ERmet ZDplus

ERmet ZDplus
www.erni.com
Catalog
Katalog D
E XXXXXX
074518
Ausgabe 3, 03/05 09/13
www.erni.com
Edition
4
1
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Catalog E XXXXXX
09/13 Edition 4
ERmet ZDplus
High Speed Differential Hard Metric Connector System
The ERmet ZDplus connector is an enhancement of the
ERmet ZD family. This high-speed differential Hard Metric
connector system enables data rates of 20 Gbit+.
The ERmet ZDplus is based on the principal mechanical
design of the proven ERmet ZD with the same dimensions.
To enable higher data rates ERNI Electronics has optimized
the signal routing and the pressfit termination of the female
connector. To benefit from the maximum performance of the
new ERmet ZDplus the usage of backdrilling is recommended. Decreasing via stub length and the related “stub effect”
by backdrilling significantly reduces the reflections and the
overall BER (Bit Error Rate) of the interconnect.
The first product of the ERmet ZD+ family is the 4-pair right
angle female connector with pressfit termination. The ERmet
ZDplus female connector is mating compatible to the existing
ERmet ZD male connector. This means, that existing
backplane designs do not need layout changes on the
backplane side, if customers want to upgrade their systems.
Of course the layout on the daughtercards has to be modified
if using the new ERmet ZDplus female parts.
Features
•
•
•
•
•
•
Data rate performance per differential pair with standard ERmet ZD male connector 15+ Gbit/s
(optional with ERmet ZDplus male connector 20+ Gbit/s)
40 differential pairs per inch
Mating compatible to standard ERmet ZD male connec-
tors, backwards compatible to existing backplane systems
Improved crosstalk behaviour
Improved layout on daughter cards
Meets the performance requirements of next generation processor technology
®
Catalog E XXXXXX
09/13
Edition 4
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3
ERmet ZDplus
High Speed Differential Hard Metric Connector System
Electrical And Mechanical Characteristics
Standard
Number of pins
Technical data
Climate category
Temperature range
Air- and creepage distance
Operating voltage
Dielectric strength
Contact resistance
Insulation resistance
Vibration, sine
Contact interruption
(while vibration test)
Shock, halfsine
Contact interruption
(while shock test)
Mechanical operation
(mating cycles)
Insertion and withdrawal
force
Gauge retention force
DIN EN 60068-1
test b
IEC 60664
IEC 60512
test 4a
IEC 60512
test 2a
IEC 60512
test 3a
IEC 60512
test 6d
IEC 60512
test 2e
IEC 60512
test 6c
IEC 60512
test 2e
IEC 60512
test 9a
IEC 60512
test 13b
IEC 60512
test 16e
Pressfit
Male- and Female
4-pair
-55/125/56
-55/125 °C
0.5 mm
The permissible operating voltages depends on the customer application and on the applicable or specified safety requirements.
Insulation coordination according to IEC 60664-1 has to be regarded for the complete electrical device. Therefore, the maximum
creepage and clearance distances of the mated connectors are
specified for consideration as a part of the whole current path.
In practice, reductions in creepage or clearance distances may
occur due to the conductive pattern of the printed board or the
wiring used, and have to be taken into account separately.
As a result the creepage and clearance distances for the application
may be reduced compared to those of the connector.
