ROHM BU7251SG-E2

TECHNICAL NOTE
General-purpose Operational Amplifier / Comparator
Low Voltage
CMOS Comparator
BU7251G,BU7251SG, BU7231G,BU7231SG,
BU7252F/FVM,BU7252S F/FVM, BU7232F/FVM,BU7232S F/FVM
● Description
CMOS comparator BU7251/BU7231family and
BU7252/BU7232 family are input full swing and
push pull output comparator. These ICs integrate
one op-amp or two independent op-amps and phase
compensation capacitor on a single chip.
The features of these ICs are low operating supply
Voltage that is +1.8V to +5.5V(single supply) and
low supply current, extremely low input bias current.
High speed
Single
(BU7251SG:105℃)
BU7252 F/FVM
Dual
Low pow er
BU7251 G
(BU7252S F/FVM:105℃)
Single
BU7231 G
(BU7231SG:105℃)
BU7232 F/FVM
Dual
(BU7232S F/FVM:105℃)
● Features
1)
2)
3)
4)
5)
6)
Low operating supply voltage (+1.8[V]~+5.5[V])
+1.8 [V]~+5.5[V](single supply)
±0.9[V]~±2.75[V](split supply)
Input and Output full swing
Push-pull output type
High speed operation
(BU7251 family, BU7252 family)
Low supply current
(BU7231 family, BU7232 family)
7)
8)
Internal ESD protection
Human body model (HBM) ±4000[V](Typ.)
Wide temperature range
-40[℃]~+85[℃]
(BU7251G,BU7252 family, BU7231G, BU7232 family)
-40[℃]~+105[℃]
(BU7251SG,BU7252S family, BU7231SG,BU7232S family)
● Pin Assignments
IN- 1
VSS 2
5
VDD
IN1- 2
-
8 VDD
OUT1 1
CH1
7 OUT2
- +
+
IN+ 3
IN1+ 3
4 OUT
SSOP5
BU7251G
BU7251SG
BU7231G
BU7231SG
VSS 4
SOP8
BU7252F
BU7252SF
BU7232F
BU7232SF
CH2
+ -
6 IN25 IN2+
MSOP8
BU7252FVM
BU7252SFVM
BU7232FVM
BU7232SFVM
2007. October
● Absolute maximum ratings (Ta=25[℃])
Rating
Parameter
Symbol
Supply Voltage
BU7251G,BU7252 F/FVM
BU7231G,BU7232 F/FVM
Unit
BU7251SG,BU7252S F/FVM
BU7231SG,BU7232S F/FVM
VDD-VSS
+7
Vid
VDD-VSS
V
Input Common-mode voltage range
Vicm
(VSS-0.3) to VDD+0.3
V
Operating Temperature
Topr
Storage Temperature
Tstg
-55 to+125
℃
Tjmax
+125
℃
Differential Input Voltage (*1)
Maximum junction Temperature
V
-40 to+85
-40 to+105
℃
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application of voltage in excess of absolute maximum rating or use out absoluted maximum rated temperature environment may cause deterioration of characteristics.
(*1) The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more then VEE.
● Electrical characteristics
○BU7251 family, BU7252 family (Unless otherwise specified VDD=+3[V], VSS=0[V], Ta=25[℃])
Guaranteed Limit
Parameter
Symbol
Temperature
range
BU7251G
BU7251SG
BU7252 F/FVM
BU7252S F/FVM
Min.
Typ.
Max.
Min.
Typ.
Max.
