Datasheet

CMOS LDO Regulators for Portable Devices
1ch 150mA
CMOS LDO Regulators
BH□□SA3WGUT Series
No.11020EAT10
●Description
The BH□□SA3WGUT Series are 150 mA output CMOS regulators that deliver a highly stable output voltage with the
precision of ± 1%. With the use of ROHM’s original technology, the load regulation of only 2 mV, 100 mV I/O drop voltage,
and the load transient of 50mV (at 1mA⇔100mA) have been achieved. The VCSP60N1 package is extremely compact as
just 0.96 mm × 0.96 mm, and the IC's enhanced protection circuits contribute to improved application safety.
●Features
1) High accuracy output voltage: ± 1%
2) I/O drop voltage: 100 mV (at 100 mA)
3) Load Transient ⊿Vout : 50mV (at 1mA⇔100mA)
4) Stable with ceramic capacitors (1µF)
5) Low bias current: 40 µA
6) High ripple rejection ratio: 63 dB (Typ., 1 kHz)
7) Output voltage on/off control
8) Built-in overcurrent (short) and thermal shutdown circuits
9) Uses the VCSP60N1 WL-CSP package.
●Applications
Battery-driven portable devices, etc.
●Product Line
■150 mA
BH□□SA3WGUT Series
Product name
BH□□SA3WGUT
1.8
2.8
3.0
Package
○
○
○
VCSP60N1
Model name: BH□□SA3W□
a
b
Symbol
a
b
Description
Output voltage specification
□□
Output voltage (V)
18
1.8 V (Typ.)
28
2.8 V (Typ.)
30
3.0 V (Typ.)
Package GUT: VCSP60N1
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© 2012 ROHM Co., Ltd. All rights reserved.
1/14
2012.02 - Rev.A
Technical Note
BH□□SA3WGUT Series
●Absolute Maximum Ratings
Parameter
Symbol
Ratings
Unit
VMAX
-0.3 to +6.5
V
Pd
530*1
mW
TjMAX
125
℃
Operating temperature range
Topr
-40 to +85
℃
Storage temperature range
Tstg
-55 to +125
℃
Applied supply voltage
Power dissipation
Maximum junction temperature
*1:
Derated at 5.3 mW/℃ for temperature above Ta = 25℃, when mounted on a glass epoxy PCB (7 mm  7 mm  0.8 mm).
●Recommended Operating Ranges (not to exceed Pd)
Parameter
Power supply voltage
Output current
Symbol
Ratings
Unit
VIN
2.2 to 5.5
V
IOUT
0 to 150
mA
●Recommended Operating Conditions
Parameter
Symbol
Ratings
Min.
Typ.
Max.
Unit
Input capacitor
CIN
0.5*2
1.0
—
µF
Output capacitor
CO
0.7*2
1.0
—
µF
*2:
Conditions
The use of ceramic
capacitors is recommended.
The use of ceramic
capacitors is recommended.
The minimum value of capacitance must be met this specifications over full operating conditions.
