09/13/2004 RELIABILITY REPORT FOR DS1249W Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected] ph: 972-371-3726 fax: 972-371-6016 mbl: 214-435-6610 Conclusion: The following qualification successfully meets the quality and reliability standards required of all Dallas Semiconductor products and processes: DS1249W In addition, Dallas Semiconductor's continuous reliability monitor program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. The current status of the reliability monitor program can be viewed at http://www.maxim-ic.com/TechSupport /dsreliability.html.* Module Description: A description of this Module can be found in the product data sheet. You can find the product data sheet at http://dbserv.maxim-ic.com/l_datasheet3.cfm.* Reliability Derating: A module device consists of one or more IC's in a single, upward integrated, package. This package is assembled to include batteries, crystals, and other piece parts that make up the configuration of the Module. Because of either the complexity of the package or the included piece parts, standard high temperature reliability testing is not possible. Therefore, in order to determine the reliability of module products, the reliability of each of the piece parts is individually determined, then summed to determine the reliability of the integrated module product. If there are "n" significant components in the module then: Fr (module) = Fr (1) + Fr (2) + Fr (3) + ..... + Fr (n) Fr (module) = Failure rate of module Fr(n) = Failure rate of the nth component Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate is related to MTTF by: MTTF = 1/Fr NOTE: MTTF is frequently used interchangeably with MTBF. The calculated failure rate for this module/assembly is: Module Device: Module Units: Quantity: Fails: Ea: MTTF (Yrs): FITs: 1 MEG SRAM 5V BR1632 2 1 1789 100 0 1 0.7 1.0 95331 47996 1.2 2.4 DS1323 1 77 0 0.7 9048 12.6 7050 16.2 Totals: The parameters used to calculate the module failure rate are as follows: Cf: 60% Tu: 25 °C The reliability data follows. A the start of this data is the module assembly information. This is a description of the module. The next section is the detailed reliability data for each stress found in the qualification / monitor. If there are additional processes or assemblies used as part of this report, a description of each will follow which includes the respective reliability data for that process/ assembly. The reliability data section includes the latest data available. Some of this data may be generic with other packages or products. * Some proprietary products may be excepted from this requirement. Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: Fastech 28 Module w/Hi Density SMT 720 Amicon PCB; FR4 ? / UL 94-V0 0104 to 0404 PACKAGE TESTS DESCRIPTION DATE CD CONDITION READPOINT QTY FAILS SOLDERABILITY 0104 MIL-STD-883-2003 5 DYS 3 0 PHYSICAL DIMENSIONS 0104 MIL-STD-883-2016 5 DYS 6 0 SOLDERABILITY 0317 JESD22-B102 5 DYS 3 0 PHYSICAL DIMENSIONS 0317 JESD22-B100 5 DYS 6 0 SOLDERABILITY 0333 JESD22-B102 5 DYS 3 0 PHYSICAL DIMENSIONS 0333 JESD22-B100 5 DYS 6 0 SOLDERABILITY 0404 JESD22-B102 5 DYS 3 0 