Spec. No. : C975F3 Issued Date : 2014.08.13 Revised Date : 2015.09.04 Page No. : 1/9 CYStech Electronics Corp. P-Channel Enhancement Mode Power MOSFET MTB050P10F3 BVDSS -100V ID @ VGS=-10V, TC=25°C RDSON(TYP) @ VGS=-10V, ID=-20A -40A 46mΩ RDSON(TYP) @ VGS=-4.5V, ID=-15A 52mΩ Features • Low Gate Charge • Simple Drive Requirement • Repetitive Avalanche Rated • Fast Switching Characteristic • RoHS compliant package Symbol Outline TO-263 MTB050P10F3 G：Gate D：Drain S：Source G D S Ordering Information Device Package Shipping TO-263 MTB050P10F3-0-T7-X 800 pcs / Tape & Reel (Pb-free lead plating and RoHS compliant package) Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T7 : 800 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name MTB050P10F3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C975F3 Issued Date : 2014.08.13 Revised Date : 2015.09.04 Page No. : 2/9 Absolute Maximum Ratings (TC=25°C, unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @ TC=25°C, VGS=-10V Continuous Drain Current @ TC=100°C, VGS=-10V Pulsed Drain Current Continuous Drain Current @ TA=25°C , VGS=10V Continuous Drain Current @ TA=70°C , VGS=10V Avalanche Current Avalanche Energy @ L=1mH, ID=-21A, RG=25Ω Repetitive Avalanche Energy@ L=0.1mH TC=25°C Power Dissipation TC=100°C TA=25°C Power Dissipation TA=70°C Operating Junction and Storage Temperature Symbol Limits VDS VGS -100 ±20 -40 -28 -140 -3.9 -3.1 25 221 20 200 100 2 1.3 -55~+175 ID (Note 3) (Note 2) (Note 2) (Note 3) (Note 2) (Note 3) (Note 1) (Note 1) (Note 2) (Note 2) IDM IDSM IAS EAS EAR PD PDSM Tj, Tstg Unit V A mJ W °C Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max (Note 2) Symbol Rth,j-c Rth,j-a Value 0.75 62 Unit °C/W Note : 1.The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. 2. The value of RθJA is measured with the device mounted on 1 in²FR-4 board with 2 oz. copper, in a still air environment with TA=25°C. The power dissipation PDSM is based on RθJA and the maximum allowed junction temperature of 150°C. The value in any given application depends on the user’s specific board design, and the maximum temperature of 175°C may be used if the PCB allows it. 3. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and low duty cycles to keep initial TJ=25°C. 4. The static characteristics are obtained using <300μs pulses, duty cycle 0.5% maximum. 5. The RθJA is the sum of thermal resistance from junction to case RθJC and case to ambient. MTB050P10F3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C975F3 Issued Date : 2014.08.13 Revised Date : 2015.09.04 Page No. : 3/9 Characteristics (TC=25°C, unless otherwise specified) Symbol Static BVDSS VGS(th) GFS IGSS IDSS *RDS(ON) Min. Typ. Max. -100 -1.0 - -1.3 34 46 52 -2.5 ±100 -1 -25 60 70 45 9.6 11 9.6 16.4 81.2 29.4 3233 227 141 4.3 - 0.84 29 37 -40 -140 -1.2 - Dynamic *Qg *Qgs *Qgd *td(ON) *tr *td(OFF) *tf Ciss Coss Crss Rg Source-Drain Diode *IS *ISM *VSD *trr *Qrr - Unit V S nA μA mΩ Test Conditions VGS=0V, ID=-250μA VDS = VGS, ID=-250μA VDS =-5V, ID=-20A VGS=±20V VDS =-80V, VGS =0V VDS =-80V, VGS =0V, Tj=125°C VGS =-10V, ID=-20A VGS =-4.5V, ID=-15A nC ID=-21A, VDS=-50V, VGS=-10V ns VDS=-20V, ID=-1A, VGS=-10V, RG=6Ω pF VGS=0V, VDS=-25V, f=1MHz Ω f=1MHz A V ns nC IS=-20A, VGS=0V IF=-20A, VGS=0V, dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% MTB050P10F3 CYStek Product Specification Spec. No. : C975F3 Issued Date : 2014.08.13 Revised Date : 2015.09.04 Page No. : 4/9 CYStech Electronics Corp. Typical Characteristics Brekdown Voltage vs Junction Temperature Typical Output Characteristics 1.4 - 10V -9V -8V -7V -6V -5V 90 -ID, Drain Current(A) 80 70 60 50 -BVDSS, Normalized Drain-Source Breakdown Voltage 100 VGS=-4V 40 VGS=-3V 30 20 VGS=-2V 10 VGS=-2.5V 1.2 1 0.8 ID=-250μA, VGS=0V 0.6 0.4 0 0 2 4 6 8 -VDS, Drain-Source Voltage(V) -75 -50 -25 10 Static Drain-Source On-State resistance vs Drain Current Reverse Drain Current vs Source-Drain Voltage 1000 R DS(ON) , Static Drain-Source On-State Resistance(mΩ) 1.2 VGS=-2.5V -VSD, Source-Drain Voltage(V) VGS=-2V 100 VGS=-3V VGS=-4.5V VGS=-10V 1 Tj=25°C 0.8 0.6 Tj=150°C 0.4 0.2 10 0.1 1 10 -ID, Drain Current(A) 0 100 4 8 12 16 -IDR , Reverse Drain Current(A) 20 Drain-Source On-State Resistance vs Junction Tempearture Static Drain-Source On-State Resistance