Clock Crystal Oscillators CMOS Crystal Oscillators EXO-3

Clock Crystal Oscillators
CMOS Crystal Oscillators
EXO-3
Features
• Since it has a frequency dividing function, it is able to obtain a frequency division of 1/2-1/2 8
(1/256).
• The symmetry of frequency divided output is within 50 ±2%.
• The oscillation start time has the fast starting characteristic of being 1.5msec. or less.
• The pin arrangement is DIP 8PIN.
• Supply Voltage VDD=5.0V
Applications
• Amusement
Specifications
Item
Output Frequency Range
Frequency Stability
Storage Temp. Range
Operating Temp. Range
Supply Voltage
Current Consumption
Duty Ratio
Rise/Fall Time
Output Voltage-"L"
Output Voltage-"H"
Output Load
Start-up Time
Symbol
FOUT
FSBY
TSTG
TOPR
VDD
IDD
SYM
Tr/Tf
VOL
VOH
CL
ST
Conditions
Min.
11.0592
−100
−40
−10
4.5
----40
--------90% VDD
---------
@50% VDD
Max.
24.576
+100
+85
+70
5
20
60
15
10% VDD
----50
1.5
Units
MHz
ppm
°C
°C
Volt
mA
%
nS
Volt
Volt
pF
mS
Note: Please contact us for inquires about extended operating temperature range, available frequencies and other conditions.
All electrical characteristics are defined at the maximum load and operating temperature range.
Settings of the frequency division output
1.F
2.D
3.ST
Outputs the original frequency (fo) of
the internal quartz crystal.
Outputs the frequency of programmed
dividing ratio (fo/2n).
Possible to be oscillated when set to
HIGH level and stopped in oscillation
when set to LOW level. when this
function is not needed, be sure to set
the STANDBY pin to the HIGH level.
4.GND
5.A⎫
6.B⎬ Used to program the dividing ratio for
7.C⎭ the original frequency.
Supply voltage
8.VDD
F
Original
Frequency
D
Divided
Wave form
C
B
A
L
L
L
H
fo clock
fo · 1/2 clock
L
L
H
H
fo clock
fo · 1/22 clock
L
H
L
H
fo clock
fo · 1/23 clock
L
H H
H
fo clock
fo · 1/24 clock
H
L
L
H
fo clock
fo · 1/25 clock
H
L
H
H
fo clock
fo · 1/26 clock
H
H
L
H
fo clock
fo · 1/27 clock
12.8MAX.
#8
#7
#6
#5
#1
#2
#3
φ1.6
#4
7.0MAX.
ST
H H
H
fo clock
fo · 1/28 clock
_
_
L
L
L
_
0.6MAX
0~15˚
1.524
H
7.62±0.3
MIN.
1
2 3 4
F D ST GND
(OUTPUT)
Select
EXO-3
0.51MIN.
EXO3 5E
16.000M
KSS JAPAN
Output
(Unit : mm)
5.08
MAX.
Input
(Divider Select)
VDD C B A
8
7 6 5
Dimensions
2.5
Pin connection
0.5±0.15
2.54±0.25
(mm)
Handling Notes for Crystal Oscillators
1. Shock & Drop • Vibration
2. Cleaning
Do not inflict excessive shock and mechanical vibration that
exceeds the norm, such as hitting or mistakenly dropping, when
transporting and mounting on a board. There are cases when
pieces of crystal break, and pieces that are used become
damaged, and become inoperable. When a shock or vibration that
exceeds the norm has been inflicted, make sure to check the
characteristics.
Since a crystal piece can be broken by resonance when a crystal
device is cleaned by ultrasonic cleaning. Be careful when carrying
out ultrasonic cleaning.
3. Soldering conditions
To maintain the product reliability, please follow recommended conditions.
