TMDXEVM6678L EVM Technical Reference Manual

TMDXEVM6678L EVM
Technical Reference Manual
Version 2.0
Literature Number: SPRUH58
Revised June 2011
Document Copyright
Publication Title:
TMDXEVM6678L Technical Reference Manual All
Rights Reserved. Reproduction, adaptation, or
translation without prior written permission is
prohibited, except as allowed under copyright laws.
1
EVALUATION BOARD / KIT / MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMER
Not for Diagnostic Use: For Feasibility Evaluation Only in Laboratory/Development
Environments
The EVM may not be used for diagnostic purposes.
This EVM is intended solely for evaluation and development purposes. It is not intended for
use and may not be used as all, or part of an end equipment product.
This EVM should be used solely by qualified engineers and technicians who are familiar with
the risks associated with handling electrical and mechanical components, systems and
subsystems.
Your Obligations and Responsibilities
Please consult the EVM documentation, including but not limited to any user guides, setup
guides or getting started guides, and other warnings prior to using the EVM. Any use of the
EVM outside of the specified operating range may cause danger to users and/or produce
unintended results, inaccurate operation, and permanent damage to the EVM and
associated electronics. You acknowledge and agree that:
You are responsible for compliance with all applicable Federal, State and local regulatory
requirements (including but not limited to Food and Drug Administration regulations, UL,
CSA, VDE, CE, RoHS and WEEE,) that relate to your use (and that of your employees,
contractors or designees) of the EVM for evaluation, testing and other purposes.
You are responsible for the safety of you and your employees and contractors when
using or handling the EVM. Further, you are responsible for ensuring that any contacts
or interfaces between the EVM and any human body are designed to be safe and to
avoid the risk of electrical shock.
You will defend, indemnify and hold TI, its licensors and their representatives harmless
from and against any and all claims, damages, losses, expenses, costs and liabilities
(collectively, “Claims”) arising out of, or in connection with any use of the EVM that is
not in accordance with the terms of this agreement. This obligation shall apply whether
Claims arise under the law of tort or contract or any other legal theory, and even if the
EVM fails to perform as described or expected.
Warning
The EVM board may get very hot during use. Specifically, the DSP, its heat
sink and power supply circuits all heat up during operation. This will not harm
the EVM. Use care when touching the unit when operating or allow it to cool
after use before handling. If unit is operated in an environment that limits
free air flow, a fan may be needed.
2
Preface
About this Document
This document is a Technical Reference Manual for the TMS320C6678 Evaluation Module
(TMDXEVM6678L) designed and developed by Advantech Limited for Texas Instruments, Inc.
Notational Conventions
This document uses the following conventions:
Program listings, program examples, and interactive displays are shown in a mono spaced
font. Examples use bold for emphasis, and interactive displays use bold to distinguish
commands that you enter from items that the system displays (such as prompts, command
output, error messages, etc.).
Square brackets ( [ and ] ) identify an optional parameter. If you use an optional parameter,
you specify the information within the brackets. Unless the square brackets are in a bold
typeface, do not enter the brackets themselves.
Underlined, italicized non-bold text in a command is used to mark place holder text that
should be replaced by the appropriate value for the user’s configuration.
3
Trademarks
The Texas Instruments logo and Texas Instruments are registered trademarks of Texas
Instruments. Trademarks of Texas Instruments include: TI, XDS, Code Composer, Code
Composer Studio, Probe Point, Code Explorer, DSP / BIOS, RTDX, Online DSP Lab, TMS320,
TMS320C54x, TMS320C55x, TMS320C62x, TMS320C64x, TMS320C67x, TMS320C5000, and
TMS320C6000.
MS-DOS, Windows, Windows XP, and Windows NT are trademarks of Microsoft
Corporation.
UNIX is a registered trademark of The Open Group in the United States and other countries.
All other brand, product names, and service names are trademarks or registered trademarks
of their respective companies or organizations.
4
Document Revision History
Release
Chapter
Description of Change
1.00
All
The First Release for draft
2.00
All
The Second Release for production
Acronyms
Acronym
AMC or AdvancedMC
CCS
DDR3
DSP
DTE
EEPROM
EMAC
EMIF
EVM
FPGA
RFU
I2C
IPMB
IPMI
JTAG
LED
MCH
MTCA or MicroTCA
MMC
PICMG®
PCIE
SDRAM
SERDES
SGMII
SRIO
TSIP
UART
USB
XDS560v2
Description
Advanced Mezzanine Card
Code Composer Studio
Double Data Rate 3 Interface
Digital Signal Processor
Data Terminal Equipment
Electrically Erasable Programmable Read Only Memory
Ethernet Media Access Controller
External Memory Interface
Evaluation Module
Field Programmable Gate Array
Reserved for Future Use
Inter Integrated Circuit
Intelligent Platform Management Bus
Intelligent Platform Management Interface
Joint Test Action Group
Light Emitting Diode
MicroTCA Carrier Hub
Micro Telecommunication Computing Architecture
Module Management Controller
PCI Industrial Computer Manufacturers Group
PCI express
Synchronous Dynamic Random Access Memory
Serializer-Deserializer
Serial Gigabit Media Independent Interface
Serial RapidIO
Telecom Serial Interface Port
Universal Asynchronous Receiver/Transmitter
Universal Serial Bus
Texas Instruments’ System Trace Emulator
5
Table of Contents
1. Overview..............................................................................................................................11
1.1 Key Features............................................................................................................... 11
1.2 Functional Overview ..................................................................................................12
1.3 Basic Operation..........................................................................................................12
1.4 Boot Mode and Boot Configuration Switch Setting...................................................13
1.5 Power Supply .............................................................................................................14
2. Introduction to the TMDXEVM6678L board.......................................................................15
2.1 Memory Map .............................................................................................................15
2.2 EVM Boot Mode and Boot Configuration Switch Settings ........................................18
2.3 JTAG - Emulation Overview........................................................................................18
2.4 Clock Domains............................................................................................................19
2.5 I2C Boot EEPROM / SPI NOR Flash .............................................................................20
2.6 FPGA ...........................................................................................................................20
2.7 Gigabit Ethernet Connections....................................................................................21
2.8 Serial RapidIO (SRIO) Interface ..................................................................................22
2.9 DDR3 External Memory Interface..............................................................................22
2.10 16-bit Asynchronous External Memory Interface (EMIF-16)...................................23
2.11 HyperLink Interface..................................................................................................24
2.12 PCIe Interface...........................................................................................................24
2.13 Telecom Serial Interface Port (TSIP) ........................................................................25
2.14 UART Interface .........................................................................................................25
2.15 Module Management Controller (MMC) for IPMI...................................................26
2.16 Expansion Header ....................................................................................................27
3. TMDXEVM6678L Board Physical Specifications .................................................................28
3.1 Board Layout..............................................................................................................28
3.2 Connector Index.........................................................................................................29
3.2.1 560V2_PWR1, XDS560v2 Mezzanine Power Connector..............................29
3.2.2 AMC1, AMC Edge Connector ....................................................................... 30
3.2.3 COM1, UART3 Pin Connector.......................................................................32
3.2.4 COM_SEL1, UART Route Select Connector..................................................32
3.2.5 DC_IN1, DC Power Input Jack Connector.....................................................33
3.2.6 EMU1, TI 60-Pin DSP JTAG Connector..........................................................33
3.2.7 FAN1, FAN Connector...................................................................................34
3.2.8 HyperLink1, HyperLink Connector...............................................................35
3.2.9 LAN1, Ethernet Connector...........................................................................35
3.2.10 PMBUS1, PMBUS Connector for Smart-Reflex Control..............................36
3.2.11 TAP_FPGA1, FPGA JTAG Connector (For Factory Use Only).......................36
3.2.12 SBW_MMC1, MSP430 JTAG Connector (For Factory Use Only) ................ 37
3.2.13 TEST_PH1, Expansion Header (EMIF-16, SPI, GPIO, Timer I/O, I2C, and
UART) .......................................................................................................................38
3.2.14 USB1, Mini-USB Connector........................................................................39
3.3 DIP and Pushbutton Switches ....................................................................................40
3.3.1 RST_FULL1, Full Reset ..................................................................................40
3.3.2 RST_COLD1, Cold Reset................................................................................40
6
3.3.3 RST_WARM1, Warm Reset...........................................................................40
3.3.4 SW9, DSP PCIESS Enable and User Defined Switch Configuration...............42
3.4 Test Points..................................................................................................................43
3.5 System LEDs ...............................................................................................................44
4. System Power Requirements ..............................................................................................46
4.1 Power Requirements .................................................................................................46
4.2 The Power Supply Distribution ..................................................................................48
4.3 The Power Supply Boot Sequence.............................................................................51
5. TMDXEVM6678L FPGA FUNCTIONAL DESCRIPTION ..........................................................56
5.1 FPGA overview ..........................................................................................................56
5.2 FPGA signals description...........................................................................................57
5.3 Sequence of operation..............................................................................................63
5.3.1 Power-On Sequence........................................................................................63
5.3.2 Power Off Sequence........................................................................................64
5.3.3 Boot Configuration Timing..............................................................................65
5.3.4 Boot Configuration Forced in I2C Boot ........................................................... 66
5.4 Reset definition .........................................................................................................66
5.4.1 Reset Behavior ................................................................................................66
5.4.2 Reset Switches and Triggers............................................................................66
5.5 SPI protocol ...............................................................................................................67
5.5.1 FPGA-DSP SPI Protocol ....................................................................................68
5.5.2 FPGA- CDCE62005(Clock Generator) SPI Protocol ..........................................69
5.6 FPGA Configuration Registers...................................................................................70
5.6.1 FPGA Configuration Registers Summary.........................................................70
5.6.2 FPGA Configuration Registers Descriptions ....................................................71
7
List of Figures
Figure 1.1: Block Diagram of TMDXEVM6678L EVM ...............................................................12
Figure 1.2: TMDXEVM6678L EVM Layout................................................................................13
Figure 2.1: TMDXEVM6678L EVM JTAG emulation .................................................................19
Figure 2.2: TMDXEVM6678L EVM Clock Domains...................................................................20
Figure 2.3: TMDXEVM6678L EVM FPGA Connections.............................................................21
Figure 2.4: TMDXEVM6678L EVM Ethernet Routing...............................................................21
Figure 2.5: TMDXEVM6678L EVM SRIO Port Connections ......................................................22
Figure 2.6: TMDXEVM6678L EVM SDRAM...............................................................................23
Figure 2.7: TMDXEVM6678L EVM EMIF-16 connections.........................................................23
Figure 2.8: TMDXEVM6678L EVM HyperLink connections......................................................24
Figure 2.9: TMDXEVM6678L EVM PCIE Port Connections.......................................................24
Figure 2.10: TMDXEVM6678L EVM TSIP connections .............................................................25
Figure 2.11: TMDXEVM6678L EVM UART Connections...........................................................26
Figure 2.12: TMDXEVM6678L EVM MMC Connections for IPMI.............................................27
Figure 3.1: TMDXEVM6678L EVM Board Assembly Layout – TOP view..................................28
Figure 3.2: TMDXEVM6678L EVM Board layout – Bottom view .............................................29
Figure 3.3: COM_SEL1 Jumper setting.....................................................................................33
Figure 3.4 : The HyperLink Connector .....................................................................................35
Figure 3.5 : TAP_FPGA1 function diagram...............................................................................37
Figure 3.6 : SW3, SW4, SW5, and SW6 default settings ..........................................................41
Figure 3.7 : SW9 default settings .............................................................................................42
Figure 3.8 : TMDXEVM6678L test points on top side..............................................................43
Figure 3.9 : TMDXEVM6678L test points on the bottom side.................................................43
Figure 3.10 : TMDXEVM6678L EVM Board LEDs......................................................................45
Figure 4.1: All the AMC power supply on TMDXEVM6678L EVM ...........................................49
Figure 4.2: The CVDD and VCC1V0 (CVDD1) power design on TMDXEVM6678L EVM ...........50
Figure 4.3: The VCC3_AUX power design on TMDXEVM6678L EVM ......................................50
Figure 4.4: The VCC1V5 power design on TMDXEVM6678L EVM...........................................51
Figure 4.5: The VCC5 power design on TMDXEVM6678L EVM ...............................................51
Figure 4.6: Initial Power Up Sequence Timing Diagram ..........................................................54
8
Figure 4.7: Initial Power Down Sequence Timing Diagram .....................................................55
Figure 5.1: Power-On Reset Boot Configuration Timing .........................................................65
Figure 5.2: Reset-Full Switch/Trigger Boot Configuration Timing ...........................................65
Figure 5.3: The SPI access form the TMS320C6678 to the FPGA (WRITE / high level)............68
Figure 5.4: The SPI access form the TMS320C6678 to the FPGA (WRITE) ..............................68
Figure 5.5: The SPI access form the TMS320C6678 to the FPGA (READ / high level) .............68
Figure 5.6: The SPI access form the TMS320C6678 to the FPGA (READ) ................................69
Figure 5.7: The SPI access form the FPGA to the CDCE62005 (WRITE) ...................................69
Figure 5.8: The SPI access form the FPGA to the CDCE62005 (READ).....................................69
9
List of Tables
Table 2.1: TMS320C6678 Memory Map..................................................................................16
Table 3.1 : TMDXEVM6678L EVM Board Connectors..............................................................29
Table 3.2 : XDS560v2 Power Connector pin out ......................................................................30
Table 3.3: AMC Edge Connector...............................................................................................30
Table 3.4 : UART Connector pin out.........................................................................................32
Table 3.5 : UART Path Select Connector pin out......................................................................33
Table 3.6: DSP JTAG Connector pin out....................................................................................34
Table 3.7 : FAN1 Connector pin out .........................................................................................34
Table 3.8 : The HyperLink Connector.......................................................................................35
Table 3.9 : Ethernet Connector pin out....................................................................................36
Table 3.10 : PMBUS1 pin out....................................................................................................36
Table 3.11 : FPGA JTAG Connector pin out .............................................................................. 37
Table 3.12 : MSP430 JTAG Connector pin out..........................................................................38
Table 3.13 : Test Header pin out...............................................................................................38
Table 3.14 : Mini-USB Connector pin out.................................................................................40
Table 3.15 : TMDXEVM6678L EVM Board Switches.................................................................40
Table 3.16 : SW3-SW6, DSP Configuration Switch ...................................................................41
Table 3.17: SW9, DSP PCI Express Enable and User Switch .....................................................43
Table 3.18 : TMDXEVM6678L EVM Board Test Points.............................................................44
Table 3.19 : TMDXEVM6678LTEEVM Board LEDs.....................................................................44
Table 4.1: EVM Voltage Table.................................................................................................. 47
Table 4.2: Each Current Requirements on each device of EVM board....................................48
Table 4.3: The power-up and down timing on the TMDXEVM6678L......................................53
Table 5.1 : TMDXEVM6678L EVM FPGA Pin Description......................................................... 57
Table 5.2 : TMS320C6678 EVM FPGA Memory Map...............................................................70
Table 5.3 : FPGA Configuration Registers Summary ................................................................70
10
1. Overview
This chapter provides an overview of the TMDXEVM6678L along with the key features and
block diagram.
1.1 Key Features
1.2 Functional Overview
1.3 Basic Operation
1.4 Configuration Switch Settings
1.5 Power Supply
1.1 Key Features
The TMDXEVM6678L is a high performance, cost-efficient, standalone development
platform that enables users to evaluate and develop applications for the Texas Instruments’
TMS320C6678 Digital Signal Processor (DSP). The Evaluation Module (EVM) also serves as a
hardware reference design platform for the TMS320C6678 DSP. The EVM’s form-factor is
equivalent to a single-wide PICMG® AMC.0 R2.0 AdvancedMC module.
Schematics, code examples and application notes are available to ease the hardware
development process and to reduce the time to market.
The key features of the TMDXEVM6678L EVM are:
Texas Instruments' multi-core DSP – TMS320C6678
512 Mbytes of DDR3-1333 Memory
64 Mbytes of NAND Flash
16MB SPI NOR FLASH
Two Gigabit Ethernet ports supporting 10/100/1000 Mbps data-rate – one on
AMC connector and one RJ-45 connector
170 pin B+ style AMC Interface containing SRIO, PCIe, Gigabit Ethernet and TDM
High Performance connector for HyperLink
128K-byte I2C EEPROM for booting
2 User LEDs, 5 Banks of DIP Switches and 4 Software-controlled LEDs
RS232 Serial interface on 3-Pin header or UART over mini-USB connector
EMIF, Timer, SPI, UART on 80-pin expansion header
11
On-Board XDS100 type Emulation using High-speed USB 2.0 interface
TI 60-Pin JTAG header to support all external emulator types
Module Management Controller (MMC) for Intelligent Platform Management
Interface (IPMI)
Optional XDS560v2 System Trace Emulation Mezzanine Card
Powered by DC power-brick adaptor (12V/3.0A) or AMC Carrier backplane
PICMG® AMC.0 R2.0 single width, full height AdvancedMC module
1.2 Functional Overview
The TMS320C66x™ DSPs (including the TMS320C6678 device) are the highest-performance
fixed / floating-point DSP generation in the TMS320C6000™ DSP platform. The
TMS320C6678 device is based on the third-generation high-performance, advanced
VelociTI™ very-long-instruction-word (VLIW) architecture developed by Texas Instruments
(TI), designed specifically for high density wireline / wireless media gateway infrastructure.
It is an ideal solution for IP border gateways, video transcoding and translation, video-server
and intelligent voice and video recognition applications. The C66x devices are backward
code-compatible from previous devices that are part of the C6000™ DSP platform.
The functional block diagram of TMDXEVM6678L is shown in the figure below:
AMC_St ate
fr om MMC
FPGA JTAG
SPI EEPROM
JTAG
User controlled LED - 4
ROM_SPI
1. 64M X 16 / 512MB
2. 128M X 16 / 1GB
MMC
CLK#1
FPGA
XC3S200AN
(XILINX)
CLK_SPI2
CLK_SPI3
CDCE62005
CLK#2
DIP_S WITCH
CDCE62005
GPIO
S WITCH
(TS 3L301)
JTAG & EMU[0:1]
CH-A
USB-JTAG
FT2232HL
CH-B
PCIEx2
S RIOx4
TSIPx2
TSIPx2
Level-S hifter
DSP_I2C
EEPROM
POWER 12V
128k-byte
M2 4M0 1-HRMN6TP
LEVEL
S HIFT
DSP_I2C(1.8V)
DSP_UART(3.3V)
DSP_SPI(1.8V)
EMIF16(1.8V)
GPIO[0:15](1.8V)
USB
UART
JTAG &
S WITCH
EMU[0:1] (TS 3L301)
DSP_UART
AMC JTAG
DSP_UART
88E1111-B2
Mini-USB
D1
D2
S GMIIx1
NU Resistor s
EMU[2:17]
MAC1
JTAG&EMU[0:1] MDIO
EMU[2:17]
ENET PHY
PCIEx2
I2C
60-Pin EMU CONN.