Unit
Condition
-
Input Offset Voltage (*2)(*4)
Vio
25℃
-
1
11
-
1
11
mV
Input Offset Current (*2)
Iio
25℃
-
1
-
-
1
-
pA
-
Input Bias Current (*2)
Ib
25℃
-
1
-
-
1
-
pA
-
Input Common-mode voltage Range
Vicm
25℃
0
-
3
0
-
3
V
(VDD-VSS)=3[V]
Large Signal Voltage Gain
AV
25℃
-
90
-
-
90
-
dB
RL=10[kΩ]
25℃
-
15
35
-
35
65
full range
-
-
50
-
-
80
µA
RL=∞
Supply current(*4)
IDD
Power supply rejection ratio
PSRR
25℃
-
80
-
-
80
-
dB
-
Common-mode rejection ratio
CMRR
25℃
-
80
-
-
80
-
dB
-
Output source current (*3)
IOH
25℃
1
2
-
1
2
-
mA
Output sink current (*3)
IOL
25℃
3
6
-
3
6
-
mA
High Level Output Voltage (*4)
VOH
25℃
VDD-0.1
-
-
VDD-0.1
-
-
V
Low Level Output Voltage (*4)
VOL
25℃
-
-
VSS+0.1
-
-
VSS+0.1
V
RL=10[kΩ]
Tr
25℃
-
50
-
-
50
-
ns
CL=15pF 100mV over drive
Output rise time
Output fall time
VDD-0.4
VSS+0.4
RL=10[kΩ]
Tf
25℃
-
20
-
-
20
-
ns
CL=15pF 100mV over drive
Propagation delay L to H
TPLH
25℃
-
0.55
-
-
0.55
-
µs
CL=15pF 100mV over drive
Propagation delay H to L
TPHL
25℃
-
0.25
-
-
0.25
-
µs
CL=15pF 100mV over drive
(*2) Abusolute values
(*3) Reference to power dissipation under the high temperature environment and decide the output current.
Continuous short circuit is occurring the degenerate of output current characteristics.
(*4) Full range BU7251,BU7252:Ta=-40[℃] to +85[℃] BU7251S,BU7252S:Ta=-40[℃] to +105[℃]
● Electrical characteristics
○BU7231 family, BU7232 family (Unless otherwise specified VDD=+3[V], VSS=0[V], Ta=25[℃])
Parameter
Symbol
Temperature
range
BU7231G
BU7231SG
Min.
Guaranteed limit
BU7232F/FVM
BU7232S F/FVM
Min.
Typ.
Max.
Unit
Condition
-
Input Offset Voltage (*5)
Vio
25℃
-
1
11
-
1
11
mV
Input Offset Current (*5)
Iio
25℃
-
1
-
-
1
-
pA
-
Input Bias Current (*5)
Ib
25℃
-
1
-
-
1
-
pA
-
Input Common-mode voltage Range
Vicm
25℃
0
-
3
0
-
3
V
(VDD-VSS)=3[V]
Large Signal Voltage Gain
AV
25℃
-
90
-
-
90
-
dB
RL=10[kΩ]
25℃
-
5
15
-
10
25
full range
-
-
30
-
-
50
µA
RL=∞
Supply current
IDD
Power supply rejection ratio
PSRR
25℃
-
80
-
-
80
-
dB
-
Common-mode rejection ratio
CMRR
25℃
-
80
-
-
80
-
dB
-
Output source current (*6)
IOH
25℃
1
2
-
1
2
-
mA
Output sink current (*6)
IOL
25℃
3
6
-
3
6
-
mA
High Level Output Voltage (*7)
VOH
25℃
VDD-0.1
-
-
VDD-0.1
-
-
V
Low Level Output Voltage (*7)
VOL
25℃
-
-
VSS+0.1
-
-
VSS+0.1
V
RL=10[kΩ]
Tr
25℃
-
50
-
-
50
-
ns
CL=15pF 100mV over drive
Output rise time
Output fall time
VDD-0.4
VSS+0.4
RL=10[kΩ]
Tf
25℃
-
20
-
-
20
-
ns
CL=15pF 100mV over drive
Propagation delay L to H
TPLH
25℃
-
1.7
-
-
1.7
-
µs
CL=15pF 100mV over drive
Propagation delay H to L
TPHL
25℃
-
0.5
-
-
0.5
-
µs
CL=15pF 100mV over drive
(*5) Abusolute values
(*6) Reference to power dissipation under the high temperature environment and decide the output current.
Continuous short circuit is occurring the degenerate of output current characteristics.
(*7) Full range BU7231,BU7232:Ta=-40[℃] to +85[℃] BU7231S,BU7232S:Ta=-40[℃] to +105[℃]
2/16
●Example of electrical characteristics
○BU7251 family
BU7251 family
BU7251G
400
200
BU7251 family
60
50
600
SUPPLY CURRENT [µA]
600
BU7251 family
800
POWER DISSIPATION [mW] .
POWER DISSIPATION [mW] .