(ex. Temperature, DC bias, aging conditions)
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2/14
2012.02 - Rev.A
Technical Note
BH□□SA3WGUT Series
●Electrical Characteristics (Unless otherwise specified, Ta = 25℃, VIN = VOUT + 1.0 V*6, STBY = 1.5 V, CIN = 1 µF, CO = 1 µF)
Limits
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
Output voltage 1
V
VOUT
VOUT1
IOUT = 1 mA, Ta = 25℃,
VOUT≧2.5V
VOUT
× 1.01
VOUT
 0.99
VOUT
- 25 mV
VOUT
+ 25 mV
IOUT = 1mA, Ta = 25℃,
VOUT＜2.5V
Output voltage 2
VOUT2
VOUT
 0.97
VOUT
VOUT
× 1.03
V
IOUT = 0 to 150 mA
VIN = VOUT+0.5V to 5.5V
Ta = -40℃ to 85℃*3,4,5
Circuit current
IGND
—
40
72
µA
IOUT = 0 mA
Ta = -40℃ to 85℃*4
Circuit current (STBY)
ICCST
—
—
1.0
µA
STBY = 0 V
RR
50
63
—
dB
Input output voltage difference
VSAT
—
100
150
mV
Line regulation
VDLI
—
2
20
mV
IOUT = 10 mA
*5
VIN = VOUT + 0.5 V to 5.5 V
Load regulation1
VDLO1
—
2
30
mV
IOUT = 1 mA to 100 mA
Load regulation1
VDLO1
—
4
45
mV
IOUT = 1 mA to 150 mA
Maximum Output Current
IOMAX
150
—
—
mA
VIN = VOUT + 0.5 V*6
Limit current
ILMAX
—
400
—
mA
VO = VOUT  0.98
Short current
ISHORT
—
50
200
mA
VO = 0 V
ISTBY
0.5
1.3
3.6
µA
ON
VSTBH
1.2
—
VIN
V
OFF
VSTBL
-0.2
—
0.2
V
Ripple rejection ratio
STBY pin current
VRR = -20 dBv,
fRR = 1 kHz,
IOUT = 10 mA
VIN = 0.98  VOUT,
IOUT = 100 mA
(except BH18SA3WGUT)
Ta = -40℃ to 85℃*4
IOUT = 150 mA
STBY control voltage
*This product is not designed for protection against radio active rays.
*3: Operating condition are limited by Pd.
*4: Typical values apply for Ta=25℃.
*5: VIN=3.0V to 5.5V for BH18SA3WGUT.
*6: VIN=3.5V for BH18SA3WGUT.
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3/14
2012.02 - Rev.A
Technical Note
BH□□SA3WGUT Series
●Reference data BH18SA3WGUT (Ta=25℃ unless otherwise specified.)
1.83
2.5
70
1.82
2.0
60
1.5
T=85℃
T=25℃
1.0
T=-40℃
1.81
50
1.8
1.79
T=85℃
T=25℃
0.5
1.78
0.0
1.77
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
T=85℃
20
T=25℃
T=-40℃
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
5.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Fig.2 Line Regulation
Fig.3 Circuit Current
2.4
60
1.83
2.1
50
T =85℃
1.82
1.8
T =-40℃
1.8
1.79
1.78
Output Voltage (V)
Gnd Current (uA)
T =25℃
1.81
40
30
T=85℃
T=25℃
T=-40℃
20
10
1.76
0
50
100
Output Current (mA)
0.9
0
0
150
1.2
0.3
0
1.75
Fig.4 Load Regulation
50
100
Output Current (mA)
150
0
70
60
60
1.82
55
1.8
VCC=5.5V
VCC=3.5V
VCC=3.0V
1.78
1.77
50
45
40
30
25
1.75
20
-15
10
35
Temp (°C)
60
VCC=5.5V
VCC=3.5V
VCC=3.0V
35
1.76
-40
-15
10
35
60
85
Temp (°C)
Fig.7 VOUT - Temp
50
40
30
20
0
2
2.5
3
3.5
4
4.5
Input Voltage [V]
Fig.9
Fig.8 IGND - Temp
5
5.5
R.R. - VIN
3
Output Noise Density [μV/√Hz
90
80
70
60
50
40
30
20
10
0
100
600
10
-40
85
Ripple Rijection R.R. [dB]
65
1.83
Gnd Current (uA)
70
1.84
1.81
200
400
Output Current (mA)
Fig.6 OCP Threshold
Fig.5 IOUT - IGND
1.85
1.79
T=85℃
T=25℃
T=-40℃
1.5
0.6
1.77
Ripple Rejection R.R.[dB]
0.5
Input Voltage (V)
Fig.1 Output Voltage
Output Voltage (V)
30
0
0
5.5
40
10
T=-40℃
Input Voltage (V)
Output Voltage (V)
Gnd Current (uA )
Output V oltage (V )
Output V oltage (V )
80
1000
10000
100000
Frequency f [Hz]
2.5
2
1.5
1
0.5
0
0.1
1
10
100
Frequency f [kHz]
Fig.10 R.R. - Freq.
