Reliability Test Category Environmental Test No Test Category Related Standards Test Conditions Purpose MIL-STD-883G IEC 60749 IEC 60068-2 JESD22 EIAJ ED-4701 ― Part 5 ― A101-C Method 102 To evaluate the endurance of the devices when used in high temperature and high humidity ambient. 1 Ta=85℃, 85% RH THB (High Temperature / Humidity Power supply voltage = Max. with Bias Life Test) operating voltage 2 HTS (High Temperature Storage Test) Ta=150℃ No power supply 1008.2 Part 6 Part 2-2 A103-C Method 201 To evaluate the endurance of the devices when stored under high temperature for long time. 3 LTS (Low Temperature Storage Test) Ta=-50℃ No power supply ― ― Part 2-1 A119 Method 202 To evaluate the endurance of the devices when stored under low temperature for long time. TCT (Temperature 4 Cycling Test) Condition: -65℃~150℃ 5 PCT (Pressure Cooker Test) Ta=121℃, 100% RH 2.0E5 Pa (2 ATM) 6 HTOL (High Temperature Operation Life Test) Ta=125℃ Power supply voltage = Max. operating voltage 1010.7 Part 25 Part 2-14 A104-C Method 105 To evaluate the endurance of the devices when exposed to repeated temperature variation cycles between high temperature and low temperature. ― Part 33 ― A102-C Method 102 Method 103 To evaluate the endurance of plastic mouled package devices when used in high temperature and high humidity ambient. 1005.8 Part 23 ― A108-C Method 101 To evaluate the endurance of the devices when they are submitted to electric stress and thermal stress of long duration. Mechanical Test No Test Category Related Standards Test Conditions MIL-STD-883G IEC 60749 IEC 60068-2 Purpose JESD22 EIAJ ED-4701 1 Soldering Heat Resistance a. Precondition:TCT➪IR Reflow b. PCT: 121℃,2atm,168hr c. TCT:-65℃~150℃,500cycles d. Solderability:Steam aging 8hr, Dipping with flux 245℃ 5sec e. Lead Fatigue:bend 90° ― ― Part 2-20 A113-F Method 301 To simulate the board mounting process., which is representative of typical standard industrial solder reflow process. For surface mount device, the preconditioning test shall be required prior to TCT, PCT and HAST tests. 2 Solder ability Solder bath temperature: 230℃, dipping time: 5 sec Solder bath temperature: 245℃, dipping time: 5 sec (lead-free solder) 2003.8 Part 21 Part 2-20 B102-E Method 303 To evaluate the solderability of the teminals of the devices that are generally conneced by soldering. 3 Lead integrity bend 90° 2004.5 Condition B2 Part 14 ― B105-C Method 401 To evaluate the resistance of terminals of the devices against forces applied during their handling and/or normal assembly work. JESD22 EIAJ ED-4701 Electrical Test No Test Category Related Standards Test Conditions MIL-STD-883G 1 ESD (HBM) Ta=25℃ HBM: C=100pF, R=1.5kΩ 2 ESD (MM) Ta=25℃ MM: C=200pF 3 Latch up Ta=25℃ Power supply voltage = Max. operating voltage 3015.7 IEC 60749 Part 26 IEC 60068-2 ― Purpose A114-F Method 304 To evaluate the endurance of a semiconductor device to human body model electrostatic discharges while the Semiconductor device is handled until mounting into electronic equipment. ― Part 27 ― A115-A Method 305 To evaluate sensitivity of integrated circuits to electrostatic discharges that such integrated circuits are exposed to before they are installed in an electronic equipment. 3023.1 Part 29 ― JESD78A Method 306 To evaluate the resistance of a CMOS device to electric noise.