Standard soldering iron conditions
Crystal Oscillators
Soldering iron
280˚C ~ 340˚C
Time
3+1/−0sec. max
Reflow conditions (Example)
+0
Peak:260 -10
˚C
Temperature(˚C)
10sec. max
+0
180 -10
˚C
200˚C min
40sec. max
120sec. max
Time(sec.)
Crystal Oscillators/TCXOs
Recommended reflow Conditions vary depending upon products.
Please check with the respective specification for details.
4. Mounting Precautions
Leaded Devices
The special glass, located where the lead of the retainer base comes out, is aligned with the coefficient of thermal expansion of the lead, If the
glass is damaged and cracks appear, there may be cases in which performance deteriorates and it fails to operate.
Consequently, when making the device adhere closely and applying solder, align the gap of the hole of the board with the gap of the lead and
insert without excessive force.
When making the device adhere closely to a through hole board and applying solder, be careful that the solder does not get into the metal part
of the retainer base and cause a short. Putting in an insulation spacer is one more method of preventing a short circuit.
When the lead is mounted floating, fix it as far as possible so that contact with other parts and the breakage due to the fatigue, and the
mechanical resonance of the lead will not occur.
When the lead is bent and used, do not bend the lead directly from the base, separate it 0.5mm or more and then bend it. When bending,
before attaching to the board, fix the place where the lead comes out in advance and attach it after bending so that a crack does not occur in
the glass part.
Surface Mount Devices
The lead of the device and the pattern of the board is soldered on the surface. Since extreme deformation of the board tears off the pattern,
tears off the lead metal, cracks the solder and damages the sealed part of the device and there are cases in which performance deteriorates
and operation fails, use it within the stipulated bending conditions. Due to the small cracks in the board resulting from mounting, please pay
sufficient attention when attaching a device at the position where the warping of the board is great.
When using an automatic loading machine, as far as possible, select a type that has a small impact and use it while confirming that there is no
damage.
Surface mount devices are NOT flow soldering compatible.
5. Storage Condition
Since the long hour high temperature and low temperature storage, as well as the storage at high humidity are causes of deterioration in
frequency accuracy and solderability.
Parts should be stored in temperature range of -5 to +40C˚, humidity 40 to 60% RH, and avoid direct sunlight. Then use within 6 months.
Handling Notes for Crystal Oscillators
6. In order to use crystal oscillators
(1)The minlature crystal oscillator for the clock utillzes a C-MOS IC and incorporates a protective circuit against static electricity
However, exerclse care in the same manner as for a normal C−MOS IC.
(2)Internal capacitor is not provided in the power supply section (+DC−GNC).
To serve as overimpressed voltage and overcurrent protective device, place a bypass capacitor (0.01 µF) as near as possible
to the (+DC−GND) terminal.
However, the capacity value is meant as a guideline.
Depending on the capacitor type, frequency characteristics vary. Accordingly, use a capacitor that matches the frequency
characteristics.
(3)Applying reverse voltage could result in damage to internal parts. Take care not to connect terminals incorrectly.
(4)Please do not use oscillators under unfavorable condition such as beyond specified range in catalog or specification sheet.
(5)Please keep oscillators away from water, salt water or harmful gas.
(6)K50H-3C / FSO series should be stored in humidity-controlled area after the package is unsealed, in temperature +25±5˚C
under humidity of 65%RH, and should be mounted on PCB within 7 days.
(7)K50H-3C / FSO series has Bypass Capacitior between VDD and GND.
