Lamp 339-9SURSUGSUBW/S1193 Features ˙Popular T-1 3/4 round package. ˙High efficiency. ˙Built in red, yellow, and green chips. ˙Selected minimum intensities. ˙Available on tape and reel. ˙The product itself will remain within RoHS compliant version Descriptions ˙The series is specially designed for applications requiring higher brightness ˙The LED lamps are available with different colors, intensities, epoxy, colors, etc. Applications ˙Status indicators. ˙Commercial use. ˙Advertising Signs. ˙Computer 1 Copyright Revision :2 © LifecyclePhase: Date:2014-12-01 18:03:16.0 2012, Everlight All Rights Reserved. Release Date :6.29.2012 Issue No:Release DLE-0001757_Rev.2 www.everlight.com Expired Period: Forever DATASHEET Lamp 339-9SURSUGSUBW/S1193 Device Selection Guide Chip LED Part No. Material 339-9SURSUGSUBW/S1193 Lens Color Emitted Color GaN/Al2O3 Brilliant Green AlGaInP Brilliant red GaN/Al2O3 White diffused Blue Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Red Blue Forward Current Pulse Forward Current (Duty1/10@ 1KHz) Operating Temperature Storage Temperature Electrostatic Discharge Soldering Temperature Power Dissipation Reverse Voltage IF 50 30 30 mA IFP 160 100 100 mA Topr Tstg ESD Tsol Pd VR 2000 120 -40 ~ +85 -40 ~ +100 1000 260 100 5 Green 1000 100 Units ℃ ℃ V ℃ mW V Notes: *Soldering time≦5 seconds. 2 Copyright Revision :2 © LifecyclePhase: Release Date:2014-12-01 18:03:16.0 2012, Everlight All Rights Reserved. Release Date :11.26.2014 Issue No: DLE-0001757_Rev.2 www.everlight.com Expired Period: Forever DATASHEET Lamp 339-9SURSUGSUBW/S1193 Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Luminous Intensity IV Color Min. Typ. Max. SUR 715 1240 1800 SUG 600 1092 1800 SUB 140 279 565 SUR Viewing Angle 2θ1/2 SUG λD ----- Spectrum half-width λp △λ VF 624 628 SUG 520 530 545 SUB 462 470 478 ----- 518 SUB 468 SUR 20 SUG IR ----- 35 ----- IF=20mA nm ----- 35 SUR 1.8 2.0 2.6 SUG 2.8 3.2 3.6 SUB 2.8 3.2 3.6 SUG deg 632 SUR Reverse Current ----- 620 SUB Forward Voltage 65 SUR SUG mcd 75 SUR Peak Wavelength Condition 65 SUB Dominant Wavelength Unit V 10 ----- SUB ----- 50 μA VR=5V 50 *Measurement Uncertainty of Luminous Intensity: ±10% *Measurement Uncertainty of Dominant Wavelength ±1.0nm *Measurement Uncertainty of Forward Voltage: ±0.1V 3 Copyright Revision :2 © LifecyclePhase: Release Date:2014-12-01 18:03:16.0 2012, Everlight All Rights Reserved. Release Date :11.26.2014 Issue No: DLE-0001757_Rev.2 www.everlight.com Expired Period: Forever DATASHEET Lamp 339-9SURSUGSUBW/S1193 Typical Electro-Optical Characteristics Curves Relative Intensity vs. Angular Displacement (Ta=25℃) Radiation Angle Relative Intensity (%) Relative Intensity vs. Wavelength (Ta=25℃) Wavelength (nm) Relative Intensity vs. Forward Current (Ta=25℃) Forward Current (mA) Relative Intensity(mW/Sr) Forward Current vs. Forward Voltage (Ta=25℃) Relative Intensity (%) Forward Voltage (V) Forward Current (mA) Ambient Temperature Ta(℃) 4 Copyright Revision :2 © LifecyclePhase: Forward Current vs. Ambient Temp. Forward Current (mA) Peak Emission Wavelength (nm) Peak Emission Wavelength vs. Ambient Temp. Ambient Temperature Ta(℃) Release Date:2014-12-01 18:03:16.0 2012, Everlight All Rights Reserved. Release Date :11.26.2014 Issue No: DLE-0001757_Rev.2 www.everlight.com Expired Period: Forever DATASHEET Lamp 339-9SURSUGSUBW/S1193 Package Dimensions Notes: ˙All dimensions are in millimeters, tolerance is 0.25mm except being specified. ˙Protruded resin under flange is 1.5mm Max LED. 5 Copyright Revision :2 © LifecyclePhase: Release Date:2014-12-01 18:03:16.0 2012, Everlight All Rights Reserved. Release Date :11.26.2014 Issue No: DLE-0001757_Rev.2 www.everlight.com Expired Period: Forever DATASHEET Lamp 339-9SURSUGSUBW/S1193 Packing Specification ■ Anti-electrostatic bag Label Pb EL EC TROSTATI C ELECTRONAGNETIC MAGNETIC OR RADIOACTI VE RELDS anti-static for 750 ■ Inner Carton ■ Label Form Specification CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Rank of Luminous Intensity HUE: Rank of Dominant Wavelength REF: Reference LOT No: Lot Number ■ Outside Carton ■ Packing Quantity 1. 