Miscellaneous I/O conn.
MAC0
IPMB-L
MMC
(MSP430)
EMIF
TS IPx2
DIP SW
BM_GPIO(0~15) /
PCIES SEN / User define
Power Contr ol
AMC_State
EMIF
SRIOx4
DSP_SGMII_P1 & MDIO
RJ45
Sequence
Cont rol
DSP
TMS320C6678
SPI
GPIO[0:15]
DS P_GPIO
512Mb 64M X8)
to FPG A
Hyper Li nk
JTAG
NUMONYX
NAND512R3A 2DZA 6E
Hy perLink
50Gbps
DDR3
NOR 128M-bit
N25Q128A21BS F40F #0
S PI
DS P_SPI#1
i Pass+HD
DDR3-1333
w/ ECC
SPI Flash
DEBUG_LED
HyperLink CONN.
1. 1Gb X 16
2. 1Gb X 8
DDR3 -1333
128k-bit
AT25128B
S YSPG_D1 LED
SBW_MMC1
NAND FLASH
DDR3(ECC)
JTAG
Power Contr ol
RS232
MAX3221EAE
Power
DSP
RAM
FPGA PHY
Others
PWR CONN
AMC JTAG
COM1 connector
2.54mm
UCD9222_PMbus
DSP_SGMII_P1 & MDIO
Figure 1.1: Block Diagram of TMDXEVM6678L EVM
1.3 Basic Operation
The TMDXEVM6678L platform is designed to work with TI’s Code Composer Studio (CCS)
development environment and ships with a version specifically tailored for this board. CCS
can interface with the board via on-board emulation circuitry using the USB cable supplied
along with this EVM or through an external emulator.
12
The EVM comes with the Texas Instruments Multicore Software Development Kit (MCSDK)
for SYS/BIOS OS. The BIOS MCSDK provides the core foundational building blocks that
facilitate application software development on TI's high performance and multicore DSPs.
The MCSDK also includes an out-of-box demonstration; see the "MCSDK Getting Started
Guide".
To start operating the board, follow instructions in the Quick Start Guide. This guide
provides instruction for proper connections and configuration for running the POST and
OOB Demos. After completing the POST and OOB Demos, proceed with installing CCS and
the EVM support files by following the instructions on the DVD. This process will install all
the necessary development tools, drivers and documentation.
After the installation has completed, follow the steps below to run Code Composer Studio.
1. Power-on the board using the power brick adaptor (12V/3.0A) supplied along with this
EVM or inserting this EVM board into a MicroTCA chassis or AMC carrier backplane.
2. Connect USB cable from host PC to EVM board.
3. Launch Code Composer Studio from host PC by double clicking on its icon on the PC
desktop.
Detailed information about the EVM including examples and reference materials are
available in the DVD included with this EVM kit.
80-pin Expansion Header
Gigabit PMBUS1
Ethernet Jack
PHY
RST_FULL1
RST_WARM1
HyperLink
TAP_FPGA1
SBW_MMC
64MB NAND
FPGA
60-pin JTAG
Emulator
TMS320C6678
RST_COLD1
560V2_PWR
1
USB
COM1
SW9 SW6 SW5 SW4 SW3
Emulator
COM_SEL1
512MB DDR3-1333
FAN1
DC IN 12V
Figure 1.2: TMDXEVM6678L EVM Layout
1.4 Boot Mode and Boot Configuration Switch Setting
The TMDXEVM6678L has 18 sliding DIP switches (Board Ref. SW3 to SW6 and SW9) to
determine boot mode, boot configuration, device number, Endian mode, CorePac PLL clock
selection and PCIe Mode selection options latched at reset by the DSP.
13
1.5 Power Supply
The TMDXEVM6678L can be powered from a single +12V / 3.0A DC (36W) external power
supply connected to the DC power jack (DC_IN1). Internally, +12V input is converted into
required voltage levels using local DC-DC converters.
• CVDD (+0.90V~+1.05V) used for the DSP Core logic
• +1.0V is used for DSP internal memory and HyperLink/SRIO/SGMII/PCIe SERDES
termination of DSP
• +1.5V is used for DDR3 buffers of DSP, HyperLink/SRIO/SGMII/PCIe SERDES regulators
in DSP and DDR3 DRAM chips
• +1.8V is used for DSP PLLs, DSP LVCMOS I/Os and FPGA I/Os driving the DSP
• +2.5V is used for Gigabit Ethernet PHY core
• +1.2V is used for FPGA core and Gigabit Ethernet PHY core
• +3.3V is used for FPGA I/Os
• +5V and +3.3V is used to power optional XDS560v2 mezzanine card
• The DC power jack connector is a 2.5mm barrel-type plug with center-tip as positive
polarity
The TMDXEVM6678L can also draw power from the AMC edge connector (AMC1). If the
board is inserted into a PICMG® MicroTCA.0 R1.0 compliant system chassis or AMC Carrier
backplane, an external +12V supply from DC jack (DC_IN1) is not required.
14
2. Introduction to the TMDXEVM6678L board
This chapter provides an introduction and details of interfaces for the TMDXEVM6678L
board. It contains:
2.1 Memory Map
2.2 EVM Boot mode and Boot configuration switch settings
2.3 JTAG - Emulation Overview
2.4 Clock Domains
2.5 I2C boot EEPROM / SPI NOR Flash
2.6 FPGA
2.7 Gigabit Ethernet PHY
2.8 Serial RapidIO (SRIO) Interfaces
2.9 DDR3 External Memory Interfaces
2.10 16-bit Asynchronous External Memory Interface
2.11 HyperLink Interface
2.12 PCIe Interface
2.13 Telecom Serial Interface Port (TSIP)
2.14 UART Interfaces
2.15 Module Management Controller for IPMI
2.16 Additional Headers
2.1 Memory Map
The memory map of the TMS320C6678 device is as shown in Table 1. The external memory
configuration register address ranges in the TMS320C6678 device begin at the hex address
location 0x7000 0000 for EMIFA and hex address location 0x8000 0000 for DDR3 Memory
Controller.
15
Table 2.1: TMS320C6678 Memory Map
Address Range
Bytes
Memory Block Description
0x00800000 – 0x0087FFFF
512K
Local L2 SRAM
0x00E00000 – 0x00E07FFF
32K
Local L1P SRAM
0x00F00000 – 0x00F07FFF
32K
L1D SRAM
0x01800000 – 0x01BFFFFF
4M
C66x CorePac Registers
0x01E00000 – 0x01E3FFFF
256K
Telecom Serial Interface Port (TSIP) 0
0x01E80000 – 0x01EBFFFF
256K
Telecom Serial Interface Port (TSIP) 1
0x02000000 – 0x0209FFFF
640K
Packet Accelerator Subsystem Configuration
0x02310000 – 0x023101FF
512
PLL Controller
0x02320000 – 0x023200FF
256
GPIO
0x02330000 – 0x023303FF
1K
SmartRlex
0x02350000 – 0x02350FFF
4K
Power Sleep Controller (PSC)
0x02360000 – 0x023603FF
1K
Memory Protection Unit (MPU) 0
0x02368000 – 0x023683FF
1K
Memory Protection Unit (MPU) 1
0x02370000 – 0x023703FF
1K
Memory Protection Unit (MPU) 2
0x02378000 – 0x023783FF
1K
Memory Protection Unit (MPU) 3
0x02530000 – 0x0253007F
128
I2C Data & Control
0x02540000 – 0x0254003F
64
UART
0x02600000 – 0x02601FFF
8K
Secondary Interrupt Controller (INTC) 0
0x02604000 – 0x02605FFF
8K
Secondary Interrupt Controller (INTC) 1
0x02608000 – 0x02609FFF
8K
Secondary Interrupt Controller (INTC) 2
0x0260C000 – 0x0260DFFF
8K
Secondary Interrupt Controller (INTC) 3
0x02620000 – 0x026207F
2K
Chip-Level Registers (boot cfg)
0x02640000 – 0x026407FF
2K
Semaphore
0x02700000 – 0x02707FFF
32K
EDMA Channel Controller (TPCC) 0
0x02720000 – 0x02727FFF
32K
EDMA Channel Controller (TPCC) 1
0x02740000 – 0x02747FFF
32K
EDMA Channel Controller (TPCC) 2
0x02760000 – 0x027603FF
1K
EDMA TPCC0 Transfer Controller (TPTC) 0
0x02768000 – 0x027683FF
1K
EDMA TPCC0 Transfer Controller (TPTC) 1
0x02770000 – 0x027703FF
1K
EDMA TPCC1 Transfer Controller (TPTC) 0
0x02778000 – 0x027783FF
1K
EDMA TPCC1 Transfer Controller (TPTC) 1
0x02780000 – 0x027803FF
1K
EDMA TPCC1 Transfer Controller (TPTC) 2
0x02788000 – 0x027883FF
1K
EDMA TPCC1Transfer Controller (TPTC) 3
0x02790000 – 0x027903FF
1K
EDMA TPCC2 Transfer Controller (TPTC) 0
0x02798000 – 0x027983FF
1K
EDMA TPCC2 Transfer Controller (TPTC) 1
0x027A0000 – 0x027A03FF
1K
EDMA TPCC2 Transfer Controller (TPTC) 2
0x027A8000 – 0x027A83FF
1K
EDMA TPCC2 Transfer Controller (TPTC) 3
0x027D0000 – 0x027D3FFF
16K
TI Embedded Trace Buffer (TETB) core 0
0x027E0000 – 0x027E3FFF
16K
TI Embedded Trace Buffer (TETB) core 1
0x027F0000 – 0x027F3FFF
16K
TI Embedded Trace Buffer (TETB) core 2
0x02800000 – 0x02803FFF
16K
TI Embedded Trace Buffer (TETB) core 3
0x02810000 – 0x02813FFF
16K
TI Embedded Trace Buffer (TETB) core 4
0x02820000 – 0x02823FFF
16K
TI Embedded Trace Buffer (TETB) core 5
16
Address Range
Bytes
Memory Block Description
0x02830000 – 0x02833FFF
16K
TI Embedded Trace Buffer (TETB) core 6
0x02840000 – 0x02843FFF
16K
TI Embedded Trace Buffer (TETB) core 7
0x02850000 – 0x02857FFF
32K
TI Embedded Trace Buffer (TETB) — system
0x02900000 – 0x02907FFF
32K
Serial RapidIO (SRIO) Configuration
0x02A00000 – 0x02BFFFFF
2M
Queue Manager Subsystem Configuration
0x08000000 – 0x0800FFFF
64K
Extended Memory Controller (XMC)
0x0BC00000 – 0x0BCFFFFF
1M
Multicore Shared Memory Controller (MSMC)
Configuration
Config
0x0C000000 – 0x0C3FFFFF
4M
Multicore Shared Memory
0x10800000 – 0x1087FFFF
512K
Core0 L2 SRAM
0x10E00000 – 0x10E07FFF
32K
Core0 L1P SRAM
0x10F00000 – 0x10F07FFF
32K
Core0 L1D SRAM
0x11800000 – 0x1187FFFF
512K
Core1 L2 SRAM
0x11E00000 – 0x11E07FFF
32K
Core1 L1P SRAM
0x11F00000 – 0x11F07FFF
32K
Core1 L1D SRAM
0x12800000 – 0x1287FFFF
512K
Core2 L2 SRAM
0x12E00000 – 0x12E07FFF
32K
Core2 L1P SRAM
0x12F00000 – 0x12F07FFF
32K
Core2 L1D SRAM
0x13800000 – 0x1387FFFF
512K
Core3 L2 SRAM
0x13E00000 – 0x13E07FFF
32K
Core3 L1P SRAM
0x13F00000 – 0x13F07FFF
32K
Core3 L1D SRAM
0x14800000 – 0x1487FFFF
512K
Core4 L2 SRAM
0x14E00000 – 0x14E07FFF
32K
Core4 L1P SRAM
0x14F00000 – 0x14F07FFF
32K
Core4 L1D SRAM
0x15800000 – 0x1587FFFF
512K
Core5 L2 SRAM
0x15E00000 – 0x15E07FFF
32K
Core5 L1P SRAM
0x15F00000 – 0x15F07FF F
32K
Core5 L1D SRAM
0x16800000 – 0x1687FFFF
512K
Core6 L2 SRAM
0x16E00000 – 0x16E07FFF
32K
Core6 L1P SRAM
0x16F00000 – 0x16F07FFF
32K
Core6 L1D SRAM
0x17800000 – 0x1787FFFF
512K
Core7 L2 SRAM
0x17E00000 – 0x17E07FFF
32K
Core7 L1P SRAM
0x17F00000 – 0x17F07FFF
32K
Core7 L1D SRAM
0x20000000 – 0x200FFFFF
1M
System Trace Manager (STM) Configuration
0x 20B00000-0x 20B1FFFF
128K
Boot ROM
0x20BF0000-0x 20BF03FF
1K
SPI
0x 20C00000 – 0x 20C000FF
256
EMIF-16 Configuration
0x 21000000 – 0x 210000FF
256
DDR3 EMIF Configuration
0x21400000 – 0x214003FF
1K
HyperLink Configuration
0x21800000 – 0x21807FFF
32K
PCIe Configuration
0x21400000 – 0x214003FF
1K
HyperLink Config
0x40000000 – 0x4FFFFFFF
2M
HyperLink data
17
Address Range
Bytes
Memory Block Description
0x60000000 – 0x6FFFFFFF
256M
PCIe Data
0x70000000 – 0x73FFFFFF
64M
EMIF16 CS2 Data NAND Memory
0x74000000 – 0x77FFFFFF
64M
EMIF16 CS3 Data NAND Memory
0x78000000 – 0x7BFFFFFF
64M
EMIF16 CS4 Data NOR Memory
0x7C000000 – 0x7FFFFFFF
64M
EMIF16 CS5 Data SRAM Memory
0x80000000 – 0x8FFFFFFF
256M
DDR3_ Data
0x90000000 – 0x9FFFFFFF
256M
DDR3_ Data
0xA0000000 – 0xAFFFFFFF
256M
DDR3_ Data
0xB0000000 – 0xBFFFFFFF
256M
DDR3_ Data
0xC0000000 – 0xCFFFFFFF
256M
DDR3_ Data
0xD0000000 – 0xDFFFFFFF
256M
DDR3_ Data
0xE0000000 – 0xEFFFFFFF
256M
DDR3_ Data
0xF0000000 – 0xFFFFFFFF
256M
DDR3_ Data
2.2 EVM Boot Mode and Boot Configuration Switch Settings
The TMDXEVM6678L has five configuration DIP switches: SW3, SW4, SW5, SW6 and SW9
that contain 17 individual values latched when reset is released. This occurs when power is
applied the board, after the user presses the FULL_RESET push button or after a POR reset is
requested from the MMC.
SW3 determines general DSP configuration, Little or Big Endian mode and boot device
selection.
SW4, SW5, SW6 and SW9 determine DSP boot device configuration, CorePac PLL setting and
PCIe mode selection and enable.
More information about using these DIP switches is contained in Section 3.3 of this
document. For more information on DSP supported Boot Modes, refer to TMS320C6678
Data Manual and C66x Boot Loader User Guide.
2.3 JTAG - Emulation Overview
The TMDXEVM6678L has on-board embedded JTAG emulation circuitry; hence users do not
require any external emulator to connect EVM with Code Composer Studio. Users can
connect CCS with the target DSP on the EVM through the USB cable supplied along with this
board.
In case users wish to connect an external emulator to the EVM, the TI 60-pin JTAG header
(EMU1) is provided for high speed real-time emulation. The TI 60-pin JTAG supports all
standard TI DSP emulators. An adapter will be required for use with some emulators.
The on-board embedded JTAG emulator is the default connection to the DSP. However
when an external emulator is connected to EVM, the board circuitry switches automatically
to give emulation control to the external emulator.
18
When the on-board emulator and external emulator both are connected at the same time,
the external emulator has priority and the on-board emulator is disconnected from the DSP.
The third way of accessing the DSP is through the JTAG port on the AMC edge connector,
users can connect the DSP through the AMC backplane if they don’t use the XDS100
on-board emulator and the 60-pin header with the external emulator.
The JTAG interface among the DSP, on-board emulator, external emulator and the AMC
edge connector is shown in the below figure.
EMU_DETz
SEL
JTAG
+1.8V
JTAG
High-Speed
SWITCH
(TS3L301)
EMU_DET PIN
JTAG
+1.8V
JTAG
+1.8V
DSP
TMS320C6678
EMU1
EMU[0..1]
EMU[2..18]
Level Shifter
JTAG
+3.3V
FT2232HL_RESET#
USB-JTAG
FT2232HL
UART
+3.3V
UART
+1.8V
UART
Level Shifter
SN74AVC4T245
COM_SEL1
RS232
MAX3221EAE
High-Speed
SWITCH
(TS3L301)
AMC JTAG
+V3.3
AMC
edge connector
SEL
USB JTAG
+3.3V
USB
USB1
Console port
COM1
RS232
Figure 2.1: TMDXEVM6678L EVM JTAG emulation
2.4 Clock Domains
The EVM incorporates a variety of clocks to the TMS320C6678 as well as other devices
which are configured automatically during the power up configuration sequence. The figure
below illustrates clocking for the system in the EVM module.
19
100MHz
PCIe_CLKP/ N (AMC)
100MHz
MUX
PCIe_CLKP/N
U0
CDCE62005
U1
312.50MHz
U2
312.50MHz
U3
100MHz
PRI_REF
MCM_CLKP/N
For HyperLink
SRIO_SGMII_CL
X'TAL
12MHZ
(Y2)
FT2232HL
PA_SS_CLKP/N
U4
TMS320C6678
U0
X'TAL
U1
X'TAL
25MHZ
100MHz
25MHZ
CDCE62005
U2
66.667MHz
U3
100MHz
(Y5)
(Y3)
88E1111
DDR_CLKP/N
CORE_CLKP/N
U4
Figure 2.2: TMDXEVM6678L EVM Clock Domains
2.5 I2C Boot EEPROM / SPI NOR Flash
The I2C modules on the TMS320C6678 may be used by the DSP to control local peripheral
ICs (DACs, ADCs, etc.) or may be used to communicate with other controllers in a system or
to implement a user interface.
The I2C bus is connected to one SEEPROM and to the 80-pin expansion header (TEST_PH1).
There are two banks in the I2C SEEPROM which respond separately at addresses 0x50 and
0x51. These banks can be loaded with demonstration programs. Currently, the bank at 0x50
contains the I2C boot code and PLL initialization procedure and the bank at 0x51 contains
the second level boot-loader program. The second level boot-loader can be used to run the
POST program or launch the OOB demonstration from NOR flash memory.
The serial peripheral interconnect (SPI) module provides an interface between the DSP and
other SPI-compliant devices. The primary intent of this interface is to allow for connection to
a SPI ROM for boot. The SPI module on TMS320C6678 is supported only in Master mode.