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© 2012 ROHM Co., Ltd. All rights reserved.
Fig.11 Noise - Freq.
4/14
2012.02 - Rev.A
Technical Note
BH□□SA3WGUT Series
●Reference data BH18SA3WGUT (Ta=25℃ unless otherwise specified.)
VIN
VIN=4.5V
VIN
VIN=4.5V
VIN
VIN=4.5V
VIN=3.5V
VIN=3.5V
VOUT
Fig.12
VIN=3.5V
VOUT
ΔV=2.7mV
Transient_response
(Ta=-40℃)
Fig.13
Transient_response
(Ta=25℃)
STBY
STBY=0V
Transient_response
(Ta=85℃)
STBY
STBY
STBY=0V
STBY=0V
VOUT
VOUT
Fig.15 START_UP
(Ta=-40℃)
Fig.14
ΔV=2.0mV
STBY=1.5V
STBY=1.5V
STBY=1.5V
VOUT
ΔV=2.15mV T
Fig.16 START_UP
(Ta=25℃)
VOUT
Fig.17 START_UP
(Ta=85℃)
IOUT
IOUT
IOUT
Io=1→30mA
Io=1→30mA
Io=1→30mA
VOUT
VOUT
VOUT
ΔV=15.0mV
Fig.18 Load_response
(Io=1→30mA)
(Ta=-40℃)
ΔV=15.2mV
Fig.19 Load_response
(Io=1→30mA)
(Ta=25℃)
ΔV=16.4mV
Fig.20 Load_response
(Io=1→30mA)
(Ta=85℃)
IOUT
IOUT
IOUT
Io=30→1mA
Io=30→1mA
Io=30→1mA
VOUT ΔV=17.8mV
VOUT ΔV=20.0mV
VOUT
ΔV=19.8mV
Fig.21 Load_response
(Io=30→1mA)
(Ta=-40℃)
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© 2012 ROHM Co., Ltd. All rights reserved.
Fig.22 Load_response
(Io=30→1mA)
(Ta=25℃)
5/14
Fig.23 Load_response
(Io=30→1mA)
(Ta=85℃)
2012.02 - Rev.A
Technical Note
BH□□SA3WGUT Series
●Reference data BH28SA3WGUT (Ta=25℃ unless otherwise specified.)
3
2.83
2.5
2.82
90
2
1.5
1
70
Gnd Current (uA)
Output Voltage (V)
Output Voltage (V
80
2.81
2.8
2.79
T=85℃
T=85℃
0.5
2.77
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
30
T=85℃
T=25℃
T=-40℃
0
0
5.5
40
10
T=-40
T=-40
50
20
T=25℃
2.78
T=25℃
60
1
2
3
4
5
0
0.5
1
Fig.24 Output Voltage
Fig.25 Line Regulation
2.85
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Input Voltage (V)
Input Voltage (V)
Fig.26 Circuit Current
60
3
50
2.5
2.82
Gnd Current (uA)
Output Voltage (V)
2.83
2.81
2.8
2.79
2.78
Output Voltage (V)
2.84
40
T =85℃
T =25℃
30
T =-40℃
20
10
T=25℃
2.76
T=-40℃
1
0.5
T=-40℃
2.75
0
0
50
100
150
0
0
50
100
Output Current (mA)
Output Current (mA)
Fig.27 Load Regulation
150
70
80
60
70
VIN=5.5V
50
40
VIN=5.5V
VIN=3.8V
30
VIN=3.3V
20
VIN=3.8V
2.77
Ripple Rejection R.R. [dB
Gnd Current (uA)
2.81
VIN=3.3V
10
2.75
-40
10
35
60
85
400
500
60
50
40
30
20
0
-40
Temp (℃)
-15
10
35
60
85
Temp (℃)
Fig.30 VOUT - Temp
Fig.31 IGND - Temp
2.5
3
3.5
4
4.5
Input Voltage [V]
5
5.5
Fig.32 R.R. - VIN
3
Output Noise Density [μV/√Hz]
80
70
60
50
40
30
20
10
2.5
2
1.5
1
0.5
0
0
100
200
300
Output Current (mA)
10
0
-15
100
Fig.29 OCP Threshold
2.83
2.79
0
Fig.28 IOUT - IGND
2.85
Output Voltage (V)
T=25℃
1.5
T=85℃
2.77
Ripple Rejection R.R.[dB]
T=85℃
2
1000
10000
100000
Frequency f [Hz]
Fig.33 R.R. - Freq.
