0806 CDMA Diplexer

Multilayer Organic (MLOTM)
0806 CDMA Diplexer
MLOTM TECHNOLOGY
APPLICATIONS
The 0806 diplexer is a best in class low profile multilayer
organic passive device that is based on AVX’s patented
multilayer organic high density interconnect technology.
The MLOTM diplexer uses high dielectric constant and low
loss materials to realize high Q passive printed passive
elements such as inductors and capacitors in a multilayer
stack up. The MLOTM diplexers can support multiple
wireless standards such as WCDMA, CDMA, WLAN,
and GSM and are less than 0.6mm in thickness. These
components are ideally suited for band switching for dual
band systems. All diplexers are expansion matched to
FR4 thereby resulting in improved reliability over standard
Si and ceramic devices.
Multiband applications including
WCDMA, WLAN, WiMax, GPS,
and cellular bands
HOW TO ORDER
LAND GRID ARRAY
ADVANTAGES
•
•
•
•
Low Insertion Loss
Excellent Solderability
Low Parasitics
Low Profile
COMPONENT DIMENSIONS AND FUNCTIONS
DP
06
A
1945
7
TR
Type
Size
Design
Frequency
(MHz)
Finish
7 = Au
T = NiSn
Packaging
Tape & Reel
Bottom View
Side View
0.254±0.05
(0.010±0.002)
0.635±0.05
(0.025±0.002)
0.127±0.04
(0.005±0.002)
1.461±0.10
(0.058±0.004)
0.254±0.10
(0.010±0.004)
0.953±0.05
(0.038±0.002)
QUALITY INSPECTION
Finished parts are 100% tested for electrical parameters
and visual characteristics.
OPERATING TEMPERATURE
-40ºC to +85ºC
TERMINATION
Finishes available in Ni/Sn, Immersion Sn, Immersion Au
and OSP coatings which are compatible with automatic
soldering technologies which include reflow, wave
soldering, vapor phase and manual.
1
6
1
6
1
6
2
5
2
5
2
5
3
4
3
4
3
4
4.5W Maximum
2.223±0.20
(0.088±0.008)
Terminal No.
1
2
3
4
5
6
0.55±0.10
(0.022±0.004)
0.445±0.10
(0.018±0.004)
Unit: mm (inches)
Terminal Name
High Frequency Port
GND
Low Frequency Port
GND
Common Port
GND
0806 CDMA DIPLEXER SPECIFICATIONS
PART NUMBER: DP06A1945TTR
ORIENTATION IN TAPE
POWER CAPACITY
0.191±0.10
(0.008±0.004)
Specification
Size
Height
Volume (mm^3)
Frequency Range (F1) (MHz)
Frequency Range (F2) (MHz)
Insertion Loss (F1, at Fc @ 25oC)
Insertion Loss (F1 at Fc) (-40 to 85ºC)
Insertion Loss (F2, at Fc @ 25ºC)
Insertion Loss (F1 at Fc ) (-40 to 85ºC)
Attenuation (F1) at (F2) (dB min)
Attenuation (F2) at (F1) (dB min)
VSWR (Input @ F1)
VSWR (Input @ F2)
VSWR (Lowband @ F1)
VSWR (Highband @ F2)
AVX -MLOTM mm (inches)
2.2 x 1.5 (0.083 x 0.060)
0.55 (0.021)
1.75
730 ± 230 MHz
2200 ± 500 MHz
-0.4
- 0.55
-0.5
-0.65
-22
-22
1.2
1.6
1.3
1.7
1
Multilayer Organic (MLOTM)
0806 CDMA Diplexer
S PARAMETER MEASUREMENTS
0.0
0.0
-0.5
-0.5
Insertion Loss (dB)
Insertion Loss (dB)
INSERTION LOSS
-1.0
-1.5
-2.0
-2.5
-1.0
-1.5
-2.0
-2.5
-3.0
0.5
0.6
0.7
0.8
0.9
1.1
1.0
1.2
-3.0
1.3
1.2
1.4
1.6
1.8
Frequency (GHz)
2.2
2.4
2.6
2.8
3.0
Frequency (GHz)
Low Band Insertion Loss
Frequency (GHz)
0.500
0.698
0.960
2.0
High Band Insertion Loss
Insertion Loss (dB)
0.121
0.199
0.400
Frequency (GHz)
1.710
2.180
2.700
Insertion Loss (dB)
0.430
0.352
0.360
0
0
-10
-10
Attenuation (dB)
Attenuation (dB)
ATTENUATION
-20
-30
-40
-30
-40
-50
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
