Future Technology Devices International Ltd. FT122

Document No.: FT_000647
FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
Future Technology Devices
International Ltd.
FT122
(Enhanced USB Device
Controller with Parallel Bus
IC)
The FT122 is a USB generic interface
controller with the following advanced

clock frequency (4 – 24 MHz)
features:

USB 2.0 Full Speed compatible

High performance USB device controller with

30 kHz output clock provided during suspend

Integrated

and voltage regulators

Fully integrated clock generation
external crystal required
with

Supports 8-bit parallel interface to external

Supports DMA operation

Supports up to 8 bi-directional endpoints with
total 2K bytes endpoint buffer

Max packet size is 504 bytes for isochronous
endpoint and 64 bytes for control/bulk/
interrupt endpoint

Double
buffer
scheme
for
any
endpoint
Multiple interrupt modes to facilitate both bulk
USB
Battery
Charger
for
USB
USB connection indicator that toggles with USB
Supports
bus-powered
or
self-powered

VCC power supply operation at 3.3V or 5V

Internal 1.8V and 3.3V LDO regulators

VCC IO level range from 1.8V to 3.3V

Integrated power-on-reset circuit

UHCI/OHCI/EHCI host controller compatible

-40°C to 85°C extended operating temperature
range
and isochronous transfers

resistor
applications
increases data transfer throughput

pull-up
transmit and receive activities
no
microcontroller
DP
connection
integrated SIE, endpoint buffer, transceiver

Dedicated clock output pin with programmable

Available in Pb-free TSSOP-28 and QFN-28
packages (RoHS compliant)
detection
allowing
optimized charging profile
Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or reproduced
in any material or electronic form without the prior written consent of the copyright holder. This product and its documentation are
supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made or implied. Future Technology
Devices International Ltd will not accept any claim for damages howsoever arising as a result of use or failure of this product. Your
statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in
which the failure of the product might reasonably be expected to result in personal injury. This document provides preliminary
information that may be subject to change without notice. No freedom to use patents or other intellectual property rights is implied by
the publication of this document. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow
G41 1HH United Kingdom. Scotland Registered Company Number: SC136640
Copyright © 2014 Future Technology Devices International Limited
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Document No.: FT_000647
FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
1
Typical Applications

