Seoul Semiconductor

Product Data Sheet
ZC6 – Chip on Board
Enable High Flux and Cost Efficient System
Z Power Chip on board – ZC series, ZC6
SDW01F1C, SDW81F1C, SDW91F1C
LM-80
RoHS
MacAdam
3-Step
Product Brief
Description
Features and Benefits
•
The ZC series are LED arrays which
provide High Flux and High Efficacy.
•
It is especially designed for easy
assembly of Lighting fixtures by
eliminating reflow soldering process.
•
It‘s thermal management is excellent
than other power LED solutions with
wider Metal area.
•
•
•
•
•
•
•
•
ZC series are ideal light sources for
General Lighting applications including
Replacement Lamps, Industrial &
Commercial Lightings and other high
Lumen required applications.
High Efficacy typ. 130lm/W
Flux range from 600 ~ 1390lm
Power dissipation 6.5 ~ 12.3W
Wide CCT range with CRI 70~90
MacAdam 3-step binning
Uniformed Shadow
Excellent Thermal management
Key Applications
•
•
•
•
•
Bulb - Replacement Lamps
Down Lighting – Commercial Lighting
High Bay - Industrial Lighting
Architectural Lighting
Decorative / Pathway Lighting
Table 1. Product Selection Table
CCT
Part Number
SDW01F1C
Color
Min.
Typ.
Max.
Cool White
4700K
-
6000K
Neutral White
3700K
-
4200K
Warm White
2600K
-
3200K
Neutral White
3700K
-
4200K
Warm White
2600K
-
3700K
SDW81F1C
SDW91F1C
Rev3.0, April 1, 2014
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Product Data Sheet
ZC6 – Chip on Board
Table of Contents
Index
•
Product Brief
•
Table of Contents
•
Performance Characteristics
•
Color Bin Structure
•
Mechanical Dimensions
•
Packaging Specification
•
Product Nomenclature (Labeling Information)
•
Handling of Silicone Resin for LEDs
•
Precaution For Use
•
Company Information
Rev3.0, April 1, 2014
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Product Data Sheet
ZC6 – Chip on Board
Performance Characteristics
Table 2. Product Selection Guide, Tc=25ºC, RH30%
CCT (K) [1]
Part Number
SDW01F1C
SDW81F1C
Typical
Luminous Flux [2]
ФV [3] (lm)
Typical Forward
Voltage (VF) [4]
CRI [5],
Ra
Viewing
Angle
(degrees)
2Θ ½
Typ.
180mA
320mA*
180mA
320mA*
Min.
Typ.
5000
875
1395
36
37.5
70
120
4000
775
1235
36
37.5
80
120
3000
745
1190
36
37.5
80
120
2700
710
1130
36
37.5
80
120
4000
680
1085
36
37.5
90
120
3500
645
1025
36
37.5
90
120
3000
635
1015
36
37.5
90
120
2700
600
955
36
37.5
90
120
SDW91F1C
Notes :
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color
coordinate : 0.01, CCT 5% tolerance.
(2) Seoul Semiconductor maintains a tolerance of ±7% on flux and power measurements.
(3) ФV is the total luminous flux output as measured with an integrating sphere.
(4) Tolerance is ±2.5V on forward voltage measurements.
(5) Tolerance is ±2 on CRI measurements.
Rev3.0, April 1, 2014
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Product Data Sheet
ZC6 – Chip on Board
Performance Characteristics
Table 3. Characteristics, Tc=25ºC, RH30%
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
Forward Current
IF
-
0.18
0.32
A
Power Dissipation
PD
-
6.5
12.3
W
Junction Temperature
Tj
-
-
125
ºC
Operating Temperature
Topr
-40
-
85
ºC
Storage Temperature
Tstg
-40
-
100
ºC
Thermal resistance (J to S) [1]
Rθj-s
-
1.4
-
K/W
ESD Sensitivity(HBM) [2]
-
-
-
±8
kV
Notes :
(1) Thermal Resistance : Rθj-s (Junction to COB’s metal PCB)
(2) A zener diode is included to protect the product from ESD.
