10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected] ph: 972-371-3726 fax: 972-371-6016 mbl: 214-435-6610 Conclusion: The following qualification successfully meets the quality and reliability standards required of all Dallas Semiconductor packages: 32 TSOP 8mm In addition, Dallas Semiconductor's continuous reliability monitor program ensures that all outgoing assemblies will continue to meet Maxim's quality and reliability standards. The current status of the reliability monitor program can be viewed at http://www.maxim-ic.com/TechSupport /dsreliability.html. Package Description: A description of this assembly can be found in the product data sheet. You can find the product data sheet at http://dbserv.maxim-ic.com/l_datasheet3.cfm. Reliability Derating: The Arrhenius model will be used to determine the acceleration factor for failure mechanisms that are temperature accelerated. AfT = exp((Ea/k)*(1/Tu - 1/Ts)) = tu/ts AfT = Acceleration factor due to Temperature tu = Time at use temperature (e.g. 55°C) ts = Time at stress temperature (e.g. 125°C) k = Boltzmann’s Constant (8.617 x 10-5 eV/°K) Tu = Temperature at Use (°K) Ts = Temperature at Stress (°K) Ea = Activation Energy (e.g. 0.7 ev) The activation energy of the failure mechanism is derived from either internal studies or industry accepted standards, or activation energy of 0.7ev will be used whenever actual failure mechanisms or their activation energies are unknown. All deratings will be done from the stress ambient temperature to the use ambient temperature. An exponential model will be used to determine the acceleration factor for failure mechanisms, which are voltage accelerated. AfV = exp(B*(Vs - Vu)) AfV = Acceleration factor due to Voltage Vs = Stress Voltage (e.g. 7.0 volts) Vu = Maximum Operating Voltage (e.g. 5.5 volts) B = Constant related to failure mechanism type (e.g. 1.0, 2.4, 2.7, etc.) The Constant, B, related to the failure mechanism is derived from either internal studies or industry accepted standards, or a B of 1.0 will be used whenever actual failure mechanisms or their B are unknown. All deratings will be done from the stress voltage to the maximum operating voltage. Failure rate data from the operating life test is reported using a Chi-Squared statistical model at the 60% or 90% confidence level (Cf). The failure rate, Fr, is related to the acceleration during life test by: Fr = X/(ts * AfV * AfT * N * 2) X = Chi-Sq statistical upper limit N = Life test sample size Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate is related to MTTF by: MTTF = 1/Fr NOTE: MTTF is frequently used interchangeably