PHYSICAL DIMENSIONS 0404 JESD22-B100 5 DYS 6 0 Total: FA# 0 STORAGE LIFE DESCRIPTION DATE CD CONDITION READPOINT QTY FAILS STORAGE LIFE 0104 70 C 1000 HRS 77 0 STORAGE LIFE 0317 70 C 1000 HRS 77 0 STORAGE LIFE 0333 70 C 1000 HRS 77 0 STORAGE LIFE 0404 70 C 1000 HRS 77 0 Total: FA# 0 TEMPERATURE CYCLE DESCRIPTION DATE CD CONDITION READPOINT TEMP CYCLE 0104 1000 CYS 0C TO 70C QTY FAILS 77 0 FA# TEMP CYCLE 0317 0C TO 70C 1000 CYS 77 0 TEMP CYCLE 0333 0C TO 70C 1000 CYS 77 0 TEMP CYCLE 0404 0C TO 70C 1000 CYS 77 0 Total: 0 UNBIASED MOISTURE RESISTANCE DESCRIPTION DATE CD CONDITION READPOINT QTY FAILS MOISTURE SOAK 0317 60C/90% R.H. 1000 HRS 77 0 MOISTURE SOAK 0333 60C/90% R.H. 1000 HRS 77 0 MOISTURE SOAK 0404 60C/90% R.H. 1000 HRS 77 1 Total: Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: FA# MODULE TRIM 1 Fastech 32 Module w/Hi Density SMT 720 Amicon PCB; FR4 ? / UL 94-V0 0101 to 0422 ELECTRICAL CHARACTERIZATION DESCRIPTION DATE CD CONDITION READPOINT QTY FAILS ESD SENSITIVITY 0139 EOS/ESD S5.1 HBM 500 VOLTS 2 PUL'S 3 0 ESD SENSITIVITY 0139 EOS/ESD S5.1 HBM 1000 VOLTS 2 PUL'S 3 0 ESD SENSITIVITY 0139 EOS/ESD S5.1 HBM 2000 VOLTS 3 PUL'S 3 0 LATCH-UP 0139 JESD78, I-TEST 125C 2 DYS 3 0 LATCH-UP 0139 JESD78, Vsupply TEST 125C 2 DYS 3 0 Total: FA# 0 PACKAGE TESTS DESCRIPTION DATE CD CONDITION READPOINT SOLDERABILITY 0422 JESD22-B102 1 DYS 3 0 SOLDERABILITY 0422 JESD22-B102 1 DYS 3 0 SOLDERABILITY 0422 JESD22-B102 1 DYS 3 0 Total: QTY FAILS FA# 0 STORAGE LIFE DESCRIPTION DATE CD CONDITION READPOINT QTY FAILS FA# STORAGE LIFE 0139 85 C 1000 HRS 49 Total: 0 0 TEMPERATURE CYCLE DESCRIPTION DATE CD CONDITION READPOINT TEMP CYCLE 0139 1000 CYS -40 TO 85C QTY FAILS 50 Total: FA# 0 0 TEMPERATURE HUMIDITY BIAS DESCRIPTION DATE CD CONDITION READPOINT BIASED MOISTURE 0422 85/85, 5.5 VOLTS 1000 HRS 77 0 BIASED MOISTURE 0422 85/85, 5.5 VOLTS 1000 HRS 77 0 BIASED MOISTURE 0422 85/85, 5.5 VOLTS 500 77 0 HRS QTY FAILS Total: FA# 0 UNBIASED MOISTURE RESISTANCE DESCRIPTION DATE CD CONDITION READPOINT QTY FAILS MOISTURE SOAK 0101 60C/90% R.H. 576 HRS 56 0 MOISTURE SOAK 0139 60C/90% R.H. 960 HRS 50 0 MOISTURE SOAK 0422 60C/90% R.H. 1000 HRS 77 0 MOISTURE SOAK 0422 60C/90% R.H. 1000 HRS 77 0 MOISTURE SOAK 0422 60C/90% R.H. 1000 HRS 77 0 Total: Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: FA# 0 Fastech 36 Module w/Hi Density SMT 720 Amicon PCB; FR4 ? / UL 94-V0 0139 to 0139 ELECTRICAL CHARACTERIZATION DESCRIPTION DATE CD CONDITION READPOINT QTY FAILS ESD SENSITIVITY 0139 EOS/ESD S5.1 HBM 500 VOLTS 2 PUL'S 3 0 ESD SENSITIVITY 0139 EOS/ESD S5.1 HBM 1000 VOLTS 2 PUL'S 3 0 ESD SENSITIVITY 0139 EOS/ESD S5.1 HBM 2000 VOLTS 2 PUL'S 3 0 LATCH-UP 0139 JESD78, I-TEST 125C 2 DYS 3 0 LATCH-UP 0139 JESD78, Vsupply TEST 125C 2 DYS 3 0 FA# Total: 0 STORAGE LIFE DESCRIPTION DATE CD CONDITION READPOINT STORAGE LIFE 0139 1000 HRS 85 C QTY FAILS 77 Total: FA# 0 0 TEMPERATURE CYCLE DESCRIPTION DATE CD CONDITION READPOINT TEMP CYCLE 0139 1000 CYS -40 TO 85C QTY FAILS 76 Total: FA# 0 0 UNBIASED MOISTURE RESISTANCE DESCRIPTION DATE CD CONDITION READPOINT MOISTURE SOAK 0139 960 60C/90% R.H. HRS Total: QTY FAILS 76 0 0 FA#