contact pair - contact pair 500 V
contact pair - shield 150 V
contact - contact 150 V
< 50 mΩ (Signal)
< 15 mΩ (Shield)
> 104 MΩ
rms
rms
rms
10 – 2000 Hz
20 g
< 1 µs
50 g
11 ms
< 1 µs
> 250 mating cycles
Insertion force: max. 0.7 N/pin (Signal)
max. 0.9 N/pin (Shield)
Withdrawal force:min. 0.15 N/pin
> 0.2 N
4Catalog E XXXXXX
09/13
Edition 4
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ERmet ZDplus
High Speed Differential Hard Metric Connector System
Electrical And Mechanical Characteristics
Standard
Number of pins
Signal transmission data
Differential impedance
Data rate per pair
Housing materials
Plastic material
CTI value
UL flame rating
UL file
Contact materials
Base material
Mating area
Termination area
LCP
CTI 175
UL 94 V-0
E83005
Cu alloy
no flame-retardent additives, no toxic additives, allow easy recycling
E84703
IEC 112
Environment compatibility
Recycling
Product Approval
UL/CSA
Catalog E XXXXXX
Pressfit
Male- and Female
09/13
4-pair
100 Ω
15+ Gbit/s (with standard ERmet ZD male connector)
20+ Gbit/s (with ERmet ZDplus male connector)
Gold plated
Sn
Edition 4
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5
ERmet ZDplus
High Speed Differential Hard Metric Connector System
Right Angle Female Connectors 4 Pair
Dimensional Drawing
22,5
2,5
0,75
h
g
1,5
19,4
f
e
4,5
d
c
b
a
10
1
EN-Zone für durchkontaktierte
Löcher 0.46 ± 0.05
compliant zone for through hole
0.46 ± 0.05
15,7
24,95 -0,1
1,1
10,4
1,2
1,2
GND h
h
g
GND g
GND f
f
e
GND e
GND d
d
c
GND c
GND b
b
a
GND a
27,9 ±0,1
Position
17,5
Date Code
+0,2
0,9
1,6
1
18,6
16,7
21,4 -0,1
Oberfläche der Tochterplatine
Top surface of daughter card
Lochbild für Leiterplatte
(Bestückungsseite)
Board hole pattern
(Component mounting side)
9 x 2,5 = (22,5)
alle Löcher
all holes
1)
1)
1,2
1,2
2,5
0.05
0.55 ± 0.02 Bohrdurchmesser des Loches
4,5
GND h
h
g
GND g
GND f
f
e
GND e
GND d
d
c
GND c
GND b
b
a
GND a
1,04
1
0,9
1,1
18
0.55 ± 0.02 Diameter of drilled hole
Schichtaufbau im metallisierten Loch
siehe Zeichnung 384191
Metal plating of plated-through hole
see drawing 384191
1
10
0.46 ± 0.05 Durchmesser des metallisierten Loches
0.46 ± 0.05 Diameter of finished plated-through hole
6Catalog E XXXXXX
09/13
Edition 4
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ERmet ZDplus
High Speed Differential Hard Metric Connector System
Standard Vertical Male Connectors 4 Pair
Dimensional Drawing
-0,1
0,05
6,35
0,1
23,4
Date Code
ERNI
)
-0,1
3
( 1,7
Löcher ø 0.6
0,2
13,4
XXXXXXX
EE-Zone für durchkontaktierte
±0.05
compliant zone for through hol e
ø 0.6
8
7
6
5
4
3
2
5,7
10 9
±0.05
1
4,5
1,5
a
b
ab
c
d
cd
e
f
ef
g
h
gh
2,5
9x2.5= 22,5
24,95
0,75
-0,1
Lochbild für Leiterplatte
Board hole patter n
(Bestückungsseite)
(Component mounting side)
9 x 2.5 =
alle Löcher - all holes
( 22.5 )
2.5
0.05
1)
1.5
10 9
Catalog E XXXXXX
8
7
6
5
4
3
2
11x 1.5 = ( 16.5 )
Durchmesser des
metallisierten Loches
ø 0.6 ±0.05 Diameter of finished
plated-through hole
a
b
ab
c
d
cd
e
f
ef
g
h
gh
1) ø 0.6
±0.05
ø 0.7
±0.02
Bohrungsdurchmesser
des Loches
ø 0.7 ±0.02 Diameter of drilled hole
1
09/13
Edition 4
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7
ERmet ZDplus
High Speed Differential Hard Metric Connector System
Metal Plating of Plated Through-holes
Schichtaufbau im metallisierten Loch für EN-Kontakt
Hole design
ø0.46 of
mm
Metal plating
plated-through hole for EN-contact
Bohrungsdurchmesser des Loches
Durchmesser des
metallisierten Loches
Diameter of finished
plated-through hole
Diameter of drilled hole
0,55 ±0,02
0,46 ±0,05
Restringbreite
min. 0,05
Restring width
max. 10 µm Sn 1)
min. 25 µm Cu
1)
Werden andere Oberflächentechniken, wie z.B. NiAu, chem. Sn oder Cu blank
eingesetzt, sind die angegebenen Maße für Bohrungsdurchmesser, Durchmesser
Schichtaufbau
im metallisierten
Lochund
für
des metallisierten
Loches, Restringbreite
dieEE-Kontakt
Mindestschichtdicke
Hole
design
ø0.6
mm
von
Cu einzuhalten.