with MTBF. The calculated failure rate for this device/process is: FAILURE RATE: MTTF (YRS): 37651 FITS: 3.0 The parameters used to calculate this failure rate are as follows: Cf: 60% Ea: 0.7 B: 0 Tu: 25 °C Vu: 5.5 Volts The reliability data follows. Some of the data in this report may be generic. A the start of this data is a description of the assembly vehicle used to generate this reliability data. The next section is the detailed reliability data for each stress. If there are additional assemblies used as part of this report, a description of each will follow which includes the respective reliability data for that assembly. Where appropriate, preconditioning is performed before all stresses and the bond crater test unless otherwise noted. The reliability data section includes the latest data available. Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: ASE 28 TSOP 8x13.4x0.965 Sumitomo G700 Stamped Alloy 42 Sn Plate 100% Matte Sumitomo 1076 DS Au / 1.0 mil UL 94-V0 Level 3 0429 to 0429 PACKAGE TESTS DESCRIPTION DATE CODE CONDITION SOLDERABILITY 0429 READPOINT JESD22-B102 QTY FAILS 15 Total: 0 0 FA# Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: ATK (Amkor, K) 28 TSOP 8x13.4x0.965 Sumitomo 7351T Stamped Copper C7025 SnPb Plate 8361J Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 0223 to 0303 OPERATING LIFE DESCRIPTION DATE CODE CONDITION READPOINT QTY FAILS HIGH VOLTAGE LIFE 0223 125C, 7.0 VOLTS 1000 HRS 80 0 HIGH VOLTAGE LIFE 0223 125C, 7.0 VOLTS 1000 HRS 160 0 HIGH VOLTAGE LIFE 0303 125C, 6.0 VOLTS 1000 HRS 77 0 Total: Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: FA# 0 ATK (Amkor, K) 32 TSOP 8x20x1.0 Sumitomo 7351T Stamped Copper C7025 SnPb Plate 8361J Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 0038 to 0303 MOISTURE SENSITIVITY LEVEL 3 DESCRIPTION DATE CODE CONDITION ULTRASOUND 0038 READPOINT J-STD-020 QTY FAILS 8 0 STORAGE LIFE 125C 24 HRS 8 MOISTURE SOAK 30C/60% R.H. 240 HRS 8 CONVECTION REFLOW 235C +5/-0C 3 PASS 8 0 EXTERNAL VISUAL MIL-STD-883-2009 8 0 PRECONDITION U/S J-STD-020 8 0 Total: FA# 0 OPERATING LIFE DESCRIPTION DATE CODE CONDITION READPOINT QTY FAILS FA# HIGH VOLTAGE LIFE 0038 125C, 6.0 VOLTS 1000 HRS 116 0 HIGH VOLTAGE LIFE 0303 125C, 6.0 VOLTS 1000 HRS 77 0 Total: 0 PACKAGE TESTS DESCRIPTION DATE CODE CONDITION READPOINT QTY FAILS SOLDERABILITY 0038 MIL-STD-883-2003 3 0 X-RAY 0038 MIL-STD-883-2012 : TOP & SIDE VIEW 6 0 PHYSICAL DIMENSIONS MIL-STD-883-2016 6 0 MARK PERMANENCY MIL-STD-883-2015 6 0 LEAD INTEGRITY MIL-STD-883-2004 : COND B2 6 0 Total: FA# 0 PRECONDITIONING LEVEL 3 DESCRIPTION DATE CODE CONDITION READPOINT