Provide USB port to Microcontrollers

Provide USB port to FPGA’s

USB Industrial Control

Utilising USB to add system modularity

Mass storage data transfers for multitude of

Isochronous support for video applications in
embedded systems applications, including
security, industrial control, and quality
medical, industrial data-logger, power-
inspections
metering, and test instrumentation
1.1 Part Numbers
Part Number
Package
FT122T-x
TSSOP-28
FT122Q-x
QFN-28
Note: Packaging codes for x is:
- R: Taped and Reel, (TSSOP is 2,500pcs per reel, QFN is 6,000pcs per reel).
- U: Tube packing, 50pcs per tube (TSSOP only)
- T: Tray packing, 490pcs per tray (QFN only)
For example: FT122T-R is 2,500pcs taped and reel packing
1.2 USB Compliant
At the time of writing this datasheet, the FT122 was in the process of completing USB compliance testing.
Copyright © 2014 Future Technology Devices International Limited
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Document No.: FT_000647
FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
2
Block Diagrams
Figure 2-1 FT122 Block Diagram
For a description of each function please refer to Section 4.
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Document No.: FT_000647
FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
Table of Contents
1
Typical Applications ...................................................................... 2
1.1
Part Numbers...................................................................................... 2
1.2
USB Compliant .................................................................................... 2
2
Block Diagrams ............................................................................ 3
3
Device Pin Out and Signal Description .......................................... 6
3.1
TSSOP-28 Package Pin Out ................................................................. 6
3.2
QFN-28 Package Pin Out ..................................................................... 6
3.3
Pin Description ................................................................................... 7
4
Function Description..................................................................... 9
4.1
Functional Block Descriptions ............................................................. 9
4.2
Interrupt Modes ................................................................................ 10
5
Endpoint Buffer Management ..................................................... 11
5.1
Endpoint Buffer Management in Default Mode .................................. 11
5.2
Endpoint Buffer Management in Enhanced Mode .............................. 12
6
Commands and Registers ........................................................... 14
6.1
Command Summary .......................................................................... 14
6.2
Initialization Commands ................................................................... 19
6.2.1
Set Address Enable .................................................................................................... 19
6.2.2
Set Endpoint Enable ................................................................................................... 19
6.2.3
Set Mode .................................................................................................................. 19
6.2.4
Set DMA ................................................................................................................... 21
6.2.5
Set Endpoint Configuration (for Enhanced Mode) ........................................................... 22
6.3
Data Flow Commands ....................................................................... 23
6.3.1
Read Interrupt Register .............................................................................................. 23
6.3.2
Select Endpoint ......................................................................................................... 25
6.3.3
Read Last Transaction Status ...................................................................................... 25
6.3.4
Read Endpoint Status ................................................................................................. 26
6.3.5
Read Buffer ............................................................................................................... 27
6.3.6
Write Buffer .............................................................................................................. 27
6.3.7
Clear Buffer .............................................................................................................. 27
6.3.8
Validate Buffer .......................................................................................................... 28
6.3.9
Set Endpoint Status ................................................................................................... 28
6.3.10
6.4
Acknowledge Setup ................................................................................................ 28
General Commands ........................................................................... 28
6.4.1
Read Current Frame Number ....................................................................................... 29
6.4.2
Send Resume ............................................................................................................ 29
6.4.3
Set Buffer Interrupt Mode ........................................................................................... 29
6.4.4
Read Vendor ID ......................................................................................................... 30
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Document No.: FT_000647
FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
6.4.5
Read Product ID ........................................................................................................ 30
6.4.6
Read FTDI ID ............................................................................................................ 30
6.4.7
Set IO Pad Drive Strength........................................................................................... 30
7
Application Information ............................................................. 32
8
Devices Characteristics and Ratings ........................................... 33
8.1
Absolute Maximum Ratings............................................................... 33
8.2
DC Characteristics............................................................................. 34
8.3
AC Characteristics ............................................................................. 35
9
Package Parameters ................................................................... 39
9.1
TSSOP-28 Package Dimensions ........................................................ 39
9.2
TSSOP-28 Package Markings ........................................................... 40
9.3
QFN-28 Package Dimensions ............................................................ 41
9.4
QFN-28 Package Markings ............................................................... 42
9.5
Solder Reflow Profile ........................................................................ 42
10
Contact Information ................................................................... 44
Appendix A– References ............................................................................ 45
Appendix B - List of Figures and Tables ..................................................... 45
Appendix C - Revision History .................................................................... 47
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Document No.: FT_000647
FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
3
Device Pin Out and Signal Description
3.1 TSSOP-28 Package Pin Out
Figure 3-1 TSSOP-28 package schematic symbol
3.2 QFN-28 Package Pin Out
Figure 3-2 QFN-28 package schematic symbol
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Document No.: FT_000647
FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
3.3 Pin Description
PIN No.
(TSSOP28)
PIN No.
(QFN28)
1
26
2
PIN NAME
TYPE
DESCRIPTION
D0
IO
Data bus bit 0.
27
D1
IO
Data bus bit 1.
3
28
D2
IO
Data bus bit 2.
4
1
D3
IO
Data bus bit 3.
5
2
VCCIO
6
3
D4
IO
Data bus bit 4.
7
4
D5
IO
Data bus bit 5.
8
5
D6
IO
Data bus bit 6.
9
6
D7
IO
Data bus bit 7.
10
7
ALE
I
P
IO Supply Voltage; 1.8V, 2.5V or 3.3V
Address latch enable for multiplexed address/data
bus configuration.
This pin must be pulled Low for non-multiplexed
address/data bus configuration.
11
8
CS_n
I
12
9
SUSPEND
13
10
CLKOUT
14
11
INT_n
OD
15
12
RD_n
I
Read enable (Active Low).
16
13
WR_n
I
Write enable (Active Low).
17
14
DMREQ
O
DMA request.
18
15
DMACK_n
I
DMA acknowledge (Active Low).
19
16
EOT_n
I
End of DMA transfer (Active Low). Also function
