GN1M

Spec. No. : C776SA
Issued Date : 2011.04.19
Revised Date :
Page No. : 1/3
CYStech Electronics Corp.
Surface Mount Glass Passivated Rectifiers
Reverse Voltage 50V to 1000V
Forward Current 1.0A
GN1A thru GN1M
Features
Outline
• For surface mounted applications
• Glass passivated junction chip
• Low profile package
• Built-in stain relief, ideal for automatic placement
• High temperature soldering: 250°C/10 seconds at terminals
• Plastic material used carries UL flammability classification 94V-0
DO-214AC (SMA)
Mechanical Data
• Case: JEDEC DO-214AC(SMA) molded plastic over glass passivated chip
• Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026
• Polarity: Color band denotes cathode end
• Weight: 0.064 gram, 0.002 ounce
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified.
inductive load.
Single phase, half wave, 60Hz, resistive or
For capacitive load, derate current by 20%. )
Parameter
Symbol
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward voltage, IF=1A
Maximum average forward rectified current, see
Fig. 1
Peak forward surge current @8.3ms single half
sine wave superimposed on rated load
(JEDEC method) TL=110°C
Maximum DC reverse current at TA=25°C
Rated DC blocking voltage
TA=125°C
Typical reverse recovery time (Note 1)
Typical junction capacitance @ f=1MHz and
applied 4V reverse voltage
Typical thermal resistance
(Note 2)
Operating junction and Storage temperature range
VRRM
VRMS
VR
VF
Type
Units
GN1A GN1B GN1D GN1G GN1J GN1K GN1M
50
100
200
400
600
800
1000
V
35
70
140
280
420
700
V
560
50
100
200
400
600
800
1000
V
1.1
V
IF(AV)
IFSM
IR
1
40
30
1
5
trr
50
1
CJ
12
RθJA
RθJL
TJ;TSTG
A
75
27
A
μA
μs
pF
85
30
-55 ~ +150
°C/W
℃
Note: 1.Reverse recovery test conditions : IF=0.5A, IR=1A, IRR=0.25A
2.Thermal resistance from junction to ambient and from junction to lead mounted on PCB with 0.2”×0.2”(5mm×5mm)
copper pad areas.
GN1A thru GN1M
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C776SA
Issued Date : 2011.04.19
Revised Date :
Page No. : 2/3
Ratings and Characteristic Curves
GN1A thru GN1M
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C776SA
Issued Date : 2011.04.19
Revised Date :
Page No. : 3/3
DO-214AC/SMA Dimension
DO-214AC/SMA Plastic
Surface Mounted Package
CYStek Package Code : SA
Inches
Min.
Max.
0.050
0.064
0.095
0.104
0.157
0.181
0.075
0.089
DIM
A
B
C
D
Millimeters
Min.
Max.
1.27
1.63
2.40
2.65
4.00
4.60
1.90
2.25
DIM
E
F
G
H
Inches
Min.
Max.
0.006
0.012
0.004
0.008
0.031
0.059
0.189
0.205
Millimeters
Min.
Max.
0.15
0.31
0.10
0.20
0.80
1.50
4.80
5.20
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
GN1A thru GN1M
CYStek Product Specification