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© 2012 ROHM Co., Ltd. All rights reserved.
0.1
1
10
Frequency f [kHz]
100
Fig.34 Noise - Freq.
6/14
2012.02 - Rev.A
Technical Note
BH□□SA3WGUT Series
●Reference data BH28SA3WGUT (Ta=25℃ unless otherwise specified.)
VIN=4.5V
VIN=4.5V
VCC
VIN=3.5V
VIN=3.5V
VOUT
Transient_response
(Ta=-40℃)
STBY
STBY=1.5V
STBY=0V
Fig.36
VCC
VIN=3.5V
VOUT ΔV=0mV
Fig.35
VIN=4.5V
VCC
ΔV=0mV
Transient_response
(Ta=25℃)
VOUT
Fig.37
STBY=1.5V
STBY=1.5V
STBY=0V
STBY=0V
ΔV=0mV
Transient_response
(Ta=85℃)
VOUT
Fig.38 START_UP
(Ta=-40℃)
Fig.39 START_UP
(Ta=25℃)
IOUT
IOUT
Io=1→30mA
Io=1→30mA
VOUT
ΔV=16.8mV
Fig.41 Load_response
(Io=1→30mA)
(Ta=-40℃)
Fig.40 START_UP
(Ta=85℃)
IOUT
VOUT ΔV=15.6mV
Fig.42 Load_response
(Io=1→30mA)
(Ta=25℃)
Io=1→30mA
VOUT
ΔV=16.8mV
Fig.43 Load_response
(Io=1→30mA)
(Ta=85℃)
IOUT
Io=30→1mA
ΔV=17.6mV
Fig.44 Load_response
(Io=30→1mA)
(Ta=-40℃)
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VOUT
ΔV=16.4mV
Fig.46 Load_response
(Io=30→1mA)
(Ta=25℃)
7/14
ΔV=17.4mV
Fig.46 Load_response
(Io=30→1mA)
(Ta=85℃)
2012.02 - Rev.A
Technical Note
BH□□SA3WGUT Series
●Reference data BH30SA3WGUT (Ta=25℃ unless otherwise specified.)