vs Gate-Source Voltage 200 2.4 180 R DS(ON) , Normalized Static DrainSource On-State Resistance R DS(ON) , Static Drain-Source OnState Resistance(mΩ) 0 25 50 75 100 125 150 175 200 Tj, Junction Temperature(°C) ID=-20A 160 140 120 100 80 60 40 20 2 VGS=-10V, ID=-20A 1.6 1.2 0.8 0.4 RDS(ON) @Tj=25°C : 46mΩ typ. 0 0 0 MTB050P10F3 2 4 6 8 -VGS, Gate-Source Voltage(V) 10 -75 -50 -25 0 25 50 75 100 125 150 175 200 Tj, Junction Temperature(°C) CYStek Product Specification Spec. No. : C975F3 Issued Date : 2014.08.13 Revised Date : 2015.09.04 Page No. : 5/9 CYStech Electronics Corp. Typical Characteristics(Cont.) Threshold Voltage vs Junction Tempearture Capacitance vs Drain-to-Source Voltage -VGS(th), Normalized Threshold Voltage 10000 Capacitance---(pF) Ciss 1000 C oss Crss 1.4 1.2 ID=-1mA 1 0.8 ID=-250μA 0.6 0.4 100 0.1 1 10 -VDS, Drain-Source Voltage(V) -75 -50 -25 100 Forward Transfer Admittance vs Drain Current Gate Charge Characteristics 10 -VGS, Gate-Source Voltage(V) GFS , Forward Transfer Admittance(S) 100 10 1 VDS=-5V Pulsed Ta=25°C 0.1 0.01 0.001 VDS=-50V ID=-21A 8 6 4 2 0 0.01 0.1 1 -ID, Drain Current(A) 10 0 100 10 20 30 40 Total Gate Charge---Qg(nC) 50 60 Maximum Drain Current vs Case Temperature Maximum Safe Operating Area 50 RDS(ON) Limit 100 -ID, Maximum Drain Current(A) 1000 -ID, Drain Current(A) 0 25 50 75 100 125 150 175 200 Tj, Junction Temperature(°C) 10 μ s 100μs 1ms 10 TC=25°C, Tj=175°C, VGS=10V,RθJC=0.75°C/W single pulse 1 10ms 100ms DC 40 30 20 10 VGS=10V, RθJC=0.75°C/W 0 0.1 0.1 MTB050P10F3 1 10 100 -VDS, Drain-Source Voltage(V) 1000 0 25 50 75 100 125 150 TC , Case Temperature(°C) 175 200 CYStek Product Specification Spec. No. : C975F3 Issued Date : 2014.08.13 Revised Date : 2015.09.04 Page No. : 6/9 CYStech Electronics Corp. Typical Characteristics(Cont.) Single Pulse Maximum Power Dissipation Typical Transfer Characteristics 5000 100 4500 VDS=-10V Peak Transient Power (W) 90 80 -ID, Drain Current (A) 70 60 50 40 30 3500 3000 2500 2000 1500 20 1000 10 500 0 0 2 4 6 -VGS, Gate-Source Voltage(V) 8 10 TJ(MAX) =175°C TC=25°C θ JC=0.75°C/W 4000 0 0.0001 0.001 0.01 0.1 Pulse Width(s) 1 10 Transient Thermal Response Curves 1 r(t), Normalized Effective Transient Thermal Resistance D=0.5 1.Rθ JC (t)=r(t)*RθJC 2.Duty Factor, D=t1/t2 3.TJM-TC=PDM*Rθ JC(t) 4.RθJC=0.75 °C/W 0.2 0.1 0.1 0.05 0.02 0.01 0.01 1.E-05 MTB050P10F3 Single Pulse 1.E-04 1.E-03 1.E-02 1.E-01 t1, Square Wave Pulse Duration(s) 1.E+00 1.E+01 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C975F3 Issued Date : 2014.08.13 Revised Date : 2015.09.04 Page No. : 7/9 Reel Dimension Carrier Tape Dimension MTB050P10F3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C975F3 Issued Date : 2014.08.13 Revised Date : 2015.09.04 Page No. : 8/9 Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Average ramp-up rate 3°C/second max. (Tsmax to Tp) Preheat 100°C −Temperature Min(TS min) −Temperature Max(TS max) 150°C −Time(ts min to ts max) 60-120 seconds Time maintained above: −Temperature (TL) 183°C − Time (tL) 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C Time within 5°C of actual peak 10-30 seconds temperature(tp) Ramp down rate 6°C/second max. 6 minutes max. Time 25 °C to peak temperature Pb-free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds 260 +0/-5 °C 20-40 seconds 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MTB050P10F3 CYStek Product Specification Spec. No. : C975F3 Issued Date : 2014.08.13 Revised Date : 2015.09.04 Page No. : 9/9 CYStech Electronics Corp. TO-263 Dimension Marking : Device Name Date Code B050 P10 □□□□ Style : Pin 1.Gate 2.Drain 3.Source 3-Lead Plastic Surface Mounted Package CYStek Package Code : F3 *:Typical Millimeters Min. Max. 4.470 4.670 0.000 0.150 1.170 1.370 0.710 0.910 1.170 1.370 0.310 0.530 1.170 1.370 10.010 10.310 DIM A A1 B b b1 c c1 D Inches Min. Max. 0.176 0.184 0.000 0.006 0.046 0.054 0.028 0.036 0.046 0.054 0.012 0.021 0.046 0.054 0.394 0.406 DIM E e e1 L L1 L2 L3 V Millimeters Min. Max. 8.500 8.900 *2.540 4.980 5.180 15.050 15.450 5.080 5.480 2.340 2.740 1.300 1.700 5.600 REF Inches Min. Max. 0.335 0.350 *0.100 0.196 0.204 0.593 0.608 0.200 0.216 0.092 0.108 0.051 0.067 0.220 REF Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTB050P10F3 CYStek Product Specification