as Vbus sensing input for self-powered
application.
20
17
RESET_n
I
Asynchronous reset (Active Low).
21
18
GL_n
22
19
VOUT3V3
I,OD
O
Chip select (Active Low).
Device suspend (output) and wakeup (input).
Programmable output clock.
Interrupt (Active Low).
OD
USB bus activity indicator (Active Low)
P
3.3V regulator output for 5V operation;
To operate the IC at 3.3 V, supply 3.3 V to both
the VCC and VOUT3V3 pins
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Document No.: FT_000647
FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
PIN No.
(TSSOP28)
PIN No.
(QFN28)
PIN NAME
TYPE
DESCRIPTION
23
20
VCC
P
24
21
GND
P
25
22
DM
AIO
USB data signal minus
26
23
DP
AIO
USB data signal plus
27
24
BCD_n
O
USB Charger detector output
28
25
A0
I
Address bit for non-multiplexed address/data bus
configuration.
Power supply (3.3V or 5V)
Ground
- A0=1 indicates command phase;
- A0=0 indicates data phase.
This pin must be pulled High for multiplexed
address/data bus configuration.
-
29
GND
P
Ground. Die pad for QFN-28 package.
Table 3-1 FT122 Pin Description
Note:
a) Pin name with suffix “_n” denotes active low input/output signal.
b) Symbol used for pin TYPE:
OD
: Open Drain Output
O
: Output
IO
: Bi-directional Input and Output
I
: Plain input
AIO
: Analog Input and Output
P
: Power or ground
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Document No.: FT_000647
FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
4
Function Description
The FT122 is a USB device controller which interfaces with microcontrollers via a generic 8-bit parallel
bus.
4.1 Functional Block Descriptions
The following sections describe the function of each block. Please refer to the block diagram shown in
Figure 2-1.
+1.8V LDO Regulator. The +1.8V LDO regulator generates the +1.8V reference voltage for the internal
core of the IC with input capabilities from 3.3V or 5V.
+3.3V LDO Regulator. The +3.3V LDO regulator generates the +3.3V supply voltage for the USB
transceiver. An external decoupling capacitor needs to be attached to the VOUT3V3 regulator output pin.
The regulator also provides +3.3V power to the 1.5kΩ internal pull up resistor on DP pin. The allowable
input voltages are 5V or 3.3V. When using 3.3V as the input voltage, the VCC and VOUT3V3 pins should
be tied together. This will result in the regulator being by-passed.
USB Transceiver. The USB Transceiver cell provides the USB 1.1 / USB 2.0 full-speed physical interface.
Output drivers provide +3.3V level slew rate control , while a differential input and two single ended input
receivers provide data in, Single-Ended-0 (SE0) and USB reset detection conditions respectfully. A 1.5kΩ
pull up resistor on DP is incorporated.
DPLL. The DPLL cell locks on to the incoming NRZI USB data and generates recovered clock and data
signals..
Internal Oscillator. The Internal Oscillator cell generates a reference clock. This provides an input to
the Clock Multiplier function.
Clock Multiplier. The 12MHz and 48MHz reference clock signals for various internal blocks can be
generated from the reference clock via the oscillator functions and clock multiplier circuitry.
Serial Interface Engine (SIE). The Serial Interface Engine (SIE) block performs the parallel to serial
and serial to parallel conversion of the USB data. In accordance with the USB 2.0 specification, it
performs bit stuffing/un-stuffing and CRC5/CRC16 generation. It also checks the CRC on the USB data
stream.
USB Protocol Engine. The USB Protocol Engine manages the data stream from the device USB control
endpoint. It handles the low level USB protocol requests generated by the USB host controller.
The
Protocol Engine also includes a memory management unit which handles endpoint buffers.
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Document No.: FT_000647
FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
OUT Buffer. Data sent from the USB host controller to FT122 via the USB data OUT endpoint is stored in
the OUT buffer. Data is removed from the OUT buffer to system memory under control of the parallel
interface block.
IN Buffer. Data from system memory is stored in the IN buffer. The USB host controller removes data
from the IN buffer by sending a USB request for data from the device data IN endpoint.
RESET Generator. The integrated Reset Generator cell provides a reliable power-on reset to the device
internal circuitry at power up. The RESET_n input pin allows an external device to reset the FT122.
Parallel Interface Block. The 8-bit parallel bus allows direct interface to a generic microcontroller
(MCU), supporting both multiplexed and non-multiplexed address/data bus configurations. The FT122
also supports Direct Memory Access (DMA) operation. With DMA access data can be written to the IN
buffer or read from the OUT buffer without MCU intervention. The DMA access can be done in single cycle
or burst mode.
4.2 Interrupt Modes
The FT122 interrupt pin (INT_n) can be programmed to generate an interrupt in different modes. The
interrupt source can be any bit in the Interrupt Register, an SOF packet being received, or both. The
interrupt modes are selectable by two register bits, one is the SOF-only Interrupt Mode bit (bit 7 of Clock
Division Factor register), and the other is the Interrupt Pin Mode bit (bit 5 of DMA Configuration register).
Interrupt
mode
Bit SOF-only
Interrupt
Mode
Bit Interrupt
Pin Mode
Interrupt source
0
0
0
Any bit in Interrupt register
1
0
1
Any bit in Interrupt register and SOF
2
1
X
SOF only
Table 4-1 Interrupt modes
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Document No.: FT_000647
FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
5
Endpoint Buffer Management
The FT122 has 2 modes of operation for command and memory management: the default mode (FT120
compatible mode) and the enhanced mode. The buffer management schemes are different in these two
modes. Upon reset the default mode is functional. The enhanced mode is activated when any of the Set
Endpoint Configuration commands (B0h – BFh) are received.
5.1 Endpoint Buffer Management in Default Mode
In default mode the FT122 has 3 bi-directional endpoints (EP0, EP1 and EP2). EP0 is the control endpoint,
with 16 bytes maximum packet size for both control OUT and control IN endpoint. EP1 can be used as
either a bulk endpoint or an interrupt endpoint, with 16 bytes maximum packet size for both OUT and IN
endpoints. Table 5-1 shows the endpoint type and maximum packet size for EP0 and EP1.
Endpoint
Number (EP)
Endpoint
Index (EPI)
Endpoint
Direction
Transfer Type
Max Packet Size
0
0
OUT
Control
16
1
IN
Control
16
2
OUT
Bulk/Interrupt
16
3
IN
Bulk/Interrupt
16
1
Table 5-1 Endpoint configuration for EP0 and EP1
EP2 is the primary endpoint. It can be configured as either a bulk/interrupt or isochronous endpoint. The
maximum packet size allowed for EP2 depends on the mode of configuration through the Set Mode
command. Table 5-2 shows all the 4 endpoint configuration modes for EP2.
EP2 Endpoint
Configuration
Mode
Endpoint
Index (EPI)
Endpoint
Direction
Transfer Type
Max Packet Size
0
4
OUT
Bulk/Interrupt
64
(default)
5
IN
Bulk/Interrupt
64
1
4
OUT
Isochronous
128
2
5
IN
Isochronous
128
3
4
OUT
Isochronous
64
5
IN
Isochronous
64
Table 5-2 Endpoint configuration for EP2
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FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
As the primary endpoint, EP2 is suitable for transmitting or receiving relatively large data. To improve the
data throughput, EP2 is implemented with double buffering. This allows the concurrent operation between
USB bus access and MCU or DMA local bus access. For example, for EP2 IN endpoint (EPI5), the USB host
can read data from FT122 Buffer 0 while the local MCU is writing to Buffer 1 at the same time. The USB
host can subsequently read from FT122 Buffer 1 without waiting for it to be filled. Buffer switching is
handled automatically by the FT122.
The EP2 buffer also supports DMA operation. The MCU needs to initialize the DMA operation through the
Set DMA command. Once DMA operation is enabled, data will be moving between the system memory
and FT122 endpoint buffer under the DMA controller. Buffer switching between Buffer 0 and Buffer 1 is
handled automatically.
5.2 Endpoint Buffer Management in Enhanced Mode
In enhanced mode the FT122 supports a dedicated 1kB buffer for IN packets and a dedicated 1kB buffer
for OUT packets. The OUT/IN buffer can be allocated to any endpoint with the same direction, up to a
maximum of 504 bytes double buffered (1008 bytes in total) to one endpoint. 504 is the maximum byte
count as there are 1024 bytes in total per OUT/IN Buffer and 8 bytes for IN and OUT packets on control