800
BU7251SG
400
200
105℃
40
85℃
30
25℃
20
10
-40℃
0
0
50
100
AMBIENT TEMPERATURE [℃]
0
0
150
50
100
Fig.1
Fig.2
5.5V
20
3.0V
10
105℃
4
85℃
25℃
-40℃
2
120
1
Fig.4
Supply Current – Ambient Temperature
BU7251 family
30
105℃
85℃
20
10
25℃
-40℃
2
3
4
5
SUPPLY VOLTAGE [V]
0
-60
5.5V
3.0V
1.8V
5.5V
20
1.8V
10
3.0V
0
30
60
90
BU7251 family
10
0
30
60
90
120
8
-40℃
6
25℃
4
85℃
0.5
25
25℃
15
105℃
85℃
10
5
AMBIENT TEMPERATURE [℃]
Fig.10
Output Source Current – Ambient Temperature
(VOUT=VDD-0.4[V])
(*) The above date is ability value of sample, it is not guaranteed.
0.5
1.0
1.5
1.5
2.0
2.5
3.0
Fig.9
Output Source Current – Supply Voltage
(VDD=3[V])
-40℃
20
1.0
OUTPUT VOLTAGE [V]
BU7251 family
30
0.0
105℃
2
0.0
(RL=10[kΩ])
120
120
0
-30
0
-30
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
(RL=10[kΩ])
BU7251 family
Fig.8
Output Voltage Low – Ambient Temperature
OUTPUT SINK CURRENT [mA]
OUTPUT SOURCE CURRENT [mA]
4
1
-60
AMBIENT TEMPERATURE [℃]
BU7251 family
2
1.8V
2
(RL=10[kΩ])
(RL=10[kΩ])
3
3.0V
Fig.6
Output Voltage High – Ambient Temperature
0
-60
Fig.7
Output Voltage Low – Supply Voltage
5
5.5V
4
Fig.5
Output Voltage High – Supply Voltage
30
6
BU7251 family
6
6
40
0
1
3
4
5
SUPPLY VOLTAGE [V]
OUTPUT SOURCE CURRENT [mA]
40
2
50
OUTPUT VOLTAGE LOW [mV]
OUTPUT VOLTAGE LOW [mV]
50
6
0
0
-30
0
30
60
90
AM BIENT TEM PERATURE [℃]
3
4
5
SUPPLY VOLTAGE [V]
8
OUTPUT VOLTAGE HIGH [V]
30
BU7251 family
6
OUTPUT VOLTAGE HIGH [V]
SUPPLY CURRENT [µA]
40
0
-60
2
Fig.3
Supply Current – Supply Voltage
Derating Curve
BU7251 family
1.8V
1
AMBIENT TEMPERATURE [℃]
Derating Curve
50
150
2.0
2.5
3.0
OUTPUT VOLTAGE [V]
BU7251 family
20
OUTPUT SINK CURRENT [mA]
0
15
5.5V
10
3.0V
1.8V
5
0
-60
-30
0
30
60
90
120
AMBIENT TEMPERATURE [℃]
Fig.11
Output Sink Current – Output Voltage
Fig.12
Output Sink Current – Ambient Temperature
(VDD=3[V])
(VOUT=VSS+0.4[V])
BU7251G:-40[℃] to+85[℃]
3/16
BU7251SG:-40[℃] to+105[℃]
○BU7251 family
BU7251 family
5.0
85℃
2.5
105℃
0.0
25℃
7.5
INPUT OFFSET VOLTAGE [mV]
-40℃
-2.5
-5.0
-7.5
-10.0
5.0
3.0V
2.5
0.0
5.5V
-5.0
-7.5
-10.0
1
2
3
4
5
6
Fig.13
Input Offset Voltage – Supply Voltage
120
85℃
100
-40℃
80
25℃
60
2
3
4
5
SUPPLY VOLTAGE [V]
3.0V
1.8V
100
5.5V
80
-60
80
3.0V
1.8V
60
40
20
0
-60
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
60
40
20
Fig.19
Common Mode Rejection Ratio –
Ambient Temperature (VDD=3[V])
BU7251 family
100
25℃
85℃
80
-40℃
105℃
60
40
20
0
1
2
3
4
5
SUPPLY VOLTAGE [V]
BU7251 family
2.0
1.5
1.8V
1.0
5.5V
3.0V
0.5
0.0
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
Fig.20
Power Supply Rejection –
Ambient Temperature
120
-60
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
Fig.21
Propagation Delay L-H –
Ambient Temperature
BU7251 family
0.8
0.6
0.4
1.8V
0.2
5.5V
3.0V
0.0
-60
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
120
Fig.22
Propagation Delay H-L –
Ambient Temperature
(*) The above date is ability value of sample, it is not guaranteed.
