Resistors

Test Conditions and Standards
CRB, CRC Series
Electrical Characteristics
Standard
Item
Resistor
DC Resistance
Temperature
Characteristics
R/R
Short-time
Overload
Visual
Intermittent
Overload
Test Conditions
R/R
Jumper
Within Initial Tolerance
Resistance()
R <10
10≤ R ≤1M
1M< R
Resistor
Jumper
Power Contdition A
(20°C, 65%RH)
50mmax
Test Temperature: 25,125(°C)
R/RR2R1/R11/T2T1106
R/R: Temp. Coefficient
(ppm/°C)
T1: 25(°C)
T2: 125(°C)
R1: T1 Resistance at ()
R2: T2 Resistance at ()
TCR(ppm/°C)
100 to 600
250 to 250
500 to 300
(2.0%0.10)max
of the intial value
50mmax
(1) Apply 2.5rated voltage for (1) 2A for 5sec.
5sec.
(2) Wait 30minutes
(2) Wait 30minutes
(3) Measure
(3) Measure resistance
resistance
No evidence of mechanical damage
intermittent overload
(5%0.1)max
of the intial value
50mmax
Visual
No evidence of mechanical damage
Dielectric
Withstanding Voltage
No evidence of mechanical damage
Insulation Resistance
108min
(1) Perform 10000voltage
cycles as follows:
ON (2.5rated voltage) 1sec.
OFF
25sec.
(2) Stabilization time 30min
without loading
(3) Measure resistance
Apply 300VAC for 1sec
Apply 100V DC.
- 11 -
(1) Perform 10000
current cycles as
follows:
ON (2A)
1sec.
OFF
25sec.
(2) Wait 30minutes
(3) Measure
resistance
Test Conditions and Standards
CRB, CRC Series
Mechanical Characteristics
Standard
Item
∆R/R
Test Conditions
Resistor
Jumper
±(1%+0.05Ω)max
of the intial value
50mΩmax
Resistor
Jumper
Apply the load as show:
Measure resistance during load application
Unit: mm
20 50
Bending in
10seconds
Visual
3
Terminal
Strength
R230
(φ5)
No evidence of mechanical damage after loading
±2max
45
45
PC board: Glass epoxy t=1.6
Soldering Heat
Resistance
∆R/R
Solvent
Resistance
∆R/R
Visual
∆R/R
Visual
50mΩmax
No evidence of leaching
Visual
Solderability
Anti-Vibration
Test
±(1%+0.05Ω)max
of the intial value
Coverage ≥95% each termination end
±(1%+0.1Ω)max
of the intial value
50mΩmax
Immerse into molten solder at 260±5°C for 10±1sec.
Stabillize component at room temperature for 1hr.
Measure resistance.
Immerse in Rogin Flux for 2±0.5 sec. and in
SN62 solder at 235±5°C for 2±0.5 sec.
2 hrs. each in X, Y and Z axis. (TTL 6hrs.)10 to 55 Hz
sweep in 1min.at 1.5mm amplitude.
No evidence of mechanical damage
±(0.5%+0.05Ω)max
of the intial value
50mΩmax
No evidence of mechanical damage
Immerse in static state butyl acetate at 20°C to 25°C
for 30±5sec.
Stabillize component at room temperature for 30min
then measure Value.
Environmental Characteristics
Standard
Item
Temperature
Cycle
Low
Temperature
Storage
High
Temperature
Storage
Moisture
Resistance
Life Test
∆R/R
Visual
∆R/R
Visual
∆R/R
Visual
∆R/R
Visual
∆R/R
Visual
Loading Life
in Moisture
∆R/R
Visual
Test Conditions
Resistor
Jumper
±(1%+0.05Ω)max
of the intial value
50mΩmax
No evidence of mechanical damage
±(2%+0.1Ω)max
of the intial value
50mΩmax
No evidence of mechanical damage
±(3%+0.1Ω)max
of the intial value
50mΩmax
No evidence of mechanical damage
±(3%+0.1Ω)max
of the intial value
50mΩmax
No evidence of mechanical damage
±(3%+0.1Ω)max
of the intial value
50mΩmax
No evidence of mechanical damage
±(3%+0.1Ω)max
of the intial value
50mΩmax
No evidence of mechanical damage
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Resistor
Jumper
1) Run 5cycles as follows: −55±3°C for 30min.
125±3°C for 30min. Room temp for 10-15min.
2) Stabilize component at room temperature for 1hr.
then measure value.
1) Dwell in −55°C chamber without loading for 1000 +48
−0
hrs.
2) Stabilize component at room temperature for 1hr.
then measure value.
1) Dwell in 125°C chamber without loading for 1000+48
−0
hrs.
2) Stabilize component at room temperature for 1hr.
then measure value.
1) Dwell in temp: 65°C RH90 to 95%RH chamber
without loading for 1000+48
−0 hrs.
2) Stabilize component at room temperature for 1hr.
then measure value.
1) Temp: 70±3°C Voltage: (rated voltage) on 90 min
off 30min. Duration: 1000+48
−0 hrs.
2) Stabilize component at room temperature for 1hr.
then measure value.
1) Temp: 40±2°C RH: 90-95% Voltage Cycle: on 90
min(rated voltage) off 30min. Duration: 1000+48
−0 hrs.
2) Stabilize component at room temperature for 1hr.
then measure value.