endpoint 0 must always be reserved. Control, interrupt and bulk endpoints can have a maximum packet
size of 64 bytes and only isochronous endpoints can be allocated more than 64 bytes.
Isochronous modes can have larger buffer sizes as USB packets can be larger than 64 bytes for
isochronous transfer. The isochronous buffer is managed in the same way as bulk, interrupt and control
buffers – i.e. a buffer is for one USB packet only and will not span more than one USB packet.
Each cell indicates a 64 byte block
An example of buffer configurations follows, where Configuration 1 and 2 have larger isochronous buffers.
Configuration 0
EP
Buffer
7
1
7
0
6
1
6
0
5
1
5
0
4
1
4
0
3
1
3
0
2
1
2
0
1
1
0
0
1
0
1
0
Configuration 1
EP
Buffer
7
1
(ISO)
7
0
(ISO)
6
1
6
0
2
1
2
0
1 (ISO)
Configuration 2
EP
Buffer
5 (ISO)
1
5 (ISO)
0
0
0
1
0
1
1 (ISO)
0
0
0
1
0
Table 5-3 - Example buffer configuration
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FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
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The endpoint buffer configurations, settable using the Set Endpoint Configuration command, are as
follows:
Endpoint buffer size register setting (0b’)
Non-isochronous endpoint
Isochronous endpoint
0000
8 bytes
16 bytes
0001
16 bytes
32 bytes
0010
32 bytes
48 bytes
0011
64 bytes
64 bytes
0100
-
96 bytes
0101
-
128 bytes
0110
-
160 bytes
0111
-
192 bytes
1000
-
256 bytes
1001
-
320 bytes
1010
-
384 bytes
1011
-
504 bytes
1100-1111
-
-
Table 5-4 - Endpoint Maximum Packet Size
Note: 504 is the maximum byte count as there are 1024 bytes in total and 8 bytes IN and OUT packets
for control endpoint 0 must always be reserved.
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FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
6
Commands and Registers
The FT122 supports two command sets: a default command set (Table 6-1) and an enhanced command
set (Table 6-2). The enhanced command set is activated if any of the Set Endpoint Configuration
commands (0xB0-0xBF) are received by the FT122. Otherwise, the default command set shall be valid.
6.1 Command Summary
Command Name
Target
Code (hex)
Data phase
Initialization Commands
Set Address Enable
Device
D0h
Write 1 byte
Set Endpoint Enable
Device
D8h
Write 1 byte
Set Mode
Device
F3h
Write 2 bytes
Set DMA
Device
FBh
Write/Read 1 byte
Data Flow Commands
Read Interrupt Register
Device
F4h
Read 2 bytes
Select Endpoint
Endpoint 0 OUT
00h
Read 1 byte (optional)
Endpoint 0 IN
01h
Read 1 byte (optional)
Endpoint 1 OUT
02h
Read 1 byte (optional)
Endpoint 1 IN
03h
Read 1 byte (optional)
Endpoint 2 OUT
04h
Read 1 byte (optional)
Endpoint 2 IN
05h
Read 1 byte (optional)
Endpoint 0 OUT
40h
Read 1 byte
Endpoint 0 IN
41h
Read 1 byte
Endpoint 1 OUT
42h
Read 1 byte
Endpoint 1 IN
43h
Read 1 byte
Endpoint 2 OUT
44h
Read 1 byte
Endpoint 2 IN
45h
Read 1 byte
Endpoint 0 OUT
80h
Read 1 byte
Endpoint 0 IN
81h
Read 1 byte
Endpoint 1 OUT
82h
Read 1 byte
Endpoint 1 IN
83h
Read 1 byte
Endpoint 2 OUT
84h
Read 1 byte
Read Last Transaction Status
Read Endpoint Status
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FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
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Command Name
Target
Code (hex)
Data phase
Endpoint 2 IN
85h
Read 1 byte
Read Buffer
Selected Endpoint
F0h
Read multiple bytes
Write Buffer
Selected Endpoint
F0h
Write multiple bytes
Set Endpoint Status
Endpoint 0 OUT
40h
Write 1 byte
Endpoint 0 IN
41h
Write 1 byte
Endpoint 1 OUT
42h
Write 1 byte
Endpoint 1 IN
43h
Write 1 byte
Endpoint 2 OUT
44h
Write 1 byte
Endpoint 2 IN
45h
Write 1 byte
Acknowledge Setup
Selected Endpoint
F1h
None
Clear Buffer
Selected Endpoint
F2h
None
Validate Buffer
Selected Endpoint
FAh
None
General Commands
Read Current Frame Number
Device
F5h
Read 1 or 2 bytes
Send Resume
Device
F6h
None
Target
Code (hex)
Table 6-1 FT122 default command set
Command Name
Data phase
Initialization Commands
Set Address Enable
Device
D0h
Write 1 byte
Set Endpoint Enable
Device
D8h
Write 1 byte
Set Mode
Device
F3h
Write 2 bytes
Set DMA
Device
FBh
Write/Read 2 bytes
Set Endpoint Configuration
Endpoint 0 OUT
B0h
Write 1 byte
Endpoint 0 IN
B1h
Write 1 byte
Endpoint 1 OUT
B2h
Write 1 byte
Endpoint 1 IN
B3h
Write 1 byte
Endpoint 2 OUT
B4h
Write 1 byte
Endpoint 2 IN
B5h
Write 1 byte
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BUS IC Datasheet Version 1.1
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Command Name
Target
Code (hex)
Data phase
Endpoint 3 OUT
B6h
Write 1 byte
Endpoint 3 IN
B7h
Write 1 byte
Endpoint 4 OUT
B8h
Write 1 byte
Endpoint 4 IN
B9h
Write 1 byte
Endpoint 5 OUT
BAh
Write 1 byte
Endpoint 5 IN
BBh
Write 1 byte
Endpoint 6 OUT
BCh
Write 1 byte
Endpoint 6 IN
BDh
Write 1 byte
Endpoint 7 OUT
BEh
Write 1 byte
Endpoint 7 IN
BFh
Write 1 byte
Data Flow Commands
Read Interrupt Register
Device
F4h
Read 1 to 4 bytes
Select Endpoint
Endpoint 0 OUT
00h
Read 1 byte (optional)
Endpoint 0 IN
01h
Read 1 byte (optional)
Endpoint 1 OUT
02h
Read 1 byte (optional)
Endpoint 1 IN
03h
Read 1 byte (optional)
Endpoint 2 OUT
04h
Read 1 byte (optional)
Endpoint 2 IN
05h
Read 1 byte (optional)
Endpoint 3 OUT
06h
Read 1 byte (optional)
Endpoint 3 IN
07h
Read 1 byte (optional)
Endpoint 4 OUT
08h
Read 1 byte (optional)
Endpoint 4 IN
09h
Read 1 byte (optional)
Endpoint 5 OUT
0Ah
Read 1 byte (optional)
Endpoint 5 IN
0Bh
Read 1 byte (optional)
Endpoint 6 OUT
0Ch
Read 1 byte (optional)
Endpoint 6 IN
0Dh
Read 1 byte (optional)
Endpoint 7 OUT
0Eh
Read 1 byte (optional)
Endpoint 7 IN
0Fh
Read 1 byte (optional)
Endpoint 0 OUT
40h
Read 1 byte
Read Last Transaction Status
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BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
Command Name
Target
Read Endpoint Status
Code (hex)
Data phase
Endpoint 0 IN
41h
Read 1 byte
Endpoint 1 OUT
42h
Read 1 byte
Endpoint 1 IN
43h
Read 1 byte
Endpoint 2 OUT
44h
Read 1 byte
Endpoint 2 IN
45h
Read 1 byte
Endpoint 3 OUT
46h
Read 1 byte
Endpoint 3 IN
47h
Read 1 byte
Endpoint 4 OUT
48h
Read 1 byte
Endpoint 4 IN
49h
Read 1 byte
Endpoint 5 OUT
4Ah
Read 1 byte
Endpoint 5 IN
4Bh
Read 1 byte
Endpoint 6 OUT
4Ch
Read 1 byte
Endpoint 6 IN
4Dh
Read 1 byte
Endpoint 7 OUT
4Eh
Read 1 byte
Endpoint 7 IN
4Fh
Read 1 byte
Endpoint 0 OUT
80h
Read 1 byte
Endpoint 0 IN
81h
Read 1 byte
Endpoint 1 OUT
82h
Read 1 byte
Endpoint 1 IN
83h
Read 1 byte
Endpoint 2 OUT
84h
Read 1 byte
Endpoint 2 IN
85h
Read 1 byte
Endpoint 3 OUT
86h
Read 1 byte
Endpoint 3 IN
87h
Read 1 byte
Endpoint 4 OUT
88h
Read 1 byte
Endpoint 4 IN
89h
Read 1 byte
Endpoint 5 OUT
8Ah
Read 1 byte
Endpoint 5 IN
8Bh
Read 1 byte
Endpoint 6 OUT
8Ch
Read 1 byte
Endpoint 6 IN
8Dh
Read 1 byte
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Command Name
Target
Code (hex)
Data phase
Endpoint 7 OUT
8Eh
Read 1 byte
Endpoint 7 IN
8Fh
Read 1 byte
Read Buffer
Selected Endpoint
F0h
Read n bytes
Write Buffer
Selected Endpoint
F0h
Write n bytes
Set Endpoint Status
Endpoint 0 OUT
40h
Write 1 byte
Endpoint 0 IN
41h
Write 1 byte
Endpoint 1 OUT
42h
Write 1 byte
Endpoint 1 IN
43h
Write 1 byte
Endpoint 2 OUT
44h
Write 1 byte
Endpoint 2 IN
45h
Write 1 byte
Endpoint 3 OUT
46h
Write 1 byte
Endpoint 3 IN
47h
Write 1 byte
Endpoint 4 OUT
48h
Write 1 byte
Endpoint 4 IN
49h
Write 1 byte
Endpoint 5 OUT
4Ah
Write 1 byte
Endpoint 5 IN
4Bh
Write 1 byte
Endpoint 6 OUT
4Ch
Write 1 byte
Endpoint 6 IN
4Dh
Write 1 byte
Endpoint 7 OUT
4Eh
Write 1 byte
Endpoint 7 IN
4Fh
Write 1 byte
Acknowledge Setup
Selected Endpoint
F1h
None
Clear Buffer
Selected Endpoint
F2h
None
Validate Buffer
Selected Endpoint
FAh
None
General Commands
Send Resume
Device
F6h
None
Read Current Frame Number
Device
F5h
Read 1 or 2 bytes
Set IO Pad Drive Strength
Device
E9h
Write 1 byte
Set Buffer Interrupt Mode
Device
ECh
None
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Command Name
Target
Code (hex)
Data phase
Read Vendor ID
Device
EBh
Read 2 bytes
Read Product ID
Device
EAh
Read 2 bytes
Read FTDI ID
Device
EDh
Read 1 byte
Table 6-2 enhanced command set
6.2 Initialization Commands
6.2.1 Set Address Enable
Command
: D0h
Data
: Write 1 byte
Bit
6-0
7
Symbol
Address
Reset
Description
0b’0000000 USB assigned device address. A bus reset will reset all
address bits to 0.
Enable
0
Function enable. A bus reset will automatically enable the
function at default address 0.
Reset
Description
Table 6-3 Address Enable Register
6.2.2 Set Endpoint Enable
Command
: D8h
Data
: Write 1 byte
Bit
Symbol
0
EP_Enable
7-1
Reserved
0
Enable all endpoints (Note EP0 is always enabled
regardless the setting of EP_Enable bit). Endpoints can
only be enabled when the function is enabled.
0b’0000000 Reserved, write to 0
Table 6-4 Endpoint Enable Register
6.2.3 Set Mode
Command
: F3h
Data