Rev3.0, April 1, 2014
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Product Data Sheet
ZC6 – Chip on Board
Relative Spectral Distribution
Fig 1. Color Spectrum, Tc=25℃, IF=180mA, RH30%
Cool white
Neutral white
Warm white CRI80
Warm white CRI90
Relative Radiant Power [%]
1.0
0.8
0.6
0.4
0.2
0.0
300
400
500
600
700
800
Wavelength [nm]
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Product Data Sheet
ZC6 – Chip on Board
Luminous Flux Characteristics
Fig 2. Radiant pattern, IF=180mA
1.1
1.0
Relative Intensity [%]
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Angular Displacement [degrees]
Rev3.0, April 1, 2014
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Product Data Sheet
ZC6 – Chip on Board
Forward Current Characteristics
Fig 3. Forward Voltage vs. Forward Current , Tc=25℃
0.4
Forward Current [A]
0.3
0.2
0.1
0.0
10
15
20
25
30
35
40
Forward Volatage [V]
Fig 4. Forward Current vs. Relative Luminous Flux, Tc=25℃
200
Relative luminous flux [%]
180
160
140
120
100
80
60
40
20
0
0
50
100
150
200
250
300
350
400
Forward Current [mA]
Rev3.0, April 1, 2014
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Product Data Sheet
ZC6 – Chip on Board
Forward Current Characteristics
Fig 5. Forward Current vs. CIE X, Y Shift , Tc=25℃ (Warm white)
0.02
CIE(X)
CIE(Y)
Relative variation
0.01
0.00
-0.01
-0.02
0
50
100
150
200
250
300
350
Forward Current [mA]
Rev3.0, April 1, 2014
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Product Data Sheet
ZC6 – Chip on Board
Junction Temperature Characteristics
Fig 6. Relative Light Output vs. Junction Temperature, IF=180mA
120
Relative luminous flux [%]
100
80
60
40
20
025
40
60
80
100
120
o
Junction Temperature [ C]
Fig 7. Junction Temp. vs. CIE X, Y Shift, IF=180mA (Warm white)
0.02
CIE(X)
CIE(Y)
Relative variation
0.01
0.00
-0.01
-0.02
25
Rev3.0, April 1, 2014
50
75
100
o
Junction Temperature [ C]
9
125
150
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Product Data Sheet
ZC6 – Chip on Board
Junction Temperature Characteristics
Fig 8. Forward Voltage vs. Junction Temperature, IF=180mA
39
Foward voltage [V]
38
37
36
35
34
33
3225
40
60
80
100
120
o
Junction Temperature [ C]
Rev3.0, April 1, 2014
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Product Data Sheet
ZC6 – Chip on Board
Ambient Temperature Characteristics
Fig 9. Maximum Forward Current vs. Ambient Temperature, Tj(max.)=125℃, IF=0.32A
400
Maximum Current [mA]
350
300
250
200
Rth(j-a)=2.6K/W
150
Rth(j-a)=4.0K/W
Rth(j-a)=5.4K/W
100
50
0
0
20
40
60
80
100
120
o
Ambient Temperature [ C]
Rev3.0, April 1, 2014
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Product Data Sheet
ZC6 – Chip on Board
Color Bin Structure
Table 4. Bin Code description
Luminous Flux (lm)
@ IF=180mA
Part Number
SDW01F1C
SDW81F1C
SDW91F1C
Rev3.0, April 1, 2014
Bin Code
Min.
Max.
C
700
800
D
800
900
E
900
B2
Color
Chromaticity
Coordinate
@ IF=180mA
Typical Forward
Voltage (VF)
Bin Code
Min.
Max.
D
32.0
36.0
1100
E
36.0
40.0
635
700
D
32.0
36.0
C
700
800
D
800
900
E
36.0
40.0
B1
570
635
D
32.0
36.0
B2
635
700
C
700
800
E
36.0
40.0
Refer to page.13
Refer to page.14
Refer to page.15
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Product Data Sheet
ZC6 – Chip on Board
Color Bin Structure
CIE Chromaticity Diagram (Cool white), Tc=25℃, IF=180mA
ANSI
0.38
4700K
5000K
0.37
C1
5300K
C0
CIE Y
0.36
C3
5600K
0.35
B1
C2
6000K
0.34
B0
B3
B2
B5
C5
C4
B4
0.33
0.32
0.31
0.32
0.33
0.34
0.35
0.36
CIE X
B0
B1
B2
B3
B4
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3207
0.3462
0.3292
0.3539
0.3212
0.3389
0.3293
0.3461
0.3217
0.3316
0.3212
0.3389
0.3293
0.3461
0.3217
0.3316
0.3293
0.3384
0.3222
0.3243
0.3293
0.3461
0.3373
0.3534
0.3293
0.3384
0.3369
0.3451
0.3294
0.3306
0.3292
0.3539
0.3376
0.3616
0.3293
0.3461
0.3373
0.3534
0.3293
0.3384