The NOR FLASH attached to CS0z on the TMS320C6678 is a NUMONYX N25Q128A21. This
NOR FLASH size is 16MB. It can contain demonstration programs such as POST or the OOB
demonstration. The CS1z of the SPI is used by the DSP to access registers within the FPGA.
2.6 FPGA
The FPGA (Xilinx XC3S200AN) controls the reset mechanism of the DSP and provides boot
mode and boot configuration data to the DSP through SW3, SW4, SW5, SW6 and SW9. FPGA
also provides the transformation of TDM Frame Sync and Clock between AMC connector
and the DSP. The FPGA also supports 4 user LEDs and 1 user switch through control registers.
All FPGA registers are accessible over the SPI interface.
20
The figure below shows the interface between TMS320C6678 DSP and FPGA.
TMDXEVM6678L EVM
XILINX_XC3S200AN
+3.3V
MMC
MMC Detect
MMC Reset
MMC
States
UCD9222
PMBus
+3.3V
PMBus
+3.3V
Power-On
Sequences
+3.3V
Sequences
Control
Power Enable
Power Good
DSP
Boot
configuration
Clock
Generators
+1.8V
CS557 Control
TMS320C6678
Configurations
+3.3V
PCIe CLK
selection
+3.3V
PHY
Events
PHY
DSP
SPI ROM
DSP
+3.3V
FPGA
Storage
+3.3V
RESET
FULL/COLD/WARM
TRGRST
DSP Reset
Reset Events
NMI control
+1.8V
SPI
DSP SPI
SPI interface
CS1z
+1.8V
DSP
128k-bit
Buttons /
Emulator
+1.8V
RESET &
Interrupts
Control
Control
PHY Reset
PHY Interrupt
DSP GPIOs
GPIO[0..15]
TIMI0
CLOCK
SPI interface
DIP Switches
Map to DSP_GPIO[0..15] for Boot Configuration
+3.3V
MULTIPLEXER
Smart-Reflex
TI UCD9222
TDM CLK
DSP TDM
Clocks
Reference clock
Frame Sync.
LVDS
AMC TCLK
FPGA
JTAG
+3.3V
Used for TDM functions
TCLK[A/B]
TCLK[C/D]
Connector
Figure 2.3: TMDXEVM6678L EVM FPGA Connections
2.7 Gigabit Ethernet Connections
The TMDXEVM6678L provides connectivity for both SGMII Gigabit Ethernet ports on the
EVM. These are shown in figure below:
TMS320C6678
AMC
SGMII_0
(EMAC0)
Port0
Marvell
SGMII_1
(EMAC1)
MDIO
SGMII
Level-Shifter
+1.8V
+2.5V
88E1111
MDIO
RJ-45
LAN1
Figure 2.4: TMDXEVM6678L EVM Ethernet Routing
The Ethernet PHY (PHY1) is connected to DSP EMAC1 to provide a copper interface and
21
routed to a Gigabit RJ-45 connector (LAN1). The EMAC0 of DSP is routed to Port0 of the
AMC edge connector backplane interface.
2.8 Serial RapidIO (SRIO) Interface
The TMDXEVM6678L supports high speed SERDES based Serial RapidIO (SRIO) interface.
There are total 4 RapidIO ports available on TMS320C6678. All SRIO ports are routed to
AMC edge connector on board. Below figure shows RapidIO connections between the DSP
and AMC edge connector.
AMC
TMS320C6678
312.50MHz
LVDS
SRIO0
Port8
SRIO1
Port9
SRIO2
Port10
SRIO3
SRIO_SGMII_CLKP/N
Port11
Figure 2.5: TMDXEVM6678L EVM SRIO Port Connections
2.9 DDR3 External Memory Interface
The TMS20C6678 DDR3 interface connects to four 1Gbit (64Meg x 16) DDR3 1333 devices.
This configuration allows the use of both “narrow (16-bit)”, “normal (32-bit)”, and “wide
(64-bit)” modes of the DDR3 EMIF.
SAMSUNG DDR3 K4B1G1646x-HCH9 SDRAMs (64Mx16; 667Mhz) are used on the DDR3
EMIF.
The figure 2.6 illustrates the implementation for the DDR3 SDRAM memory.
22
TMS320C6678
DDR3 EMIF
X64
DDR3
SDRAM
667MHz
1G-bit
X16
Figure 2.6: TMDXEVM6678L EVM SDRAM
2.10 16-bit Asynchronous External Memory Interface (EMIF-16)
The TMS20C6678 EMIF-16 interface connects to one 512Mbit (64MB) NAND flash device
and 80-pin expansion header (TEST_PH1) on the TMDXEVM6678L EVM. The EMIF16 module
provides an interface between DSP and asynchronous external memories such as NAND and
NOR flash. For more information, see the External Memory Interface (EMIF16) for KeyStone
Devices User Guide (literature number SPRUGZ3).
NUMONYX NAND512R3A2d NAND flash (64MB) is used on the EMIF-16.
The figure 2.7 illustrates the EMIF-16 connections on the TMDXEVM6678L EVM.
TMS320C6678
EMIF-16
D0-D7
A0-A23
D0-D15
CE1z / CE2z
NAND
Flash
64MB
80-pin Expansion header
CE0z
Figure 2.7: TMDXEVM6678L EVM EMIF-16 connections
23
2.11 HyperLink Interface
The TMS320C6678 provides the HyperLink bus for companion chip/die interfaces. This is a
four lane SerDes interface designed to operate at 12.5 Gbps per lane. The interface is used
to connect with external accelerators.
The interface includes the Serial Station Management Interfaces used to send power
management and flow messages between devices. This consists of four LVCMOS inputs and
four LVCMOS outputs configured as two 2-wire output buses and two 2-wire input buses.
Each 2-wire bus includes a data signal and a clock signal.
The figure 2.8 illustrates the Hyperlink bus connections on the TMDXEVM6678L EVM.
TMS320C6678
TX port X4
HyperLink
RX port X4
PM
FL
HyperLink1
iPass+HD
Connector
Figure 2.8: TMDXEVM6678L EVM HyperLink connections
2.12 PCIe Interface
The 2 lane PCI express (PCIe) interface on TMDXEVM6678L provides a connection between
the DSP and AMC edge connector. The PCI Express interface provides low pin count, high
reliability, and high-speed data transfer at rates of 5.0 Gbps per lane on the serial links. For
more information, see the Peripheral Component Interconnect Express (PCIe) for KeyStone
Devices User Guide (literature number SPRUGS6).
The TMDXEVM6678L provides the PCIe connectivity to AMC backplane on the EVM, this is
shown in figure 2.9.
AMC
Edge
Connector
TMS320C6678
PCIe
PCIe[0:1]
One Port /
Two Lanes
Port4
Port5
Figure 2.9: TMDXEVM6678L EVM PCIE Port Connections
24
2.13 Telecom Serial Interface Port (TSIP)
The telecom serial interface port (TSIP) module provides a glueless interface to common
telecom serial data streams. For more information, see the Telecom Serial Interface Port
(TSIP) for the C66x DSP User Guide (literature number SPRUGY4).
The number of active serial links of the TSIP0 and TSIP1 is four and they are connected to
the AMC edge connector through a level shift IC to support 3.3V I/O on the TMDXEVM6678L
EVM. The serial links support up to 512 8-bit timeslots for each link. The serial data rates
supported are 8.192Mbps, 16.384Mbps or 32.768Mbps. Maximum occupation of the serial
interface links for the entire TSIP is 1024 transmit and receive timeslots in all configurations.
The figure 2.9 illustrates the TSIP0 and TSIP1 connections on the TMDXEVM6678L EVM. The
RX and TX ports on the TSIP interfaces are cross-connected to support both interleaved and
unidirectional backplane TBM buses.
TMS320C6678
+1.8V I/O
+3.3V I/O
TSIP0/1_TX3/RX1
TSIP0 /
TSIP1
TSIP0/1_TX1/RX3
TSIP0/1_TX2/RX0
TSIP0/1_TX0/RX2
Level
Shift
AMC
Edge
Connector
Figure 2.10: TMDXEVM6678L EVM TSIP connections
2.14 UART Interface
A serial port is provided for UART communication by TMS320C6678. This serial port can be
accessed either through USB connector (USB1) or through 3-pin (Tx, Rx and Gnd) serial port
header (COM1). The selection can be made through UART Route Select shunt-post
COM_SEL1 as follows:
• UART over mini-USB Connector - Shunts installed over COM_SEL1.3- COM_SEL1.1 and
COM_SEL1.4 - COM_SEL1.2 (Default)
• UART over 3-Pin Header (COM1) - Shunts installed over COM_SEL1.3- COM_SEL1.5 and
COM_SEL1.4 –COM_SEL1.6
25
TMS320C6678
USB1
COM_SEL1
USB-JTAG
FT2232HL
UART
UART
UART
+1.8V
+3.3V
RS232
MAX3221EAE
Level Shifter
SN74AVC4T245
USB
Mini-USB
Console port
RS232
COM1
Figure 2.11: TMDXEVM6678L EVM UART Connections
2.15 Module Management Controller (MMC) for IPMI
The TMDXEVM6678L supports a limited set of Intelligent Platform Management Interface
(IPMI) commands using Module Management Controller (MMC) based on Texas Instruments
MSP430F5435 mixed signal processor.
The MMC will communicate with MicroTCA Carrier Hub (MCH) over IPMB (Intelligent
Platform Management Bus) when inserted into an AMC slot of a PICMG® MTCA.0 R1.0
compliant chassis. The primary purpose of the MMC is to provide necessary information to
MCH, to enable the payload power to TMDXEVM6678L EVM when it is inserted into the
MicroTCA chassis.
The EVM also supports a Blue LED (LED2) and LED1 (LED1, RED) on the front panel as
specified in PICMG® AMC.0 R2.0 AdvancedMC base specification. Both of these LEDs will
blink as part of initialization process when the MMC will receive management power.
Blue LED (LED2):
Blue LED will turn ON when MicroTCA chassis is powered ON and an EVM is inserted into
it. The blue LED will turn OFF when payload power is enabled to the EVM by the MCH.
LED1 (LED1, RED):
Red colored LED1 will normally be OFF. It will turn ON to provide basic feedback about
failures and out of service.
26
AMC edge
Connector
MMC
MSP430F5435
+3.3V
+3.3V
+V3.3MP
GA[0..2]
MMC_DETECT#
MMC_POR_IN_AMC#
MMC_WR_AMC#
IPMB-L (I2C)
MMC_EN#
MMC_RESETSTAT#
MMC_BOOTCOMPLETE
BLUE
LED2
TMS320C6678
FPGA
XC3S200AN
DSP
Reset
Events
+1.8V
DSP_RSTSTAT#
DSP_BOOTCOMPLETE
PORz
RSTFULLz
RESETz
LRESETz
CORESEL[0..3]
NMIENz
RSTSTATEz
BOOTCOMPLETE
RED
LED1
Figure 2.12: TMDXEVM6678L EVM MMC Connections for IPMI
2.16 Expansion Header
The TMDXEVM6678L contains an 80-pin header (TEST_PH1) which has EMIF, I2C, TIMI[1:0],
TIMO[0:1], SPI, GPIO[15:0] and UART signal connections. It should be noted that EMIF, I2C,
TIMI[1:0], TIMO[0:1], and SPI GPIO[15:0] connections to this header (TEST_PH1) are of 1.8V
level whereas UART signals are of 3.3V level.
27
3. TMDXEVM6678L Board Physical Specifications
This chapter describes the physical layout of the TMDXEVM6678L board and its connectors,
switches and test points. It contains:
3.1 Board Layout
3.2 Connector Index
3.3 Switches
3.4 Test Points
3.5 System LEDs
3.1 Board Layout
The TMDXEVM6678L board dimension is 7.11” x 2.89” (180.6mm x 73.5mm). It is a 12-layer
board and powered through connector DC_IN1. Figure 3-1 and 3-2 shows assembly layout of
the TMDXEVM6678L EVM Board.
Figure 3.1: TMDXEVM6678L EVM Board Assembly Layout – TOP view
28
Figure 3.2: TMDXEVM6678L EVM Board layout – Bottom view
3.2 Connector Index
The TMDXEVM6678L Board has several connectors which provide access to various
interfaces on the board.
Table 3.1 : TMDXEVM6678L EVM Board Connectors
Connector
560V2_PWR1
AMC1
COM1
COM_SEL1
DC_IN1
EMU1
FAN1
HyperLink1
Pins
8
170
3
6
3
60
3
36
LAN1
PMBUS1
TAP_FPGA1
SBW_MMC1
12
5
10
14
TEST_PH1
80
USB1
5
Function
XDS560v2 Mezzanine Power Connector
AMC Edge Connector
UART 3-Pin Connector
UART Route Select Jumper
DC Power Input Jack Connector
TI 60-Pin DSP JTAG Connector
FAN connector for +12V DC FAN
HyperLink connector for companion chip/die
interface
Gigabit Ethernet RJ-45 Connector
PMBUS for Smart-Reflex connected to UCD9222
FPGA JTAG Connector
MSP430 Spy-Bi-Wire Connector -- For Factory Use
Only
EMIF, SPI, I2C, GPIO, TIMI[1:0], TIMO[1:0], and
UART1 connections
Mini-USB Connector
3.2.1 560V2_PWR1, XDS560v2 Mezzanine Power Connector
560V2_PWR1 is an 8-pin power connector for XDS560v2 mezzanine emulator board. The
pin out for the connector is shown in the figure below:
29
Table 3.2 : XDS560v2 Power Connector pin out
Pin #
1
2
3
4
5
6
7
8
Signal Name
+5VSupply
+5VSupply
XDS560V2_IL
Ground
+3.3VSupply
+3.3VSupply
Ground
Ground
3.2.2 AMC1, AMC Edge Connector
The AMC card edge connector plugs into an AMC compatible carrier board and provides 4
Serial RapidIO lanes, 2 PCIe lanes, 1 SGMII port, 2 4-lane TDM ports and system interfaces
to the carrier board. This connector is the 170 pin B+ style. The signals on this connector
are shown in the table below:
Table 3.3: AMC Edge Connector
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
Signal
Pin
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
GND
VCC12
MMC_PS_N1#
VCC3V3_MP_AMC
MMC_GA0
RSVD
GND
RSVD
VCC12
GND
AMC0_SGMII0_TX_DP
AMC0_SGMII0_TX_DP
GND
AMC0_SGMII0_RX_DP
AMC0_SGMII0_RX_DN
GND
MMC_GA1
VCC12
GND
NC
NC
GND
NC
NC
GND
30
Signal
GND
AMC_JTAG_TDI
AMC_JTAG_TDO
AMC_JTAG_RST#
AMC_JTAG_TMS
AMC_JTAG_TCK
GND
NC
NC
GND
NC
NC
GND
NC
NC
GND
NC
NC
GND
NC
NC
GND
NC
NC
GND
Pin
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
Signal
MMC_GA2
VCC12
GND
NC
NC
GND
NC
NC
GND
NC
NC
GND
NC
NC
GND
MMC_ENABLE_N
VCC12
GND
AMCC_P4_PCIe_TX1P
AMCC_P4_PCIe_TX1N
GND
AMCC_P4_PCIe_RX1P
AMCC_P4_PCIe_RX1N
GND
AMCC_P5_PCIe_TX2P
AMCC_P5_PCIe_TX2N
GND
AMCC_P5_PCIe_RX2P
AMCC_P5_PCIe_RX2N
GND
SMB_SCL_IPMBL
VCC12
GND
NC
NC
GND
NC
NC
GND
NC
NC
GND
NC
NC
GND
Pin
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
31
Signal
NC
NC
GND
NC
NC
GND
TDM_CLKD_P
TDM_CLKD_N
GND
TDM_CLKC_P
TDM_CLKC_N
GND
NC
NC
GND
DSP_SDA_AMC
DSP_SCL_AMC
GND
NC
NC
GND
NC
NC
GND
AMCC_P13_TDM1_TX3/RX1
AMCC_P13_TDM1_TX1/RX3
GND
AMCC_P13_TDM1_TX2/RX0
AMCC_P13_TDM1_TX0/RX2
GND
AMCC_P12_TDM0_TX3/RX1
AMCC_P12_TDM0_TX1/RX3
GND
AMCC_P12_TDM0_TX2/RX0
AMCC_P12_TDM0_TX0/RX2
GND
AMCC_P11_SRIO4_TXP
AMCC_P11_SRIO4_TXN
GND
AMCC_P11_SRIO4_RXP
AMCC_P11_SRIO4_RXN
GND
AMCC_P10_SRIO3_TXP
AMCC_P10_SRIO3_TXN
GND
Pin
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
Signal
SMB_SDA_IPMBL
VCC12
GND
TDM_CLKA_P
TDM_CLKA_N
GND
TDM_CLKB_P
TDM_CLKB_N
GND
PCIE_REF_CLK_P
PCIE_REF_CLK_N
GND
MMC_PS_N0
VCC12
GND
Pin
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
Signal
AMCC_P10_SRIO3_RXP
AMCC_P10_SRIO3_RXN
GND
AMCC_P9_SRIO2_TXP
AMCC_P9_SRIO2_TXN
GND
AMCC_P9_SRIO2_RXP
AMCC_P9_SRIO2_RXN
GND
AMCC_P8_SRIO1_TXP
AMCC_P8_SRIO1_TXN
GND
AMCC_P8_SRIO1_RXP
AMCC_P8_SRIO1_RXN
GND
3.2.3 COM1, UART3 Pin Connector
COM1 is 3-pin male connector for RS232 serial interface. A 3-Pin female to 9-Pin DTE
female cable is supplied with TMDXEVM6678L to connect with the PC.
Table 3.4: UART Connector pin out
Pin #
1
2
3
Signal Name
Receive
Transmit
Ground
3.2.4 COM_SEL1, UART Route Select Connector
UART port can be accessed either through Mini-USB connector (USB1) or through 3-pin
RS232 Serial port header (COM1). The selection can be made through UART route select
connector COM_SEL1 as follows:
• UART over USB Connector (Default): Shunts installed over COM_SEL1.3-COM_SEL1.1
and COM_SEL1.4-COM_SEL1.2
• UART over 3-Pin Header LAN1-Shunts installed over COM_SEL1.3-COM_SEL1.5 and
COM_SEL1.4-COM_SEL1.6
The pin out for the connector is shown in the table and figure below:
32
Table 3.5: UART Path Select Connector pin out
Pin #
1
3
5
Signal Name
FT2232H (USB Chip)
Transmit
UART Transmit
MAX3221 Transmit
Pin #
Signal Name
FT2232H (USB Chip)
Receive
UART Receive
MAX3221 Receive
2
4
6
Figure 3.3: COM_SEL1 Jumper setting
Wire pin1-3 and pin2-4
UART over the XDS100v1
6
4
2
Wire pin3-5 and pin4-6
UART over the 3-pin terminal
5
3
1
6
4
2
5
3
1
PCB edge
3.2.5 DC_IN1, DC Power Input Jack Connector
DC_IN1 is a DC Power-in Jack Connector for the stand-alone application of
TMDXEVM6678L. It is a 2.5mm power jack with positive center tip polarity. Do not use
this connector if EVM is inserted into MicroTCA chassis or AMC carrier backplane.