4
100
3.06
90
3.5
3.04
80
2
1.5
1
T=-85℃
T=25℃
T=-40℃
0.5
GND Current (uA)
T=85℃
3.02
2.5
Output Voltage (V)
Output Voltage (V)
3
T=25℃
T=-40℃
3
2.98
1
1.5
2
2.5
50
40
30
T=-85℃
T=25℃
T=-40℃
20
2.96
2.94
0.5
60
10
0
0
70
3
3.5
4
4.5
5
5.5
0
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
0.5
1
1.5
Input Voltage (V)
Input Voltage (V)
Fig.47 Output Voltage
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Fig.48 Line Regulation
Fig.49 Circuit Current
4.0
3.04
60
3.5
50
3.0
3.03
3.02
T=25℃
T=-40℃
3
2.99
2.98
2.97
40
T =85℃
30
T =25℃
T =-40℃
20
10
0
50
100
150
0
200
2.0
T=-85℃
T=25℃
T=-40℃
1.5
1.0
50
100
150
0.0
200
0
Output Current (mA)
Output Current(mA)
Fig.50 Load Regulation
Fig.51 IOUT - IGND
50 100 150 200 250 300 350 400 450 500 550
Output Current (mA)
Fig.52 OCP Threshold
70
3.2
90
65
3.15
80
VCC=5.5V
VCC＝3.5V
VCC=3.0V
3.05
60
3
2.95
2.9
55
Ripple Rijection R.R [dB]
3.1
Gnd Current (uA)
Output Voltage (V)
2.5
0.5
0
2.96
VCC=5.5V
VCC＝3.5V
VCC=3.0V
50
45
40
2.85
35
2.8
70
60
50
40
30
20
10
0
30
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
-40 -30 -20 -10 0
Temp (°C)
10 20 30 40 50 60 70 80
T emp (°C)
3
3.5
4
4.5
Input Voltage [V]
5
5.5
Fig.55 R.R. - VIN
Fig.54 IGND - Temp
Fig.53 VOUT - Temp
3
Output Noise Density [μV/√Hz]
90
80
Ripple Rejection R.R.[dB]
Output Voltage (V)
3.01
GND Current (uA)
Output Voltage(V)
T=85℃
70
60
50
40
30
20
10
2.5
2
1.5
1
0.5
0
0
100
1000
10000
100000
Frequency f [Hz]
Fig.56 R.R. - Freq.
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0.1
1
10
Frequency f [kHz]
100
Fig.57 Noise - Freq.
8/14
2012.02 - Rev.A
Technical Note
BH□□SA3WGUT Series
●Reference data BH30SA3WGUT (Ta=25℃ unless otherwise specified.)
VIN
VIN=4.5V
VIN
VIN=4.5V
VIN=3.5V
VIN=3.5V
VIN=3.5V
VOUT
VOUT ΔV=0mV
Fig.58
Transient_response
(Ta=-40℃)
Fig.59
Transient_response
(Ta=25℃)
Transient_response
(Ta=85℃)
STBY
STBY
STBY=0V
STBY=0V
VOUT
Fig.61 START_UP
(Ta=-40℃)
Fig.60
ΔV=0mV
STBY=1.5V
STBY
STBY=0V
VOUT
ΔV=0mV
STBY=1.5V
STBY=1.5V
VIN
VIN=4.5V
VOUT
VOUT
Fig.62 START_UP
(Ta=25℃)
Fig.63 START_UP
(Ta=85℃)
IOUT
IOUT
IOUT
Io=1→30mA
Io=1→30mA
Io=1→30mA
VOUT ΔV=14.6mV
VOUT
VOUT
ΔV=15.2mV
Fig.64
Load_response
(Ta=-40℃)
(Io=1→30mA)
Fig.65
Load_response
(Ta=25℃)
(Io=1→30mA)
ΔV=15.6mV
Fig.66
Load_response
(Ta=85℃)
(Io=1→30mA)
IOUT
IOUT
IOUT
Io=30→1mA
Io=30→1mA
Io=30→1mA
VOUT
VOUT ΔV=16.8mV
ΔV=16.6mV
Fig.67
Load_response
(Ta=-40℃)
(Io=30→1mA)
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Fig.68
Load_response
(Ta=25℃)
(Io=30→1mA)
9/14
VOUT
ΔV=16.0mV
Fig.69
Load_response
(Ta=85℃)
(Io=30→1mA)
2012.02 - Rev.A
Technical Note
BH□□SA3WGUT Series
●Block Diagram, Recommended Circuit Diagram, and Pin Assignment Diagram
BH□□SA3WGUT
VIN
VIN
B2
VO LTAGE
REFERENCE
Cin
VOUT
VO UT
Pin
No.
