0.3222 0.3243 0.3226 0.3178 0.3207 0.3462 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.3295 0.3234 0.3292 0.3539 0.3292 0.3539 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.329 0.3656 5300~5600K B1 B3 B5 B7 B9 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3292 0.3539 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.329 0.3656 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.3295 0.3234 0.3292 0.3539 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3364 0.3288 0.3376 0.3616 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3381 0.374 Rev. 05 * Measurement Uncertainty of the Color Coordinates : ± 0.01 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK <IF=100mA, Ta=25℃> 5000~5300K C0 C2 C4 C6 C8 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3381 0.374 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3364 0.3288 0.347 0.381 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3433 0.3345 0.3463 0.3687 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3376 0.3616 4700~5000K C1 C3 C5 C7 C9 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.347 0.381 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3433 0.3345 0.3572 0.3891 0.3539 0.3669 0.3526 0.3578 0.3514 0.3487 0.35 0.34 0.3552 0.376 0.3552 0.376 0.3539 0.3669 0.3526 0.3578 0.3514 0.3487 0.3463 0.3687 4500~4700K D0 D2 D4 D6 D8 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3548 0.3736 0.3536 0.3646 0.3523 0.3555 0.3511 0.3465 0.3562 0.3826 0.3536 0.3646 0.3523 0.3555 0.3511 0.3465 0.3498 0.3385 0.3548 0.3736 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3575 0.3441 0.3641 0.3804 0.3641 0.3804 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3661 0.39 4200~4500K D1 D3 D5 D7 D9 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3641 0.3804 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3661 0.39 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3575 0.3441 0.3641 0.3804 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.365 0.3489 0.3736 0.3874 0.3736 0.3874 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.376 0.3974 Rev. 05 * Measurement Uncertainty of the Color Coordinates : ± 0.01 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK <IF=100mA, Ta=25℃> 4000~4200K E0 E2 E4 E6 E8 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3736 0.3874 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.376 0.3974 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.365 0.3489 0.3736 0.3874 0.3842 0.3855 0.3813 0.3751 0.3783 0.3646 0.3758 0.355 0.3869 0.3958 0.3869 0.3958 0.3842 0.3855 0.3813 0.3751 0.3783 0.3646 0.3902 0.4067 3700~4000K E1 E3 E5 E7 E9 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3869 0.3958 0.3842 0.3855 0.3813 0.3751 0.3783 0.3646 0.3902 0.4067 0.3842 0.3855 0.3813 0.3751 0.3783 0.3646 0.3758 0.355 0.3869 0.3958 0.397 0.3935 0.3934 0.3825 0.3898 0.3716 0.3863 0.361 0.4006 0.4044 0.4006 0.4044 0.397 0.3935 0.3934 0.3825 0.3898 0.3716 0.4044 0.416 3500~3700K F0 F2 F4 F6 F8 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3996 0.4015 0.396 0.3907 0.3925 0.3798 0.3889 0.369 0.4037 0.414 0.396 0.3907 0.3925 0.3798 0.3889 0.369 0.386 0.36 0.3996 0.4015 0.4104 0.3978 0.4062 0.3865 0.4017 0.3751 0.3983 0.366 0.4146 0.4089 0.4146 0.4089 0.4104 0.3978 0.4062 0.3865 0.4017 0.3751 0.4197 0.4217 3200~3500K F1 F3 F5 F7 F9 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4146 0.4089 0.4104 0.3978 0.4062 0.3865 0.4017 0.3751 0.4197 0.4217 0.4104 0.3978 0.4062 0.3865 0.4017 0.3751 0.3983 0.366 0.4146 0.4089 0.4248 0.4048 0.4198 0.3931 0.4147 0.3814 0.4104 0.3715 0.4299 0.4165 0.4299 0.4165 0.4248 0.4048 0.4198 0.3931 0.4147 0.3814 0.4354 0.4288 Rev. 05 * Measurement Uncertainty of the Color Coordinates : ± 0.01 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK <IF=100mA, Ta=25℃> 3000~3200K G0 G2 G4 G6 G8 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4299 0.4165 0.4248 0.4048 0.4198 0.3931 0.4147 0.3814 0.4354 0.4288 0.4248 0.4048 0.4198 0.3931 0.4147 0.3814 0.4102 0.371 0.4299 0.4165 0.4374 0.4093 0.4317 0.3973 0.4259 0.3853 0.4207 0.3744 0.443 0.4212 0.443 0.4212 0.4374 0.4093 0.4317 0.3973 0.4259 0.3853 0.4487 0.4333 2900~3000K G1 G3 G5 G7 G9 