Thick Film Chip Resistors
Tape & Reel
Tape & Reel
• Reel
(Unit : mm)
Code
Width: 8mm
E
Width: 12mm
1782.0
B
C
50min.
D
E
W
10.01.5
2.00.5
13.00.5 21.00.8
13.01.5
t
R
2.5MAX.
1.0
B
C
A
D
R
t
A
W
• Carrier Tape (8mm)
(Unit : mm)
Dimension
Code
TYPE
A
B
0404
1.20.1
1.20.1
0804
1.250.2 2.250.2
0805
1.65.0.2 2.4.0.2
1206
2.0.0.2
3.6.0.2
1506
1.9.0.2
4.1.0.2
t
B
D
A
C
E
J
F
H
G
C
D
E
F
G
H
J
t
0.6max.
2.00.1
8.00.2
3.50.05
1.750.1
2.00.05
4.00.1
1.5
0.1
0
4.00.1
• Carrier Tape (12mm)
(Unit : mm)
J
Dimension
Code
TYPE
A
B
1020
2.90.2
5.30.2
1608
2.50.2
4.40.2
2512
3.50.2
6.70.2
2506
2.00.2
6.90.2
K
B
D
A
C
E
T
F
H
1.1max.
G
• Taping Quantity per reel
C
D
E
12.00.3 5.50.05 1.750.1 4.00.1
(Unit : pcs)
TYPE
Series
Paper (178 reel)
0404
CRC11A2E, ATC1A
10000 (2mm pitch)
0804
CRB2A4E, CRC2A4E
10000 (2mm pitch)
0805
LR21
5000 (4mm pitch)
1206
LR32
5000 (4mm pitch)
1506
CRC4A8E
5000 (4mm pitch)
1020
LR50
4000 (4mm pitch)
1608
RNA4A
4000 (4mm pitch)
2512
LR63
4000 (4mm pitch)
2506
CRB6A8E
4000 (4mm pitch)
- 13 -
F
G
H
J
2.00.1
4.00.1
1.5 0.1
0
T
K
0.6max. 1.4max.
Recommended Land Patterns
Recommended Land Patterns
Chip Type
(Unit : mm)
C
A
B
B
EIA Size
A
B
C
0805
1.0
0.8
1.2
1206
2.2
0.9
1.5
1020
1.4
1.0
5.0
2512
5.0
1.0
3.0
Array Type
(Unit : mm)
Solder resist
b
a
d
Series
a
b
c
d
CRB2A4E
0.4
1.5
0.25
0.5
CRC11A2E
0.5
1.5
0.4
0.65
CRC4A8E
0.8
2.4
0.3
0.5
CRB6A8E
0.7
2.3
0.4
0.8
ATC1A
0.5
1.5
0.4
0.65
c
(Unit : mm)
RNA4A8E Series
0.55
CRC2A4E Series
(Unit : mm)
3.0
0.25
4.8
0.4
- 14 -
2.9
1.1
1.5
0.5
0.4
0.55
0.4
0.8
Precautions
Circuit design
Soldering method
1) Once application and assembly environments have been checked,
the resistors may be used in conformance with the catalog and the
specifications.
1) Recommendable temperature profile
reflow
2) Please consult the manufacturer in advance when the resistors is
used in devices such as: devices which deal with human life, I.e.
medical devices; devices which are highy public orientated; and
devices which demand a high standerd of liability.
Temp(°C)
300
250
230 to 250°C
preheat
200
More than 180°C
40 sec. max.
150
3) Please use the resistors in conformance with the operating
temperature provided in both the catalog and the specifications.
100
50
0
(Time)
4) Please keep voltage under the rated voltage which is applied to
the resistor.
60 sec.
5) Do not use the resistor in an environment where it might easily
exceed the respective provisions concerning shock and vibration
specified in the catalog and specifications.
60 sec.
10 sec. max.
2) Recommendable temperature profile
wave
6) Please do not use the resistor in the following environments.
①State that water, oil, and solvent hang in resistor
②State where poisonous gas (sulfur and chlorine, etc.) exists
③State that direct sunshine, radiation, and ultraviolet, etc. are irradiated
Temp(°C)
300
250
230 to 250°C
preheat
200
7) There is a thing that resistance changes according to the stuff of the
resin when the coating with the resin is given.
Please use resin coating after confirming the characteristic.
T
150
100
50
0
8) There is a thing that resistance changes according to flux and
cleaner.
Please use flux and cleaner after confirming the characteristic.
(Time)
60 to 120 sec.
3 sec. max.
(Caution) Cooling after soldering should be as slow as possible.
Ensure that the chip Resistor is preheated adequately.
Ensure that the temperature difference(T) does not exceed 130°C.
9) Please consult about a lead free products.
Storage
3) pb-free recommendable temperature profile
1) Keep storage place temperature 5 to 35°C, humidity 45 to 75%
RH.
reflow
2) Please keep parts out of poisonous gas such as sulfur or chlorine in
the air, and out of salty moisture. Or they may cause rust of
terminal, and poor solderability. and, please consider the abovementioned item after mounting your company.
300
250
preheat
200
150
3) Soldering iron
Peak temperature
250°C5°C
5 to 10 sec. max.
Temp(°C)
170 to 180°C
1 to 3°C/sec.
More than 220°C
90 sec. max.
100
Temperature
soldering iron 3005°C *
Time
3 sec. max.
50
0
(Time)
*
9030 sec.
*Do not place the soldering iron on the chip. Soldering iron is 30W max.
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