AVX Tantalum Division Biddeford Surface Mount Military/Aerospace Products HIGH RELIABILITY TANTALUM CHIP SPECIFICATIONS TAZ FAMILY TBC FAMILY TBJ FAMILY AVX COTS-Plus Weibull Grade TAZ Standard & Low ESR TBC Microchip TCP Ultra Low ESR Module TBJ Low ESR TBM Ultra Low ESR NBS NBM Oxi DSCC DRAWING DSCC 09009 Ultral Low ESR Module DSCC 95158 Older Standard, Non-ER, few ratings DSCC 07016 Current Standard, Full Weibull MIL-PRF-55365 (Including MIL âTâ Level) CWR09 CWR19 CWR15 CWR11 CWR29 SRC9000 Space Level TAZ SRC9000 TBC SRC9000 TCP Module SRC9000 TBJ SRC9000 TBM SRC9000 MEDICAL GRADE TBC HRC5000 Inplantable TAZ HRC5000 Inplantable TBC HRC6000 HIGH RELIABILITY WET TANTALUM SPECIFICATIONS TWC FAMILY TWA FAMILY TWM FAMILY (Ta Cathode) (AVX proprietary Cathode) (Module) AVX COTS-Plus TWC-Y 200°C TWC COTS+ TWA-Y 200°C TWA COTS+ TWA-E TWM (TWC or TWA) DSCC DRAWING TWA DSCC 93026 MIL-PRF-39006 M39006 /22 /25 /30 /31 SRW Space Level TWC TWA TWM SEPTEMBER 2013 n3 AVX Tantalum Division Biddeford Surface Mount Military/Aerospace Products GROUP A TEST OPTIONS Group A Testing comparison TEST MIL-PRF-55365 QPL AVX COTS-Plus MIL Weibull B, C, D AVX SRC9000 MIL T Level Space Level 3 100% Reflow 3 3 3 100% Thermal Shock 3 3 3 3 100% Weibull Optional Mandatory Mandatory-Grade C min Mandatory-Grade C min 100% Surge Current Optional Optional Mandatory - C Level Mandatory - C Level 100% Electrical Testing Custom Test Limits Available To Specification Limits Only +3 Sigma Limits +3 Sigma Limits or Custom Visual & Mechanical Sample Sample 100% - 20X 100% - 20X 3 Simulated Mounting, Rework and Lot Conformance Optional 75% Coverage Mandatory 95% Coverage Mandatory 95% Coverage 100% X-Ray 3 3 DPA - 1580 Destructive Physical Analysis 3 3 Solderability Test* Mandatory 95% Coverage 3 Surge Voltage 3 Hot DC Leakage Temperature Stability Optional Mandatory Mandatory Mandatory *Only Mil QPL ratings receive the steam age portion of solderability testing unless otherwise specified by the customer Space Level AVX SRC9000** AVX COTS-Plus ESA-ESCC3012 COTS-Plus** DSCC 07016 DSCC 95158 LAT 1 LAT 2 LAT 3 NO LAT TAJ-ESA, TES On On On© On nXs On O sX O sX s X (HO) s X O OX O X O O X OnX On sX On snX sX On snX snX O O O Ol Ol l l O O O Ol l l l sX sX O O sX sX sX sX snX sX sX O O O O O On On On On O s s s s s l l l l O O O Ol Ol Ol l OX OX OX O O O O O sX sX sX Ol Ol Ol l level B l level B l level B l level B l *Only Mil QPL ratings receive the steam age portion of solderability testing unless otherwise specified by the customer **Testing of low ESR components requiring a mounted sample shall allow a 2X increase in catalog ESR for post measurements *** = Dry Heat, Damp Heat, Storage, Low Air Pressure, Damp Heat O s n X Standard Test Optional Test Qualification and or GRP C Sample Test 4 n SEPTEMBER 2013 H © l COTS Upscreen 1000Hr 125ºC AVX Standard DCL/ESR/DF 3 SIGMA DLA Standard DCL/ESR 3 SIGMA Part of Manufacturing Flow (PID) OX n X OnX OX OX O X sX OX On X OnX OnX sX sX sX O O O OX sX sX sX O O O O O O O Climatique Sequence *** OnX OnX Adhesion (shear) nX nX Burn-in 168hrs nX Temperature Stability On Hot DC Leakage nX Surge Voltage On DPA - 1580 Destructive Physical Analysis nXs 100% X-Ray On sn On OnX Solderability Test* nX Visual & Mechanical nX 100% Electrical Testing nX 100% Surge Current On 100% Weibull nX Operating Life On Shock or Bump Moisture Resistance AVX SRC9000** Resistance to Soldering Heat New âTâ level CWR09, 11, 15, 19, 29 CWR09, 11, 15, 19, 29 TBJ/TBM (COTS) TAZ/TBC/TBJ (MIL) TBJ/TBM/TAZ TBJ TBJ 100% Thermal Shock Standard MIL Vibration MIL PRF 55365 QPL 100% Reflow AVX Series TEST Simulated Mounting, Rework and Accelerated Life HIGH RELIABILITY SPECIFICATION REQUIREMENTS COMPARISON CHART O