3.2.6 EMU1, TI 60-Pin DSP JTAG Connector
EMU1 is a high speed system trace capable TI 60-pin JTAG connector for XDS560v2 type
of DSP emulation. The on board switch multiplexes this interface with the on-board
XDS100 type emulator. Whenever an external emulator is plugged into EMU1, the
external emulator connection will be switched to the DSP. The I/O voltage level on these
pins is 1.8V. So any 1.8 V level compatible emulator can be used to interface with the
TMS320C6678 DSP. It should be noted that when an external emulator is plugged into
this connector (EMU1), on board XDS100 type emulation circuitry will be disconnected
from the DSP. The pin out for the connector is shown in figure below:
33
Table 3.6: DSP JTAG Connector pin out
Pin #
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
Signal Name
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Type0 (NC)
Ground
Ground
Ground
Ground
Ground
Ground
TRGRST#
ID0 (GND)
TMS
EMU17
TDI
EMU14
EMU12
TDO
TVD (+1.8V)
EMU9
EMU7
EMU5
TCLK
EMU2
EMU0
ID1 (GND)
Pin #
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
Signal Name
ID2 (GND)
EMU18
TRST#
EMU16
EMU15
EMU13
EMU11
TCLKRTN
EMU10
EMU8
EMU6
EMU4
EMU3
EMU1
ID3 (GND)
NC
Ground
Ground
Ground
Ground
Ground
Ground
Type1 (GND)
Ground
Ground
Ground
Ground
Ground
Ground
Ground
3.2.7 FAN1, FAN Connector
The EVM incorporates a dedicated cooling fan. This fan has the capability of easily being
removed when the EVM is inserted into an AMC backplane which uses forced air cooling.
The fan selected provides maximum cooling (CFM) and operates on 12Vdc. FAN1 will be
connected to provide 12Vdc to the fan.
Table 3.7 : FAN1 Connector pin out
Pin #
1
2
3
Signal Name
GNG
+12Vdc
NC
34
3.2.8 HyperLink1, HyperLink Connector
The EVM provides a HyperLink connection by a mini-SAS HD+ 4i connector. The connector
contains 8 SERDES pairs and 4 sideband sets to carry full HyperLink signals. The connector
is shown in Figure 3.3. and its pin out is shown in Table 3.8. This connector is the Molex
iPass+HD connector 76867-0011. The Molex cable 1110670200 can be used to connect
two EVMs together.
D1
C1
B1
A1
Figure 3.4 : The HyperLink Connector
Pin#
A1
A2
A3
A4
A5
A6
A7
A8
A9
C1
C2
C3
C4
C5
C6
C7
C8
C9
Net
Pin#
B1
B2
B3
B4
B5
B6
B7
B8
B9
D1
D2
D3
D4
D5
D6
D7
D8
D9
HyperLink_TXFLCLK
HyperLink_RXFLCLK
GND
HyperLink_RXP1
HyperLink_RXN1
GND
HyperLink_RXP3
HyperLink_RXN3
GND
HyperLink_TXPMDAT
HyperLink_TXPMCLK
GND
HyperLink_TXP1
HyperLink_TXN1
GND
HyperLink_TXP3
HyperLink_TXN3
GND
Net
HyperLink_RXPMDAT
HyperLink_TXFLDAT
GND
HyperLink_RXP0
HyperLink_RXN0
GND
HyperLink_RXP2
HyperLink_RXN2
GND
HyperLink_RXPMCLK
HyperLink_RXFLDAT
GND
HyperLink_TXP0
HyperLink_TXN0
GND
HyperLink_TXP2
HyperLink_TXN2
GND
Table 3.8 : The HyperLink Connector
3.2.9 LAN1, Ethernet Connector
LAN1 is a Gigabit RJ45 Ethernet connector with integrated magnetics. It is driven by
Marvell Gigabit Ethernet transceiver 88E1111. The connections are shown in the table
35
below:
Table 3.9 : Ethernet Connector pin out
Pin #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
H3
H4
Signal Name
Center Tap2
MD2MD2+
MD1MD1+
Center Tap1
Center Tap3
MD3+
MD3MD0MD0+
Center Tap0
ACT_LED1ACT_LED1+
LINK1000_LED2LINK_LED2+
LINK100_LED2Shield 1
Shield 2
3.2.10 PMBUS1, PMBUS Connector for Smart-Reflex Control
The TMS320C6678 DSP core power is supplied by a Smart-Reflex power controller
UCD9222 with the Integrated FET Driver UCD7242. PMBUS1 provides a connection
between UCD9222 and remote connection during development. Through the USB to GPIO
pod provided by TI, the user can trace and configure the parameters in UCD9222 with the
Smart-Fusion GUI. The pin out of PMBUS1 is shown in table 3.10.
Table 3.10 : PMBUS1 pin out
Pin #
1
2
3
4
5
Signal Name
PMBUS_CLK
PMBUS_DAT
PMBUS_ALT
PMBUS_CTL
GND
3.2.11 TAP_FPGA1, FPGA JTAG Connector (For Factory Use Only)
TAP_FPGA1 is an 8-pin JTAG connector for the FPGA programming and the PHY boundary
36
test of the factory only. The pin out for the connector is shown in the figure below:
Table 3.11 : FPGA JTAG Connector pin out
Pin #
1
2
3
4
5
6
7
8
Signal Name
VCC3V3_FPGA
GND
BSC_JTAG_TCK
BSC_JTAG_TDI
BSC_JTAG_TDO
BSC_JTAG_TMS
BSC_JTAG_RST#
NC
The diagram of the boundary scan route is shown in Figure 3.4.
TAP_FPGA1
TDO
Boundary Scan
Diagram
TDI
TMS/TCK/TRSTn
TDI
TDI
TDO
TDO
Gigabit PHY
(88E1111)
JTAG
FPGA
XC3S200AN
JTAG
Figure 3.5 : TAP_FPGA1 function diagram
3.2.12 SBW_MMC1, MSP430 SpyBiWire Connector (For Factory Use Only)
SBW_MMC1 is a 4-pin SpyBiWire connector for IPMI software loading into MSP430. The
TMDXEVM6678L are supplied with IPMI software already loaded into MSP430. The pin out
for the connector is shown in the figure below:
37
Table 3.12 : MSP430 JTAG Connector pin out
Pin #
1
2
3
4
Signal Name
GND
VCC3V3_MP
MMC_SBWTDIO
MMC_SBWTCK
3.2.13 TEST_PH1, Expansion Header (EMIF-16, SPI, GPIO, Timer I/O, I2C, and UART)
TEST_PH1 is an expansion header for several interfaces on the DSP. They are 16-bit EMIF,
SPI, GPIO, Timer, I2C, and UART. The signal connections to the test header are as shown
in a table below:
Table 3.13 : Expansion Header pin out
Pin
Signal
Description
1
GND
Ground
3
DSP_SDA
5
Pin
Signal
Description
2
DSP_EMIFA00
EMIF addr0
DSP I2C data
4
DSP_EMIFA01
EMIF addr1
DSP_SCL
DSP I2C clock
6
DSP_EMIFA02
EMIF addr2
7
DSP_EMIFD0
EMIF data0
8
DSP_EMIFA03
EMIF addr3
9
DSP_EMIFD1
EMIF data1
10
DSP_EMIFA04
EMIF addr4
11
DSP_EMIFD2
EMIF data2
12
DSP_EMIFA05
EMIF addr5
13
DSP_EMIFD3
EMIF data3
14
DSP_EMIFA06
EMIF addr6
15
DSP_EMIFD4
EMIF data4
16
DSP_EMIFA07
EMIF addr7
17
DSP_EMIFD5
EMIF data5
18
DSP_EMIFA08
EMIF addr8
19
DSP_EMIFD6
EMIF data6
20
DSP_EMIFA09
EMIF addr9
21
DSP_EMIFD7
EMIF data7
22
DSP_EMIFA10
EMIF addr10
23
DSP_EMIFD8
EMIF data8
24
DSP_EMIFA11
EMIF addr11
25
DSP_EMIFD9
EMIF data9
26
DSP_EMIFA12
EMIF addr12
27
DSP_EMIFD10
EMIF data10
28
DSP_EMIFA13
EMIF addr13
29
DSP_EMIFD11
EMIF data11
30
DSP_EMIFA14
EMIF addr14
31
DSP_EMIFD12
EMIF data12
32
DSP_EMIFA15
EMIF addr15
33
DSP_EMIFD13
EMIF data13
34
DSP_EMIFA16
EMIF addr16
35
DSP_EMIFD14
EMIF data14
36
DSP_EMIFA17
EMIF addr17
37
DSP_EMIFD15
EMIF data15
38
DSP_EMIFA18
EMIF addr18
38
Pin
Signal
Description
Pin
Signal
Description
39
DSP_EMIFCE1z
EMIF Space Enable1
40
DSP_EMIFA19
EMIF addr19
41
DSP_EMIFCE2z
EMIF Space Enable2
42
DSP_EMIFA20
EMIF addr20
43
DSP_EMIFBE0z
EMIF Byte Enable0
44
DSP_EMIFA21
EMIF addr21
45
DSP_EMIFBE1z
EMIF Byte Enable1
46
DSP_EMIFA22
EMIF addr22
47
DSP_EMIFOEz
EMIF Output Enable
48
DSP_EMIFA23
EMIF addr23
49
DSP_EMIFWEz
EMIF Write Enable
50
DSP_GPIO_00
DSP GPIO0
51
DSP_EMIFRNW
EMIF Read/Write
52
DSP_GPIO_01
DSP GPIO1
53
DSP_EMIFWAIT1
EMIF Wait
54
DSP_GPIO_02
DSP GPIO2
55
DSP_TIMI0
Timer input 0
56
DSP_GPIO_03
DSP GPIO3
57
DSP_TIMO0
Timer output 0
58
DSP_GPIO_04
DSP GPIO4
59
DSP_TIMI1
Timer input 1
60
DSP_GPIO_05
DSP GPIO5
61
DSP_TIMO1
Timer output 1
62
DSP_GPIO_06
DSP GPIO6
63
DSP_SSPMISO
SPI data input
64
DSP_GPIO_07
DSP GPIO7
65
DSP_SSPMOSI
SPI data output
66
DSP_GPIO_08
DSP GPIO8
67
DSP_SSPCS1
SPI chip select
68
DSP_GPIO_09
DSP GPIO9
69
PH_SSPCK
SPI clock
70
DSP_GPIO_10
DSP GPIO10
71
DSP_UARTTXD
UART Serial Data Out
(+3.3v)
72
DSP_GPIO_11
DSP GPIO11
73
DSP_UARTRXD
UART Serial Data In
(+3.3v)
74
DSP_GPIO_12
DSP GPIO12
75
DSP_UARTRTS
UART Request To
Send (+3.3v)
76
DSP_GPIO_13
DSP GPIO13
77
DSP_UARTCTS
UART Cear To Send
(+3.3v)
78
DSP_GPIO_14
DSP GPIO14
79
GND
Ground
80
DSP_GPIO_15
DSP GPIO15
3.2.14 USB1, Mini-USB Connector
USB1 is a 5-pin Mini-USB connector to connect Code Composer Studio with
TMS320C6678 DSP using XDS100 type on-board emulation circuitry. Below table shows
the pin outs of the Mini-USB connector.
39
Table 3.14 : Mini-USB Connector pin out
Pin #
1
2
3
4
5
Signal Name
VBUS
USB DUSB D+
ID (NC)
Ground
3.3 DIP and Pushbutton Switches
The TMDXEVM6678L has 3 push button switches and five sliding actuator DIP switches. The
RST_FULL1, RST_COLD1, and RST_WARM1 are push button switches while SW3, SW4, SW5,
SW6 and SW9 are DIP switches. The function of each of the switches is listed in the table
below:
Table 3.15 : TMDXEVM6678L EVM Board Switches
Switch
RST_FULL1
RST_COLD1
RST_WARM1
SW3
SW4
SW5
SW6
SW9
Function
Full Reset Event
Cold Reset Event (RFU)
Warm Reset Event
DSP Boot mode, DSP Configuration
DSP boot Configuration
DSP boot Configuration
DSP boot Configuration, PLL
setting, PCIe mode Selection
PCIe Enable/Disable, User Switch
3.3.1 RST_FULL1, Full Reset
Pressing the RST_FULL1 button switch will issue a RESETFULL# to TMS320C6678 by the
FPGA. It’ll reset DSP and other peripherals.
3.3.2 RST_COLD1, Cold Reset
The button is reserved for future use.
3.3.3 RST_WARM1, Warm Reset
Pressing the RST_WARM1 button switch will issue a RESET# to TMS320C6678 by the FPGA.
The FPGA will assert the RESET# signal to the DSP and the DSP will execute either a HARD
or SOFT reset by the configuration in the RSCFG register in PLLCTL.
Note: Users may refer to the TMS320C6678 Data Manual to check the difference between
assertion of DSP RESET# and the other reset signals.
3.3.4 SW3, SW4, SW5, and SW6, DSP boot mode and Configuration
SW3, SW4, SW5, and SW6 are 4-position DIP switches, which are used for DSP ENDIAN,
40
Boot Device, Boot Configuration, and PCI Express subsystem configuration.
For the details about the DSP Boot modes and their configuration, please refer to the
TMS320C6678 Data Manual.
The diagram of the default setting on these switches is shown below:
OFF (0x1b)
Logic High
SW6
4 3 2 1
ON (0x0b)
Logic Low
ON
SW5
4 3 2 1
SW4
4 3 2 1
SW3
4 3 2 1
ON
ON
ON
ENDIAN
Boot device [2:0]
Device configuration bit [12:3]
PCIESSMODE
[1:0]
0 0 0 0
1 0 0 0
0 0 0 0
1 0 1 1
Figure 3.6 : SW3, SW4, SW5, and SW6 default settings
The following table describes the positions and corresponding functions on SW1.
Table 3.16 : SW3-SW6, DSP Configuration Switch
Switch
Description
Default Value
(HUA Demo)
SW3[1]
LENDIAN
1 (OFF)
SW3[4:2]
Boot Device /
101b
Boot Mode
[2:0]
(OFF,ON,OFF)
Parameter
Index [4:0] /
00000b
SW5[1]
SW4[4:1]
Boot Mode
[7:3]
(ON,ON,ON,
ON,ON)
41
Function
Device Endian mode (LENDIAN).
0 = Device operates in big Endian mode
1 = Device operates in little Endian
mode
Boot Device
000b = EMIF16 and Emulation Boot
001b = Serial Rapid I/O
010b = SGMII (PASSCLK rate same as
CORECLK rate)
011b = SGMII (PASSCLK rate same as
SGMIICLK rate)
100b = PCI Express
101b = I2C
110b = SPI
111b = HyperLink
These 5 bits are the Parameter Index
when I2C is the boot device. They have
other definitions for other boot
devices. For the details about the
device configuration, please refer to
the chapter 2.5.2 in TMS320C6678
Data Manual.
SW5[2]
Mode /
Boot Mode
[8]
0 (ON)
Mode (I2C Boot Device)
0 = Master
1 = Slave
SW5[3]
Reserved /
Boot Mode
[9]
0 (ON)
Bit reserved with I2C Boot Device
SW5[4]
Address /
Boot Mode
[10]
1 (OFF)
Address (I2C Boot Device)
0 = Boot from address 0x50
1 = Boot from address 0x51
SW6[1]
Speed /
Boot Mode
[11]
0 (ON)
Speed (I2C Boot Device)
0 = Low speed
1 = High Speed
SW6[2]
Reserved /
Boot Mode
[12]
0 (ON)
Bit reserved with I2C Boot Device
SW6[4:3]
PCIESSMODE
[1:0]
00b
PCIe Subsystem mode selection.
00b = PCIe in end point mode
01b = PCIe legacy end point (no
support for MSI)
10b = PCIe in root complex mode
11b = Reserved
(ON,ON)
3.3.4 SW9, DSP PCIESS Enable and User Defined Switch Configuration
SW9 is a 2-position DIP switch. The first position is used for enabling the PCI Express
Subsystem within the DSP. The second position is undefined by hardware and available for
application software use. A diagram of the SW9 switch (with factory default settings) is
shown below:
ON (0x0b)
Logic Low
ON
1 2
SW9
OFF (0x1b)
Logic High
Figure 3.7 : SW9 default settings
The following table describes the positions and corresponding functions on SW9.
42
Table 3.17: SW9, DSP PCI Express Enable and User Switch
SW9
Description
Default Value
SW9[1]
PCIESSEN
0b (ON)
SW9[2]
User Switch
0b (ON)
Function
PCIe module enable.
0 = PCIe module disabled
1 = PCIe module enabled
Application software
defined
3.4 Test Points
The TMDXEVM6678L EVM Board has 26 test points. The position of each test point is
shown in the figures below:
TP13 / TP14
TP10
TP4
TP29
TP16
TP19
TP28
TP18
TP20
TP11
TP22
TP26
6
TP25
TP27
TP21
TP24
Figure 3.8 : TMDXEVM6678L test points on top side
TP17
TP8 / TP9 / TP7
TP12
TP5
TP6
TP15
Figure 3.9 : TMDXEVM6678L test points on the bottom side
43
TP30
Table 3.18 : TMDXEVM6678L EVM Board Test Points
Test Point
TP7
TP8
TP9
TP5
TP6
TP12
TP10
TP11
TP4
TP13
TP14
TP15
TP16
TP17
TP18
TP19
TP20
TP21
TP22
TP24
TP25
TP26
TP27
TP28
TP29
TP30
Signal
Reserved for MMC1 pin23
Reserved for MMC1 pin33
Reserved for MMC1 pin25
HyperLink_REFCLKOUTP
HyperLink_REFCLKOUTN
DSP_SYSCLKOUT
Reserved for U9 (FT2232) pin60 (PWREN#)
Reserved for U9 (FT2232) pin36 (SUSPEND#)
PHY1 (88E1111) 125MHz clock (default: disable)
Reserved for FPGA1 (XC3S200AN) pin A13 (+1.8V I/O).
Reserved for FPGA1 (XC3S200AN) pin A14 (+1.8V I/O).
Reserved for FPGA1 (XC3S200AN) pin M14 (+3.3V I/O).
Reserved for FPGA1 (XC3S200AN) pin L16 (+3.3V I/O).
Reserved for MMC1 pin43
Test point for CVDD
Test point for VCC1V0
Test point for VCC2V5
Test point for VCC1V8
Test point for VCC1V8_AUX
Test point for VCC0V75
Test point for VCC5
Test point for VCC3V3_AUX
Test point for VCC1V5
Test point for VCC1V2
Test point for TI_CDCE62005RGZT pin13(AUXOUT)
Test point for VCC12
3.5 System LEDs
The TMDXEVM6678L board has seven LEDs. Their positions on the board are indicated in
figure 3.7. The description of each LED is listed in table below:
Table 3.19 : TMDXEVM6678LTEEVM Board LEDs
LED#
D1
D2
SYSPG_D1
FPGA_D1FPGA_D4
Color
Red
Blue
Green
Description
Failure and Out of service status in AMC chassis
Hot Swap status in AMC chassis
All Power rails are stable on AMC
Blue
Debug LEDs.