Symbol
B2
VIN
B1
VOUT
Voltage output
A1
GND
Ground
A2
STBY
Output voltage on/off control
(High: ON, Low: OFF)
Function
Power supply input
B1
G ND
A1
THERMA L
PROTECTION
Co
OVER CURRENT
PROTECTION
VSTBY
STBY
A2
CONTRO L
BLOCK
Cin: 1.0 F
Co: 1.0 F
1PIN MARK
Fig.70
1
2
A
B
TOP VIEW (Mark side)
●Power Dissipation (Pd)
1. Power dissipation (Pd)
Power dissipation calculations include estimates of power dissipation characteristics and internal IC power consumption
and should be treated as rough guidelines. In the event that the IC is used in an environment where this power
dissipation is exceeded, the attendant rise in the chip's temperature will trigger the thermal shutdown circuit, reducing
the current capacity and otherwise degrading the IC's design performance. Allow for sufficient margins so that this
power dissipation is not exceeded during IC operation.
Calculating the maximum internal IC power consumption (PMAX)
PMAX = (VIN - VOUT)  IOUT (MAX.)
2.
VIN: Input voltage
VOUT: Output voltage
IOUT (MAX): Output current
Power dissipation/power dissipation reduction (Pd)
VCSP60N1
0.6
530 mW
Board: 7 mm  7 mm  0.8 mm
Material: Glass epoxy PCB
Pd[W]
0.4
0.2
0
0
25
50
75
100
125
Ta[℃]
Fig.71 VCSP60N1 Power Dissipation/Power Dissipation Reduction (Example)
*Circuit design should allow a sufficient margin for the temperature range so that PMAX < Pd.
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10/14
2012.02 - Rev.A
Technical Note
BH□□SA3WGUT Series
●Input Output Capacitors
It is recommended to insert bypass capacitors between input and GND pins, positioning them as close to the pins as
possible. These capacitors will be used when the power supply impedance increases or when long wiring routes are used,
so they should be checked once the IC has been mounted.
Ceramic capacitors generally have temperature and DC bias characteristics. When selecting ceramic capacitors, use X5R or
X7R or better models that offer good temperature and DC bias characteristics and high torelant voltages.
Typical ceramic capacitor characteristics
100
80
60
10 V torelance
16 V torelance
40
20
0
0
1
2
3
4
50 V torelance
100
95
Capacitance
rate of change
静電容量変化率
[%] (%)
50 V
torelance
Capacitance
of change
(%) (%)
Capacitancerate
rate
of change
Capacitance
Capacitancerate
rateofofchange
change(%)
(%)
120
100
120
90
16 V torelance
85
10 V torelance
80
75
70
0
1
2
3
4
X7R
X5R
80
Y5V
60
40
20
0
-25
DC bias Vdc (V)
DC bias Vdc (V)
Fig.72 Capacitance vs Bias (Y5V)
Fig.73 Capacitance vs Bias
(X5R, X7R)
0
25
T emp[℃ ]
50
75
Fig.74 Capacitance vs Temperature
(X5R, X7R, Y5V)
●Output Capacitors
Ceramic capacitors for stopping oscillation must be inserted between output and GND pins, positioned as close to the pins
as possible. Larger output capacitance values provide greater stability as well as improved output load variation and other
characteristics.
BH□□SA3WGUT
Fig.75 Stable Operating Region Characteristics (Example)
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© 2012 ROHM Co., Ltd. All rights reserved.
11/14
2012.02 - Rev.A
Technical Note
BH□□SA3WGUT Series
●Other Precautions
・Absolute maximum ratings
This product is subject to a strict quality management regime during its manufacture. However, damage may result if
absolute maximum ratings such as applied voltage and operating temperature range are exceeded. Assumptions should
not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety
measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum
ratings may be exceeded is anticipated.
