CYStech Electronics Corp. Spec. No. : C193LD Issued Date : 2012.12.11 Revised Date : Page No. : 1/3 3.0Amp. Glass Passivated Super Fast Rectifiers SF31G thru SF38G Features • High current capability • High reliability • Low forward voltage drop • High surge current capability Mechanical Data • Case: Molded plastic DO-201AD • Terminals: Solder plated, solderable per MIL-STD-750 method 2026 • Polarity: Indicated by cathode band. • Epoxy : UL94V-0 rate flame retardant • Weight: 0.041 oz., 1.15 gram Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. ) Parameter Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage, IF=3A (Note 1) Reverse Recovery Time Average forward rectified current @TA=95℃ Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum DC reverse current VR=VRRM,TA=25℃(Note 1) VR=VRRM,TA=100℃(Note 1) Storage temperature Operating temperature Symbol VRRM VRMS VR SF 31G 50 35 50 SF 32G 100 70 100 VF SF 33G 150 105 150 Type SF SF 34G 35G 200 300 140 210 200 300 0.95 SF 36G 400 280 400 1.3 SF Units 38G 600 V 420 V 600 V SF 37G 500 350 500 1.7 V trr 35 ns IFAV 3 A IFSM 125 A IR 5 100 -55 ~ +150 -55 ~ +150 μA μA ℃ ℃ Tstg TJ Notes : 1. Pulse test, pulse width=300μsec, 2% duty cycle 2 . Reverse recovery test condition: IF=0.5A, IR=1.0A, IRR=0.25A SF31G thru SF38G CYStek Product Specification CYStech Electronics Corp. Spec. No. : C193LD Issued Date : 2012.12.11 Revised Date : Page No. : 2/3 Characteristic Curves SF31G thru SF38G CYStek Product Specification CYStech Electronics Corp. Spec. No. : C193LD Issued Date : 2012.12.11 Revised Date : Page No. : 3/3 DO-201AD Dimension DO-201AD Molded Plastic Package CYStek Package Code: LD Inches Min. Max. ϕ0.048 ϕ0.052 1.000 0.285 0.375 DIM A B C Millimeters Min. Max. ϕ1.20 ϕ1.30 25.40 7.20 9.50 DIM D E Inches Min. Max. 1.000 ϕ0.197 ϕ0.220 Millimeters Min. Max. 25.40 ϕ5.00 ϕ5.60 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Axial leads, solderable per MIL-STD-202, Method 208 guaranteed. • Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. SF31G thru SF38G CYStek Product Specification