44
FPGA_D1-D4
SYSPG_D1
D1
D2
Figure 3.10 : TMDXEVM6678L EVM Board LEDs
45
4. System Power Requirements
This chapter describes the power design of the TMDXEVM6678L board. It contains:
4.1 Power Requirements
4.2 Power Supply Distribution
4.3 Power Supply Boot Sequence
4.1 Power Requirements
Note that the power estimates stated in this section are maximum limits used in the design
of the EVM. They have margin added to allow the EVM to support early silicon samples that
normally have higher power consumption than eventual production units.
The maximum EVM power requirements are estimated to be:
• EVM FPGA – 0.65W;
• DSP Cooling Fans – 1.2W (+12Vdc/0.1A);
• Clock Generators & clock sources – 3.30W;
• DSP – 14.90W;[worse case]
Core supplies: 13.0W;
Peripheral supplies: 1.90W;
• DDR3 – 2.63W;
5 SDRAMs to support 64-bit with ECC of the DSP
• Misc – 0.33W;
• USB – 0.84W;
• SGMII PHY – 1.14W;
EVM board total: 31.2W;
The selected AC/DC 12V adapter should be rated for a minimum of 36 Watts.
46
The power planes in TMDXEVM6678L are identified in the following table:
Device
Input
Management
TMS320C6678
DDR3 Memory
NAND Flash
NOR Flash (SPI)
CDCE62005
PHY (88E111)
USB Emulator
MMC (MPS430)
FPGA
Misc. Logic
Net name
3.3V_MP_AMC
VCC12
VCC3V3_AUX
Voltage
+3.3V
+12V
+3.3V
VCC1V2
+1.2V
VCC1V8_AUX
+1.8V
CVDD
VCC1V0
VCC1V8
VCC1V5
VCC1V5
VCC0V75
VCC1V8
VCC1V8
VCC3V3_AUX
VCC2V5
VCC1V2
VCC3V3_AUX
VCC1V8_AUX
VCC3V3_MP
VCC1V2
VCC3V3_AUX
VCC1V8_AUX
VCC3V3_AUX
VCC1V8_AUX
+0.9V~1.05V
+1.0V
+1.8V
+1.5V
+1.5V
+0.75V
+1.8V
+1.8V
+3.3V
+2.5V
+1.2V
+3.3V
+1.8V
+3.3V
+1.2V
+3.3V
+1.8V
+3.3V
+1.8V
Description
Management Power for MMC
Payload Power to AMC
3.3V Power Rail for all support
devices on EVM
1.2V Power Rail for all support
devices on EVM
1.8V Power Rail for all support
devices on EVM
DSP Core Power
DSP Fixed Core Power
DSP I/O power
DSP DDR3 and SERDES Power
DDR3 RAM Power
DDR3 RAM Termination Power
NAND Flash Power
SPI NOR Flash Power
Clock Gen Power
PHY Analog and I/O Power
PHY Core Power (instead of 1.0V)
USB Emulation Power (FT2232H)
USB Emulation Power (FT2232H)
MMC Power
FPGA Core Power
FPGA I/O Power for +3.3V bank
FPGA I/O Power for +1.8V bank
Translator and Logic Power
Translator and Logic Power
Table 4.1: EVM Voltage Table
47
The following table identifies the expected power requirements for each power plane of the
devices on the TMDXEVM6678L EVM.
TMS320C6678
CVDD
VCC1V0
VCC1V8
VCC1V5
DDR3
VCC1V5
VCC0V75
FPGA
VCC3V3_AUX
VCC1V2
VCC1V8_AUX
XDS560V2
VCC5
VCC3V3_AUX
CDCE62005
VCC3V3_AUX
PHY (88E1111)
VCC2V5_AUX
VCC1V2_AUX
FT2232
VCC3V3_AUX
VCC1V8_AUX
MMC (MSP430)
VCC3V3_MP
V(V)
1.00
1.00
1.80
1.50
V(V)
1.50
0.75
V(V)
3.30
1.20
1.80
V(V)
5.00
3.30
V(V)
3.30
V(V)
3.30
1.80
V(V)
3.30
1.80
V(V)
3.30
I(A)
8.00
5.00
0.33
0.85
I(A)
0.30
0.10
I(A)
0.03
0.13
0.20
I(A)
1.00
0.30
I(A)
0.50
I(A)
0.21
0.25
I(A)
0.21
0.08
I(A)
0.02
Qty
1
1
1
1
Qty
5
5
Qty
1
1
1
Qty
1
1
Qty
2
Qty
1
1
Qty
1
1
Qty
1
Pd (W)
8.00
5.00
14.87
0.59
1.28
Pd(W)
2.25
2.63
0.38
Pd(W)
0.10
0.62
0.16
0.36
Pd(W)
5.00
5.99
0.99
Pd(W)
3.30
3.30
Pd(W)
0.69
1.14
0.45
Pd(W)
0.69
0.84
0.14
Pd(W)
0.07
0.07
Table 4.2: Each Current Requirements on each device of EVM board
4.2 The Power Supply Distribution
A high-level block diagram of the power supplies is shown in Figure 4.1. It is also shown on
the schematic.
In Figure 4.1, the Auxiliary power rails are always on after payload power is supplied. These
regulators support all control, sequencing, and boot logic. The Auxiliary Power rails contain:
• VCC3V3_AUX
• VCC1V8_AUX
• VCC1V2
• VCC5_AUX
The maximum allowable power is 36W from the external AC brick supply or from the 8 AMC
header pins.
48
3.3V_MP
AMC
Gold
Finger
165uA
VCC3V3_MP_AMC @ 165uA
Efficiency=80%
VCC12
3.04A
1.4A
PM_BUS
UCD9222_ENA
[ 1..2]
DC
Jack
Smart-Reflex
Dual
Power Driver
CVDD @ 8A
UCD9222
UCD7242
VCC1V0 @ 5A
Efficiency=90%
0.79A
TPS54620
2.585A
VCC3V3_AUX @1.2A
TPS73701DCQ
VCC1V2 @0.375A
TPS73701DCQ
VCC1V8_AUX @0.3A
TPS73701DCQ
VCC1V8 @0.5A
VCC1V8_EN1
TPS73701DCQ
Efficiency=90%
0.33A
TPS54622
2.35A
VCC1V5 @2.1A
VCC1V5_EN
TPS51200
(3.3 Control)
Efficiency=80%
0.52A
VCC2V5 @0.21A
VCC2V5_EN
VCC0V75 @0.25A
VCC0V75_EN
VCC5 @1A
TPS54231
VCC_5V_EN
Figure 4.1: All the AMC power supply on TMDXEVM6678L EVM
Individual control for each (remaining) voltage regulator is provided to allow flexibility in
how the power planes are sequenced (Refer to section 4.3 for specific details). The goal of
all power supply designs is to support the ambient temperature range of 0°C to 45°C.
The TMS320C6678 core power is supplied using a dual digital controller coupled to a high
performance FET driver IC. Additional DSP supply voltages are provided by discrete TI Swift
power supplies. The TMS320C6678 supports a VID interface to enable Smart-Reflex® power
supply control for its primary core logic supply. Refer to the TMS320C6678 Data Manual and
other documentation for an explanation of the Smart-Reflex® control.
Figure 4.1 shows that the EVM power supplies are a combination of switching supplies and
linear supplies. The linear supplies are used to save space for small loads. The switching
supplies are implemented for larger loads. The switching supplies are listed below followed
by explanations of critical component selection:
CVDD (AVS core power for TMS320C6678)
VCC1V0 (1.0V fixed core power for TMS320C6678)
VCC3V3_AUX (3.3V power for peripherals)
VCC1V5 (1.5V DDR3 power for TMS320C6678 and DDR3 memories)
49
VCC5 (5.0V power for the XDS520V2 mezzanine card)
The CVDD and VCC1V0 power rails are regulated by TI Smart-Reflex controller UCD9222 and
the dual synchronous-buck power driver UCD7242 to supply DSP AVS core and CVDD1 core
power.
The VCC3V3_AUX and VCC1V5 power rails are regulated by two TI 6A Synchronous Step
Down SWIFT™ Converters, TPS54620, to supply the peripherals and other power sources
and the DSP DDR3 EMIF and DDR3 memory chips respectively.
The VCC5 power rail is regulated by TI 2A Step Down SWIFT™ DC/DC Converter, TPS54231,
to supply the power of the XDS560V2 mezzanine card on TMDXEVM6678L.
The high level diagrams and output components are shown in figure 4.2, figure 4.3, figure
4.4, and figure 4.5 as well as choosing the proper inductors and buck capacitors.
CVDD
L
0.47uH
VID pins
fr. DSP
CAP
6.3V
330uFx3
PWM1
CAP
220uFx2
4V
CAP
47uFx2
6.3V
PGND1
UCD9222
Fixed
UCD7242
VCC1V0
L
0.47uH
CAP
330uFx3
6.3V
PWM2
CAP
220uFx2
4V
CAP
47uFx2
6.3V
PGND2
Figure 4.2: The CVDD and VCC1V0 (CVDD1) power design on TMDXEVM6678L EVM
TI
TPS54620RGY
L
3.3uH
VCC3V3_AU X
6A
CAP
100uF
6.3V
(Over all tolerance is 5% ,DC tolerance is 2.5% ) (KIND=0.3)
Output capacitor Calculation
Cout>(2*delta(Iout))/(Fsw*delta(Vout))
Cout>(2*3)/(840kHz*0.0825)
Cout>(6)/(69300)
Cout>87uF
Reference Capacitor=100uF
Inductor Calculation
L = ((Vin(max) - Vout)/Iout * Kind)) * (Vout/(Vin(max) * Fsw))
L = ((12 - 3.3)/3 * Kind) * (3.3 / (12 * 840kHz))
L = ((8.7/3 * 0.3) * (3.3 / (10.08M))
L = (9.67) * (0.33u)
L = ~3.2uH
Reference Inductor 3.3uH
Figure 4.3: The VCC3_AUX power design on TMDXEVM6678L EVM
50
TI
TPS54620RGY
VCC1V5
L
3.3uH
6A
CAP
100uFx2
6.3V
(Over all tolerance is 5% ,DC tolerance is 2.5% )
Output capacitor Calculation
Cout=(2*delta(Iout))/(Fsw*delta(Vout))
Cout=(2*2.5)/(840kHz*0.0375)
Cout=(5)/(31500)
Cout=159uF
Reference Capacitor=100uF*2=200uF
Inductor Calculation (KIND=0.3)
L = ((Vin(max) - Vout)/Iout * Kind)) * (Vout/(Vin(max) *
L = ((12 - 1.5)/2.5 * Kind) * (1.5 / (12*840kHz))
L = ((10.5/2.5 * 0.3) * (1.5 / (10.08M))
L = (10.51.1/0.75) * (0.1488M)
L = 2.08uH
Reference Inductor 3.3uH
Figure 4.4: The VCC1V5 power design on TMDXEVM6678L EVM
L
22uH
TI
TPS54231D
2
1
D
B340A
3A
Output capacitor Calculation
Cout=1/( 2 * 3.14 * 5 * 25K)
Cout=1.3 uf
Reference Capacitor=100uF
VCC5
2.8A
CAP
100uF
6.3V
Inductor Calculation
(KIND=0.3)
L = ((Vin(max) - Vout)/Iout * Kind)) * (Vout/(Vin(max) * Fsw))
L = ((12.6 - 5)/1 * Kind) * (5 / (12.7 * 570K))
L = ((7.6/ 0.3) * (5 / (7239K))
L = (25.3) * (0.69M)
L = 17.5uH
Reference Inductor 22uH
Figure 4.5: The VCC5 power design on TMDXEVM6678L EVM
4.3 The Power Supply Boot Sequence
Specific power supply and clock timing sequences are identified below. The TMS320C6678
DSP requires specific power up and power down sequencing. Figure 4.2 and Figure 4.3
illustrate the proper boot up and down sequence. Table 4.3 provides specific timing details
for Figure 4.6 and Figure 4.7.
Refer to the TMS320C6678 DSP Data Manual for confirmation of specific sequencing and
timing requirements.
51
Step
Power rails
Timing
Descriptions
Power-Up
1
VCC12 (AMC Payload power),
VCC3V3_AUX,
VCC1V8_AUX
VCC1V2
VCC5
Auto
When the 12V power is supplied
to the TMDXEVM6678L, the 3.3V,
1.8V and 1.2V supplies to the
FPGA power will turn on. FPGA
outputs to the DSP will be locked
(held at ground)..
2
VCC5,
VCC2V5
10mS
Turn on VCC5 and VCC2V5 after
VCC3V3 stable for 10mS.
3
CVDD (DSP AVS core power)
5mS
Enable the CVDD and VCC1V0,
the UCD9222 power rail#1 is for
CVDD and go first after both of
VCC5 and VCC2V5 are stable for
5mS.
VCC1V0 (DSP CVDD1 fixed core
5mS
Turn on VCC1V0, the UCD222
power rail#2. The VCC1V0 will
start the regulating power rail
after enable it after 5mS, the
start-delay time is set by the
UCD9222 configuration file.
4
power)
5
VCC1V8 (DSP IO power)
5mS
Turn on VCC1V8 after VCC1V0
stable for 5mS.
6
CDCE62005#2/#3 initiations
FPGA 1.8V outputs
5mS
Unlock the 1.8V outputs and
initiate the CDCE62005s after
VCC1V8 stable for 5mS.
De-asserted CDCE62005 power down
pins (PD#), initial the CDCE62005s.
7
VCC1V5 (DSP DDR3 power)
5mS
Turn on VCC1V5 after initiation
of the CDCE62005s for 5mS.
8
VCC0V75
5mS
Turn on VCC0V75 after VCC1V5
stable for 5mS.
When VCC1V5 is valid, FPGA will
de-assert the power down pin on
the ICS557-08, the PCIE clock
multiplexor.
When the VCC0V75 is valid, FPGA
will enable the ICS557-08 clock
outputs by the OE# pin on it.
52
9
RESETz
Other reset and NMI pins
5mS
De-asserted RESETz and unlock
other reset and NMI pins for the
DSP after VCC0V75 stable and
CDCE62005 PLLs locked for 5mS.
In the meanwhile, the FPGA will
driving the boot configurations to
the DSP GPIO pins.
10
PORz
5mS
De-asserted PORz after RESETz
de-asserted for 5mS.
11
RESETFULLz
5mS
De-asserted RESETFULLz after
PORz de-asserted for 5mS.
12
DSP GPIO pins for boot
configurations
1mS
Release the DSP GPIO pins after
RESETFULLz de-asserted for 1mS
Power-Down
13
RESETFULLz
PORz
0mS
If there is any power failure
events or the AMC payload
power off, the FPGA will assert
the RESETFULLz and PORz signals
to the DSP.
14
FPGA 1.8V outputs
CDCE62005 PD# pins
5mS
Locked 1.8V output pins on the
FPGA and pull the CDCE62005
PD# pins to low to disable DSP
clocks.
15
CVDD
VCC1V0
VCC1V8
VCC1V5
VCC0V75
VCC2V5
ICS557-08 PD# and OE#
0mS
Turn off all main power rails.
Table 4.3: The power-up and down timing on the TMDXEVM6678L
53
VCC3V3_MP_AMC
S0
S1
S2 Other
S3
S4
S5
S6
S7
S8
S9
S10
S11
S12
S13
S14
S15
S16
S17
S18
VCC3V3_MP
MMC
VCC12
XC3S200AN
FT2232H
XC3S200AN
XC3S200AN
88E1111
TMS320C6678
TMS320C6678
VCC3V3_AUX_PGOOD
VCC3V3_AUX
VCC1V8_AUX
VCC1V2
PMBUS &
UCD9222_ENA1
UCD9222_PG1
CVDD
UCD9222_VID2 &
UCD9222_ENA2
UCD9222_PG2 / PGUCD9222
VCC1V0
VCC1V8_EN
TMS3206678
VCC1V8_PGOOD
VCC1V8
(Unlock Output pins to DSP from FPGA.)
VCC1V5_EN
DDR3
TMS320C6678
VCC1V5_PGOOD
VCC1V5
VCC0V75_EN
DDR3
TMS320C6678
VCC0V75_PGOOD
VCC0V75
VCC2V5_EN
88E1111
VCC2V5_PGOOD
VCC2V5
VCC5_EN
XDS560V2
Mezzanine
VCC5_PGOOD
VCC5
T=5mS
RESET#
T=5mS
POR#
T=5mS
RESETFULL#
REFCLK must always be active
before the POR# can be removed.
RESETSTAT#
REFCLKP&N
by REFCLK2_PD#
CLOCK2_PLL_LOCK
DDRCLKP&N
by REFCLK3_PD#
CLOCK3_PLL_LOCK
T=5mS
FPGA_ICS557_OE
Figure 4.6: Initial Power Up Sequence Timing Diagram
54
VCC3V3_MP_AMC
MMC
VCC3V3_MP
VCC12
Other
XC3S200AN
FT2232H
VCC3V3_AUX
XC3S200AN
XC3S200AN
88E1111
VCC1V8_AUX
TMS320C6678
CVDD
UCD9222_VID2 &
UCD9222_ENA2
TMS320C6678
VCC1V0
VCC1V2
PMBUS &
UCD9222_ENA1
VCC1V8_EN
TMS320C6678
FPGA will lock all output pins to DSP
after VCC1V8_PGOOD de-asserted
VCC1V8
VCC1V5_EN
DDR3
TMS320C6678
DDR3 SDRAM
VCC1V5
VCC0V75_EN
DDR3 Vref
DDR3
VCC0V75
VCC2V5_EN
88E1111
VCC2V5
VCC5_EN
XDS560V2
Mezzanine
VCC5
RESET#
RESETFULL#
POR# will be asserted by FPGA
during power off or any
POR#
abnormal power status
occurred.
RESETSTAT#
The clocks must exist while the REFCLKP&N
by REFCLK2_PD#
period of POR# de-asserted
CLOCK2_PLL_LOCK
DDRCLKP&N
by REFCLK3_PD#
CLOCK3_PLL_LOCK
Figure 4.7: Initial Power Down Sequence Timing Diagram
55
5. TMDXEVM6678L FPGA FUNCTIONAL DESCRIPTION
This chapter contains,
5.1 FPGA overview
5.2 FPGA signals description
5.3 Sequence of operation
5.4 Reset definition
5.5 SPI protocol
5.6 CDCE62005 Programming Descriptions
5.7 FPGA Configuration Registers
5.1 FPGA overview
The FPGA (Xilinx XC3S200AN) controls the EVM power sequencing, reset mechanism, DSP
boot mode configuration and clock initialization. The FPGA also provides the transformation
of TDM Frame Synchronization signal and Reference Clock between the AMC connector and
the DSP.