・Setting of heat
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
・Pin short and mistake fitting
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by the
presence of a foreign object may result in damage to the IC.
・Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit. The thermal shutdown circuit is designed only to shut the IC off to
prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use
the IC after operating this circuit or use the IC in an environment where the operation of the thermal shutdown circuit is
assumed.
・Overcurrent protection circuit
The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This
circuit serves to protect the IC from damage when the load is shorted. The protection circuits use fold-back type current
limiting and are designed to limit current flow by not latching up in the event of a large and instantaneous current flow
originating from a large capacitor or other component. These protection circuits are effective in preventing damage due to
sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous
operation or transitioning of the protection circuits.
・Actions in strong magnetic fields
Use caution when using the IC in the presence of a strong magnetic field as such environments may occasionally cause
the chip to malfunction.
・Mutual impedance
Power supply and ground wiring should reflect consideration of the need to lower common impedance and minimize ripple
as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and
capacitance).
・influence of strong light
Exposure of the IC to strong light sources such as infrared light from a halogen lamp may cause the IC to malfunction.
When it is necessary to use the IC in such environments, implement measures to block exposure to light from the light
source. During testing, exposure to neither fluorescent lighting nor white LEDs had a significant effect on the IC.
・GND potential
Ensure a minimum GND pin potential in all operating conditions.
In addition, ensure that no pins other than the GND pin carry a voltage less than or equal to the GND pin, including during
actual transient phenomena.
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© 2012 ROHM Co., Ltd. All rights reserved.
12/14
2012.02 - Rev.A
Technical Note
BH□□SA3WGUT Series
●Back Current
In applications where the IC may be exposed to back current flow, it is recommended to create a route to dissipate this
current by inserting a bypass diode between the VIN and VOUT pins.
Back current
VIN
OUT
STBY
GND
Fig.76 Example Bypass Diode Connection
●Testing on Application Boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure, and
use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process.
●Regarding Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of
parasitic elements.
For example, when a resistor and transistor are connected to pins as shown in Fig.77
○the P/N junction functions as a parasitic diode when GND > (Pin A) for the resistor or GND > (Pin B) for the transistor
(NPN).
○Similarly, when GND > (Pin B) for the transistor (NPN), the parasitic diode described above combines with the N layer
of other adjacent elements to operate as a parasitic NPN transistor.
The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of
the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC
malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will trigger
the operation of parasitic elements, such as by the application of voltages lower than the GND (P substrate) voltage to input
pins.
Resistor
(Pin B)
Transistor (NPN)
(Pin B)
C
C
E
B
～
～
～
～
(Pin A)
～
～
B
E
GND
N
P+
P+
P
P
GND
Parasitic
elements
N
N
N
N
P substrate
Other adjacent
element
P+
N
N
P substrate
Parasitic elem ent
GND
(Pin A)
～
～
P+
Parasitic
element
GND
Parasitic elem ents
GND
Fig.77
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© 2012 ROHM Co., Ltd. All rights reserved.
13/14
2012.02 - Rev.A
Technical Note
BH□□SA3WGUT Series
●Selecting a Model Name When Ordering
B
H
ROHM
model name
1
8
S
Output
voltage
A
3
Series
Chip sizepackage
W
G
U
T
Shutdown
switch
Packege
GUT: VCSP60N1
E
2
Packaging and forming specification
E2: Embossed tape and reel
VCSP60L1(BHXXSA3WGUT)
<Tape and Reel information>
0.6±0.075
0.96±0.05
0.96±0.05
0.21±0.05
1PIN MARK
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
B
0.5
B
3000pcs
0.23±0.05
0.06 S
Embossed carrier tape (heat sealing method)
Quantity
Direction
of feed
S
4-φ0.3±0.05
0.05 A B
Tape
A
1
0.23±0.05
1pin
2
0.5
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
(Unit : mm)
Reel
14/14
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2012.02 - Rev.A
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001