Test Circuits and Clock Timing Chart
CMOS Output Test Circuits
Clock Timing chart(C-MOS Output)
Note) Maximum load(Includes capacitances of fixture and probe)
LV-PECL Output Test Circuits
Clock Timing chart (LV-PECL Output)
Tape & Reel Specifications
Tape & Reel Specifications
ICrystal Oscillators
KC2520
K25
K30
FXO-61F
FXO-64F
VC-FXO-65F
A
2.0±0.1
2.0±0.1
2.0±0.1
2.0±0.1
B
4.0±0.1
4.0±0.1
4.0±0.1
4.0±0.1
φ1.5+0.1/−0
φ1.55±0.1
8.0±0.1
C
T
A
P
E
R
E
E
L
D
4.0±0.1
8.0±0.1
8.0±0.1
E
3.5±0.05
3.5±0.05
5.5±0.1
5.5±0.1
F
1.75±0.1
1.75±0.1
1.75±0.1
1.75±0.1
G
8.0±0.2
8.0±0.2
12.0±0.2
12.0±0.3
H
φ1.1±0.1
φ1.55±0.1
φ1.55±0.1
φ1.55±0.1
J
2.7±0.1
3.5±0.05
5.5±0.1
5.4±0.1
L
2.2±0.1
2.8±0.05
3.7±0.1
3.6±0.1
N
1.25±0.1
1.1±0.05
1.4±0.1
1.7±0.1
O
0.2±0.05
0.3±0.05
0.3±0.05
0.3±0.05
P
φ180+0/−3
φ180+0/−3
φ180+0/−3
φ254±2
Q
φ60+1/−0
φ60+1/−0
φ60+1/−0
φ100±1
R
φ13±0.2
φ13±0.2
φ13±0.2
φ13±0.5
φ21±0.8
S
φ21±0.8
φ21±0.8
φ21±0.8
U
2.0±0.5
2.0±0.5
2.0±0.5
2.0±0.5
W
9.0±0.3
9.0±0.3
13.0±0.3
13.4+2/-0
2000
2000
1000
1000
FSO-1C/1D
FSO-2B/2C/2D
VC-FSO-1D
FXO-31F
FXO-34F
FXO-37F
VC-FXO-35F
VCXO-7050
K50H
K50
K53
K50V-3P
KT21
2.0±0.1
2.0±0.1
2.0±0.1
2.0±0.1
Qty
A
T
A
P
E
(VC)TCXO-214C (VC)TCXO-212C
2.0±0.1
2.0±0.1
(VC)TCXO-208C
MFO-208F
KT18B
KT20A
(VC)TCXO-204C
2.0±0.1
2.0±0.1
2.0±0.1
2.0±0.1
B
4.0±0.1
4.0±0.1
4.0±0.1
4.0±0.1
4.0±0.1
4.0±0.1
4.0±0.1
4.0±0.1
4.0±0.1
4.0±0.1
C
φ1.55±0.1
φ1.55±0.1
φ1.5±0.1
φ1.5+0.1/−0
φ1.5+0.1/−0
φ1.5+0.1/−0
φ1.5+0.1/−0
φ1.5+0.1/−0
φ1.5+0.1/−0
φ1.5+0.1/−0
D
8.0±0.1
8.0±0.1
8.0±0.1
4.0±0.1
4.0±0.1
4.0±0.1
8.0±0.1
4.0±0.1
E
7.5±0.1
7.5±0.1
7.5±0.1
3.5±0.1
3.5±0.05
5.5±0.1
5.5±0.1
5.5±0.1
5.5±0.1
7.5±0.1
1.75±0.1
8.0±0.1/4.0±0.1 8.0±0.1/4.0±0.1
F
1.75±0.1
1.75±0.1
1.75±0.1
1.75±0.1
1.75±0.1
1.75±0.1
1.75±0.1
1.75±0.1
1.75±0.1
G
16.0±0.3
16.0±0.3
16.0±0.2
8.0±0.3
8.0±0.2
8.0±0.3/12.0±0.3
12.0±0.3
12.0±0.3
12.0±0.3
16.0±0.3
H
φ1.55
φ1.55
φ1.55±0.1
φ1.5+0.1/−0
φ1.0+0.2/−0
φ1.5+0.1/−0
φ1.5+0.1/−0
φ1.5+0.1/−0
φ1.5+0.1/−0
φ1.5+0.1/−0
J
8.18
8.18
7.4±0.1
3.5±0.1
3.6±0.1
4.4±0.1
5.5±0.1
5.5±0.1
5.5±0.1
7.4±0.1
3.7±0.1
3.7±0.1
3.7±0.1
5.4±0.1
L
5.56
5.56
5.4±0.1
2.8±0.1
2.9±0.1
2.9±0.1
N
2.16±0.1
2.16±0.1
2.0±0.1
1.1±0.1
1.3±0.1
1.1±0.1/1.3±0.1
O
0.3±0.05
0.3±0.05
