LAMP 6324/F1C9-1LNA

LAMP
6324/F1C9-1LNA
Features
․4.8mm round package.
․High luminous power.
․Typical chromaticity coordinates x=0.29, y=0.28
according to CIE1931.
․Bulk, available taped on reel.
․ESD-withstand voltage: up to 4KV
․The product itself will remain within RoHS compliant version.
Descriptions
․The series is designed for application required
high luminous intensity.
․The phosphor filled in the reflector converts the
blue emission of InGaN chip to ideal white
Applications
․Message panels
․Optical Indicators
․Backlighting
․Marker Lights
1
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2009, Everlight All Rights Reserved. Release Date : Nov.28, 2014. Issue No:DLE-0000740_Rev.2
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Release Date:2014-12-03
19:32:43.0
Expired Period: Forever
DATASHEET
LAMP
6324-F1C9-1LNA
Device Selection Guide
Chip
Emitted Color
Materials
InGaN
Resin Color
White
Water Clear
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
IF
30
mA
Peak Forward Current(Duty 1 /10 @ 1KHZ)
IFP
100
mA
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Soldering Temperature (T=5 sec)
Tsol
260
℃
Power Dissipation
Pd
110
mW
Zener Reverse Current
Iz
100
mA
Electrostatic Discharge
ESD
Continuous Forward Current
4K
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Forward Voltage
VF
2.8
----
3.6
V
IF=20mA
Zener Reverse Voltage
Vz
5.2
----
----
V
Iz=5mA
Reverse Current
IR
----
----
50
μA
VR=5V
Luminous Intensity
IV
1425
----
2850
mcd
IF=20mA
2θ1/2
----
100
----
deg
IF=20mA
x
----
0.29
----
----
y
----
0.28
----
----
Viewing Angle
Chromaticity Coordinates
2
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IF =20mA
2009, Everlight All Rights Reserved. Release Date : Nov.28, 2014. Issue No:DLE-0000740
_Rev.2
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Release Date:2014-12-03
19:32:43.0
Expired Period: Forever
DATASHEET
LAMP
6324-F1C9-1LNA
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
Unit
Condition
L
M
N
1425
1800
2250
1800
2250
2850
mcd
IF =20mA
Bin Code
Min.
Max.
Unit
Condition
0
1
2
3
2.8
3.0
3.2
3.4
3.0
3.2
3.4
3.6
V
IF =20mA
Note:
Tolerance of Luminous Intensity: ±10%
Forward Voltage Combination
Note:
Measurement Uncertainty of Forward Voltage:±0.1V
Color Combination ( at 20mA)
3
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Group
Bins
1
A1+A0+B3+B4+B5+B6+C0
2009, Everlight All Rights Reserved. Release Date : Nov.28, 2014. Issue No:DLE-0000740
_Rev.2
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Release Date:2014-12-03
19:32:43.0
Expired Period: Forever
DATASHEET
LAMP
6324-F1C9-1LNA
CIE Chromaticity Diagram
Color Ranks (IF=20mA,Ta=25℃)
Color Ranks
A1
A0
B3
B4
B5
B6
C0
CIE
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
0.255
0.245
0.264
0.267
0.283
0.305
0.304
0.33
0.287
0.295
0.307
0.315
0.33
0.36
0.264
0.267
0.283
0.305
0.304
0.33
0.33
0.36
0.307
0.315
0.33
0.339
0.361
0.385
0.28
0.248
0.296
0.267
0.307
0.315
0.33
0.339
0.311
0.294
0.33
0.318
0.355
0.35
0.27
0.23
0.28
0.248
0.287
0.295
0.307
0.315
0.296
0.276
0.311
0.294
0.33
0.318
Note:
Measurement uncertainty of the color coordinates:±0.01
4
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2009, Everlight All Rights Reserved. Release Date : Nov.28, 2014. Issue No:DLE-0000740
_Rev.2
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Release Date:2014-12-03
19:32:43.0
Expired Period: Forever
DATASHEET
LAMP
6324-F1C9-1LNA
Typical Electro-Optical Characteristics Curves
Relative Intensity vs. Wavelength
Forward Current vs. Forward Voltage
Relative Intensity vs. Forward Current
Chromaticity Coordinate vs. Forward Current
5
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Forward Current vs. Ambient Temp.
Relative Intensity vs. Angle Displacement
2009, Everlight All Rights Reserved. Release Date : Nov.28, 2014. Issue No:DLE-0000740
_Rev.2
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Release Date:2014-12-03
19:32:43.0
Expired Period: Forever
DATASHEET
LAMP
6324-F1C9-1LNA
Package Dimension
Note: Note:
1.All dimensions are in millimeters, and tolerance is 0.25mm except being specified.
2.Lead spacing is measured where the lead emerges from the package.
3.Protruded resin under flange is 1.5mm Max. LED.
6
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2009, Everlight All Rights Reserved. Release Date : Nov.28, 2014. Issue No:DLE-0000740
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Release Date:2014-12-03
19:32:43.0
Expired Period: Forever
DATASHEET
LAMP
6324-F1C9-1LNA
Moisture Resistant Packing Materials
■
Anti-electrostatic bag
Label
Pb
EL ECTROSTATIC ELECTRONAGNETIC
MAGNETIC OR RADIOACTIVE RELDS
anti-static for 750
■
Inner Carton
■
■
Outside Carton
■
7
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Label Form Specification
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Ranks of Luminous Intensity and Forward Voltage
HUE: Color Rank
REF: Reference
LOT No: Lot Number
MADE IN TAIWAN: Production Place
Packing Quantity
1. 500 PCS/1 Bag, 5 Bags/1 Inner Carton
2. 10 Inner Cartons/1 Outside Carton
2009, Everlight All Rights Reserved. Release Date : Nov.28, 2014. Issue No:DLE-0000740
_Rev.2
www.everlight.com
Release Date:2014-12-03
19:32:43.0
Expired Period: Forever
DATASHEET
LAMP
6324-F1C9-1LNA
Production Designation
Notes
1. Lead Forming
 During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy
bulb.