: Write 2 bytes
Bit
Symbol
Reset
Description
0
Reserved
0
Reserved, write to 0
1
No Suspend Clock
1
0: CLKOUT switches to 30 KHz during USB suspend
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Bit
Symbol
Reset
Description
1: CLKOUT remains unchanged during USB suspend
Note: The programmed value will not be changed by a
bus reset.
2
Clock Running
1
0: internal clocks stop during USB suspend
1: internal clocks continue running during USB suspend
This bit must be set to ‘0’ for bus powered application in
order to meet the USB suspend current requirement.
Note: The programmed value will not be changed by a
bus reset.
3
Interrupt Mode
1
0: interrupt will not generate on NAK or Error
transactions
1: interrupt will generate on NAK and Error transactions
Note: The programmed value will not be changed by a
bus reset.
4
DP_Pullup
0
0: Pullup resistor on DP pin disabled
1: Pullup resistor on DP pin enabled when Vbus is
present
Note: The programmed value will not be changed by a
bus reset.
5
7-6
Reserved
0
Endpoint Configuration
Mode
0b’00
Reserved, write to 0
Set the endpoint configuration mode for EP2.
00: Mode 0 (Non-ISO Mode)
01: Mode 1 (ISO-OUT Mode)
10: Mode 2 (ISO-IN Mode)
11: Mode 3 (ISO-IO Mode)
In Enhanced Mode, these 2 bits are reserved. The
Endpoint Configuration will be done through separate
command. See “Set Endpoint Configuration” commands.
Table 6-5 Configuration Register (Byte 1)
Bit
3-0
Symbol
Clock Division Factor
Reset
Description
0b’1011
The Clock Division Factor value (CDF) determines the
output clock frequency on the CLKOUT pin. Frequency =
48 MHz / (CDF +1), where CDF ranges 1-12 or the
allowed CLKOUT frequency is 4-24 MHz. Default CLKOUT
is 4 MHz.
When the CDF is programmed to 0b’1111, the CLKOUT
will be turned off. It is recommended to turn off the
CLKOUT if it is not used, for power saving (about 3mA).
Note: The programmed value will not be changed by a
bus reset.
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Bit
5-4
Symbol
Reserved
Reset
0b’00
Description
Reserved, write to 0
6
SET_TO_ONE
0
This bit must be set to 1
7
SOF-only Interrupt
Mode
0
0: normal operation
1: interrupt will generate on receiving SOF packet only,
regardless the value of the Interrupt Pin Mode bit in DMA
configuration register.
Table 6-6 Clock Division Factor Register (Byte 2)
6.2.4 Set DMA
Command
: FBh
Data
: Read/Write 1 byte; Read/Write 2 bytes (for Enhanced Mode)
Bit
1-0
Symbol
DMA Burst
Reset
0b’00
Description
Set the DMA burst size
00: Single cycle mode
01: 4 cycle burst mode
10: 8 cycle burst mode
11: 16 cycle burst mode
2
DMA Enable
0
Enable DMA operation
0: DMA operation is disabled
1: DMA operation is enabled
FT122 will clear this bit upon EOT_n assertion.
3
DMA Direction
0
This bit indicates the DMA read or write operation.
0: DMA read. Data read from FT122 OUT buffer to
system memory.
1: DMA write. Data write to FT122 IN buffer from system
memory.
4
Auto Reload
0
Automatically restart the DMA operation.
0: DMA needs to restart by software
1: DMA will restart automatically after the previous DMA
transfer finishes
5
Interrupt Pin Mode
0
0: normal operation. Interrupt will generate if any of the
bit in the interrupt register is set.
1: interrupt will generate upon receiving SOF packet or if
any of the bit in the interrupt register is set.
6
EPI4 Interrupt Enable
0
Interrupt Enable for endpoint index 4. During DMA
operation, EPI4 interrupt should be turned off to avoid
un-necessary interrupt service.
For enhanced mode this bit has no function. EPI4
interrupt is always enabled unless it is selected as a DMA
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Bit
Symbol
Reset
Description
endpoint.
7
EPI5 Interrupt Enable
0
Interrupt Enable for endpoint index 5. During DMA
operation, EPI5 interrupt should be turned off to avoid
un-necessary interrupt service.
For enhanced mode this bit has no function. EPI5
interrupt is always enabled unless it is selected as a DMA
endpoint.
Table 6-7 DMA Configuration Register (Byte 1)
Bit
Symbol
Reset
Description
3-0
DMA Endpoint Index
0b’0000
Select the endpoint index number for DMA operation.
DMA operation occurs between the selected endpoint
buffer and the DMA agent. Any of the 16 endpoint index
can be selected for DMA data transfers, but only one at a
time.
7-4
Reserved
0b’0000
Reserved, write to 0
Table 6-8 DMA Endpoint Select Register (Byte 2, for Enhanced Mode)
6.2.5 Set Endpoint Configuration (for Enhanced Mode)
Command
: B0-BFh
Data
: Write 1 byte
Bit
0
2-1
Symbol
Endpoint Enabled
Endpoint Type
Reset
0
0b’00
Description
Enable or disable the endpoint index associated with the
command
Endpoint type
00: control
01: bulk or interrupt
10: isochronous
11: reserved
6-3
7
Max Packet Size
Reserved
0b’0000
0
Maximum USB packet size for this endpoint. Defined the
IN buffer or OUT buffer size for the endpoint. Refer to
Table 5-4 for full details on the buffer configuration.
Reserved, write to 0
Table 6-9 Endpoint Configuration Register
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6.3 Data Flow Commands
6.3.1 Read Interrupt Register
Command
: F4h
Data
: Read 1 or 2 bytes (Default Mode); Read 1-4 bytes (Enhanced Mode)
Bit
Symbol
Reset
Description
0
Endpoint 0 Out
0
Interrupt for endpoint 0 OUT buffer. Cleared by Read
Last Transaction Status command.
1
Endpoint 0 In
0
Interrupt for endpoint 0 IN buffer. Cleared by Read Last
Transaction Status command.
2
Endpoint 1 Out
0
Interrupt for endpoint 1 OUT buffer. Cleared by Read
Last Transaction Status command.
3
Endpoint 1 In
0
Interrupt for endpoint 1 IN buffer. Cleared by Read Last
Transaction Status command.
4
Endpoint 2 Out
0
Interrupt for endpoint 2 OUT buffer. Cleared by Read
Last Transaction Status command.
5
Endpoint 2 In
0
Interrupt for endpoint 2 IN buffer. Cleared by Read Last
Transaction Status command.
6
Bus Reset
0
Interrupt for bus reset. This bit will be cleared after
reading.
7
Suspend Change
0
Interrupt for USB bus suspend status change. This bit
will be set to ‘1’ when FT122 goes to suspend (missing 3
continuous SOFs) or resumes from suspend. This bit will
be cleared after reading.
Reset
Description
Interrupt for end of DMA transfer. This bit will be cleared
after reading.
Table 6-10 Interrupt Register Byte 1
Bit
Symbol
0
DMA EOT
0
7-1
Reserved
0b’xxxxxxx
Reserved
Table 6-11 Interrupt Register Byte 2
Bit
Symbol
Reset
Description
0
Endpoint 3 Out
0
Interrupt for endpoint 3 OUT buffer. Cleared by Read
Last Transaction Status command.
1
Endpoint 3 In
0
Interrupt for endpoint 3 IN buffer. Cleared by Read Last
Transaction Status command.
2
Endpoint 4 Out
0
Interrupt for endpoint 4 OUT buffer. Cleared by Read
Last Transaction Status command.
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Bit
Symbol
Reset
Description
3
Endpoint 4 In
0
Interrupt for endpoint 4 IN buffer. Cleared by Read Last
Transaction Status command.
4
Endpoint 5 Out
0
Interrupt for endpoint 5 OUT buffer. Cleared by Read
Last Transaction Status command.
5
Endpoint 5 In
0
Interrupt for endpoint 5 IN buffer. Cleared by Read Last
Transaction Status command.
6
Endpoint 6 Out
0
Interrupt for endpoint 6OUT buffer. Cleared by Read Last
Transaction Status command.
7
Endpoint 6 In
0
Interrupt for endpoint 6 IN buffer. Cleared by Read Last
Transaction Status command.
Table 6-12 Interrupt Register Byte 3 (for Enhanced Mode)
Bit
Symbol
Reset
Description
0
Endpoint 7 Out
0
Interrupt for endpoint 7 OUT buffer. Cleared by Read
Last Transaction Status command.
1
Endpoint 7 In
0
Interrupt for endpoint 7 IN buffer. Cleared by Read Last
Transaction Status command.
7-2
Reserved
0b’xxxxxx
Reserved
Table 6-13 Interrupt Register Byte 4 (for Enhanced Mode)
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6.3.2 Select Endpoint
Command
: 00-05h (00-0Fh for Enhanced Mode)
Data
: Optional Read 1 byte
Bit
0
Symbol
Reset
Full/Empty
0
Description
0: selected endpoint buffer is empty
1: selected endpoint buffer is full
1
Stall
0
0: selected endpoint is not stalled
1: selected endpoint is stalled
7-2
Reserved
0b’xxxxxx
Reserved
Table 6-14 Endpoint Status Register
6.3.3 Read Last Transaction Status
Command
: 40-45h (40-4Fh for Enhanced Mode)
Data
: Read 1 byte
Bit
Symbol
Reset
0
Data Receive/Transmit
Success
0
4-1
5
Error Code
Description
0: indicate USB data receive or transmit not OK
1: indicate USB data receive or transmit OK
0b’0000
Setup Packet
0
Refer to Table 6-16
0: indicate not a setup packet
1: indicate last received packet has a SETUP token
6
Data 0/1 Packet
0
0: packet has a DATA0 token
1: packet has a DATA1 token
7
Previous Status not
Read
0
0: previous transaction status was read
1: previous transaction status was not read
Table 6-15 Endpoint Last Transaction Status Register
Error Code
Result
0000
No error
0001