6
(VDD=3[V])
80
0
-60
4
Fig.18
Common Mode rejection Ratio – Supply Voltage
100
120
1
2
3
INPUT VOLTAGE [V]
120
120
BU7251 family
120
0
Fig.15
Input offset voltage – Input Voltage
PROPAGATION DELAY L-H [µs]
5.5V
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
Fig.17
Large Signal Voltage Gain –
Ambient Temperature
POWER SUPPLY REJECTION RATIO [dB]
100
25℃
(VDD=3[V])
120
Fig.16
Large Signal Voltage Gain – Supply Voltage
120
-40℃
-10
-1
BU7251 family
140
6
BU7251 family
105℃
-5
120
60
1
COMMON MODE REJECTION RATIO [dB]
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
160
LARGE SIGNAL VOLTAGE GAIN [dB]
LARGE SIGNAL VOLTAGE GAIN [dB]
140
85℃
0
(Vicm=VDD, Vout=0.1[V])
BU7251 family
105℃
5
Fig.14
Input Offset Voltage – Ambient Temperature
(Vicm=VDD, Vout=0.1[V])
160
10
-15
-60
SUPPLY VOLTAGE [V]
PROPAGATION DELAY H-L [µs]
1.8V
-2.5
BU7251 family
15
COMMON MODE REJECTION RATIO [dB]
INPUT OFFSET VOLTAGE [mV]
7.5
BU7251 family
10.0
INPUT OFFSET VOLTAGE [mV]
10.0
BU7251G:-40[℃] to+85[℃]
4/16
BU7251SG:-40[℃] to+105[℃]
120
○BU7252 family
POWER DISSIPATION [mV]
POWER DISSIPATION [mV]
800
600
BU7252F
BU7252FVM
400
200
0
0
85
50
100
AMBIENT TEMPERATURE [℃] .
BU7252 family
1000
800
600
BU7252SF
BU7252SFVM
400
200
0
150
0
105
50
100
AMBIENT TEMPERATURE [℃] .
Fig.1
100
50
0
150
1
2
3
4
5
SUPPLY VOLTAGE [V]
6
Fig.3
Supply Current – Supply Voltage
BU7252 family
8
25℃
-40℃
Derating Curve
BU7252 family
105℃
85℃
Fig.2
Derating Curve
150
BU7252 family
150
SUPPLY CURRENT [µA]
BU7252 family
1000
BU7252 family
8
100
5.5V
3.0V
1.8V
50
0
105℃
85℃
4
25℃
-40℃
2
0
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
1
40
30
105℃
85℃
20
10
25℃
3
4
5
SUPPLY VOLTAGE [V]
40
5.5V
30
3.0V
20
10
1.8V
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
BU7252 family
3
3.0V
2
1.8V
1
0
-60
0
30
60
90
0
20
15
10
85℃
105℃
5
Fig.10
Output Source Current –
Ambient Temperature
(*) The above date is ability value of sample, it is not guaranteed.