0.3±0.05
0.25±0.05
0.3±0.05
0.2±0.05/0.3±0.05
0.3±0.05
φ180+0/-3
φ180±2
φ180+1/−1.5 φ254±1/φ180+1/−1.5
P
R
E
E
L
φ1.5+0.1/−0 φ1.5+0.1/−0
Feed direction
φ330±2φ254±2 φ330±2φ254±2
1.8±0.1
2.1±0.1
0.3±0.05
0.3±0.05
0.3±0.05
φ330±1
φ330±1
φ330±1
φ254±2
1.6±0.1/1.5±0.1 1.6±0.1/1.5±0.1
Q
φ100±1
φ100±1
φ60+1/−0
φ60
φ60+1/−0
φ100±1/φ60+1/−0
φ100±1/φ60
φ100±1φ60
φ100±1
φ100±1
R
φ13±0.3
φ13±0.3
φ13±0.2
φ13±0.2
φ13±0.2
φ13±0.2
φ13±0.2
φ13±0.2
φ13±0.2
φ13±0.2
S
φ21±0.8
φ21±0.8
φ21±0.8
φ21±0.8
φ21±0.8
φ21±0.8
φ21±0.8
φ21±0.8
φ21±0.8
φ21±0.8
U
2.0±0.5
2.0±0.5
2.0±0.5
2.0±0.5
2.0±0.5
2.0±0.5
2.0±0.5
2.0±0.5
2.0±0.2
2.0±0.5
16.4
17.5±0.5/16.4
17±0.2
9.0±0.1
9.0+0.3/−0
9.0±0.3/13.0+0.3−0
13.5±1
13.5±1
13.5±1
17.5±0.5
3000/1000
3000/1000
1000
2000
2000
4000/2000
2000
4000
4000
1000
W
Qty
Ordering Format for Crystal Oscillatiors
ORDERING FORMAT FOR CRYSTAL OSCILLATORS
Please specify the following items when ordering crystal oscillators.
I. Standard products shown in the catalogue:
Please specify package type and nominal frequency.
II. Special-order products:
Please specify the following items in specification.
1 . Frequency
(1)Oscillation Frequency ____________ Hz
2 . Frequency Stability
(1)Temperature ______ ×10-6 MAX. ______ ~ ______˚C (On the basis of +25˚C frequency)
(2)Supply Voltage ______ ×10-6 MAX. ______ VDC ± ______ %
(3)Load. ______ ×10-6 MAX. ______ Ω// ______ pF ± ______ % ± ______ %
(4)Aging ______ ×10-6 MAX./year
3 . Frequency Tuning Range
± ______ ×10-6 MIN
4 . Frequency Control Range
± ______ ~± ______ ×10-6 /+ ______ V± ______ V
5 . Output
(1)Voltage ______ Vrms ______ VP-P MIN.
(2)Wave Form
Sine, Half sine wave, Harmonics 2nd ______ dB, 3rd ______ dB, Others ______ dB
(3)Load Resistance ______ Ω//Capacitance ______ pF
6 . Supply Voltage
(1)For circuit ______ VDC± ______ %, ______ mA MAX.
7 . Environmental Condition
(1)Operating Temperature Range ______ ~ ______ ˚C
(2)Vibration
Total Amplitude ______ mm, Vibration Frequency ______ Hz~ ______ Hz
(3)Shock ______________________________________________________
8 . Dimensions, Pin Connection _______________________________________________
9 . Application ______________________________________________________________