STORAGE LIFE 0038 QTY FAILS 125C 24 HRS 315 MOISTURE SOAK 30C/60% R.H. 240 HRS 315 CONVECTION REFLOW 235C +5/-0C 3 PASS 315 Total: FA# 0 0 TEMPERATURE CYCLE DESCRIPTION DATE CODE CONDITION READPOINT TEMP CYCLE 0038 1000 CYS -55C TO 125C QTY FAILS 77 Total: FA# 0 0 TEMPERATURE HUMIDITY BIAS DESCRIPTION DATE CODE CONDITION READPOINT HAST 0038 100 130C, 85%R.H.,5.5V HRS QTY FAILS 77 Total: FA# 0 0 UNBIASED MOISTURE RESISTANCE DESCRIPTION DATE CODE CONDITION READPOINT HAST, NO BIAS 0038 200 130C, 85% R.H. HRS Total: Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: ATP (Amkor, PI) 28 TSOP 8x13.4x0.965 Sumitomo 7351T Stamped Copper C7025 SnPb Plate 8361J Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 9921 to 9924 QTY FAILS 45 0 0 FA# MOISTURE SENSITIVITY LEVEL 3 DESCRIPTION DATE CODE CONDITION PRECONDITION U/S 9921 READPOINT QTY FAILS J-STD-020 6 0 EXTERNAL VISUAL MIL-STD-883-2009 8 0 ULTRASOUND J-STD-020 8 0 STORAGE LIFE 125C 24 HRS 8 MOISTURE SOAK 30C/60% R.H. 240 HRS 8 CONVECTION REFLOW 235C +5/-0C 3 PASS 8 0 PRECONDITION U/S J-STD-020 8 0 ULTRASOUND 9921 J-STD-020 8 0 STORAGE LIFE 125C 24 HRS 8 MOISTURE SOAK 30C/60% R.H. 240 HRS 8 CONVECTION REFLOW 235C +5/-0C 3 PASS 8 0 EXTERNAL VISUAL MIL-STD-883-2009 8 0 Total: FA# 0 OPERATING LIFE DESCRIPTION DATE CODE CONDITION READPOINT QTY FAILS HIGH VOLTAGE LIFE 9921 125C, 7.0 VOLTS 1000 HRS 116 0 HIGH VOLTAGE LIFE 9924 125C, 7.0 VOLTS 1000 HRS 116 1 Total: FA# 990165 1 PACKAGE TESTS DESCRIPTION DATE CODE CONDITION READPOINT QTY FAILS CONSTRUCTION ANALYSIS 9921 SENT TO OUTSIDE SOURCE 5 0 SOLDERABILITY 9921 MIL-STD-883-2003 3 0 X-RAY 9921 MIL-STD-883-2012 : TOP & SIDE VIEW 6 0 PHYSICAL DIMENSIONS MIL-STD-883-2016 6 0 MARK PERMANENCY MIL-STD-883-2015 6 0 LEAD INTEGRITY MIL-STD-883-2004 : COND B2 6 0 SOLDERABILITY 9921 MIL-STD-883-2003 3 0 X-RAY 9921 MIL-STD-883-2012 : TOP & SIDE VIEW 6 0 PHYSICAL DIMENSIONS MIL-STD-883-2016 6 0 MARK PERMANENCY MIL-STD-883-2015 6 0 LEAD INTEGRITY MIL-STD-883-2004 : COND B2 6 0 Total: FA# 0 PRECONDITIONING LEVEL 3 DESCRIPTION DATE CODE CONDITION READPOINT STORAGE LIFE 9921 QTY FAILS 125C 24 HRS 356 MOISTURE SOAK 30C/60% R.H. 240 HRS 356 CONVECTION REFLOW 235C +5/-0C 3 PASS 356 Total: FA# 0 0 TEMPERATURE CYCLE DESCRIPTION DATE CODE CONDITION READPOINT QTY FAILS TEMP CYCLE 9921 -55C TO 125C 1000 CYS 77 0 TEMP CYCLE 9921 -55C TO 125C 1000 CYS 91 0 FA# Total: 0 TEMPERATURE HUMIDITY BIAS DESCRIPTION DATE CODE CONDITION READPOINT HAST 9921 130C, 85%R.H.,5.5V 100 HAST 9921 130C, 85%R.H.,5.5V 100 QTY FAILS HRS 45 1 HRS 90 0 Total: FA# No FA 1 UNBIASED MOISTURE RESISTANCE DESCRIPTION DATE CODE CONDITION READPOINT