Lead forming should be done before soldering.

Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s
characteristics or it may break the LEDs.

Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause
failure of the LEDs.

When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position
of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy
resin and this will degrade the LEDs.
2. Storage
 The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and
the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored
for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.

Please avoid rapid transitions in ambient temperature, especially, in high humidity environments
where condensation can occur.
3. Soldering
 Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder
joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended.

Recommended soldering conditions:
Hand Soldering
300℃ Max. (30W
Temp. at tip of
Max.)
iron
Soldering time
Distance
8
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3 sec Max.
3mm Min.(From
solder joint to
epoxy bulb)
DIP Soldering
Preheat temp.
Bath temp. & time
Distance
100℃ Max. (60 sec
Max.)
260 Max., 5 sec Max
3mm Min. (From
solder joint to epoxy
bulb)
2009, Everlight All Rights Reserved. Release Date : Nov.28, 2014. Issue No:DLE-0000740
_Rev.2
www.everlight.com
Release Date:2014-12-03
19:32:43.0
Expired Period: Forever
DATASHEET
LAMP
6324-F1C9-1LNA
laminar wave
Fluxing
Prehead

Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly
when soldering.

Dip and hand soldering should not be done more than one time

After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration
until the LEDs return to room temperature.

A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.

Although the recommended soldering conditions are specified in the above table, dip or
handsoldering at the lowest possible temperature is desirable for the LEDs.

Wave soldering parameter must be set and maintain according to recommended temperature and
dwell time in the solder wave.
4. Cleaning
 When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a
duration of no more than one minute. Dry at room temperature before use.

Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED
5. Circuit Protection
 Below the zener reference voltage Vz, all the current flows through LED and as the voltage rises to
Vz, the zener diode “breakdown." If the voltage tries to rise above Vz current flows through the zener
branch to keep the voltage at exactly Vz.

When the LED is connected using serial circuit, if either piece of LED is no light up but current can’t
flow through causing others to light down. In new design, the LED is parallel with zener diode. if

either piece of LED is no light up but current can flow through causing others to light up.
9
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2009, Everlight All Rights Reserved. Release Date : Nov.28, 2014. Issue No:DLE-0000740
_Rev.2
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Release Date:2014-12-03
19:32:43.0
Expired Period: Forever
DATASHEET
LAMP
6324-F1C9-1LNA
6. Heat Management
 Heat management of LEDs must be taken into consideration during the design stage of LED
application. The current should be de-rated appropriately by referring to the de-rating curve found in
each product specification.

The temperature surrounding the LED in the application should be controlled. Please refer to the data
sheet de-rating curve.
7. ESD (Electrostatic Discharge)
 Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.

An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs.

All devices, equipment and machinery must be properly grounded.

Use ion blower to neutralize the static charge which might have built up on surface of the LEDs
plastic lens as a result of friction between LEDs during storage and handing.
8. Other
 Above specification may be changed without notice. EVERLIGHT will reserve authority on material
change for above specification.

When using this product, please observe the absolute maximum ratings and the instructions for using
outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage
resulting from use of the product which does not comply with the absolute maximum ratings and the
instructions included in these specification sheets.

These specification sheets include materials protected under copyright of EVERLIGHT corporation.
Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.
10
Revision Copyright
:2 ©
LifecyclePhase:
2009, Everlight All Rights Reserved. Release Date : Nov.28, 2014. Issue No:DLE-0000740
_Rev.2
www.everlight.com
Release Date:2014-12-03
19:32:43.0
Expired Period: Forever