MetalEinplating
of
plated-thr
ough
hole
for
EE-contact
mögliches Überschreiten der oberen Toleranz von Maß "Durchmesser des
metallisierten Loches" wird durch eine entsprechende Cu-Schichtdicke vermieden.
Bohrungsdurchmesser
0,7
Loches
For other platings, such as NiAu, chem. Sn or blanc
Cu the des
recommended
dimensions have to be respected for the diameter of drilledDiameter
hole, diameter
ofhole
of drilled
Durchmesser
des
plated-through
hole, rest ring
width and min. thickness of Cu plating.
0,05
0,6
metallisierten
To keepLoches
the max. tolerance for the "Diameter of finished plated-through hole" the
according
thickness of the Cu-plating has to be used.
Diameter
of finished
0,02
plated-through hole
min. 0,05
für Einpresszone ERmet ZDplus
for press-fit zone ERmet ZDplus
Restringbreite
Restring width
max. 15 m
min. 25 m Cu
1)
Sn
Werden andere Oberflächentechniken, wie z.B. NiAu, chem. Sn oder Cu blank
eingesetzt, sind die angegebenen Maße für Bohrungsdurchmesser, Durchmesser
des metallisierten Loches, Restringbr
eite und die Mindestschichtdicke
von Cu einzuhalten.
Ein mögliches Überschreiten der oberen Toleranz von Maß "Durchmesser des
metallisierten Loches" wird durch eine entsprechende Cu-Schichtdicke vermieden.
For other platings, such as NiAu, chem. Sn or blanc Cu the ecommended
r
dimensions have to be respected for the diameter of drilled hole, diameter of
planted-thru hole, rest ring width and min. thickness of Cu plating.
To keep the max. tolerance for the "Diameter of finished plated-thru hole" the
according thickness of the Cu-plating has to be used.
für Einpresszone D = 0.72
8
Catalog E XXXXXX
for press-fit zone D = 0.72
09/13
Edition 4
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ERmet ZDplus
High Speed Differential Hard Metric Connector System
Notes
Catalog E XXXXXX
09/13
Edition 4
www.erni.com
9
ERmet ZDplus
High Speed Differential Hard Metric Connector System
Notes
10Catalog E XXXXXX
09/13
Edition 4
www.erni.com
Member
www.erni.com
Catalog
Katalog D
E XXXXXX
074518
Ausgabe 3, 03/05 09/13
www.erni.com
Edition
4
11
ERNI Electronics GmbH & Co. KG
Seestrasse 9
73099 Adelberg/Germany
Tel +49 7166 50-0
Fax +49 7166 50-282
[email protected]
Europe
ERNI Electronics, Inc.
2201 Westwood Ave
Richmond, VA 23230/USA
Tel +1 804 228-4100
Fax +1 804 228-4099
[email protected]
North America
ERNI Asia Holding Pte Ltd.
Blk 4008 Ang Mo Kio Avenue 10
#04-01/02 Techplace I
Singapore 569625
Tel +65 6 555 5885
Fax +65 6 555 5995
[email protected]
Asia
South America
Australia
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Canada
Mexico
New Zealand
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© ERNI Electronics GmbH & Co. KG 2013 • Printed in Germany. A policy of continuous improvement is followed and the right to alter any published data without notice is
reserved. ERNI ®, MicroStac ®, MicroSpeed ®, MiniBridge ®, MaxiBridge ®, ERmet ®, ERmet ZD ®, ERbic ® and ERNIPRESS ® are trademarks (registered or applied for in various countries) of ERNI Electronics GmbH & Co. KG.
Catalog E XXXXXX
09/13 Edition 4