HAST, NO BIAS 9921 130C, 85% R.H. 200 HAST, NO BIAS 9921 130C, 85% R.H. 200 QTY FAILS HRS 45 0 HRS 55 0 Total: Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: FA# 0 ATP (Amkor, PI) 32 TSOP 8x20x1.0 Sumitomo 7351T Stamped Copper C7025 SnPb Plate 8361J Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 9913 to 0106 MOISTURE SENSITIVITY LEVEL 3 DESCRIPTION DATE CODE CONDITION PRECONDITION U/S 9913 READPOINT QTY FAILS J-STD-020 8 0 ULTRASOUND J-STD-020 8 0 STORAGE LIFE 125C HRS 8 MOISTURE SOAK 30C/60% R.H. 240 HRS 8 CONVECTION REFLOW 235C +5/-0C 3 PASS 8 0 EXTERNAL VISUAL MIL-STD-883-2009 8 0 Total: FA# 0 OPERATING LIFE DESCRIPTION DATE CODE CONDITION READPOINT QTY FAILS HIGH VOLTAGE LIFE 9913 125C, 6.0 VOLTS 1000 HRS 85 0 HIGH VOLTAGE LIFE 0106 125C, 6.0 VOLTS 1000 HRS 256 2 Total: FA# iBATT LEAK 2 PACKAGE TESTS DESCRIPTION DATE CODE CONDITION READPOINT QTY FAILS SOLDERABILITY 9913 MIL-STD-883-2003 3 0 X-RAY 9913 MIL-STD-883-2012 : TOP & SIDE VIEW 6 0 FA# PHYSICAL DIMENSIONS 9913 MIL-STD-883-2016 6 0 MARK PERMANENCY MIL-STD-883-2015 6 0 LEAD INTEGRITY MIL-STD-883-2004 : COND B2 6 0 Total: 0 PRECONDITIONING LEVEL 3 DESCRIPTION DATE CODE CONDITION READPOINT QTY FAILS STORAGE LIFE 9913 125C 24 HRS 315 MOISTURE SOAK 30C/60% R.H. 240 HRS 315 CONVECTION REFLOW 235C +5/-0C 3 PASS 315 Total: FA# 0 0 TEMPERATURE CYCLE DESCRIPTION DATE CODE CONDITION READPOINT TEMP CYCLE 9913 1000 CYS -55C TO 125C QTY FAILS 70 Total: FA# 0 0 TEMPERATURE HUMIDITY BIAS DESCRIPTION DATE CODE CONDITION READPOINT HAST 9913 100 130C, 85%R.H.,5.5V HRS QTY FAILS 70 Total: FA# 0 0 UNBIASED MOISTURE RESISTANCE DESCRIPTION DATE CODE CONDITION READPOINT HAST, NO BIAS 9913 200 130C, 85% R.H. HRS QTY FAILS 40 Total: Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: FA# 0 0 NSEB 28 TSOP 8x13.4x0.965 Ciba-Geigy Aratonic 2184-4 (KMC 184) Stamped Copper C7025 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 0432 to 0432 PACKAGE TESTS DESCRIPTION DATE CODE CONDITION SOLDERABILITY 0432 READPOINT JESD22-B102 QTY FAILS 8 Total: 0 0 FA# Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: NSEB 32 TSOP 8x20x1.0 Ciba-Geigy Aratonic 2184-4 (KMC 184) Stamped Copper C7025 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 0145 to 0324 CONSTRUCTION ANALYSIS DESCRIPTION DATE CODE CONDITION CONSTRUCTION ANALYSIS 0146 READPOINT TO BE SUBMITTED BY ASSEMBLY SITE QTY FAILS 3 Total: FA# 0 0 MOISTURE SENSITIVITY LEVEL 3 DESCRIPTION DATE CODE CONDITION ULTRASOUND 0145 READPOINT J-STD-020 QTY FAILS 8 0 STORAGE LIFE 125C 24 HRS 8 MOISTURE SOAK 30C/60% R.H. 192 HRS 8 CONVECTION REFLOW 235C +5/-0C 3 PASS 8 0 EXTERNAL VISUAL J-STD-020, 