PID encoding error
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Error Code
Result
0010
PID unknown
0011
Unexpected packet
0100
Token CRC error
0101
Data CRC error
0110
Time out error
0111
Reserved
1000
Unexpected EOP
1001
Packet NAKed
1010
Sent stall
1011
Buffer overflow
1101
Bit stuff error
1111
Wrong DATA PID
Table 6-16 Transaction error code
6.3.4 Read Endpoint Status
Command
: 80-85h (80-8Fh for Enhanced Mode)
Data
: Read 1 byte
Bit
1-0
2
Symbol
Reserved
Reset
0b’00
Setup packet
0
Description
Reserved
0: indicate not a setup packet
1: indicate last received packet has a SETUP token
4-3
5
Reserved
0b’xx
Buffer 0 Full
0
Reserved
0: buffer 0 is not filled up
1: buffer 0 is filled up
6
Buffer 1 Full
0
0: buffer 1 is not filled up
1: buffer 1 is filled up
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Bit
7
Symbol
Reset
Endpoint Stalled
0
Description
0: endpoint is not stalled
1: endpoint is stalled
Table 6-17 Endpoint Buffer Status Register
6.3.5 Read Buffer
Command
: F0h
Data
: Read multiple bytes
The Read Buffer command is used to read the received packet from the selected endpoint OUT buffer.
The data in the endpoint buffer is organized as follows:
byte 0: length of payload packet, MSB (for default mode this byte is ignored)
byte 1: length of payload packet, LSB
byte 2: Payload packet byte 1
byte 3: Payload packet byte 2
…
byte n+1: Payload packet byte n (n = packet length)
For DMA read operation the first two bytes are skipped. Only the payload packet itself will be read and
stored in system memory.
6.3.6 Write Buffer
Command
: F0h
Data
: Write multiple bytes
The Write Buffer command is used to write payload packet to the selected endpoint IN buffer.
The data must be organized in the same way as described in the Read Buffer command. For default mode
byte 0 should always be set to 00h.
For DMA write operation the first two bytes are skipped. Only the payload packet itself shall be written to
the selected endpoint OUT buffer. Buffer is validated when the max packet size is reached, or when the
DMA transfer is terminated by EOT_n (usually the last packet).
6.3.7 Clear Buffer
Command
: F2h
Data
: None
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The Clear Buffer command should be issued after all data has been read out from the endpoint buffer.
This is to free the buffer to receive next packet from USB host.
6.3.8 Validate Buffer
Command
: FAh
Data
: None
The Validate Buffer command should be issued after all data has been written to the endpoint buffer. This
is to set the buffer full flag so that the packet can be sent to USB host when IN token arrives.
6.3.9 Set Endpoint Status
Command
: 40-45h (40-4Fh for Enhanced Mode)
Data
: Write 1 byte
Bit
0
Symbol
Reset
Stall
0
Description
0: Disable the endpoint STALL state.
1: Enable the endpoint STALL state.
For EP0 OUT (control OUT endpoint) the STALL state will
automatically be cleared by receiving a SETUP packet.
When this bit is written to ‘0’, the endpoint will
reinitialize. Any data in the endpoint buffer will be
flushed away, and the PID for next packet will carry
DATA0 flag.
7-1
Reserved
0b’xxxxxxx
Reserved
Table 6-18 Endpoint Control Register
6.3.10 Acknowledge Setup
Command
: F1h
Data
: None
When receiving a SETUP packet the FT122 will flush the IN buffer and disable the Validate Buffer and
Clear Buffer commands for both Control IN and Control OUT endpoints. The MCU shall read and process
the SETUP packet, and then issue the Acknowledge Setup command to re-enable the Validate Buffer and
Clear Buffer commands. The Acknowledge Setup command must be sent to both Control IN and Control
OUT endpoints.
6.4 General Commands
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6.4.1 Read Current Frame Number
Command
: F5h
Data
: Read One or Two Bytes
Bit
7-0
Symbol
Frame Number LSB
Reset
00h
Description
Frame number for last received SOF, byte 1 (least
significant byte)
Table 6-19 Frame Number LSB Register
Bit
Symbol
2-0
Frame Number MSB
7-3
Reserved
Reset
0b’000
0b’00000
Description
Frame number for last received SOF, byte 2 (Most
significant byte)
Reserved
Table 6-20 Frame Number MSB Register
6.4.2 Send Resume
Command
: F6h
Data
: None
To perform remote-wakeup when suspended, the MCU needs to issue Send Resume command. The
FT122 will send an upstream resume signal for a period of 10 ms. If the clock is not running during
suspend, the MCU needs to wakeup FT122 by drive SUSPEND pin to LOW, followed by Send Resume
command.
6.4.3 Set Buffer Interrupt Mode
Command
: ECh (for Enhanced Mode)
Data
: none
The read or write buffer commands can be interrupted, typically by a read interrupt register or read last
transaction status command, and can be resumed without having to re-issue a read or write buffer
command. When the default command set is in use, a read or write buffer command can be resumed
after 2 bytes have been read at a read interrupt command. In this case the FT122 design is primed to
resume a read or write buffer command if another command is not issued and a read or write occurs.
For the enhanced command set the read interrupt register command has been extended to read 4 bytes.
The FT122 therefore needs to know whether to prime at 2 or 4 bytes. The Set Buffer Interrupt Mode
command notifies the FT122 to prime after 4 bytes.
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6.4.4 Read Vendor ID
Command
: EBh (for Enhanced Mode)
Data
: read 2 bytes
Read the 2 bytes Vendor ID. Shall return 0403h.
6.4.5 Read Product ID
Command
: EAh (for Enhanced Mode)
Data
: read 2 bytes
Read the 2 bytes Product ID. Shall return 6018h.
6.4.6 Read FTDI ID
Command
: EDh (for Enhanced Mode)
Data
: read 1 byte
Read the 1 byte FTDI ID. Shall return 11h.
6.4.7 Set IO Pad Drive Strength
Command
: E9h
Data
: Write 1 byte
Bit
1-0
Symbol
CLKOUT pin
Reset
0b’00
Description
00: 4mA
01: 8mA
10: 12mA
11:16mA
3-2
D[7:0] pins
0b’00
00: 4mA
01: 8mA
10: 12mA
11:16mA
5-4
INT_n, SUSPEND,
DMREQ pins
0b’00
00: 4mA
01: 8mA
10: 12mA
11:16mA
7-6
GL_n pin
0b’00
00: 4mA
01: 8mA
10: 12mA
11:16mA
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Table 6-21 IO Pad Drive Strength Register
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7
Application Information
Figure 7-1 shows a reference application circuit for a USB bus-powered application. Figure 7-2 shows a
reference application circuit for a USB self-powered application.
VCC
VCC
Ferrite
Bead
1
100nF
10k
VCC
2
27R
3
27R
10k
DM
SUSPEND
DP
4
P3.3
INT_n
EOT_n
47pF
5
FT122
10nF
RESET_n
VCC3V3
VCCIO
D[7:0]
P0.7-P0.0
WR_n
WR#/P3.6
XTAL1
GN
D
AL
E
80C51
RD#/P3.7
CLKOUT
CS
_n
GN
D
100nF
100nF +
P3.4
RD_n
VOUT3V3
VCC
INT#/P3.2
A0
DMACK_n
SHIELD
VCC
4.7uF
Figure 7-1 FT122 bus-powered application
VCC3V3
1M
VCC
VCC
100nF
1M
10k
1
VCC
10k
VCC
2
27R
3
27R
DM
INT_n
470k
5
47pF
EOT_n
47pF
FT122
A0
DMACK_n
SHIELD
RESET_n
VCC3V3
VCCIO
WR_n
WR#/P3.6
CLKOUT
AL
E
100nF
100nF +
GN
D
VCC
P0.7-P0.0
RD_n
VOUT3V3
INT#/P3.2
P3.4
D[7:0]
CS
_n
1M
P3.3
80C51
RD#/P3.7
XTAL1
GN
D
SUSPEND
DP
4
4.7uF
Figure 7-2 FT122 self-powered application
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Clearance No.: FTDI# 313
8
Devices Characteristics and Ratings
8.1 Absolute Maximum Ratings
The absolute maximum ratings for the FT122 devices are as follows. These are in accordance with the
Absolute Maximum Rating System (IEC 60134). Exceeding these may cause permanent damage to the
device.
Parameter
Value
Unit
Storage Temperature
-65 to 150
°C
Floor Life (Out of Bag) At Factory Ambient
168
(30°C / 60% Relative Humidity)
(IPC/JEDEC J-STD-033A MSL Level 3
Compliant)*
Hours
Ambient Temperature (Power Applied)
-40 to 85
°C
Latch-up current
±200
mA
±2
kV
±200
V
±500
V
VCC Supply Voltage
-0.5 to +6.0
V
DC Input Voltage – DP and USBDM
-0.5 to +3.8
V
DC Input Voltage – High Impedance
Bidirectional
-0.5 to + (VCC +0.5)
V
DC Input Voltage – All Other Inputs
-0.5 to + (VCC +0.5)
V
DC Output Current – Outputs
22
mA
Electrostatic Discharge Voltage(ESD)
human body model(HBM)
Electrostatic Discharge Voltage(ESD)
machine model(MM)
Electrostatic Discharge Voltage(ESD)
charged device model(CDM)
Table 8-1 Absolute Maximum Ratings
* If devices are stored out of the packaging beyond this time limit the devices should be baked before
use. The devices should be ramped up to a temperature of +125°C and baked for up to 17 hours.
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8.2 DC Characteristics
DC Characteristics (Ambient Temperature = -40°C to +85°C).
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
VCC1
VCC Operating Supply
Voltage
4.0
5.0
5.5
V
Normal Operation
VCC2
VCC Operating Supply
Voltage
3.0
3.3
3.6
V
Regulator by-pass
mode Operation
VCCIO
VCCIO Operating
Supply Voltage
1.65
3.6
V
Icc
Operating Supply
Current
Icc2