1
1.5
2
2.5
3
Fig.9
Output Source Current – Output Voltage
(VDD=3[V])
25℃
AMBIENT TEMPERATURE [℃]
0.5
BU7252 family
20
-40℃
25
120
85℃
105℃
2
OUTPUT VOLTAGE [V]
0
-30
4
120
BU7252 family
30
OUTPUT SINK CURRENT [mA]
OUTPUT SOURCE CURRENT [mA]
5.5V
25℃
6
(RL=10[kΩ])
(RL=10[kΩ])
4
-40℃
Fig.8
Output Voltage Low – Ambient Temperature
Fig.7
Output Voltage Low – Supply Voltage
5
8
0
-60
6
120
BU7252 family
10
OUTPUT SINK CURRENT [mA]
3
4
5
SUPPLY VOLTAGE [V]
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
Fig.6
Output Voltage High – Ambient Temperature
0
2
1.8V
2
(RL=10[kΩ])
-40℃
1
3.0V
-60
BU7252 family
50
0
4
6
(RL=10[kΩ])
OUTPUT VOLTAGE LOW [mV]
50
2
Fig.5
Output Voltage High – Supply Voltage
Fig.4
Supply Curreny – Ambient Temperature
BU7252 family
6
0
120
OUTPUT SOURCE CURRENT [mA]
-60
OUTPUT VOLTAGE LOW [mV]
OUTPUT VOLTAGE HIGH [V]
OUTPUT VOLTAGE HIGH [V]
SUPPLY CURRENT [µA]
5.5V
6
0.0
0.5
1.0
1.5
2.0
2.5
3.0
OUTPUT VOLTAGE [V]
Fig.11
Output Sink Current – Output Voltage
(VDD=3[V])
15
5.5V
10
3.0V
1.8V
5
0
-60
-30
0
30
60
120
Fig.12
Output Sink Current – Ambient Temperature
(VOUT=VSS+0.4[V])
BU7252 F/FVM:-40[℃] to+85[℃] BU7252S F/FVM:-40[℃] to+105[℃]
5/16
90
AMBIENT TEMPERATURE [℃]
○BU7252 family
BU7252 family
5.0
2.5
25℃
-40℃
0.0
-2.5
85℃
7.5
INPUT OFFSET VOLTAGE [mV]
105℃
-5.0
-7.5
5.0
2.5
1.8V
0.0
-2.5
5.5V
-5.0
-7.5
-10.0
-10.0
1
2
3
4
5
(Vicm=VDD,VOUT=0.1[V])
(Vicm=VDD,VOUT=0.1[V])
105℃
120
25℃
100
85℃
80
60
-40℃
40
20
2
3
4
5
SUPPLY VOLTAGE [V]
140
120
1.8V
100
80
3.0V
60
5.5V
40
6
-60
5.5V
80
60
40
1.8V
3.0V
20
0
-60
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
85℃
-10
0
80
60
40
20
-30
0
30
60
90
BU7252 family
100
80
85℃
105℃
60
25℃
40
-40℃
20
0
1
2
3
4
5
SUPPLY VOLTAGE [V]
120
AMBIENT TEMPERATURE [℃]
Fig.20
Power Supply Rejection Ratio – Ambient
1.5
1.8V
1.0
5.5V
0.5
3.0V
0.0
-60
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
PROPAGATION DELAY H-L [µs]
0.6
1.8V
3.0V
0.2
5.5V
0.0
-60
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
120
Fig.22
Propagation Delay H-L – Ambient Temperature
(*) The above date is ability value of sample, it is not guaranteed.
BU7252 F/FVM:-40[℃] to+85[℃] BU7252S F/FVM:-40[℃] to+105[℃]
6/16
120
Fig.21
Propagation Delay L-H – Ambient Temperature
BU7251 family
0.4
6
BU7252 family
2.0
(VDD=3[V])
0.8
4
Fig.18
Common Mode Rejection Ratio
– Supply Voltage (VDD=3[V])
100
0
-60
1
2
3
INPUT VOLTAGE [V]
120
120
BU7252 family
120
120
Fig.19
Common Mode Rejection – Ambient Temperature
105℃
Fig.15
Input Offset Voltage – Input Voltage
PROPAGATION DELAY L-H [µs]
POWER SUPPLY REJECTION RATIO [dB]
BU7252 family
100
-5
Fig.17
Large Signal Voltage Gain
– Ambient Temperature
Fig.16
Large Signal Voltage Gain – Supply Voltage
120
0
(VDD=3[V])
20
1
25℃
-1
BU7252 family
160
LARGE SIGNAL VOLTAGE GAIN [dB]
140
-40℃
5
120
Fig.14
Input Offset Voltage – Ambient Temperature
160
LARGE SIGNAL VOLTAGE GAIN [dB]
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
Fig.13
Input Offset Voltage – Supply Voltage
BU7252 family
10
-15
-60
6
SUPPLY VOLTAGE[V]
COMMON MODE REJECTION RATIO [dB]
3.0V
BU7252 family
15
COMMON MODE REJECTION RATIO [dB]
INPUT OFFSET VOLTAGE [mV]
7.5
BU7252 family
10.0
INPUT OFFSET VOLTAGE [mV]
10.0
○BU7231 series
BU7231 family
BU7231G
400
200
BU7231 family
20
16
600
SUPPLY CURRENT [µA]
600
BU7231 family
800
POWER DISSIPATION [mW] .
POWER DISSIPATION [mW] .