6.1a 8 0 PRECONDITION U/S J-STD-020 8 0 8 0 ULTRASOUND 0146 J-STD-020 STORAGE LIFE 125C 24 HRS 8 MOISTURE SOAK 30C/60% R.H. 192 HRS 8 CONVECTION REFLOW 235C +5/-0C 3 PASS 8 0 EXTERNAL VISUAL J-STD-020, 6.1a 8 0 PRECONDITION U/S J-STD-020 8 0 8 0 ULTRASOUND 0147 J-STD-020 STORAGE LIFE 125C 24 HRS 8 MOISTURE SOAK 30C/60% R.H. 192 HRS 8 CONVECTION REFLOW 235C +5/-0C 3 PASS 8 0 EXTERNAL VISUAL J-STD-020, 6.1a 8 0 PRECONDITION U/S J-STD-020 8 0 Total: FA# 0 OPERATING LIFE DESCRIPTION DATE CODE CONDITION READPOINT QTY FAILS HIGH VOLTAGE LIFE 0145 125C, 6.0 VOLTS 1000 HRS 70 0 HIGH VOLTAGE LIFE 0146 125C, 6.0 VOLTS 1000 HRS 77 0 HIGH VOLTAGE LIFE 0147 125C, 6.0 VOLTS 1000 HRS 77 0 HIGH TEMP OP LIFE 0324 125C, 5.5 VOLTS 1000 HRS 77 0 FA# HIGH TEMP OP LIFE 0324 125C, 5.5 VOLTS 988 HRS 77 Total: 0 0 PACKAGE TESTS DESCRIPTION DATE CODE CONDITION SOLDERABILITY 0145 X-RAY 0145 READPOINT QTY FAILS JESD22-B102 3 0 MIL-STD-883-2012 : TOP & SIDE VIEW 6 0 PHYSICAL DIMENSIONS JESD22-B100 6 0 MARK PERMANENCY JESD22-B107 6 0 LEAD INTEGRITY JESD22-B105 TEST CONDITION B 6 0 SOLDERABILITY 0146 JESD22-B102 3 0 X-RAY 0146 MIL-STD-883-2012 : TOP & SIDE VIEW 6 0 PHYSICAL DIMENSIONS JESD22-B100 6 0 MARK PERMANENCY JESD22-B107 6 0 LEAD INTEGRITY JESD22-B105 TEST CONDITION B 6 0 SOLDERABILITY 0147 JESD22-B102 3 0 X-RAY 0147 MIL-STD-883-2012 : TOP & SIDE VIEW 6 0 PHYSICAL DIMENSIONS JESD22-B100 6 0 MARK PERMANENCY JESD22-B107 6 0 LEAD INTEGRITY JESD22-B105 TEST CONDITION B 6 0 Total: FA# 0 PRECONDITIONING LEVEL 3 DESCRIPTION DATE CODE CONDITION READPOINT STORAGE LIFE 0145 QTY FAILS 125C 24 HRS 308 MOISTURE SOAK 30C/60% R.H. 192 HRS 308 CONVECTION REFLOW 235C +5/-0C 3 PASS 308 STORAGE LIFE 125C 24 HRS 308 MOISTURE SOAK 30C/60% R.H. 192 HRS 308 CONVECTION REFLOW 235C +5/-0C 3 PASS 308 STORAGE LIFE 0146 125C 24 HRS 308 MOISTURE SOAK 0147 30C/60% R.H. 192 HRS 308 CONVECTION REFLOW 235C +5/-0C 3 PASS 308 Total: FA# 0 0 0 0 TEMPERATURE CYCLE DESCRIPTION DATE CODE CONDITION READPOINT QTY FAILS TEMP CYCLE 0145 -55C TO 125C 1000 CYS 70 0 TEMP CYCLE 0146 -55C TO 125C 1000 CYS 77 0 TEMP CYCLE 0147 -55C TO 125C 1000 CYS 77 0 Total: FA# 0 TEMPERATURE HUMIDITY BIAS DESCRIPTION DATE CODE CONDITION READPOINT QTY FAILS HAST 0145 130C, 85%R.H.,5.5V 100 HRS 44 0 HAST 0146 130C, 85%R.H.,5.5V 100 HRS 77 0 HAST 0147 130C, 85%R.H.,5.5V 100 HRS 77 0 FA# Total: 0 UNBIASED MOISTURE RESISTANCE DESCRIPTION DATE CODE CONDITION READPOINT HAST, NO BIAS 0145 130C, 85% R.H. 200 HRS 44 0 HAST, NO BIAS 0146 130C, 85% R.H. 200 HRS 74 0 HAST, NO BIAS 0147 130C, 85% R.H. 200 HRS 73 0 Total: FAILURE RATE: MTTF (YRS): 37651 FITS: 3.0 QTY FAILS 0 FA#