B5
B6
B7
B8
B9
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3293
0.3384
0.3222
0.3243
0.3294
0.3306
0.3200
0.3572
0.3290
0.3656
0.3294
0.3306
0.3226
0.3178
0.3295
0.3234
0.3207
0.3462
0.3292
0.3539
0.3366
0.3369
0.3295
0.3234
0.3364
0.3288
0.3292
0.3539
0.3376
0.3616
0.3369
0.3451
0.3294
0.3306
0.3366
0.3369
0.3290
0.3656
0.3381
0.3740
C0
C1
C2
C3
C4
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3376
0.3616
0.3463
0.3687
0.3373
0.3534
0.3456
0.3601
0.3369
0.3451
0.3373
0.3534
0.3456
0.3601
0.3369
0.3451
0.3448
0.3514
0.3366
0.3369
0.3456
0.3601
0.3539
0.3669
0.3448
0.3514
0.3526
0.3578
0.3440
0.3428
0.3463
0.3687
0.3552
0.3760
0.3456
0.3601
0.3539
0.3669
0.3448
0.3514
C5
C6
C7
C8
C9
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3448
0.3514
0.3366
0.3369
0.3440
0.3428
0.3381
0.3740
0.3470
0.3810
0.3440
0.3428
0.3364
0.3288
0.3433
0.3345
0.3376
0.3616
0.3463
0.3687
0.3514
0.3487
0.3433
0.3345
0.3500
0.3400
0.3463
0.3687
0.3552
0.3760
0.3526
0.3578
0.3440
0.3428
0.3514
0.3487
0.3470
0.3810
0.3572
0.3891
Rev3.0, April 1, 2014
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Product Data Sheet
ZC6 – Chip on Board
Color Bin Structure
CIE Chromaticity Diagram (Warm white), Tc=25℃, IF=180mA
3-step (E10, G10, H10)
4-step (E11, G11, H11)
ANSI
0.44
2600K
2700K
2900K
3000K
0.42
3200K
H11
G21
CIE Y
H10
G11
3700K
H22
H21
G22
G10
0.40
4000K
H23
E22
4200K
E21
0.38
H24
G24
G23
E11
E10
E24
E23
0.36
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
CIE X
3-STEP
E10
4-STEP
G10
H10
E11
G11
H11
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3764
0.3713
0.4267
0.3946
0.4502
0.4020
0.3744
0.3685
0.4242
0.3919
0.4475
0.3994
0.3793
0.3828
0.4328
0.4079
0.4576
0.4158
0.3782
0.3837
0.4322
0.4096
0.4573
0.4178
0.3890
0.3887
0.4422
0.4113
0.4667
0.4180
0.3912
0.3917
0.4449
0.4141
0.4695
0.4207
0.3854
0.3768
0.4355
0.3977
0.4588
0.4041
0.3863
0.3758
0.4359
0.396
0.4589
0.4021
ANSI
E21
CIE x
0.3703
0.3736
0.3871
0.3849
0.3784
0.3765
E22
CIE y
0.3726
0.3874
0.3959
0.3881
0.3841
0.3765
CIE x
0.3890
0.3914
0.3849
0.3871
0.4006
0.3952
CIE y
0.3990
0.4165
0.4212
0.4122
0.4100
0.4011
CIE x
0.4406
0.4451
0.4387
0.4430
0.4562
0.4468
CIE y
0.4077
0.4260
0.4289
0.4197
0.4182
0.4090
CIE x
0.4644
0.4697
0.4636
0.4687
0.4810
0.4703
G21
CIE x
0.4223
0.4299
0.4430
0.4387
0.4324
0.4284
CIE x
0.3670
0.3703
0.3765
0.3746
0.3806
0.3784
CIE y
0.4055
0.4145
0.4122
0.4212
0.4260
0.4077
CIE x
0.4147
0.4223
0.4284
0.4243
0.4302
0.4259
CIE y
0.4118
0.4211
0.4197
0.4289
0.4319
0.4132
CIE x
0.4373
0.4468
0.4526
0.4477
0.4534
0.4483
G22
H21
CIE x
0.4468
0.4562
0.4687
0.4636
0.4575
0.4526
E23
CIE y
0.3842
0.3922
0.3881
0.3959
0.4044
0.3880
CIE x
0.3784
0.3806
0.3865
0.3890
0.3952
0.3898
CIE y
0.3814
0.3990
0.4011
0.3922
0.3943
0.3853
CIE x
0.4259
0.4302
0.4361
0.4406
0.4468
0.4373
CIE y
0.3893
0.4077
0.4090
0.3998
0.4012
0.3919
CIE x
0.4483
0.4534
0.4591
0.4644
0.4703
0.4593
G23
H22
Rev3.0, April 1, 2014
E24
CIE y
0.3578
0.3726
0.3765
0.3689
0.3725
0.3647
G24
H23
14
CIE y
0.3647
0.3725
0.3762
0.3842
0.3880
0.3716
CIE y
0.3853
0.3943
0.3964
0.4055
0.4077
0.3893
H24
CIE y
0.3919
0.4012
0.4025
0.4118
0.4132
0.3944
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Product Data Sheet
ZC6 – Chip on Board
Color Bin Structure
CIE Chromaticity Diagram (Warm white), Tc=25℃, IF=180mA
ANSI
MacAdam 4-step
MacAdam 3-step
0.44
0.42
H22
H21
3200K
G22
H11
G21
3500K
F22
3700K
CIE Y
2600K
2700K
2900K
3000K
H10
G11
G10
0.40
4000K
E22
F21
4200K
F11
H23
E21
0.38
H24
G24
F10
G23
E11
F24
E10
E24
F23
E23
0.36
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
CIE X
3-STEP
E10
CIE x
F10
CIE y
CIE x
CIE y
4-STEP
G10
CIE x
H10
CIE y
CIE x
E11
CIE y
CIE x
F11
CIE y
CIE x
CIE y
G11
CIE x
H11
CIE y
CIE x
CIE y
0.3764 0.3713 0.4006 0.3829 0.4267 0.3946 0.4502 0.4020 0.3744 0.3685 0.3981 0.3800 0.4242 0.3919 0.4475 0.3994