800
BU7231SG
400
200
12
105℃
85℃
8
25℃
4
-40℃
0
0
0
0
85 100
50
AMBIENT TEMPERATURE [℃]
0
150
50
100 105
Fig.1
Derating Curve
BU7231 family
8
6
3.0V
1.8V
2
-60
-30
0
30
60
90
AM BIENT TEM PERATURE [℃]
105℃
4
85℃
25℃
-40℃
2
1
Fig.4
Supply Current – Ambient Temperature
BU7231 family
40
30
105℃
85℃
20
25℃
10
-40℃
2
4
6
SUPPLY VOLTAGE [V]
3
4
5
SUPPLY VOLTAGE [V]
BU7231 family
5.5V
20
1.8V
10
3.0V
0
-60
0
30
60
90
0
-60
3.0V
1.8V
30
60
25℃
4
85℃
90
25
-40℃
25℃
20
15
105℃
10
85℃
5
120
AMBIENT TEMPERATURE [℃]
Fig.10
Output Source Current – Ambient Temperature
(VOUT=VDD-0.4[V])
(*) The above date is ability value of sample, it is not guaranteed.
0.0
105℃
2
0.5
1.0
1.5
2.0
2.5
0.5
1
1.5
2
2.5
3
OUTPUT VOLTAGE [V]
0
0
-40℃
6
0
Fig.9
Output Source Current – Output Voltage
(VDD=3[V])
3.0
OUTPUT VOLTAGE [V]
BU7231 family
20
OUTPUT SINK CURRENT [mA]
5.5V
-30
8
120
BU7231 family
30
OUTPUT SINK CURRENT [mA]
OUTPUT SOURCE CURRENT [mA]
4
120
BU7231 family
10
AMBIENT TEMPERATURE [℃]
BU7231 family
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
0
-30
(RL=10[kΩ])
1
-60
(RL=10[kΩ])
(RL=10[kΩ])
2
1.8V
2
(RL=10[kΩ])
Fig.8
Output Voltage Low – Ambient Temperature
3
3.0V
Fig.6
Output Voltage High – Ambient Temperature
Fig.7
Output Voltage Low – Supply Voltage
5
5.5V
4
Fig.5
Output Voltage – Supply Voltage
30
8
BU7231 family
6
6
40
0
0
2
50
OUTPUT VOLTAGE LOW [mV]
OUTPUT VOLTAGE LOW [mV]
50
6
0
0
120
OUTPUT SOURCE CURRENT [mA]
5.5V
3
4
5
SUPPLY VOLTAGE [V]
8
OUTPUT VOLTAGE HIGH [V]
OUTPUT VOLTAGE HIGH [V]
10
SUPPLY CURRENT [µA]
BU7231 family
6
4
2
Fig.3
Supply Current – Supply Voltage
Fig.2
Derating Curve
12
1
150
AMBIENT TEMPERATURE [℃]
15
5.5V
10
5
0
-60
3.0V
1.8V
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
120
Fig.11
Output Sink Current – Output Voltage
Fig.12
Output Sink Current – Ambient Temperature
(VDD=3[V])
(VOUT=VSS+0.4[V])
BU7231G:-40[℃] to+85[℃]
7/16
BU7231SG:-40[℃] to+105[℃]
○BU7231 series
BU7231 family
5.0
-40℃
2.5
25℃
0.0
105℃
-2.5
7.5
INPUT OFFSET VOLTAGE [mV]
7.5
85℃
-5.0
-7.5
-10.0
5.0
3.0V
2.5
1.8V
0.0
5.5V
-2.5
-5.0
-7.5
-10.0
1
2
3
4
5
6
SUPPLY VOLTAGE [V]
120
100
85℃
-40℃
25℃
80
60
2
3
4
5
SUPPLY VOLTAGE [V]
1.8V
120
100
3.0V
80
5.5V
-60
80
3.0V
1.8V
40
20
0
-60
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
1
2
3
INPUT VOLTAGE [V]
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
100
80
60
80
60
40
20
Fig.19
Common Mode Rejection Ratio
– Ambient Temperature (VDD=3[V])
0
-60
105℃
25℃
-40℃
20
0
1
2
3
4
5
SUPPLY VOLTAGE [V]
BU7231 family
5
4
3
5.5V
3.0V
2
1.8V
1
0
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
120
Fig.20
Power Supply Rejection Ratio
– Ambient Temperature
-60
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
Fig.21
Propagation Delay L-H
– Ambient Temperature
BU7231 family
1.5
1.2
0.9
5.5V
0.6
1.8V
3.0V
0.3
0.0
-60
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
120
Fig.22
Propagation Delay H-L
– Ambient Temperature
(*) The above date is ability value of sample, it is not guaranteed.
