Data Sheet - Hittite Microwave

Analog Devices Welcomes
Hittite Microwave Corporation
NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED
www.analog.com
www.hittite.com
THIS PAGE INTENTIONALLY LEFT BLANK
HMC168C8
v02.1105
GaAs MMIC SMT DOUBLEBALANCED MIXER, 4.5 - 8 GHz
Typical Applications
Features
The HMC168C8 is ideal for:
Conversion Loss: 8.2 dB
• Microwave Point-to-Point Radios
LO to RF and IF Isolation: 34 dB
• 5.8 GHz ISM Band Circuits
Surface Mount
Small Size, No DC Bias Required
Functional Diagram
MIXERS - DBL-BAL - SMT
9
General Description
The HMC168C8 is a miniature double-balanced mixer
in a non-hermetic ceramic surface mount package
that can be used as an upconverter, downconverter
or biphase modulator. The device is a passive diode/
balun type mixer with high dynamic range. Noise
figure is essentially equal to the conversion loss.
The mixer can handle larger signal levels than most
active mixers due to the high third order intercept.
MMIC implementation provides exceptional balance
in the circuit resulting in high LO/RF and LO/IF
isolations and unit-to-unit consistency. This mixer
has applications where small size and surface mount
compatibility are important.
Electrical Specifi cations, TA = +25° C, LO Drive = +10 dBm
Parameter
Min.
Frequency Range, RF & LO
Frequency Range, IF
9 - 42
Typ.
Max.
4.5 - 8.0
Units
GHz
DC - 2
GHz
Conversion Loss
8.2
10
dB
Noise Figure (SSB)
8.2
10
dB
LO to RF Isolation
29
35
LO to IF Isolation
30
34
dB
IP3 (Input)
12
16
dBm
IP2 (Input)
55
62
dBm
1 dB Gain Compression (Input)
7
10
dBm
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
dB
HMC168C8
v02.1105
GaAs MMIC SMT DOUBLEBALANCED MIXER, 4.5 - 8 GHz
Isolation
Conversion Loss
CONVERSION LOSS (dB)
0
0
-10
ISOLATION (dB)
-5
-10
-15
RF/IF
-20
LO/RF
-30
LO /IF
LO/RF
-60
0
1
2
3
4
5
6
7
8
9
10
11
0
1
2
3
4
5
6
7
8
9
10
11
FREQUENCY (GHz)
RF FREQUENCY (GHz)
Distortion and 1dB
Compression vs. LO Drive Level
Conversion Loss vs. LO Power
Distortion
-5
LO
Drive
-7.5
-10
+15dBm
+10dBm
+13dBm
-12.5
+9dBm
+8dBm
-15
0
1
2
3
4
5
6
7
8
9
10 11
9
10
RF (f1) = 6.01 GHz
RF (f2) = 6.00 GHz
LO = 6.5 GHz
RF Level = 0 dBm
1 dB
Compression
(dBm)
IP3 (dBm)
IP2 (dBm)
P1dB (dBm)
+7
14
59
8.5
+10
16
62
10
+13
18
65
11
+15
19
65
11
MIXERS - DBL-BAL - SMT
-50
-20
CONVERSION LOSS (dB)
9
LO /IF
-40
RF FREQUENCY (GHz)
Return Loss
0
RETURN LOSS (dB)
LO
-10
IF
-20
RF
-30
-40
0
1
2
3
4
5
6
7
8
11
FREQUENCY (GHz)
S - Paremeters for the RF, LO, IF Ports are Available On-Line at www.hittite.com
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9 - 43
HMC168C8
v02.1105
GaAs MMIC SMT DOUBLEBALANCED MIXER, 4.5 - 8 GHz
Absolute Maximum Ratings
MIXERS - DBL-BAL - SMT
9
RF / IF Input
+13 dBm
LO Drive
+27 dBm
Storage Temperature
-65 to +150 °C
Operating Temperature
-55 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
NOTES:
1. PACKAGE BODY MATERIAL: WHITE ALUMINA 92%
2. LEAD, PACKAGE BOTTOM MATERIAL: COPPER
3. PLATING: ELECTROLYTIC GOLD 100-200 MICROINCHES, OVER
ELECTROLYTIC NICKEL 100-250 MICROINCHES.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. PACKAGE LENGTH AND WIDTH DIMENSIONS DO NOT INCLUDE LID
SEAL PROTRUSION .005 PER SIDE.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
9 - 44
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC168C8
v02.1105
GaAs MMIC SMT DOUBLEBALANCED MIXER, 4.5 - 8 GHz
Evaluation PCB
MIXERS - DBL-BAL - SMT
9
List of Materials for Evaluation PCB 102102 [1]
Item
Description
J1 - J3
PCB Mount SMA RF Connector
U1
HMC168C8 Mixer
PCB [2]
107214 Evaluation Board
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
The circuit board used in the final application should
use RF circuit design techniques. Signal lines
should have 50 ohm impedance while the package
ground leads and exposed paddle should be connected directly to the ground plane similar to that
shown. A sufficient number of via holes should be
used to connect the top and bottom ground planes.
The evaluation circuit board shown is available from
Hittite upon request.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9 - 45