ERNI D-Sub Connectors for THR (through hole reflow) Process

ERNI D-Sub Connectors
for THR (through hole reflow) Process
General
The THR method is an attractive option for processing wired components during SMT assembly without leaving the
production line.
The new ERNI D-Sub connectors are reflow/lead-free process compatible and free of halogen. Temperatures greater
than 260 °C can be sustained without exhibiting any visual or functional impairment.
Wired D-Sub connectors are automatically or manually placed in plated-through holes of a pcb. Prior to this, soldering paste required for the solder joints is positioned in these holes via paste printing. What follows is the traditional
process of soldering in the reflow or vapor phase oven.
It is practical to carry out a soldering paste calculation before converting to the THR method. Doing this will allow you
to estimate in advance as to whether the existing solder for the given geometric data will be able to meet the required
quality standards.
Clip with and without assembly force
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Catalog E XXXXXX
06/05
Edition 1
Printed in Germany · Subject to modification without prior notice.
D-Sub connectors are available with or without assembly force, depending on the type of assembly process (automatic or manual).
Layout Recommendations
Standard Right Angle D-Sub Connector
2,54
1 ±0,05
1,27
Layout, drilling plan
11,7max.
1,37 9/15 pol.
1,38 25/37 pol.
3,2 ±0,1
2,74
9/15 pol.
2,76 25/37 pol.
2,54
1,27
1,6
Cu plating
1,37
9/15 pol.
1,38 25/37 pol.
3,8
2,74
9/15 pol.
2,76 25/37 pol.
Paste printing stencil
2,54
2,3
3,48
1,27
1,6
1,5
4,32
5,5
1,37
9/15 pol.
1,38 25/37 pol.
2,74
9/15 pol.
2,76 25/37 pol.
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Catalog E XXXXXX
06/05
Edition 1
Eurostyle Right Angle D-Sub Connector
7,6 max.
2,54
1 ±0,05
1,27
Layout, drilling plan
1,37 9/15 pol.
1,38 25/37 pol.
2,74
9/15 pol.
2,76 25/37 pol.
3,2 ±0,1
2,54
1,27
1,6
Cu plating
1,37
9/15 pol.
1,38 25/37 pol.
3,8
2,74
9/15 pol.
2,76 25/37 pol.
Paste printing stencil
2,54
2,3
3,48
1,27
1,6
1,5
1,37
4,32
5,5
9/15 pol.
1,38 25/37 pol.
2,74
9/15 pol.
2,76 25/37 pol.
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Catalog E XXXXXX
06/05
Edition 1
Vertical D-Sub Connector
2,54
1 ±0,05
1,27
Layout, drilling plan
1,37 9/15 pol.
1,38 25/37 pol.
3,2 ±0,1
2,74
9/15 pol.
2,76 25/37 pol.
2,54
1,27
1,6
Cu plating
1,37
9/15 pol.
1,38 25/37 pol.
3,8
2,74
9/15 pol.
2,76 25/37 pol.
Paste printing stencil
2,54
2,3
3,476
1,27
1,6
1,5
1,37
4,32
5,5
9/15 pol.
1,38 25/37 pol.
2,74
9/15 pol.
2,76 25/37 pol.
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Catalog E XXXXXX
06/05
Edition 1
Solder Paste Printing
In addition to other criteria, the placement of a sufficient, reproducible solder paste volume has turned out to be the
main criterion for ensuring the quality of the solder joint as per IPC-A610.
The solder volume is determined by the stencil thickness and hole diameter as well as by the level of paste in the plated-through hole.
Solder paste printing component side view
Solder paste printing soldering side view
In order to avoid paste displacement and solder balls, it is advisable to use stencil apertures that are 10 % smaller
than the pads.
The best results are achieved with a paste fill level of 100 %. This can be realized when a closed squeegee system is
used. A double print in conjunction with an open squeegee system also can produce satisfactory fill levels.
Solder paste printing stencil:
Stencil thickness (steel)
Stencil aperture
150 µm – 200 µm
see drawings (page 2-4)
Solder paste SnPb or SnAgCu (lead-free)
Solder proportion
Paste type 3
solder ball size
ca. 50 %
20 – 40 µm
Required solder paste volume (based on nominal drill-hole diameter 1.0 mm)
Bei unterschiedlichen Pastenfüllgraden / Bohrungsdurchmesser
75 % solder joint
ca. 1.2 mm3
ca. 1.5 mm3
Required paste volume
Achievable paste volume
100% solder joint
ca. 1.45 mm3
ca. 1.5 mm3
Achievable solder joint form
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Catalog E XXXXXX
06/05
Edition 1
Relevant data for automatic assembly
Weight (gram)
Standard Right Angle D-Sub Connectors
Female without
Female with nut
Female with bolt
Male without
Male with nut
Male with bolt
9 pin
6.70
6.99
9.34
6.09
6.36
8.52
15 pin
8.50
8.79
11.02
7.65
7.90
10.23
25 pin
11.52
11.84
14.00
9.96
10.08
12.33
37 pin
15.03
15.27
15.99
12.85
13.00
15.39
9 pin
5.70
5.85
8.40
5.23
5.26
7.68
15 pin
7.41
7.54
9,79
6.42
6.50
9.02
25 pin
9.99
10.24
12.46
8.33
8.60
10.69
37 pin
13.19
13.44
15.69
10.86
11.06
13.22
9 pin
4.31
4.58
5.45
3.57
4.00
4.73
15 pin
5.80
6.07
7.01
4.94
5.21
5.69
25 pin
8.21
8.49
9.09
6.41
6.69
7.29
37 pin
10.87
11.15
11.72
10.62
10.89
11.51
Eurostyle Right Angle D-Sub Connectors
Female without
Female with nut
Female with bolt
Male without
Male with nut
Male with bolt
Vertical D-Sub Connectors
Female without
Female with nut
Female with bolt
Male without
Male with nut
Male with bolt
Pick and place point
see connector datasheet
Packaging
Tape and Reel
Tray
dimensions see datasheet
dimensions see datasheet
Reflow data
Common temperature profile
Temperature stability
EN 61760-1
min. 3 x reflow solder (Peaktemp. 260 °C)
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Catalog E XXXXXX
06/05
Edition 1
Soldering results
Soldering conditions:
1.6 mm PCB thickness ,
D-Sub THR Part number: 154204
Closed squeegee system 150µm stencil thickness
Vapor Phase soldered at 230 °C
Cross Section Signalpin
Cross Section Clip with Assembly Force
7
www.ERNI.com/contact/
Catalog E XXXXXX
06/05
Edition 1