Multilayer Organic (MLOTM) 0805 WCDMA Diplexer MLOTM TECHNOLOGY APPLICATIONS The 0805 diplexer is a best in class low profile multilayer organic passive device that is based on AVX’s patented multilayer organic high density interconnect technology. The MLOTM diplexer uses high dielectric constant and low loss materials to realize high Q passive printed passive elements such as inductors and capacitors in a multilayer stack up. The MLOTM diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN, and GSM and are less than 0.6mm in thickness. These components are ideally suited for band switching for dual band systems. All diplexers are expansion matched to FR4 thereby resulting in improved reliability over standard Si and ceramic devices. Multiband applications including WCDMA, WLAN, WiMax, GPS, and cellular bands Type 05 Size A Design 1940 Frequency (MHz) 7 TR Finish 7 = Au T = NiSn Packaging Tape & Reel TR = 3 Kpcs TR/500 = 500 pcs QUALITY INSPECTION Finished parts are 100% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -40ºC to +85ºC TERMINATION Finishes available in Ni/Sn, Immersion Sn, Immersion Au and OSP coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual. Top View 6 1 2 5 2 3 4 3 1 5 4 POWER CAPACITY 4.5W Maximum Low Insertion Loss Excellent Solderability Low Parasitics Low Profile Bottom View 0.20±0.10 0.20±0.10 (0.008±0.004) (0.008±0.004) 1 2 3 0.04±0.04 (0.002±0.002) 1.28±0.20 (0.050±0.008) 0.25±0.10 (0.010±0.004) 0.95±0.05 (0.037±0.002) 0.20±0.10 0.20±0.10 (0.008±0.004) (0.008±0.004) Side View 0.64±0.05 (0.025±0.002) 6 5 4 2.12±0.20 (0.083±0.008) Terminal No. 1 2 3 4 5 6 0.55±0.10 (0.022±0.004) 0.44±0.10 0.44±0.10 (0.017±0.004) (0.017±0.004) Unit: mm (inches) Terminal Name High Frequency Port GND Low Frequency Port GND Common Port GND PART NUMBER: DP05A19407TR ORIENTATION IN TAPE 6 • • • • COMPONENT DIMENSIONS AND FUNCTIONS HOW TO ORDER DP LAND GRID ARRAY ADVANTAGES Specification @ 25ºC Size [mm(inches)] Height [mm(inches)] Volume (mm^3) Frequency Range (F1) (MHz) Frequency Range (F2) (MHz) Insertion Loss (F1, at Fc) (dB) Insertion Loss (F2, at Fc) (dB) Attenuation (F1) at (F2) (dB) Attenuation (F2) at (F1) (dB) VSWR (Input @ F1) VSWR (Input @ F2) VSWR (Lowband @ F1) VSWR (Highband @ F2) 2.12 x 1.28 (0.083 x 0.050) 0.55 (0.021) 1.5 892±68 1940±230 -0.4 -0.65 -23 -20 1.3 1.4 1.4 1.2 3 Multilayer Organic (MLOTM) 0805 WCDMA Diplexer S PARAMETER MEASUREMENTS 0 0 -5 dB(S(1.1) dB(S(2.1) dB(S(1.1) dB(S(3.1) -10 -15 -20 -20 -30 Return Loss -40 -25 -30 High Band -10 Low Band -50 Return Loss -35 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 -60 0.4 0.6 2.4 2.6 0.8 1.0 1.2 1.4 freq, GHz 1.6 1.8 2.0 2.2 2.4 2.6 freq, GHz -5 dB(S(2.3)) -10 -15 -20 Isolation -25 -30 -35 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 freq, GHz Note: Measurements were taken using an Anritsu 4 port VNA; Diplexer was mounted on a custom evaluation board. To reduce systematic errors from the VNA, the coaxial measurement cables, and evaluation board, a Short-Open-Load-Thru (SOLT) calibration was performed, using a custom fabricated calibration substrate. This is the most common coaxial calibration methods. 4 Multilayer Organic (MLOTM) 0805 WLAN/BT Diplexer AUTOMATED SMT ASSEMBLY Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLOTM devices onto the PCB. The following section describes the guidelines for automated SMT assembly of MLOTM RF devices which are typically Land Grid Array (LGA) packages or side termination SMT pacages. Control of solder and solder paste volume is critical for surface mount assembly of MLOTM RF devices onto the PCB. SMT REFLOW PROFILE may be required to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below. Common IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLOTM devices onto the PCB. In all cases, a temperature gradient of 3°C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and slower preheating time tp Tp Critical Zone TL to Tp Ramp-up Temperature TL tL Ts max Ts min Ramp-down ts Preheat 25 t 25ºC to Peak Time Figure A. Typical Lead Free Profile and Parameters Profile Parameter Ramp-up rate (Tsmax to Tp Preheat temperature (Ts min to Ts max) Preheat time (ts) Time above TL, 217ºC (tL) Peak temperature (Tp) Time within 5ºC of peak temperature (tp) Ramp-down rate Time 25ºC to peak temperature Pb free, Convection, IR/Convection 3ºC/second max. 150ºC to 200ºC 60 – 180 seconds 60 – 120 seconds 260°C 10 – 20 seconds 4ºC/second max. 6 minutes max. 9