Spec. No. : C474LB Issued Date : 2009.08.13 Revised Date : Page No. : 1/3 CYStech Electronics Corp. Schottky Barrier Rectifiers Reverse Voltage 20V to 60V Forward Current 1.0 Amperes SB120 thru SB160 Features Outline • Metal semiconductor junction with guard ring • Epitaxial construction • Low forward voltage drop • High current capability • The plastic material carries UL recognition 94V-0 • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications DO-204AL(DO-41) Mechanical Characteristics: •Case: JEDEC DO-204AL(DO-41) molded plastic •Terminals: Tin plated axial leads, solderable per MIL-STD-202, method 208 •Polarity: Color band denotes cathode •Mounting position: Any •Weight : 0.012oz., 0.33grams Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%) Parameter Symbol Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum forward voltage at 1A Maximum average forward rectified current .375”(9.5mm) lead lengths @TL=100°C Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) TJ=25°C Maximum DC reverse current at rated DC blocking voltage TJ=100°C VRRM VRMS VDC VF Typical thermal resistance (Note 1) Typical junction capacitance (Note 2) Operating junction temperature range Storage temperature range RθJL CJ TJ TSTG Type Units SB120 SB130 SB140 SB150 SB160 20 30 40 50 60 V 14 21 28 35 42 V 20 30 40 50 60 V 0.5 0.70 V IF(AV) 1 A IFSM 40 A IR 0.5 10 15 150 -55 ~ +125 -55 ~ +150 mA °C/W pF °C °C Note: 1.Thermal resistance, junction to lead. 2.Measured at 1.0MHz and applied reverse voltage of 4.0VDC SB120 thru SB160 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C474LB Issued Date : 2009.08.13 Revised Date : Page No. : 2/3 Characteristic Curves SB120 thru SB160 CYStek Product Specification Spec. No. : C474LB Issued Date : 2009.08.13 Revised Date : Page No. : 3/3 CYStech Electronics Corp. DO-204AL(DO-41) Dimension DO-204AL(DO-41) Molded Plastic Package CYStek Package Code: LB DIM A B C Inches Min. Max. ϕ0.0280 ϕ0.0339 1.0000 0.1654 0.2047 Millimeters Min. Max. ϕ0.71 ϕ0.86 25.40 4.20 5.20 DIM D E Inches Min. Max. 1.0000 ϕ0.0787 ϕ0.1063 Millimeters Min. Max. 25.40 ϕ2.00 ϕ2.70 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Axial leads, solderable per MIL-STD-202, Method 208 guaranteed. • Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. SB120 thru SB160 CYStek Product Specification