Suspend Current
VOUT3V3
3.3v regulator output
3.9
84
3.0
mA
Normal Operation,
USB bus transmit
or receive
μA
USB Suspend,
Clock Running =
‘0’, excluding the
DP_Pullup current
3.3
3.6
V
VCC=5V
Typical
Maximum
Units
Conditions
V
I source = 4mA
V
I sink = 4mA
Table 8-2 Operating Voltage and Current
Parameter
Description
Minimum
Voh
Output Voltage High
2.9
Vol
Output Voltage Low
Vih
Input Voltage High
2.0
Vil
Input Voltage Low
-
0.4
V
0.8
V
Maximum
Units
Conditions
V
I source = 4mA
V
I sink = 4mA
Table 8-3 digital I/O Pin Characteristics (VCCIO=+3.3V)
Parameter
Description
Minimum
Voh
Output Voltage High
2.25
Vol
Output Voltage Low
Vih
Input Voltage High
1.7
Vil
Input Voltage Low
-
Typical
0.4
V
0.7
V
Table 8-4 digital I/O Pin Characteristics (VCCIO=+2.5V)
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Parameter
Description
Minimum
Voh
Output Voltage High
1.62
Vol
Output Voltage Low
Vih
Input Voltage High
1.17
Vil
Input Voltage Low
-
Typical
Maximum
0.4
Units
Conditions
V
I source = 4mA
V
I sink = 4mA
V
0.63
V
Maximum
Units
Conditions
Table 8-5 digital I/O Pin Characteristics (VCCIO=+1.8V)
Parameter
Description
Minimum
Typical
UVoh
I/O Pins Static Output
(High)
2.8
3.6
V
RL = 1.5kΩ to 3.6
V
UVol
I/O Pins Static Output
(Low)
-
0.3
V
RL = 15kΩ to GND
UVse
Single Ended Rx
Threshold
0.8
2.0
V
UCom
Differential Common
Mode
0.8
2.5
V
UVDif
Differential Input
Sensitivity
0.2
UDrvZ
Driver Output
Impedance
29
V
-
44
Including external
22 Ω ±1% series
resistor
Ω
Table 8-6 USB I/O Pin (DP, USBDM) Characteristics
8.3 AC Characteristics
Symbol
Parameter
VCCIO=3.3V
Min
Max
VCCIO=1.8V
Min
Unit
Max
ALE Timings:
tLH
ALE High Pulse Width
tAVLL
Address Valid to ALE Low Time
tLLAX
ALE Low to Address Transition Time
20
20
ns
3
5
ns
2
3
ns
Write Timings:
tCLWL
CS_n (DMACK_n) Low to WR_n Low Time
0
1
ns
tWHCH
WR_n High to CS_n (DMACK_n) High Time
1
1
ns
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Symbol
Parameter
VCCIO=3.3V
Min
Max
VCCIO=1.8V
Min
Unit
Max
tAVWL
A0 Valid to WR_n Low Time
0
1
ns
tWHAX
WR_n High to A0 Transition Time
1
1
ns
tWL
WR_n Low Pulse Width
30
30
ns
tWDSU
Write Data Setup Time
5
8
ns
tWDH
Write Data Hold Time
1
1
ns
tWC
Write Cycle Time
40
40
ns
t(WC-WD)
Write command to write data
40
40
ns
Read Timings:
tCLRL
CS_n (DMACK_n) Low to RD_n Low Time
0
1
ns
tRHCH
RD_n High to CS_n (DMACK_n) High Time
1
1
ns
tAVRL
A0 Valid to RD_n Low Time
0
1
ns
tRL
RD_n Low Pulse Width
30
30
ns
tRLDD
RD_n Low to Data Valid Time
25
25
ns
tRHDZ
RD_n High to Data Hi-Z Time
20
20
ns
tRHNDV
RD_n High to Next Data Valid Time
40
50
ns
tRC
Read Cycle Time
40
50
ns
t(WC-RD)
Write command to read data
40
50
ns
Table 8-7 Parallel Interface IO timing
Figure 8-1 ALE Timing
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Figure 8-2 Parallel interface timing
Symbol
Parameter
VCCIO=3.3V
Min
Max
VCCIO=1.8V
Min
Unit
Max
Single-cycle DMA Timings:
tRHSH
DMREQ High to RD_n/WR_n High Time
tAHRH
DMACK_n High to DMREQ High Time
tSHAH
RD_n/WR_n High to DMACK_n High Time
tEL
EOT_n
Low
Pulse
Width
(Simultaneous
120
120
330
ns
330
ns
130
130
ns
10
10
ns
DMACK_n, RD_n/WR_n and EOT_n low time)
Burst DMA Timings:
tSLRL
RD_n/WR_n Low to DMREQ Low Time
tRHSH
DMREQ High to RD_n/WR_n High Time
tSHAH
RD_n/WR_n High to DMACK_n High Time
15
40
ns
40
120
ns
3
130
ns
EOT Timings:
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Symbol
Parameter
VCCIO=3.3V
Min
tELRL
EOT_n Low to DMREQ Low Time
Max
VCCIO=1.8V
Min
40
Unit
Max
40
ns
Table 8-8 DMA timing characteristics
Figure 8-3 Single cycle DMA timing
Figure 8-4 Burst mode DMA timing
Figure 8-5 DMA terminated by EOT_n
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9
Package Parameters
The FT122 is available in two different packages. The FT122T is the TSSOP-28 package option and the
FT122Q is the QFN-28 package option. The solder reflow profile for both packages is described in section
9.5.
9.1 TSSOP-28 Package Dimensions
Figure 9-1 TSSOP-28 Package Dimensions
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The FT122T is supplied in a RoHS compliant 28 pin TSSOP package. The package is lead (Pb) free and
uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.
This package is nominally 4.4mm x 9.7mm body (6.4mm x9.7mm including pins). The pins are on a 0.65
mm pitch. The above mechanical drawing shows the TSSOP-28 package.
All dimensions are in millimetres.
9.2 TSSOP-28 Package Markings
Line 1 – FTDI Logo
YYWW-B
FT122T
Line 2 – Date Code, Revision
Line 3 – FTDI Part Number
Figure 9-2 TSSOP-28 Package Markings
The date code format is YYWW where WW = 2 digit week number, YY = 2 digit year number.
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9.3 QFN-28 Package Dimensions
Figure 9-3 QFN-28 Package Dimensions
The FT122Q is supplied in a RoHS compliant leadless QFN-28 package. The package is lead ( Pb ) free,
and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.
This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.40mm pitch. The above
mechanical drawing shows the QFN-28 package. All dimensions are in millimetres.
The centre pad on the base of the FT122Q is internally connected to GND pin, and can be left
unconnected, or connected to ground (recommended).
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9.4 QFN-28 Package Markings
Line 1 – FTDI Logo
YYWW-B
Line 2 – Date Code, Revision
FT122Q
Line 3 – FTDI Part Number
Figure 9-4 QFN-28 Package Markings
The date code format is YYWW where WW = 2 digit week number, YY = 2 digit year number.
9.5 Solder Reflow Profile
The FT122 is supplied in Pb free TSSOP-28 and QFN-28 packages. The recommended solder reflow profile
for both package options is shown in Figure 9-5.
Temperature, T (Degrees C)
tp
Tp
Critical Zone: when
T is in the range
TL to Tp
Ramp Up
TL
tL
TS Max
Ramp
Down
TS Min
tS
Preheat
25
T = 25º C to TP
Time, t (seconds)
Figure 9-5 FT122 Solder Reflow Profile
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The recommended values for the solder reflow profile are detailed in Table 9-1. Values are shown for
both a completely Pb free solder process (i.e. the FT122 is used with Pb free solder), and for a non-Pb
free solder process (i.e. the FT122 is used with non-Pb free solder).
Profile Feature
Average Ramp Up Rate (Ts to Tp)
Pb Free Solder
Process
3°C / second Max.
Non-Pb Free Solder Process
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
150°C
- Temperature Max (Ts Max.)
200°C
- Time (ts Min to ts Max)
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical
Temperature TL:
- Temperature (TL)
- Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak
Temperature (tp)
Ramp Down Rate
Time for T= 25°C to Peak Temperature,
Tp
217°C
183°C
60 to 150 seconds
60 to 150 seconds
260°C
240°C
20 to 40 seconds
20 to 40 seconds
6°C / second Max.
6°C / second Max.
8 minutes Max.
6 minutes Max.
Table 9-1 Reflow Profile Parameter Values
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10 Contact Information
Head Office – Glasgow, UK
Future Technology Devices International Limited
Unit 1, 2 Seaward Place, Centurion Business Park
Glasgow G41 1HH
United Kingdom
Tel: +44 (0) 141 429 2777
Fax: +44 (0) 141 429 2758
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
[email protected]
[email protected]
[email protected]
Branch Office – Tigard, Oregon, USA
Future Technology Devices International Limited
(USA)
7130 SW Fir Loop
Tigard, OR 97223
Tel: +1 (503) 547 0988
Fax: +1 (503) 547 0987
E-Mail (Sales)
E-Mail (Support)
E-Mail (General Enquiries)
[email protected]
[email protected]
[email protected]
Branch Office – Taipei, Taiwan
Branch Office – Shanghai, China
Future Technology Devices International Limited
(Taiwan)
2F, No. 516, Sec. 1, NeiHu Road
Taipei 114
Taiwan , R.O.C.
Tel: +886 (0) 2 8791 3570
Fax: +886 (0) 2 8791 3576
Future Technology Devices International Limited
(China)
Room 1103, No.666 West Huaihai Road,
Shanghai, 200052
China
Tel: +86 21 62351596
Fax: +86 21 62351595
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
[email protected]
E-mail (Sales)
[email protected] E-mail (Support)
[email protected] E-mail (General Enquiries)
[email protected]
[email protected]
[email protected]
Branch Office – Singapore
Future Technology Devices International Limited (Singapore)
178 Paya Lebar Road
#07-03/04/05
Singapore 409030
Tel: +65 6841 1174
Fax: +65 6841 6071
E-mail (Support)
E-mail (General Enquiries)
[email protected]
[email protected]
Web Site
http://ftdichip.com
System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future
Technology Devices International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory
and system-level performance requirements. All application-related information in this document (including application