0.3793 0.3828 0.4051 0.3954 0.4328 0.4079 0.4576 0.4158 0.3782 0.3837 0.4040 0.3966 0.4322 0.4096 0.4573 0.4178
0.3890 0.3887 0.4159 0.4007 0.4422 0.4113 0.4667 0.4180 0.3912 0.3917 0.4186 0.4037 0.4449 0.4141 0.4695 0.4207
0.3854 0.3768 0.4108 0.3878 0.4355 0.3977 0.4588 0.4041 0.3863 0.3758 0.4116 0.3865 0.4359
0.396
0.4589 0.4021
ANSI
E21
CIE x
0.3703
0.3736
0.3871
0.3849
0.3784
0.3765
E22
CIE y
0.3726
0.3874
0.3959
0.3881
0.3841
0.3765
CIE x
0.3890
0.3914
0.3849
0.3871
0.4006
0.3952
CIE y
0.4090
0.4015
0.3853
0.3887
0.3966
0.4002
CIE x
0.4013
0.3943
0.3889
0.4018
0.4049
0.3981
CIE y
0.3990
0.4165
0.4212
0.4122
0.4100
0.4011
CIE x
0.4406
0.4451
0.4387
0.4430
0.4562
0.4468
CIE y
0.4077
0.4260
0.4289
0.4197
0.4182
0.4090
CIE x
0.4644
0.4697
0.4636
0.4687
0.4810
0.4703
F21
CIE x
0.4148
0.3996
0.3943
0.4013
0.4040
0.4113
CIE y
0.3887
0.3853
0.3690
0.3752
0.3833
0.3800
CIE x
0.4223
0.4153
0.4116
0.4049
0.4018
0.4147
CIE y
0.4055
0.4145
0.4122
0.4212
0.4260
0.4077
CIE x
0.4147
0.4223
0.4284
0.4243
0.4302
0.4259
CIE y
0.4118
0.4211
0.4197
0.4289
0.4319
0.4132
CIE x
0.4373
0.4468
0.4526
0.4477
0.4534
0.4483
CIE x
0.3784
0.3806
0.3865
0.3890
0.3952
0.3898
CIE y
0.3990
0.3955
0.3865
0.3833
0.3752
0.3814
CIE x
0.4299
0.4148
0.4113
0.4186
0.4153
0.4223
CIE y
0.3814
0.3990
0.4011
0.3922
0.3943
0.3853
CIE x
0.4259
0.4302
0.4361
0.4406
0.4468
0.4373
CIE y
0.3893
0.4077
0.4090
0.3998
0.4012
0.3919
CIE x
0.4483
0.4534
0.4591
0.4644
0.4703
0.4593
CIE y
0.4165
0.4090
0.4002
0.4037
0.3955
0.3990
G24
H23
15
CIE y
0.3647
0.3725
0.3762
0.3842
0.3880
0.3716
F24
G23
H22
Rev3.0, April 1, 2014
E24
CIE y
0.3578
0.3726
0.3765
0.3689
0.3725
0.3647
F23
G22
H21
CIE x
0.4468
0.4562
0.4687
0.4636
0.4575
0.4526
CIE x
0.3670
0.3703
0.3765
0.3746
0.3806
0.3784
F22
G21
CIE x
0.4223
0.4299
0.4430
0.4387
0.4324
0.4284
E23
CIE y
0.3842
0.3922
0.3881
0.3959
0.4044
0.3880
CIE y
0.3853
0.3943
0.3964
0.4055
0.4077
0.3893
H24
CIE y
0.3919
0.4012
0.4025
0.4118
0.4132
0.3944
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Product Data Sheet
ZC6 – Chip on Board
Mechanical Dimensions
Circuit
Cathode
X 12
X 12
Anode
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) Undefined tolerance is ±0.2mm
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Product Data Sheet
ZC6 – Chip on Board
Packaging Specification
Notes :
(1) Quantity : 30pcs/Tray
(2) All dimensions are in millimeters (tolerance : ±0.3)
(3) Scale none
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Product Data Sheet
ZC6 – Chip on Board
Packaging Specification
Notes :
(1) Heat Sealed after packing (Use Zipper Bag)
(2) Quantity : 3Tray(90pcs) /Bag
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Product Data Sheet
ZC6 – Chip on Board
Product Nomenclature
Table 5. Part Numbering System : X1X2X3 X4X5 X6X7 X8
Part Number Code
Description
Part Number
Value
X1
Company
S
X2
Package series
D
X3X4
Color Specification
W0
White
W8
CRI 80
W9
CRI 90
X5
Series number
1
X6
Lens type
F
Flat
X7
PCB type
1
PCB
X8
Revision number
C
New COB type
Table 6. Lot Numbering System : Y1Y2Y3Y4Y5Y6 – Y7Y8Y9Y10 – Y11Y12Y13
Lot Number Code
Description
Y1Y2
Year
Y3Y4
Month
Y5Y6
Day
Y7Y8Y9Y10
Mass order
Y11Y12Y13
Tray No.
Rev3.0, April 1, 2014
Lot Number
19
Value
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Product Data Sheet
ZC6 – Chip on Board
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
(3) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As
mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of wire.
(4) Seoul Semiconductor suggests using isopropyl alcohol for cleaning.
In case other solvents are used, it must be
assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not
recommended. Ultrasonic cleaning may cause damage to the LED.