6
Fig.18
Common Mode Rejection Ratio
– Supply Voltage (VDD=3[V])
100
120
85℃
40
120
BU7231 family
120
4
BU7231 family
120
PROPAGATION DELAY L-H [µs]
5.5V
60
0
Fig.15
Input Offset Voltage – Input Voltage
Fig.17
Large Signal Voltage Gain
– Ambient Temperature
POWER SUPPLY REJECTION RATIO [dB]
COMMON MODE REJECTION RATIO [dB]
100
25℃
(VDD=3[V])
140
6
BU7231 family
-40℃
-10
-1
BU7231 family
Fig.16
Large Signal Voltage Gain – Supply Voltage
120
105℃
-5
120
60
1
PROPAGATION DELAY H-L [µs]
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
160
LARGE SIGNAL VOLTAGE GAIN [dB]
LARGE SIGNAL VOLTAGE GAIN [dB]
140
85℃
0
(Vicm=VDD, Vout=0.1[V])
BU7231 family
105℃
5
Fig.14
Input Offset Voltage – Ambient Temperature
(Vicm=VDD, Vout=0.1[V])
160
10
-15
-60
Fig.13
Input Offset Voltage – Supply Voltage
BU7231 family
15
COMMON MODE REJECTION RATIO [dB]
INPUT OFFSET VOLTAGE [mV]
BU7231 family
10.0
INPUT OFFSET VOLTAGE [mV]
10.0
BU7231G:-40[℃] to+85[℃]
8/16
BU7231SG:-40[℃] to+105[℃]
120
○BU7232 family
POWER DISSIPATION [mV]
600
BU7232F
BU7232FVM
400
200
0
0
40
800
600
BU7232SF
BU7232SFVM
400
200
0
150
50
100105
AMBIENT TEMPERATURE [℃] .
Fig.1
OUTPUT VOLTAGE HIGH [V]
SUPPLY CURRENT [µA]
30
5.5V
3.0V
1.8V
10
0
10
1
2
6
105℃
85℃
4
25℃
-40℃
2
120
BU7232 family
8
5.5V
6
4
3.0V
1.5V
2
2
3
4
5
6
SUPPLY VOLTAGE [V]
-60
7
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
BU7232 family
(RL=10[kΩ])
105℃
30
85℃
20
10
25℃
-40℃
40
30
20
10
1.8V
0
0
2
3
4
5
SUPPLY VOLTAGE [V]
6
Fig.7
Output Voltage Low – Supply Voltage
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
3.0V
2
1.8V
1
0
30
60
90
85℃
105℃
2
0
0.5
1
1.5
2
2.5
3
OUTPUT VOLTAGE [V]
Fig.9
Output Source Current – Output
Voltage
BU7232 family
20
-40℃
25℃
20
105℃
85℃
10
0
0
-30
4
120
BU7232 family
30
OUTPUT SINK CURRENT [mA]
5.5V
3
-60
25℃
6
(RL=10[kΩ])
BU7232 family
4
-40℃
Fig.8
Output Voltage Low – Ambient temperature
(RL=10[kΩ])
5
8
0
-60
7
OUTPUT SINK CURRENT [mA]
1
OUTPUT SOURCE CURRENT [mA]
5.5V
3.0V
BU7232 family
10
OUTPUT SOURCE CURRENT [mA]
OUTPUT VOLTAGE LOW [mV]
OUTPUT VOLTAGE LOW [mV]
40
BU7232 family
50
120
Fig.6
Output Voltage – Ambient Temperature
Fig.5
Output Voltage High – Supply Voltage
(RL=10[kΩ])
50
6
0
1
Fig.4
Supply Current – Ambient Temperature
3
4
5
SUPPLY VOLTAGE [V]
Fig.3
Supply Current – Supply Voltage
0
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
25℃
-40℃
150
BU7232 family
8
40
-60
20
Derating Curve
BU7232 family
20
105℃
85℃
Fig.2
Derating Curve
50
30
0
0
85
50
100
AMBIENT TEMPERATURE [℃] .