The FPGA also supports 4 user LEDs and 1 user switch through control registers. All the FPGA
registers are accessible by the TMS320C6678 DSP.
The key features of the TMDXEVM6678L EVM FPGA are:
TMDXEVM6678L EVM Power Sequence Control
TMDXEVM6678L EVM Reset Mechanism Control
TMDXEVM6678L EVM Clock Generator Initialization and Control
TMS320C6678 DSP SPI Interface for Accessing the FPGA Configurable Registers
Provides Shadow Registers for TMS320C6678 DSP to Access the Clock Generator
Configurations Registers
Provides Shadow Registers for TMS320C6678 DSP to Access the UCD9222
Devices via the PM Bus (RFU)
Provides TMS320C6678 DSP Boot Mode Configuration switch settings to DSP
MMC Reset Events Initiation Interface
Provides the transformation of TDM Frame Synchronization and Reference Clock
between AMC and DSP
56
Provide Ethernet PHY Interrupt(RFU) and Reset Control Interface
Provides support for Reset Buttons, User Switches and Debug LEDs
5.2 FPGA signals description
This section provides a detailed description of each signal. The signals are arranged in
functional groups according to their associated interface. Throughout this manual, a ‘#’ or ‘Z’
will be used at the end of a signal name to indicate that the active or asserted state occurs
when the signal is at a low voltage level.
The following notations are used to describe the signal and type.
I
Input pin
O
Output pin
I/O
Bi-directional pin
Differential
Differential Pair pins
PU
Internal Pull-Up
.
Table 5.1 : TMDXEVM6678L EVM FPGA Pin Description
Pin Name
IO Type Description
MMC Control :
MMC_DETECT#
I
MMC Detection on the insertion to an AMC
PU
Chassis : This signal is an insertion indication
from the MMC. The MMC will drive logic low
state when the EVM module is inserted into an
AMC chassis.
MMC_RESETSTAT#
O
RESETSTAT# state to MMC : The FPGA will
drive the same status of the DSP RESETSTAT# to
the MMC via this signal.
MMC_POR_IN_AMC# I
MMC POR Request : This signal is used by the
PU
MMC to request a power-on reset sequence to
DSP. A logic Low to High transition on this
signal will complete the FPGA Full Reset
sequence with a specified delay time.
MMC_WR_AMC#
I
MMC WARM Request : This signal is used by
PU
the MMC to initiate a warm reset request. A
logic Low to High transition on this signal will
complete the FPGA warm reset sequence with
a specified delay time.
57
Pin Name
MMC_BOOTCOMPLET
E
IO Type
O
Power Sequences Control :
VCC5_PGOOD
I
VCC2P5_PGOOD
I
VCC3_AUX_PGOOD
I
VCC0P75_PGOOD
I
VCC1P5_PGOOD
I
VCC1P8_PGOOD
I
SYS_PGOOD
O
VCC1P8_EN1
O
VCC0P75_EN
O
VCC2P5_EN
O
VCC_5V_EN
O
CLOCK Configurations :
CLOCK[2:3]_SSPCS1
O
CLOCK[2:3]_SSPCK
O
CLOCK[2:3]_SSPSI
O
Description
BOOTCOMPLETE state to MMC : The FPGA will
drive the same status of the DSP
BOOTCOMPLETE to the MMC via this signal.
5V Voltage Power Good Indication : This signal
indicates the 5V power is valid.
2.5V Voltage Power Good Indication : This
signal indicates the 2.5V power is valid.
3.3V Auxiliary Voltage Power Good
Indication : This signal indicates the 3.3V
auxiliary power is valid.
0.75V Voltage Power Good Indication : This
signal indicates the 0.75V power is valid.
1.5V Voltage Power Good Indication : This
signal indicates the 1.5V power is valid.
1.8V Voltage Power Good Indication : This
signal indicates the 1.8V power is valid.
System Power Good Indication : This signal is
indicated by the FPGA to the system when all
the power supplies are valid.
1.8V Voltage Power Supply Enable :
VCC1P8_EN1 is for 1.8V power plane control.
0.75V Voltage Power Supply Enable :
VCC0P75_EN is for 0.75V power plane control.
2.5V Voltage Power Supply Enable :
VCC2P5_EN is for 2.5V power plane control.
5V Voltage Power Supply Enable : VCC_5V_EN
is for 5V power plane control.
SPI Chip Select Enable : This signal is
connected to the TI CDCE62005 CLOCK
Generators SPI_LE pin. The falling edge of the
SSPCS1 initiates a transfer. If SSPCS1 is high, no
data transfer can take place.
SPI Serial Clock : This signal is connected to the
TI CDCE62005 CLOCK Generators SPI_CLK pin.
The FPGA SPI bus clocks data in and out on the
rising edge of SSPCK. Data transitions therefore
occur on the falling edge of the clock.
SPI Serial Data MOSI : This signal is connected
to the TI CDCE62005 CLOCK Generators MOSI
pin. This signal is used for serial data
transfers from the master (FPGA) output to the
slave (CDCE62005) input.
58
Pin Name
CLOCK[2:3]_SSPSO
IO Type
I
PU
REFCLK[2:3]_PD#
O
UCD9222 Interface :
UCD9222_PG1
I
UCD9222_ENA1
O
UCD9222_PG2
I
UCD9222_ENA2
O
PGUCD9222
I
UCD9222_RST#
O
PM BUS : (RFU)
PMBUS_CLK
O
PMBUS_DAT
I/O
PMBUS_ALT
I
PMBUS_CTL
I
PU
PHY Interface :
PHY_INT#
I
Description
SPI Serial Data MISO : This signal is connected
to the TI CDCE62005 CLOCK Generators MISO
pin. This signal is used for the serial data
transfers from the slave (CDCE62005) output to
the master (FPGA) input.
TI CDCE62005 CLOCK Generator Power Down :
The power down pins each place the respective
CDCE62005 into the power down state forcing
the differential clock output into the
high-impedance state.
UCD9222 Power Good Indication for CVDD
DSP Core Power : This signal indicates the
CVDD DSP core power is valid.
UCD9222 Enable for CVDD DSP Core Power :
UCD9222_ENA1 is for CVDD DSP core power
plane control.
UCD9222 Power Good Indication for VCC1V0
DSP Core Power : This signal indicates the
VCC1V0 DSP core power is valid.
UCD9222 Enable for VCC1V0 DSP Core Power :
UCD9222_ENA2 is for VCC1V0 DSP core power
plane control.
UCD9222 Power Good Indication : This signal
indicates both the CVDD DSP and VCC1V0 DSP
core power supplies are valid.
UCD9222 Reset : An active low signal will reset
the UCD9222 device.
PM Bus Clock : The FPGA provides the clock
source on the PM bus.
PM Bus Data : A PM Bus slave device can
receive data provided by the master (FPGA), or
it can also provide data to the master (FPGA)
via this signal line.
PM Bus Alert : The PM Bus device may notify
the host (FPGA) via this signal if a fault or
warning is detected.
PM Bus Control : This signal is used to turn the
device on and off in conjunction with
UCD9222_ENA1 / UCD9222_ENA2 pins.
Interrupt Request from 88E111 PHY (RFU)
59
Pin Name
PHY_RST#
IO Type
O
Description
Reset to 88E1111 PHY : This signal is used to
reset the 88E1111 PHY device. The PHY_RST#
will be asserted during the active DSP_PORZ or
DSP_RESETFULLZ period. The PHY_RST# logic
also can be configured by the DSP accessed
register.
DSP SPI :
DSP_SSPCS1
I
DSP_SSPCK
I
DSP_SSPMISO
O
DSP_SSPMOSI
I
DSP SPI Chip Select 1 : This signal is connected
to the TMS320C6678 DSP SPISCS1 pin. The
falling edge of the SSPCS1 from the DSP will
initiate a transfer. If SSPCS1 is high, no data
transfer can take place.
DSP SPI Serial Clock : This signal is connected
to the TMS320C6678 DSP SPICLK pin. The FPGA
SPI bus clocks data in on the falling edge of
SSPCK. Data transitions therefore occur on the
rising edge of the clock.
DSP SPI Serial Data MISO : This signal is
connected to the TMS320C6678 DSP SPIDIN
pin. This signal is used for serial data
transfers from the slave (FPGA) output to the
master (DSP) input in the DSP_SSPCS1 asserted
period.
DSP SPI Serial Data MOSI : This signal is
connected to the DSP SPIDOUT pin. This signal
is used for serial data transfers from the master
(DSP) output to the slave (FPGA) input.
RESET Buttons and Requests :
FULL_RESET
I
Full Reset Button Input : This button input is
used to initiate a Full Reset event.
WARM_RESET
I
Warm Reset Button Input : This button input is
used to initiate a Warm Reset event.
COLD_RESET
I
Cold Reset Button Input :
(RFU)
Reserved for Future Use (RFU).
FPGA_JTAG_RST#
I
FPGA JTAG Reset Input :
(RFU)
Reserved for Future Use (RFU).
TRGRSTZ
I
Reset Request from the DSP Emulator
Header : A warm Reset sequence will be
initiated if an active TRGRSTZ event is
recognized by the FPGA.
DSP Boot & Device configurations :
BM_GPIO[0 : 15]
I
DSP Boot Mode Strap Configurations : These
switch inputs are used to drive the DSP boot
mode configuration during the EVM power up
period.
60
Pin Name
DSP_GPIO[0 : 15]
IO Type
I/O
Description
DSP GPIO : In normal operation mode, these
signals are not driven by the FPGA so that the
DSP can use them as GPIO pins. During the
EVM power-on or during the RESETFULLz
asserted period, the FPGA will output the
BM_GPIO switch values to the DSP on these
pins so the DSP can latch the boot mode
configuration.
DSP RESET & Interrupts Control :
DSP_CORESEL[0:3]
O
DSP Core Selection Bit:
The default value is 0000b and Register bits
define the state of these pins.
DSP_PACLKSEL
O
DSP PACLKSEL : This pin is used for the DSP
PASS clock selection setting. The logic of this
signal is derived from the BM_GPIO[13:11]
state or configured by the FPGA registors.
DSP_LRESETNMIENZ
O
Latch Enable for DSP Local Reset and NMI
inputs :The default value is 1b and a register
bit defines the state of this pin.
DSP_NMIZ
O
DSP NMI.
The default value is 1b and unlocked a register
bit defines the state of this pin.
DSP_LRESETZ
O
DSP Local Reset.
The default value is 1b and a register bit
defines the state of this pin.
DSP_HOUT
I
DSP HOUT
DSP_BOOTCOMPLETE I
DSP Boot Complete Indication
DSP_SYSCLKOUT
I
DSP System Clock Output
DSP_PORZ
O
DSP Power-On Reset
DSP_RESETFULLZ
O
DSP Full Reset.
DSP_RESETZ
O
DSP Reset
FPGA Storage (RFU):
FPGA_SPI_CS#
O
FPGA SPI Chip Select : (RFU)
FPGA_SPI_SI
O
FPGA SPI Serial Data MOSI : (RFU)
FPGA_SPI_SCK
O
FPGA SPI Clock Output : (RFU)
FPGA_SPI_SO
I
FPGA SPI Serial Data MISO : (RFU)
DSP TDM CLK :
DSP_TSIP0_FS[A:B]0
O
DSP TSIP0_FS[A:B]0 : The single-ended clock
(DSP_TSIP0_FSA0 and DSP_TSIP0_FSB0)
outputs are derived from the differential TDM
Frame Synchronization (TDM_CLKC) input.
61
Pin Name
DSP_TSIP1_FS[A:B]1
IO Type
O
DSP_TSIP0_CLK[A:B]0
O
DSP_TSIP1_CLK[A:B]1
O
TDM_CLKA[p/n]
I, Diff
TDM_CLKB[p/n]
(RFU)
TDM_CLKC[p/n]
I, Diff
TDM_CLKD[p/n]
(RFU)
DEBUG LED:
DEBUG_LED[1:4]
I, Diff
I, Diff
Description
DSP TSIP1_FS[A:B]1 : The single-ended clock
(DSP_TSIP1_FSA1 and DSP_TSIP1_FSB1)
outputs are derived from the differential TDM
Frame Synchronization (TDM_CLKC) input.
DSP TSIP0_CLK[A:B]0 : The single-ended clock
(DSP_TSIP0_CLKA0 and DSP_TSIP0_CLKB0)
outputs are derived from the differential TDM
clock (TDM_CLKA) input.
DSP TSIP1_CLK[A:B]1 : The single-ended clock
(DSP_TSIP1_CLKA1 and DSP_TSIP1_CLKB1)
outputs are derived from the differential TDM
clock (TDM_CLKA) input.
TDM_CLKA Different Clock Input Pairs
The reference clock referring to the TSIP0/1
CLKs of the DSP.
TDM_CLKB Different Clock Input Pairs
Reserved for future use (RFU).
TDM_CLKC Different Clock Input Pairs
The frame synchronization signal referring to
the TSIP0/1 FSs of the DSP.
TDM_CLKD Different Clock Input Pairs
Reserved for future use (RFU)
O
Debug LED : The LEDs are used for debugging
purposes only. It can be configured by the
registers in the FPGA.
Miscellaneous:
MAIN_48MHZ_CLK_R
I
DSP_TIMI0
O
DSP_VCL_1 (RFU)
DSP_VD_1 (RFU)
PCA9306_EN
I
I/O
O
NAND_WP#
O
NOR_WP#
O
EEPROM_WP
O
FPGA Main Clock Source : A 48 MHz clock is
used as the FPGA main clock source.
DSP Timer 0 Clock : The FPGA provides a
24MHz clock to the DSP timer 0 input. During
the EVM Power-on or RESETFULLZ asserted
period, the FPGA will drive the PCIESSEN
switch state to DSP for latching.
DSP Smart Reflex I2C Clock
DSP Smart Reflex I2C Clock
PCA9306 Enable : This signal is used to enable
the DSP Smart Reflex I2C buffer function.
NAND Flash Write Protect : This signal is used
to control the NAND flash write-protect
function.
NOR Flash Write Protect : This signal is used to
control the NOR flash write-protect function.
EEPROM Write Protect : This signal is used to
control the EEPROM write-protect function.
62
Pin Name
PCIESSEN
IO Type
I
USER_DEFINE
I
ICS557_SEL
O
ICS557_PD#
O
ICS557_OE
O
VID_OE#
O
XDS560_IL
O
FPGA JTAG TAP Control Port:
JTAG_FPGA_TCK
I
JTAG_FPGA_TDI
I
JTAG_FPGA_TDO
O
JTAG_FPGA_TMS
I
JTAG_FPGA_RST#
I
Description
PCIE Subsystem Enable : This is used for the
PCIESSEN switch input.
User Defined Switch : This is reserved for the
user defined switch input.
PCIE clock pultipleaxor inputs selection: This
pin is controlled by the register to select PCIE
reference clock from the CDCE62005 or the
AMC edge connector.
The default is from the CDCE62005.
PCIE clock pultipleaxor Power Down: This pin
is used to control the ICS557-08 PD# pin, it’s
de-asserted after VCC1V5 valid.
PCIE clock pultipleaxor output enable: This pin
enables the output of the ICS557-08.
Smart-Reflex VID Enable: This pin enables the
output of the Smart-Reflex VID from the DSP to
the UCD9222.
XDS560 IL : XDS560 IL control signal
FPGA JTAG Clock Input
FPGA JTAG Data Input
FPGA JTAG Data Output
FPGA JTAG Mode Select Input
FPGA JTAG Reset (RFU)
5.3 Sequence of operation
This section describes the FPGA sequence of operation on the EVM. It contains:
5.3.1 Power-On Sequence
5.3.2 Power Off Sequence
5.3.3 Boot Configuration Timing
5.3.4 Boot Configuration Forced in I2C Boot
5.3.1 Power-On Sequence
The following section provides details of the FPGA Power-On sequence of operation.
1. After the EVM 3.3V auxiliary voltage (VCC3V3_AUX_PGOOD) is valid and stable, and
the FPGA design code is loaded, the FPGA is ready for the Power-On sequence of
operation.
2. The FPGA starts to execute the Power-On sequence. Wait for 10 ms, the FPGA enable
the 2.5V power.
63
3. Once the 2.5V voltages (VCC5_PGOOD and VCC2V5_PGOOD) is valid, wait for 5 ms,
the FPGA asserts the UCD9222_ENA1 and UCD9222_ENA2 to enable the CVDD and
VCC1V0 DSP core power.
4. After both the UCD9222_PG1, UCD9222_PG2 and PGUCD9222 are all valid, wait for 5
ms, the FPGA enables the 1.8V power.
5. After the 1.8V voltage is valid (VCC1V8_PGOOD asserted), wait for 5 ms and then:
•
Unlock the 1.8V outputs on the FPGA,
•
De-asserted CDCE62005#2_PD# pin, after driving CDCE62005_PD# to high for
1mS, the FPGA starts to initialize the CDCE62005 clock generator #2.
•
During the initiation phase of the CDCE62005#2, the FPGA de-asserts the
CDCE62005#3_PD# pin and checks the CDCE62005#2 PLL_LOCK state. Once the
PLL_Lock state is valid, the FPGA starts to initialize CDCE62005 clock generator
#3.
6. After finishing the initiation of the CDCE62005#3, wait for 5mS, the FPGA enables the
1.5V power rail.
7. After the 1.5V voltage is valid (VCC1V5_PGOOD), wait for 5 ms, the FPGA enables the
0.75V power and Level shift component output and initialize the ICS557.
8. After the 0.75V voltage is valid (VCC0V75_PGOOD asserted), wait for 5ms and check
the both of the CDCE62005 PLL_LOCK states and FPGA assert ICS 557 OE pin, after
the PLL states of the CDCD62005s are valid, the FPGA de-asserts the DSP_RESETz and
DSP_LRESETz and Keep the DSP_PORz and DSP_RESETFULLz in assertion.
9. After the DSP_RESETz and DSP_LRESETz have de-asserted, wait for 5 ms, the FPGA
de-asserts the DSP_PORz and keeps the DSP_RESETFULLz still being asserted. Wait
for another 5 ms, the FPGA de-asserts the DSP_RESETFULLz. The FPGA will drive the
BM_GPIO switches value to the DSP for the DSP boot mode configuration strapping
during the period from the VCC0P75_PGOOD is valid to the RESETSTAT# being
de-asserted. The FPGA will also drive the PCIESSEN switch value to DSP_TIMI0 for the
DSP boot configuration strapping.
10. Wait for the RESETSTAT# signal from DSP to go from low to high. The EVM Power-On
sequence is completed.
5.3.2 Power Off Sequence
Following section provides details of FPGA power off sequence of operation.
1. Once the system powers on, any power failure events (any one of power good signals
de-asserted) will trigger the FPGA to proceed to the power off sequence.
2. Once any de-asserted Power Good signals have been detected by the FPGA, the
FPGA will assert the DSP_PORz and DSP_RESETFULLz to DSP immediately.