descriptions, suggested FTDI devices and other materials) is provided for reference only. While FTDI has taken care to
assure it is accurate, this information is subject to customer confirmation, and FTDI disclaims all liability for system designs
and for any applications assistance provided by FTDI. Use of FTDI devices in life support and/or safety applications is
entirely at the user’s risk, and the user agrees to defend, indemnify and hold harmless FTDI from any and all damages,
claims, suits or expense resulting from such use. This document is subject to change without notice. No freedom to use
patents or other intellectual property rights is implied by the publication of this document. Neither the whole nor any part of
the information contained in, or the product described in this document, may be adapted or reproduced in any material or
electronic form without the prior written consent of the copyright holder. Future Technology Devices International Ltd, Unit
1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH, United Kingdom. Scotland Registered Company Number:
SC136640
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Appendix A– References
Useful Application Notes
http://www.ftdichip.com/Documents/AppNotes/AN_167_FT1248_Parallel_Serial_Interface_Basics.pdf
http://www.ftdichip.com/Support/Documents/TechnicalNotes/TN_100_USB_VID-PID_Guidelines.pdf
http://www.ftdichip.com/Support/Documents/AppNotes/AN_175_Battery%20Charging%20Over%20USB
%20with%20FTEX%20Devices.pdf
http://www.usb.org/developers/devclass_docs/BCv1.2_011912.zip
Appendix B - List of Figures and Tables
List of Figures
Figure 2-1 FT122 Block Diagram ..................................................................................................... 3
Figure 3-1 TSSOP-28 package schematic symbol .............................................................................. 6
Figure 3-2 QFN-28 package schematic symbol.................................................................................. 6
Figure 7-1 FT122 bus-powered application ..................................................................................... 32
Figure 7-2 FT122 self-powered application ..................................................................................... 32
Figure 8-1 ALE Timing ................................................................................................................. 36
Figure 8-2 Parallel interface timing ............................................................................................... 37
Figure 8-3 Single cycle DMA timing ............................................................................................... 38
Figure 8-4 Burst mode DMA timing ............................................................................................... 38
Figure 8-5 DMA terminated by EOT_n ........................................................................................... 38
Figure 9-1 TSSOP-28 Package Dimensions ..................................................................................... 39
Figure 9-2 TSSOP-28 Package Markings ........................................................................................ 40
Figure 9-3 QFN-28 Package Dimensions ........................................................................................ 41
Figure 9-4 QFN-28 Package Markings ............................................................................................ 42
Figure 9-5 FT122 Solder Reflow Profile .......................................................................................... 42
List of Tables
Table 3-1 FT122 Pin Description ..................................................................................................... 8
Table 4-1 Interrupt modes ........................................................................................................... 10
Table 5-1 Endpoint configuration for EP0 and EP1 ........................................................................... 11
Table 5-2 Endpoint configuration for EP2 ....................................................................................... 11
Table 5-3 - Example buffer configuration ....................................................................................... 12
Table 5-4 - Endpoint Maximum Packet Size .................................................................................... 13
Table 6-1 FT122 default command set ........................................................................................... 15
Table 6-2 enhanced command set ................................................................................................ 19
Table 6-3 Address Enable Register ................................................................................................ 19
Table 6-4 Endpoint Enable Register ............................................................................................... 19
Table 6-5 Configuration Register (Byte 1) ...................................................................................... 20
Table 6-6 Clock Division Factor Register (Byte 2) ............................................................................ 21
Table 6-7 DMA Configuration Register (Byte 1) ............................................................................... 22
Table 6-8 DMA Endpoint Select Register (Byte 2, for Enhanced Mode) ............................................... 22
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Table 6-9 Endpoint Configuration Register ..................................................................................... 22
Table 6-10 Interrupt Register Byte 1 ............................................................................................. 23
Table 6-11 Interrupt Register Byte 2 ............................................................................................. 23
Table 6-12 Interrupt Register Byte 3 (for Enhanced Mode) ............................................................... 24
Table 6-13 Interrupt Register Byte 4 (for Enhanced Mode) ............................................................... 24
Table 6-14 Endpoint Status Register ............................................................................................. 25
Table 6-15 Endpoint Last Transaction Status Register ..................................................................... 25
Table 6-16 Transaction error code ................................................................................................ 26
Table 6-17 Endpoint Buffer Status Register .................................................................................... 27
Table 6-18 Endpoint Control Register ............................................................................................ 28
Table 6-19 Frame Number LSB Register ........................................................................................ 29
Table 6-20 Frame Number MSB Register........................................................................................ 29
Table 6-21 IO Pad Drive Strength Register ..................................................................................... 31
Table 8-1 Absolute Maximum Ratings ............................................................................................ 33
Table 8-2 Operating Voltage and Current ....................................................................................... 34
Table 8-3 digital I/O Pin Characteristics (VCCIO=+3.3V) ................................................................. 34
Table 8-4 digital I/O Pin Characteristics (VCCIO=+2.5V) ................................................................. 34
Table 8-5 digital I/O Pin Characteristics (VCCIO=+1.8V) ................................................................. 35
Table 8-6 USB I/O Pin (DP, USBDM) Characteristics ........................................................................ 35
Table 8-7 Parallel Interface IO timing ............................................................................................ 36
Table 8-8 DMA timing characteristics............................................................................................. 38
Table 9-1 Reflow Profile Parameter Values ..................................................................................... 43
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Appendix C - Revision History
Document Title:
DS_FT122
Document Reference No.:
FT_000647
Clearance No.:
FTDI# 133
Product Page:
http://www.ftdichip.com/Products/ICs/FT122.htm
Document Feedback:
Send Feedback
Version Draft
Initial draft
30th July 2012
Version 1.0
Initial release
1st October 2012
Version 1.1
Updated release
23rd March 2015
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