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.443 0.4212 0.4374 0.4093 0.4317 0.3973 0.4259 0.3853 0.4487 0.4333 0.4374 0.4093 0.4317 0.3973 0.4259 0.3853 0.4207 0.3744 0.443 0.4212 0.4499 0.4138 0.4436 0.4015 0.4373 0.3893 0.4312 0.3778 0.4562 0.426 0.4562 0.426 0.4499 0.4138 0.4436 0.4015 0.4373 0.3893 0.4619 0.4378 2700~2900K H0 H2 H4 H6 H8 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4562 0.426 0.4499 0.4138 0.4436 0.4015 0.4373 0.3893 0.4619 0.4378 0.4499 0.4138 0.4436 0.4015 0.4373 0.3893 0.4312 0.3778 0.4562 0.426 0.462 0.4166 0.4551 0.4042 0.4483 0.3919 0.4422 0.3805 0.4687 0.4289 0.4687 0.4289 0.462 0.4166 0.4551 0.4042 0.4483 0.3919 0.4747 0.441 2600~2700K H1 H3 H5 H7 H9 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4687 0.4289 0.462 0.4166 0.4551 0.4042 0.4483 0.3919 0.4747 0.441 0.462 0.4166 0.4551 0.4042 0.4483 0.3919 0.4422 0.3805 0.4687 0.4289 0.474 0.4194 0.4666 0.4069 0.4593 0.3944 0.4527 0.383 0.481 0.4319 0.481 0.4319 0.474 0.4194 0.4666 0.4069 0.4593 0.3944 0.4875 0.4435 Rev. 05 * Measurement Uncertainty of the Color Coordinates : ± 0.01 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 7. Bin Code Description Bin Code Luminous Intensity CIE Forward Voltage S5 G5 Z1 Luminous Intensity (mcd) @ IF = 100mA Flux (lm) Color Rank @ IF = 100mA Bin Code Min. Max. Typ A~H Q5 7500 8000 25.8 R0 8000 8500 27.7 R5 8500 9000 28.7 S0 9000 9500 30.6 S5 9500 10000 33 T0 10000 10500 34 T5 10500 11000 35.6 V0 11000 11500 36 Forward Voltage (V) @ IF = 100mA Bin Code Min. Max. Y3 2.9 3.0 Z1 3.0 3.1 Z2 3.1 3.2 Z3 3.2 3.3 A1 3.3 3.4 Available ranks Not yet available ranks CCT IV Rank 5300~7000 K (CIE A,B) Q5 R0 R5 S0 S5 T0 T5 V0 3700~5300 K (CIE C,D,E) Q5 R0 R5 S0 S5 T0 T5 V0 2600~3700 K (CIE F,G,H) Q5 R0 R5 S0 S5 T0 T5 V0 Rev. 05 [Note] All measurements were made under the standardized environment of SSC. In order to ensure availability, single color rank will not be orderable. October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 8. Outline Dimension ( Tolerance: ±0.1, Unit: mm ) Package Marking N.C C1 A C2 Slug (Anode) [Recommended Solder Pattern] [Note] Forward current is 50mA per die for parallel inner circuit. Package Total Forward Current is 100mA Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 15.4±1.0 180 13±0.3 2 60 Z-Power LED X10490 Technical Data Sheet 9. Reel Structure 22 13 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 3,500pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape Rev. 05 (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 10. Soldering (1) Lead Solder Lead Solder Lead Solder 2.5~5 o C / sec. Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-free Solder Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 1~5 oC / sec. 1~5 oC / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. (5) It is recommended that the customer use the nitrogen reflow method. (6) Repairing should not be done after the LEDs have been soldered. (7) Reflow soldering should not be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 11. Packing Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE c 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX RoHS PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. b a Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 12. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMT, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 4 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Silver plating might be tarnished in the environment that contains corrosive gases and materials. Also any product that has tarnished lead might be decreased the solder-ability and optical-electrical properties compare to normal ones. Please do not expose the product in the corrosive environment during the storage. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products. (9) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice. Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet 13. Handling of Silicone Resin LEDs 1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. 2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. 3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. 4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24