64
3. Wait for 5 ms, the FPGA will disable all the system power rails by the enable pins and
two CDCE62005 clock generators by the power down pins, assert all the other DSP
resets to DSP, lock the +1.8V output pins from the FPGA to the DSP.
4. FPGA remains in the power failure state until main 12V power is removed and
restored.
5.3.3 Boot Configuration Timing
The boot configuration timing of the power-up and the RESETFULLz event are shown below.
Figure 5.1: Power-On Reset Boot Configuration Timing
Figure 5.2: Reset-Full Switch/Trigger Boot Configuration Timing
65
5.3.4 Boot Configuration Forced in I2C Boot
Note: This workaround is only needed with PG1.0 samples of the TMS320C6678 DSP.
For reliable PLL operation at boot-up, the FPGA will force the DSP to boot from the I2C by
providing the boot configuration value as 0x0405 on the boot mode pins [12:0]. After the
code in the I2C SEEPROM executes to initialize the PLLs, it will read the true values on the
DIP switches from the registers in the FPGA and then boot as if the normal boot sequence
had occurred.
The exception for the forced I2C boot is the emulation boot. The FPGA will not perform
the I2C boot configuration override when the DIP switches have the following
configuration: BOOTMODE[2:0] (GPIO[3:1]) = [000] and BOOTMODE[5:4] (GPIO[6:5]) = [00].
Therefore, the additional logic of the FPGA will allow the emulation boot to latch directly
from the DIP switches.
5.4 Reset definition
5.4.1 Reset Behavior
Power-On : The Power-On behavior includes initiating and sequencing the power
sources, clock sources and then DSP startup. Please refer to the section 5.5.1 for
detailed sequence and operations.
Full Reset : The RESETFULLz is asserted low to the DSP. This causes RESETSTAT# to
go low which triggers the boot configuration to be driven from the FPGA. Reset to
the Marvell PHY is also asserted. POR# and RESET# to the DSP remain high. The
power supplies and clocks operate without interruption. Please refer to the section
5.5.3 for detailed timing diagrams.
Warm Reset : The RESETz is asserted low to the DSP. The PORz and RESETFULLz to
the DSP remain high. The power supplies and clocks operate without interruption.
5.4.2 Reset Switches and Triggers
FULL_RESET (RST_FULL1) – a logic low state with a low to high transition will trigger a
Full Reset behavior event.
When the push button switch RST_FULL1 is pressed, FPGA on EVM will assert DSP’s
RESETFULL# input to issue a total reset of the DSP, everything on the DSP will be reset to
its default state in response to this event, boot configurations will be latched and the
ROM boot process will be initiated.
This is equivalent to a power cycle of the board but POR and will have following effects:
* Reset DSP
* Reset Gigabit Ethernet PHY
* Reload boot parameters.
66
* Protect the conents in the I2C EEPROM, NAND flash and SPI NOR flash.
WARM_RESET (RST_WARM1) – a logic low state with a low to high transition will
trigger a warm reset behavior event.
When the push button Switch RST_WARM1 is pressed, FPGA will assert a DSP RESET#
input, which will reset the DSP. Software can program this to be either hard or soft. Hard
reset is the default which resets almost everything. Soft Reset will behave like Hard Reset
except that PCIe MMRs, EMIF16 MMRs, DDR3 EMIF MMRs, and External Memory
contents are retained.
Boot configurations are not latched by Warm Reset. Also, Warm Reset will not reset
blocks supporting Reset Isolation when they are appropriately configured previously by
application software. Warm Reset must be used to wake from low-power sleep and
hibernation modes.
In the case of a Soft Reset, the clock logic or the power control logic of the peripherals are
not affected, and, therefore, the enabled/disabled state of the peripherals is not affected.
The following external memory contents are maintained
During a Soft Reset:
• DDR3 MMRs: The DDR3 Memory Controller registers are not reset. In addition, the
DDR3 SDRAM memory content is retained if the user places the DDR3 SDRAM in
self-refresh mode before invoking the soft reset.
• PCIe MMRs: The contents of the memory connected to the EMIFA are retained. The
EMIFA registers are not reset.
COLD_RESET (RST_COLD1) – not used in current implementation.
MMC_POR_IN_AMC# - a logic low state with a low to high transition will trigger a
Full Reset behavior event.
MMC_WR_AMC# - a logic low state with a low to high transition will trigger a warm
reset behavior event.
TRGRSTz - a logic low state with a low to high transition on the Target Reset signal
from emulation header that will trigger a warm reset behavior event.
FPGA_JTAG_RST# - not used in current implementation.
5.5 SPI protocol
This section describes the FPGA SPI bus protocol design specification for interfacing with
TMS320C6678 DSP and CDCE62005 clock generators. It contains:
5.5.1 FPGA-DSP SPI Protocol
5.5.2 FPGA-CEDC62005(Clock Generator) SPI Protocol
67
5.5.1 FPGA-DSP SPI Protocol
The FPGA supports the simple write and read commands for the TMS320C6678 DSP to
access the FPGA configuration registers through the SPI interface. The FPGA SPI bus
clocks data in on the falling edge of DSP SPI Clock. Data transitions therefore occur on
the rising edge of the clock.
The figures below illustrates a DSP to FPGA SPI write operation.
Figure 5.3: The SPI access form the TMS320C6678 to the FPGA (WRITE / high level)
Figure 5.4: The SPI access form the TMS320C6678 to the FPGA (WRITE)
The below figures illustrate a DSP to FPGA SPI read operation.
Figure 5.5: The SPI access form the TMS320C6678 to the FPGA (READ / high level)
68
Figure 5.6: The SPI access form the TMS320C6678 to the FPGA (READ)
5.5.2 FPGA- CDCE62005(Clock Generator) SPI Protocol
The FPGA-Clock Generator SPI interface protocol is compatible to CDCE62005 SPI. The
FPGA SPI bus clocks data in on the rising edge of DSP SPI Clock. Data transitions therefore
occur on the falling edge of the clock.
The figure below illustrates a FPGA to CDCD62005 SPI write operation.
Figure 5.7: The SPI access form the FPGA to the CDCE62005 (WRITE)
The figure below illustrates a FPGA to CDCD62005 SPI read operation.
Figure 5.8: The SPI access form the FPGA to the CDCE62005 (READ)
69
5.6 FPGA Configuration Registers
The TMS320C6678 DSP communicates with the FPGA configuration registers through the SPI
interface. These registers are addressed by memory mapped location and defined by the DSP
SPI chip enable setting. The following tables list the FPGA configuration registers and the
respective descriptions.
Table 5.2 : TMS320C6678 EVM FPGA Memory Map
Memory Map Base Address
DSP SPI Chip Select 1
0x20BF0000-0x20BF03FF
(TMS320C6678 DSP SPI
Memory Map Address)
Memory Map Offset Address
0x00-0x3F
Memory
Configuration Registers
5.6.1 FPGA Configuration Registers Summary
Table 5.3 : FPGA Configuration Registers Summary
Address Offset
Definition
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
FPGA Device ID (Low Byte)
FPGA Device ID (High Byte)
FPGA Revision ID (Low Byte)
FPGA Revision ID (High Byte)
BM GPI Status (Low Byte)
BM GPI Status (High Byte)
DSP GPI Status (Low Byte)
DSP GPI status (High Byte)
Debug LED
MMC Control
PHY Control
Reset Buttons Status
Miscellaneous - 1
Miscellaneous - 2
FPGA FW Update SPI Interface
Control Register
Scratch Register
CLK-GEN 2 Control Register
CLK-GEN 2 Interface Clock
Setting
Reserved
CLK-GEN 2 Command Byte 0
CLK-GEN 2 Command Byte 1
CLK-GEN 2 Command Byte 2
CLK-GEN 2 Command Byte 3
0Fh
10h
11h
13h~12h
14h
15h
16h
17h
70
Attribute (R/W)
(RO : Read-Only)
RO
RO
RO
RO
RO
RO
RO
RO
R/W
RO
R/W
RO
R/W
RO
R/W
Default Value
04h
80h
**
00h*
------------00h
---03h
00h
1Ch
-00h
R/W
R/W
R/W
00h
00h
03h
R/W
R/W
R/W
R/W
0s
00h
00h
00h
00h
Address Offset
Definition
18h
19h
1Ah
1Bh
1Fh~1Ch
20h
21h
CLK-GEN 2 Read Data Byte 0
CLK-GEN 2 Read Data Byte 1
CLK-GEN 2 Read Data Byte 2
CLK-GEN 2 Read Data Byte 3
Reserved
CLK-GEN 3 Control Register
CLK-GEN 3 Interface Clock
Setting
Reserved
CLK-GEN 3 Command Byte 0
CLK-GEN 3 Command Byte 1
CLK-GEN 3 Command Byte 2
CLK-GEN 3 Command Byte 3
CLK-GEN 3 Read Data Byte 0
CLK-GEN 3 Read Data Byte 1
CLK-GEN 3 Read Data Byte 2
CLK-GEN 3 Read Data Byte 3
Reserved
PM Bus (RFU)
Attribute (R/W)
(RO : Read-Only)
RO
RO
RO
RO
R/W
R/W
Default Value
00h
00h
00h
00h
0s
00h
03h
23h~22h
0s
24h
R/W
00h
25h
R/W
00h
26h
R/W
00h
27h
R/W
00h
28h
RO
00h
29h
RO
00h
2Ah
RO
00h
2Bh
RO
00h
2Fh~2Ch
0s
3Fh~30h
R/W
0s
Note :
“**” means the value may be changed in the future FPGA FW update release.
5.6.2 FPGA Configuration Registers Descriptions
Register Address :
SPI Base + 00h
Register Name :
FPGA Device ID (Low Byte) Register
Default Value:
04h
Attribute :
Read Only
Bit
Description
7-0
FPGA Device ID (Low Byte)
This offset 01h field combined with this field identifies the
particular device. This identifier is allocated by the FPGA design
team.
Read/Write
Register Address :
SPI Base + 01h
Register Name :
FPGA Device ID (High Byte) Register
Default Value:
80h
Attribute :
Read Only
Bit
Description
7-0
FPGA Device ID (High Byte)
This field combined with the offset 00h field identifies the
particular device. This identifier is allocated by the FPGA design
team.
Read/Write
71
RO
RO
Register Address :
SPI Base + 02h
Register Name :
FPGA Revision ID (Low Byte) Register
Default Value:
**
Attribute :
Read Only
Bit
Description
7-0
FPGA Revision ID (Low Byte)
This offset 03h register combined with this register specifies the
FPGA device specific revision identifier. The value may be
changed in the future FPGA FW update release.
Read/Write
Register Address :
SPI Base + 03h
Register Name :
FPGA Revision ID (High Byte) Register
Default Value:
00h*
Attribute :
Read Only
Bit
Description
7-0
FPGA Revision ID (High Byte)
This register combined with the offset 02h register specifies the
FPGA device specific revision identifier. The value may be
changed in the future FPGA FW update release.
Read/Write
Register Address :
SPI Base + 04h
Register Name :
BM GPI Status (07-00 Low Byte) Register
Default Value:
---Attribute :
Read Only
Bit
Description
0
BM GPIO 00 : This bit reflects the state of the BM general
purpose input signal GPIO 00 and writes will have no effect.
0 : BM GPIO 00 state is low
1 : BM GPIO 00 state is high
1
BM GPIO 01 : This bit reflects the state of the BM general
purpose input signal GPIO 01 and writes will have no effect.
0 : BM GPIO 01 state is low
1 : BM GPIO 01 state is high
2
BM GPIO 02 : This bit reflects the state of the BM general
purpose input signal GPIO 02 and writes will have no effect.
0 : BM GPIO 02 state is low
1 : BM GPIO 02 state is high
3
BM GPIO 03 : This bit reflects the state of the BM general
purpose input signal GPIO 03 and writes will have no effect.
0 : BM GPIO 03 state is low
1 : BM GPIO 03 state is high
4
BM GPIO 04 : This bit reflects the state of the BM general
purpose input signal GPIO 04 and writes will have no effect.
0 : BM GPIO 04 state is low
1 : BM GPIO 04 state is high
5
BM GPIO 05 : This bit reflects the state of the BM general
purpose input signal GPIO 05 and writes will have no effect.
72
RO
RO
Read/Write
RO
RO
RO
RO
RO
RO
Bit
6
7
Description
0 : BM GPIO 05 state is low
1 : BM GPIO 05 state is high
BM GPIO 06 : This bit reflects the state of the BM general
purpose input signal GPIO 06 and writes will have no effect.
0 : BM GPIO 06 state is low
1 : BM GPIO 06 state is high
BM GPIO 07 : This bit reflects the state of the BM general
purpose input signal GPIO 07 and writes will have no effect.
0 : BM GPIO 07 state is low
1 : BM GPIO 07 state is high
Register Address :
SPI Base + 05h
Register Name :
BM GPI (15-08 High Byte) Status Register
Default Value:
---Attribute :
Read Only
Bit
Description
0
BM GPIO 08 : This bit reflects the state of the BM general
purpose input signal GPIO 08 and writes will have no effect.
0 : BM GPIO 08 state is low
1 : BM GPIO 08 state is high
1
BM GPIO 09 : This bit reflects the state of the BM general
purpose input signal GPIO 09 and writes will have no effect.
0 : BM GPIO 09 state is low
1 : BM GPIO 09 state is high
2
BM GPIO 10 : This bit reflects the state of the BM general
purpose input signal GPIO 10 and writes will have no effect.
0 : BM GPIO 10 state is low
1 : BM GPIO 10 state is high
3
BM GPIO 11 : This bit reflects the state of the BM general
purpose input signal GPIO 11 and writes will have no effect.
0 : BM GPIO 11 state is low
1 : BM GPIO 11 state is high
4
BM GPIO 12 : This bit reflects the state of the BM general
purpose input signal GPIO 12 and writes will have no effect.
0 : BM GPIO 12 state is low
1 : BM GPIO 12 state is high
5
BM GPIO 13 : This bit reflects the state of the BM general
purpose input signal GPIO 13 and writes will have no effect.
0 : BM GPIO 13 state is low
1 : BM GPIO 13 state is high
6
BM GPIO 14 : This bit reflects the state of the BM general
purpose input signal GPIO 14 and writes will have no effect.
0 : BM GPIO 14 state is low
1 : BM GPIO 14 state is high
7
BM GPIO 15 : This bit reflects the state of the BM general
purpose input signal GPIO 15 and writes will have no effect.
73
Read/Write
RO
RO
Read/Write
RO
RO
RO
RO
RO
RO
RO
RO
Bit
Description
0 : BM GPIO 15 state is low
1 : BM GPIO 15 state is high
Read/Write
Register Address :
SPI Base + 06h
Register Name :
DSP GPI (07-00 Low Byte) Register
Default Value:
---Attribute :
Read Only
Bit
Description
0
DSP GPIO 00 : This bit reflects the state of the DSP general
purpose input signal GPIO 00 and writes will have no effect.
0 : DSP GPIO 00 state is low
1 : DSP GPIO 00 state is high
1
DSP GPIO 01 : This bit reflects the state of the DSP general
purpose input signal GPIO 01 and writes will have no effect.
0 : DSP GPIO 01 state is low
1 : DSP GPIO 01 state is high
2
DSP GPIO 02 : This bit reflects the state of the DSP general
purpose input signal GPIO 02 and writes will have no effect.
0 : DSP GPIO 02 state is low
1 : DSP GPIO 02 state is high
3
DSP GPIO 03 : This bit reflects the state of the DSP general
purpose input signal GPIO 03 and writes will have no effect.
0 : DSP GPIO 03 state is low
1 : DSP GPIO 03 state is high
4
DSP GPIO 04 : This bit reflects the state of the DSP general
purpose input signal GPIO 04 and writes will have no effect.
0 : DSP GPIO 04 state is low
1 : DSP GPIO 04 state is high
5
DSP GPIO 05 : This bit reflects the state of the DSP general
purpose input signal GPIO 05 and writes will have no effect.
0 : DSP GPIO 05 state is low
1 : DSP GPIO 05 state is high
6
DSP GPIO 06 : This bit reflects the state of the DSP general
purpose input signal GPIO 06 and writes will have no effect.
0 : DSP GPIO 06 state is low
1 : DSP GPIO 06 state is high
7
DSP GPIO 07 : This bit reflects the state of the DSP general
purpose input signal GPIO 07 and writes will have no effect.
0 : DSP GPIO 07 state is low
1 : DSP GPIO 07 state is high
74
Read/Write
RO
RO
RO
RO
RO
RO
RO
RO
Register Address :
SPI Base + 07h
Register Name :
DSP GPI (15-08 High Byte) Status Register
Default Value:
00h
Attribute :
Read Only
Bit
Description
0
DSP GPIO 08 : This bit reflects the state of the DSP general
purpose input signal GPIO 08 and writes will have no effect.
0 : DSP GPIO 08 state is low
1 : DSP GPIO 08 state is high
1
DSP GPIO 09 : This bit reflects the state of the DSP general
purpose input signal GPIO 09 and writes will have no effect.
0 : DSP GPIO 09 state is low
1 : DSP GPIO 09 state is high
2
DSP GPIO 10 : This bit reflects the state of the DSP general
purpose input signal GPIO 10 and writes will have no effect.
0 : DSP GPIO 10 state is low
1 : DSP GPIO 10 state is high
3
DSP GPIO 11 : This bit reflects the state of the DSP general
purpose input signal GPIO 11 and writes will have no effect.
0 : DSP GPIO 11 state is low
1 : DSP GPIO 11 state is high
4
DSP GPIO 12 : This bit reflects the state of the DSP general
purpose input signal GPIO 12 and writes will have no effect.
0 : DSP GPIO 12 state is low
1 : DSP GPIO 12 state is high
5
DSP GPIO 13 : This bit reflects the state of the DSP general
purpose input signal GPIO 13 and writes will have no effect.
0 : DSP GPIO 13 state is low
1 : DSP GPIO 13 state is high
6
DSP GPIO 14 : This bit reflects the state of the DSP general
purpose input signal GPIO 14 and writes will have no effect.
0 : DSP GPIO 14 state is low
1 : DSP GPIO 14 state is high
7
DSP GPIO 15 : This bit reflects the state of the DSP general
purpose input signal GPIO 15 and writes will have no effect.
0 : DSP GPIO 15 state is low
1 : DSP GPIO 15 state is high
75
Read/Write
RO
RO
RO
RO
RO
RO
RO
RO
Register Address :
SPI Base + 08h
Register Name :
Debug LED Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
0
DEBUG_LED 1 : This bit can be updated by the DSP software to
drive a high or low value on the debug LED 1 pin.
0 : DEBUG_LED 1 drives low and set the LED 1 to ON.
1 : DEBUG_LED 1 drives high and set the LED 1 to OFF.
1
DEBUG_LED 2 : This bit can be updated by the DSP software to
drive a high or low value on the debug LED 2 pin.
0 : DEBUG_LED 2 drives low and set the LED 2 to ON.
