Specifications & Group A Test Options

AVX Tantalum Division
Biddeford Surface Mount Military/Aerospace Products
HIGH RELIABILITY TANTALUM CHIP SPECIFICATIONS
TAZ FAMILY
TBC FAMILY
TBJ FAMILY
AVX COTS-Plus Weibull Grade
TAZ
Standard
&
Low ESR
TBC
Microchip
TCP
Ultra Low
ESR
Module
TBJ
Low ESR
TBM
Ultra Low
ESR
NBS
NBM
Oxi
DSCC DRAWING
DSCC 09009
Ultral Low ESR
Module
DSCC 95158
Older Standard,
Non-ER, few ratings
DSCC 07016
Current Standard, Full Weibull
MIL-PRF-55365 (Including MIL “T” Level)
CWR09
CWR19
CWR15
CWR11
CWR29
SRC9000 Space Level
TAZ
SRC9000
TBC
SRC9000
TCP
Module
SRC9000
TBJ
SRC9000
TBM
SRC9000
MEDICAL GRADE
TBC
HRC5000
Inplantable
TAZ
HRC5000
Inplantable
TBC
HRC6000
HIGH RELIABILITY WET TANTALUM SPECIFICATIONS
TWC FAMILY
TWA FAMILY
TWM FAMILY
(Ta Cathode)
(AVX proprietary Cathode)
(Module)
AVX COTS-Plus
TWC-Y
200°C
TWC
COTS+
TWA-Y
200°C
TWA
COTS+
TWA-E
TWM
(TWC or TWA)
DSCC DRAWING
TWA DSCC
93026
MIL-PRF-39006
M39006 /22 /25 /30 /31
SRW Space Level
TWC
TWA
TWM
SEPTEMBER 2013
n3
AVX Tantalum Division
Biddeford Surface Mount Military/Aerospace Products
GROUP A TEST OPTIONS
Group A Testing comparison
TEST
MIL-PRF-55365 QPL
AVX COTS-Plus
MIL Weibull B, C, D
AVX SRC9000
MIL T Level
Space Level
3
100% Reflow
3
3
3
100% Thermal Shock
3
3
3
3
100% Weibull
Optional
Mandatory
Mandatory-Grade C min
Mandatory-Grade C min
100% Surge Current
Optional
Optional
Mandatory - C Level
Mandatory - C Level
100% Electrical Testing
Custom Test Limits
Available
To Specification Limits
Only
+3 Sigma Limits
+3 Sigma Limits or
Custom
Visual & Mechanical
Sample
Sample
100% - 20X
100% - 20X
3
Simulated Mounting, Rework
and Lot Conformance
Optional
75% Coverage
Mandatory
95% Coverage
Mandatory
95% Coverage
100% X-Ray
3
3
DPA - 1580 Destructive
Physical Analysis
3
3
Solderability Test*
Mandatory
95% Coverage
3
Surge Voltage
3
Hot DC Leakage
Temperature Stability
Optional
Mandatory
Mandatory
Mandatory
*Only Mil QPL ratings receive the steam age portion of solderability testing unless otherwise specified by the customer
Space Level
AVX SRC9000**
AVX COTS-Plus
ESA-ESCC3012
COTS-Plus**
DSCC 07016
DSCC 95158
LAT 1
LAT 2
LAT 3
NO LAT
TAJ-ESA, TES
On On On© On
nXs
On
O
sX
O
sX
s X (HO) s X O
OX
O X
O
O X
OnX
On
sX
On snX sX
On snX snX
O
O
O
Ol
Ol
l
l
O
O
O
Ol
l
l
l
sX
sX
O
O
sX
sX
sX
sX
snX
sX
sX
O
O
O
O
O
On On On On
O
s
s
s
s
s
l
l
l
l
O
O
O
Ol
Ol
Ol
l
OX
OX
OX
O
O
O
O
O
sX
sX
sX
Ol
Ol
Ol
l
level B l
level B l
level B l
level B l
*Only Mil QPL ratings receive the steam age portion of solderability testing unless otherwise specified by the customer
**Testing of low ESR components requiring a mounted sample shall allow a 2X increase in catalog ESR for post measurements
*** = Dry Heat, Damp Heat, Storage, Low Air Pressure, Damp Heat
O
s
n
X
Standard Test
Optional Test
Qualification and or GRP C
Sample Test
4 n SEPTEMBER 2013
H
©
l
COTS Upscreen 1000Hr 125ºC
AVX Standard DCL/ESR/DF 3 SIGMA
DLA Standard DCL/ESR 3 SIGMA
Part of Manufacturing Flow (PID)
OX
n X
OnX
OX
OX
O X
sX
OX On X OnX OnX
sX
sX
sX
O
O
O
OX
sX
sX
sX
O
O
O
O
O
O
O
Climatique Sequence ***
OnX
OnX
Adhesion (shear)
nX
nX
Burn-in 168hrs
nX
Temperature Stability
On
Hot DC Leakage
nX
Surge Voltage
On
DPA - 1580 Destructive
Physical Analysis
nXs
100% X-Ray
On sn On OnX
Solderability Test*
nX
Visual & Mechanical
nX
100% Electrical Testing
nX
100% Surge Current
On
100% Weibull
nX
Operating Life
On
Shock or Bump
Moisture Resistance
AVX SRC9000**
Resistance to Soldering Heat
New “T” level
CWR09,
11, 15, 19, 29
CWR09,
11, 15, 19, 29
TBJ/TBM
(COTS)
TAZ/TBC/TBJ
(MIL)
TBJ/TBM/TAZ
TBJ
TBJ
100% Thermal Shock
Standard MIL
Vibration
MIL PRF 55365
QPL
100% Reflow
AVX
Series
TEST
Simulated Mounting,
Rework and Accelerated Life
HIGH RELIABILITY SPECIFICATION REQUIREMENTS COMPARISON CHART
O