(5) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this
product with acid or sulfur material in sealed space.
(6) Avoid leaving fingerprints on silicone resin parts.
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Product Data Sheet
ZC6 – Chip on Board
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend storing Power LEDs in a dry box with a
desiccant.
The recommended storage temperature range is 5C to 30C and a maximum humidity of 50%.
(2) Use Precaution after Opening the Packaging. Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 4 week or the color of the desiccant changes.
(3) For manual soldering
Seoul Semiconductor recommends the soldering condition
(ZC series product is not adaptable to reflow process)
a. Use lead-free soldering
b. Soldering should be implemented using a soldering equipment at temperature lower than 350°C.
c. Before proceeding the next step, product temperature must be stabilized at room temperature.
(4) Components should not be mounted on warped (non coplanar) portion of PCB.
(5) Radioactive exposure is not considered for the products listed here in.
(6) It is dangerous to drink the liquid or inhale the gas generated by such products when chemically
disposed of.
(7) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(8) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(9) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more
after being shipped from Seoul Semiconductor,
a sealed container with vacuum atmosphere should be used for storage.
(10) The appearance and specifications of the product may be modified for improvement without
notice.
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Product Data Sheet
ZC6 – Chip on Board
Precaution for Use
(11) Long time exposure of sun light or occasional UV exposure will cause silicone discoloration.
(12) Attaching LEDs, do not use adhesive that outgas organic vapor.
(13) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the
reverse voltage is applied to LED, migration can be generated resulting in LED damage.
(14) Please do not touch any of the circuit board, components or terminals with bare hands or metal
while circuit is electrically active.
(15) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic
energy. The result can be a significant loss of light output from the fixture. Knowledge of the
properties of the materials selected to be used in the construction of fixtures can help prevent
these issues.
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact. While most ESD events are considered harmless, it can be an expensive problem in
many industrial environments during production and storage. The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as:
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event.
One or more recommended work area suggestions:
- Ionizing fan setup
- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options:
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls:
- Humidity control (ESD gets worse in a dry environment)
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Product Data Sheet
ZC6 – Chip on Board
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
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Product Data Sheet
ZC6 – Chip on Board
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage
and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than
10,000 patents globally, while offering a wide range of LED technology and production capacity in
areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type
LEDs as well as custom modules, displays, and sensors.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party. The appearance and specifications of the product can be changed
to improve the quality and/or performance without notice.
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