Frequency (GHz)
Low Band Attenaution
Frequency (GHz)
1.710
2.180
2.700
2
-20
Attenuation (dB)
26.726
24.681
31.074
2.8
3.0
-50
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
Frequency (GHz)
High Band Attenaution
Frequency (GHz)
0.500
0.698
0.960
Attenuation (dB)
26.671
28.611
23.988
2.6
2.8
3.0
Multilayer Organic (MLOTM)
0806 CDMA Diplexer
RETURN LOSS
0
0
-5
Return Loss (dB)
Return Loss (dB)
-5
-10
-15
-20
-15
-20
-25
-30
-25
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
Frequency (GHz)
Frequency (GHz)
Low Band Return Loss
High Band Return Loss
Frequency (GHz)
0.500
0.698
0.960
Insertion Loss (dB)
29.191
23.723
17.655
Frequency (GHz)
1.710
2.180
2.700
COMMON RETURN LOSS
2.6
2.8
3.0
2.8
3.0
Insertion Loss (dB)
18.487
15.685
17.037
ISOLATION
0
0
-5
-5
-10
-10
Isolation (dB)
Return Loss (dB)
-10
-15
-20
-25
-15
-20
-25
-30
-30
-35
-35
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
Frequency (GHz)
Common Port Return Loss
Frequency (GHz)
0.500
0.698
0.960
1.710
2.180
2.700
Attenuation (dB)
32.382
27.566
19.543
23.343
17.958
16.744
2.8
3.0
-40
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
Frequency (GHz)
Isolation
Frequency (GHz)
0.500
0.698
0.960
1.710
2.180
2.700
Attenuation (dB)
26.956
28.872
24.238
35.833
26.827
29.338
3
Multilayer Organic (MLOTM)
0806 CDMA Diplexer
AUTOMATED SMT ASSEMBLY
Stencil thickness and aperture openings should be adjusted
according to the optimal solder volume. The following are
general recommendations for SMT mounting of MLOTM
devices onto the PCB.
The following section describes the guidelines for automated
SMT assembly of MLOTM RF devices which are typically Land
Grid Array (LGA) packages or side termination SMT pacages.
Control of solder and solder paste volume is critical for
surface mount assembly of MLOTM RF devices onto the PCB.
SMT REFLOW PROFILE
may be required to improve the out-gassing of solder paste.
In addition, the reflow profile depends on the PCB density
and the type of solder paste used. Standard no-clean solder
paste is generally recommended. If another type of flux is
used, complete removal of flux residual may be necessary.
Example of a typical lead free reflow profile is shown below.
Common IR or convection reflow SMT processes shall be
used for the assembly. Standard SMT reflow profiles, for
eutectic and Pb free solders, can be used to surface mount
the MLOTM devices onto the PCB. In all cases, a temperature
gradient of 3°C/sec, or less, should be maintained to prevent
warpage of the package and to ensure that all joints reflow
properly. Additional soak time and slower preheating time
tp
Tp
Critical Zone
TL to Tp
Ramp-up
Temperature
TL
tL
Ts max
Ts min
Ramp-down
ts
Preheat
25
t 25ºC to Peak
Time
Figure A. Typical Lead Free Profile and Parameters
Profile Parameter
Ramp-up rate (Tsmax to Tp
Preheat temperature (Ts min to Ts max)
Preheat time (ts)
Time above TL, 217ºC (tL)
Peak temperature (Tp)
Time within 5ºC of peak temperature (tp)
Ramp-down rate
Time 25ºC to peak temperature
4
Pb free, Convection, IR/Convection
3ºC/second max.
150ºC to 200ºC
60 – 180 seconds
60 – 120 seconds
260°C
10 – 20 seconds
4ºC/second max.
6 minutes max.