1 : DEBUG_LED 2 drives high and set the LED 2 to OFF.
2
DEBUG_LED 3 : This bit can be updated by the DSP software to
drive a high or low value on the debug LED 3 pin
0 : DEBUG_LED 3 drives low and set the LED 3 to ON.
1 : DEBUG_LED 3 drives high and set the LED 3 to OFF.
3
DEBUG_LED 4 : This bit can be updated by the DSP software to
drive a high or low value on the debug LED 4 pin
0 : DEBUG_LED 4 drives low and set the LED 4 to ON.
1 : DEBUG_LED 4 drives high and set the LED 4 to OFF.
7-4
Reserved
Read/Write
R/W
R/W
R/W
R/W
RO
Register Address :
SPI Base + 09h
Register Name :
MMC Control Register
Default Value:
---Attribute :
Read Only
Bit
Description
Read/Write
0
MMC_DETECT# : This bit reflects the MMC_DETECT# state and it
is used by the MMC to indicate the AMC chassis insertion status.
0 : MMC_DETECT# state is low to indicate that the EVM is
RO
inserted into the AMC chassis.
1 : MMC_DETECT# state is high to indicate that the EVM is not
inserted into the AMC chassis.
1
MMC_RESETSTAT# : This bit reflects the DSP RESETSTAT# state
and the FPGA will drive the same logic value on the
MMC_RESETSTAT# pin ( to MMC ).
0 : DSP RESETSTAT# state is low and the FPGA drives
RO
MMC_RESETSTAT# low to MMC
1 : DSP RESETSTAT# state is high and the FPGA drives
MMC_RESETSTAT# high to MMC
2
MMC_POR_IN_AMC# : This bit reflects the
MMC_POR_IN_AMC# state and it is used by the MMC to trigger
a Power-On sequence & reset event.
RO
0 : MMC_POR_IN_AMC# state is low to trigger a Power-On
sequence & reset event.
1 : MMC_POR_IN_AMC# state is high and the FPGA stays in
76
3
4
7-5
current state.
MMC_WR_AMC# : This bit reflects the MMC_WR_AMC# state
and it is used by the MMC to trigger a warm reset event.
0 : MMC_WR_AMC# state is low to trigger a warm reset event.
1 : MMC_WR_AMC# state is high and the FPGA stays in current
state
MMC_BOOTCOMPLETE: This bit reflects the
DSP_BOOTCOMPLETE state and the FPGA will drive the same
logic value on the MMC_ BOOTCOMPLETE pin ( to MMC ).
0 : DSP_BOOTCOMPLETE state is low and the FPGA drives MMC_
BOOTCOMPLETE low to MMC
1 : DSP_BOOTCOMPLETE state is high and the FPGA drives
MMC_ BOOTCOMPLETE high to MMC
Reserved
Register Address :
SPI Base + 0Ah
Register Name :
PHY Control Register
Default Value:
03h
Attribute :
Read/Write
Bit
Description
0
PHY_INT# : This bit reflects the PHY_INT# state.
0 : PHY_INT# state is low.
1 : PHY_INT# state is high.
1
PHY_RST# : This bit can be updated by the DSP software to drive
a high or low value on the PHY_RST# pin
0 : PHY_RST# drives low
1 : PHY_RST# drives high
7-3
Reserved
Register Address :
SPI Base + 0Bh
Register Name :
Reset Button Status Register
Default Value:
---Attribute :
Read Only
Bit
Description
0
FULL_RESET button status : This bit reflects the FULL_RESET
button state. This button is used to request a power full reset
sequence to DSP. A logic Low to High transition on this button
signal will complete the FPGA FULL_RESET sequence with a
specified delay time.
0 : FULL_RESET button state is low
1 : FULL_RESET button state is high
1
WARM_RESET button status : This bit reflects the WARM _RESET
button state. This button is used to request a warm reset
sequence to DSP. A logic Low to High transition on this button
signal will complete the FPGA WARM_RESET sequence with a
specified delay time.
0 : WARM_RESET button state is low
77
RO
RO
RO
Read/Write
RO
R/W
RO
Read/Write
RO
RO
Bit
2
3
4
5
6
7
Description
1 : WARM_RESET button state is high
COLD_RESET button status (RFU): This bit reflects the COLD
_RESET button state. This button is not used in current
implementation.
0 : COLD_RESET button state is low
1 : COLD_RESET button state is high
FPGA_JTAG_RST#
0 : FPGA_JTAG_RST# state is low
1 : FPGA_JTAG_RST# state is high
DSP_RESETSTAT# : This bit reflects the DSP_RESETSTAT# state.
0 : DSP_RESETSTAT# state is low
1 : DSP_RESETSTAT# state is high
TRGRSTZ : This bit reflects the TRGRSTZ state.
0 : TRGRSTZ state is low
1 : TRGRSTZ state is high
PCIESSEN : This bit reflects the PCIESSEN switch state.
0 : PCIESSEN state is low
1 : PCIESSEN state is high
User_Defined Switch : This bit reflects the User_Define Switch
state.
0 : User_Defined Switch state is low
1 : User_Defined Switch state is high
Read/Write
RO
RO
RO
RO
RO
RO
Register Address :
SPI Base + 0Ch
Register Name :
Miscellaneous - 1 Register
Default Value:
1Ch
Attribute :
Read/Write
Bit
Description
Read/Write
1-0
Reserved
R/W
2
NAND_WP# : This bit can be updated by the DSP software to
drive a high or low value on the NAND_WP# pin
R/W
0 : NAND_WP# drives low
1 : NAND_WP# drives high
3
XDS560_IL control
R/W
0 : Disable XDS560 mezzanine card
1 : Enable XDS560 mezzanine card (Default)
4
NOR_WP# : This bit can be updated by the DSP software to drive
a high or low value on the NOR_WP# pin
R/W
0 : NOR_WP# drives low
1 : NOR_WP# drives high
5
EEPROM_WP : This bit can be updated by the DSP software to
drive a high or low value on the EEPROM_WP pin
R/W
0 : EEPROM_WP drives low
1 : EEPROM_WP drives high
6
PCA9306_EN : This bit can be updated by the DSP software to
R/W
drive a high or low value on the PCA9306_EN pin (RFU)
78
7
0 : PCA9306_EN drives low (Default)
1 : PCA9306_EN drives high
Reserved
RO
Register Address :
SPI Base + 0Dh
Register Name :
Miscellaneous - 2 Register
Default Value:
---Attribute :
Read Only
Bit
Description
Read/Write
0
FPGA FW Update SPI Interface Enable Status : This bit reflects
the FPGA FW Update SPI Interface Enable status. The FPGA FW
Update SPI interface could be enabled/disabled through the
offset 0Eh register.
0 : FPGA FW update SPI interface is disabled.
RO
1 : FPGA FW update SPI interface is enabled.
The DSP_GPIO[12] is mapped to FPGA_FW_SPI_CLK.
The DSP_GPIO[13] is mapped to FPGA_FW_SPI_CS#.
The DSP_GPIO[14] is mapped to FPGA_FW_SPI_MOSI.
The DSP_GPIO[15] is mapped to FPGA_FW_SPI_MISO.
2
DSP_HOUT status : This bit reflects the DSP_HOUT signal state.
0 : DSP_HOUT state is low
RO
1 : DSP_HOUT state is high
3
DSP_SYSCLKOUT status : This bit reflects the DSP_SYSCLKOUT
signal state.
RO
0 : DSP_SYSCLKOUT state is low
1 : DSP_SYSCLKOUT state is high
7-4
Reserved
RO
Register Address :
SPI Base + 0Eh
Register Name :
FPGA FW Update SPI Interface Control Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
7-0
FPGA FW Update SPI Interface Enable Control : These bits are
used to enable/disable the FPGA FW Update SPI Interface. If
the value of this register be set to 68h, the FPGA FW Update SPI
interface would be enabled. All the other values set to this
register would disable the FPGA FW Update SPI interface.
68h : FPGA FW update SPI interface is enabled.
Others : FPGA FW update SPI interface is disabled.
The DSP_GPIO[12] is mapped to FPGA_FW_SPI_CLK.
The DSP_GPIO[13] is mapped to FPGA_FW_SPI_CS#.
The DSP_GPIO[14] is mapped to FPGA_FW_SPI_MOSI.
The DSP_GPIO[15] is mapped to FPGA_FW_SPI_MISO.
79
Read/Write
R/W
Register Address :
SPI Base + 0Fh
Register Name :
Scratch Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
7-0
Scratch Data
Read/Write
R/W
Register Address :
SPI Base + 10h
Register Name :
CLK-GEN 2 Control Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
0
Initiate a data transfer via the SPI bus to update the SPI
command to CDCE62005 Clock Generator #2
0 : Idle state
1 : Write 1 to perform the SPI command update process.
1
The BUSY status indication for the CDCE62005 Clock Generator
#2 SPI bus
0 : The SPI bus for the CDCE62005 Clock Generator #2 is idle.
1 : The SPI bus for the CDCE62005 Clock Generator #2 is busy
and a SPI command is processing..
7-2
Reserved
Register Address :
SPI Base + 11h
Register Name :
CLK-GEN 2 Interface Clock Setting Register
Default Value:
03h
Attribute :
Read/Write
Bit
Description
7-0
This register is a clock divider setting to adjust the interface
clock for the CDCE62005 Clock Generator #2 SPI bus.
00 : CDCE62005 2 SPI Clock = 12MHz ( = 48 / 4 )
01 : CDCE62005 2 SPI Clock = 12MHz ( = 48 / 4 )
02 : CDCE62005 2 SPI Clock = 8 MHz ( = 48 / 6 )
03 : CDCE62005 2 SPI Clock = 6 MHz ( = 48 / 8 )
04 : CDCE62005 2 SPI Clock = 4.8 MHz ( = 48 /10 )
05 : CDCE62005 2 SPI Clock = 4 MHz ( = 48 /12 )
06 : CDCE62005 2 SPI Clock = 3.42 MHz ( = 48 / 14)
……
X : CDCE62005 2 SPI Clock = 48 MHz /((X+1)*2) if X != 0
80
Read/Write
R/W
RO
RO
Read/Write
R/W
Register Address :
Register Name :
SPI Base + 12h ~ 13h
Reserved
Register Address :
SPI Base + 14h
Register Name :
CLK-GEN 2 Command Byte 0 Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
7-0
This register specifies the update SPI command byte 0 to the
CDCE62005 Clock Generator #2
3-0 : SPI command address field bit 3 to bit 0
7-4 : SPI command data field bit 3 to bit 0
Register Address :
SPI Base + 15h
Register Name :
CLK-GEN 2 Command Byte 1 Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
7-0
This register specifies the update SPI command byte 1 to the
CDCE62005 Clock Generator #2
7-0 : SPI command data field bit 11 to bit 4
Register Address :
SPI Base + 16h
Register Name :
CLK-GEN 2 Command Byte 2 Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
7-0
This register specifies the update SPI command byte 2 to the
CDCE62005 Clock Generator #2
7-0 : SPI command data field bit 19 to bit12
Register Address :
SPI Base + 17h
Register Name :
CLK-GEN 2 Command Byte 3 Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
7-0
This register specifies the update SPI command byte 3 to the
CDCE62005 Clock Generator #2
7-0 : SPI command data field bit 27 to bit 20
81
Read/Write
R/W
Read/Write
R/W
Read/Write
R/W
Read/Write
R/W
Register Address :
SPI Base + 18h
Register Name :
CLK-GEN 2 Read Data Byte 0 Register
Default Value:
00h
Attribute :
Read Only
Bit
Description
7-0
This register reflects the read back data byte 0 from the
CDCE62005 Clock Generator #2 for responding a host SPI Read
Command.
7-0 : The SPI read back data bit 7 to bit 0 for a SPI Read
Command.
Register Address :
SPI Base + 19h
Register Name :
CLK-GEN 2 Read Data Byte 1 Register
Default Value:
00h
Attribute :
Read Only
Bit
Description
7-0
This register reflects the read back data byte 1 from the
CDCE62005 Clock Generator #2 for responding a host SPI Read
Command.
7-0 : The SPI read back data bit 15 to bit 8 for a SPI Read
Command.
Register Address :
SPI Base + 1Ah
Register Name :
CLK-GEN 2 Read Data Byte 2 Register
Default Value:
00h
Attribute :
Read Only
Bit
Description
7-0
This register reflects the read back data byte 1 from the
CDCE62005 Clock Generator #2 for responding a host SPI Read
Command.
7-0 : The SPI read back data bit 23 to bit 16 for a SPI Read
Command.
Register Address :
SPI Base + 1Bh
Register Name :
CLK-GEN 2 Read Data Byte 3 Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
7-0
This register reflects the read back data byte 1 from the
CDCE62005 Clock Generator #2 for responding a host SPI Read
Command.
3-0 : The SPI read back data bit 27 to bit 24 for a SPI Read
Command.
7-4 : Reserved
82
Read/Write
RO
Read/Write
RO
Read/Write
RO
Read/Write
RO
Register Address :
Register Name :
SPI Base + 1Ch ~ 1Fh
Reserved
Register Address :
SPI Base + 20h
Register Name :
CLK-GEN 3 Control Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
0
Initiate a data transfer via the SPI bus to update the SPI
command to CDCE62005 Clock Generator #3
0 : Idle state
1 : Write 1 to perform the SPI command update process.
1
The BUSY status indication for the CDCE62005 Clock Generator
#3 SPI bus
0 : The SPI bus for the CDCE62005 Clock Generator #3 is idle.
1 : The SPI bus for the CDCE62005 Clock Generator #3 is busy
and a SPI command is processing.
7-2
Reserved
Register Address :
SPI Base + 21h
Register Name :
CLK-GEN 3 Interface Clock Setting Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
7-0
This register is a clock divider setting to adjust the interface
clock for the CDCE62005 Clock Generator #3 SPI bus.
00 : CDCE62005#3 SPI Clock = 12MHz ( = 48 / 4 )
01 : CDCE62005#3 SPI Clock = 12MHz ( = 48 / 4 )
02 : CDCE62005#3 SPI Clock = 8 MHz ( = 48 / 6 )
03 : CDCE62005#3 SPI Clock = 6 MHz ( = 48 / 8 )
04 : CDCE62005#3 SPI Clock = 4.8 MHz ( = 48 /10 )
05 : CDCE62005#3 SPI Clock = 4 MHz ( = 48 /12 )
06 : CDCE62005#3 SPI Clock = 3.42 MHz ( = 48 / 14)
……
X : CDCE62005#3 SPI Clock = 48 MHz /((X+1)*2) if X != 0
83
Read/Write
R/W
RO
RO
Read/Write
R/W
Register Address :
Register Name :
SPI Base + 22h ~ 23h
Reserved
Register Address :
SPI Base + 24h
Register Name :
CLK-GEN 3 Command Byte 0 Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
7-0
This register specifies the update SPI command byte 0 to the
CDCE62005 Clock Generator #3
3-0 : SPI command address field bit 3 to bit 0
7-4 : SPI command data field bit 3 to bit 0
Register Address :
SPI Base + 25h
Register Name :
CLK-GEN 2 Command Byte 1 Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
7-0
This register specifies the update SPI command byte 1 to the
CDCE62005 Clock Generator #3
7-0 : SPI command data field bit 11 to bit 4
Register Address :
SPI Base + 26h
Register Name :
CLK-GEN 3 Command Byte 2 Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
7-0
This register specifies the update SPI command byte 2 to the
CDCE62005 Clock Generator #3
7-0 : SPI command data field bit 19 to bit 12
Register Address :
SPI Base + 27h
Register Name :
CLK-GEN 3 Command Byte 3 Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
7-0
This register specifies the update SPI command byte 3 to the
CDCE62005 Clock Generator #3
7-0 : SPI command data field bit 27 to bit 20
84
Read/Write
R/W
Read/Write
R/W
Read/Write
R/W
Read/Write
R/W
Register Address :
SPI Base + 28h
Register Name :
CLK-GEN 3 Read Data Byte 0 Register
Default Value:
00h
Attribute :
Read Only
Bit
Description
7-0
This register reflects the read back data byte 0 from the
CDCE62005 Clock Generator #3 for responding to a host SPI
Read Command.
3-0: The SPI read back register address [3-0] for a SPI Read
Command
7-4 : The SPI read back data bit 3 to bit 0 for a SPI Read
Command.
Register Address :
SPI Base + 29h
Register Name :
CLK-GEN 3 Read Data Byte 1 Register
Default Value:
00h
Attribute :
Read Only
Bit
Description
7-0
This register reflects the read back data byte 1 from the
CDCE62005 Clock Generator #3 for responding to a host SPI
Read Command.
7-0 : The SPI read back data bit 11 to bit 4 for a SPI Read
Command.
Register Address :
SPI Base + 2Ah
Register Name :
CLK-GEN 3 Read Data Byte 2 Register
Default Value:
00h
Attribute :
Read Only
Bit
Description
7-0
This register reflects the read back data byte 1 from the
CDCE62005 Clock Generator #3 for responding to a host SPI
Read Command.
7-0 : The SPI read back data bit 19 to bit 12 for a SPI Read
Command.
Register Address :
SPI Base + 2Bh
Register Name :
CLK-GEN 3 Read Data Byte 3 Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
7-0
This register reflects the read back data byte 1 from the
CDCE62005 Clock Generator #3 for responding to a host SPI
Read Command.
7-0 : The SPI read back data bit 27 to bit 20 for a SPI Read
Command.
85
Read/Write
RO
Read/Write
RO
Read/Write
RO
Read/Write
RO
Register Address :
Register Name :
SPI Base + 2Ch ~ 2Fh
Reserved
Register Address :
SPI Base + 30h ~ 3Fh(TBD)
Register Name :
PM Bus Control Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
7-0
TBD
Register Address :
Register Name :
Read/Write
R/W
SPI Base + 40h ~ 4Fh
Reserved
Register Address :
SPI Base + 50h
Register Name :
ICS 557 Clock Selection Control Register
Default Value:
00h
Attribute :
Read/Write
Bit
Description
0
FPGA_ICS557_SEL : This bit can be updated by the DSP software
to drive a high or low value on the FPGA_ICS557_SEL pin.
0 : FPGA_ICS557_SEL drives low
1 : FPGA_ICS557_SEL drives high
7-1
Reserved
86
Read/Write
R/W
RO
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Product Applications
Amplifiers amplifier.ti.com
Data Converters dataconverter.ti.com
DSP dsp.ti.com
Clocks and Timers www.ti.com/clocks
Interface interface.ti.com
Logic logic.ti.com
Power Mgmt power.ti.com
Microcontrollers microcontroller.ti.com
RFID www.ti-rfid.com
RF/IF and ZigBee® Solutions www.ti.com/lprf
Audio www.ti.com/audio
Automotive www.ti.com/automotive
Broadband www.ti.com/broadband
Digital Control www.ti.com/digitalcontrol
Medical www.ti.com/medical
Military www.ti.com/military
Optical Networking www.ti.com/opticalnetwork
Security www.ti.com/security
Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
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