500 PCS/1 Bag, 5 Bags/1 Inner Carton 2. 10 Inner Cartons/1 Outside Carton 6 Copyright Revision :2 © LifecyclePhase: Release Date:2014-12-01 18:03:16.0 2012, Everlight All Rights Reserved. Release Date :11.26.2014 Issue No: DLE-0001757_Rev.2 www.everlight.com Expired Period: Forever DATASHEET Lamp 339-9SURSUGSUBW/S1193 Notes 1.Lead Forming During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. Lead forming should be done before soldering. Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs. Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs. When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. 2.Storage The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. 3.Soldering Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended. Recommended soldering conditions: Hand Soldering DIP Soldering Temp. at tip of iron 300℃ Max. (30W Max.) Preheat temp. 100℃ Max. (60 sec Max.) Soldering time 3 sec Max. Bath temp. & time 260 Max., 5 sec Max Distance 3mm Min.(From solder Distance joint to epoxy bulb) 3mm Min. (From solder joint to epoxy bulb) Recommended soldering profile laminar wave Fluxing Prehead Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering. 7 Copyright Revision :2 © LifecyclePhase: Release Date:2014-12-01 18:03:16.0 2012, Everlight All Rights Reserved. Release Date :11.26.2014 Issue No: DLE-0001757_Rev.2 www.everlight.com Expired Period: Forever DATASHEET Lamp 339-9SURSUGSUBW/S1193 Dip and hand soldering should not be done more than one time After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the LEDs. Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4.Cleaning When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use. Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED. 5.Heat Management Heat management of LEDs must be taken into consideration during the design stage of LED application. The current should be de-rated appropriately by referring to the de-rating curve found in each product specification. The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating curve. 6.ESD (Electrostatic Discharge) The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability. When handling the products, the following measures against electrostatic discharge are strongly recommended: Eliminating the charge Grounded wrist strap, ESD footwear, clothes, and floors Grounded workstation equipment and tools ESD table/shelf mat made of conductive materials Proper grounding is required for all devices, equipment, and machinery used in product assembly. Surge protection should be considered when designing of commercial products. If tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: Dissipating static charge with conductive materials Preventing charge generation with moisture Neutralizing the charge with ionizers 7.Other Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent. 8 Copyright Revision :2 © LifecyclePhase: Release Date:2014-12-01 18:03:16.0 2012, Everlight All Rights Reserved. Release Date :11.26.2014 Issue No: DLE-0001757_Rev.2 www.everlight.com Expired Period: Forever