BU7232 family
50
OUTPUT VOLTAGE HIGH [V]
POWER DISSIPATION [mV]
800
BU7232 family
1000
SUPPLY CURRENT [µA]
BU7232 family
1000
120
AMBIENT TEMPERATURE [℃]
Fig.10
Output Source Current – Ambient Temperature
(VOUT=VDD-0.4[V])
(*) The above date is ability value of sample, it is not guaranteed.
15
5.5V
10
5
3.0V
1.8V
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
OUTPUT VOLTAGE [V]
Fig.11
Output Sink Current – Output Voltage
(VDD=3[V])
-60
-30
0
30
60
120
Fig.12
Output Sink Current – Ambient
Temperature (VOUT=VSS+0.4[V])
BU7232 F/FVM:-40[℃] to+85[℃] BU7232S F/FVM:-40[℃] to+105[℃]
9/16
90
AMBIENT TEMPERATURE [℃]
○BU7232 family
BU7232 family
5.0
2.5
85℃
25℃
-40℃
0.0
-2.5
105℃
-5.0
-7.5
-10.0
5.0
2.5
1.8V
2
3
4
5
AMBIENT TEMPERATURE [℃]
0.0
-2.5
5.5V
-5.0
-7.5
6
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
(Vicm=VDD, VOUT=0.1[V])
(Vicm=VDD, VOUT=0.1[V])
100
85℃
105℃
80
-40℃
25℃
-10
1
2
3
4
5
SUPPLY VOLTAGE [V]
140
120
1.8V
100
5.5V
80
3.0V
-60
6
80
5.5V
60
40
1.8V
3.0V
20
0
-60
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
120
BU7232 family
80
105℃
60
40
25℃
0
1
2
3
4
5
SUPPLY VOLTAGE [V]
60
40
20
BU7232 family
5
4
5.5V
3
3.0V
2
1
1.8V
0
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
Fig.20
Power Supply Rejection Ratio
– Ambient Temperature
120
-60
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
1.2
5.5V
0.9
1.8V
0.6
0.3
3.0V
0.0
-60
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
120
Fig.22
Propagation Delay H-L – Ambient Temperature
(*) The above date is ability value of sample, it is not guaranteed.
BU7232 F/FVM:-40[℃] to+85[℃] BU7232S F/FVM:-40[℃] to+105[℃]
10/16
120
Fig.21
Propagation Delay L-H – Ambient temperature
BU7232 family
1.5
6
Fig.18
Common Mode Rejection Ratio –
Supply Voltage (VDD=3[V])
80
Fig.19
Common Mode Rejection Ratio
– Ambient Temperature (VDD=3[V])
-40℃
20
120
100
0
-60
4
100
BU7232 family
120
1
2
3
INPUT VOLTAGE [V]
120
PROPAGATION DELAY L-H [µs]
POWER SUPPLY REJECTION RATIO [dB]
BU7232 family
100
-30
0
30
60
90
AMBIENT TEMPERATURE [℃]
0
Fig.15
Input Offset Voltage – Input Voltage
Fig.17
Large Signal Voltage Gain –
Ambient Temperature
Fig.16
Large Signal Voltage Gain – Supply Voltage
120
-1
(VDD=3[V])
60
60
85℃
-5
BU7232 family
160
LARGE SIGNAL VOLTAGE GAIN [dB]
25℃
120
105℃
0
COMMON MODE REJECTION RATIO [dB]
BU7232 family
-40℃
5
120
Fig.14
Input Offset Voltage – Ambient Temperature
140
COMMON MODE REJECTION RATIO [dB]
10
-15
-60
Fig.13
Input Offset Voltage – Ambient Temperature
160
PROPAGATION DELAY H-L [us]
3.0V
BU7232 family
15
-10.0
1
LARGE SIGNAL VOLTAGE GAIN [dB]
7.5
INPUT OFFSET VOLTAGE [mV]
INPUT OFFSET VOLTAGE [mV]
7.5
BU7232 family
10.0
INPUT OFFSET VOLTAGE [mV]
10.0
● Schematic diagram
Fig.1 Simplified schematic
● Test circuit1 NULL method
VDD,VSS,EK,Vicm, Unit : [V]
Parameter
Input offset voltage
Large signal voltage gain
Common-mode rejection ratio
(Input common-mode voltage range)
Power supply rejection ratio
VF
S1
S2
S3
VF1
ON
ON
OFF
VF2
VF3
VF4
VF5
VF6
VF7
VDD
VSS
3
0
Vicm
-0.1
0.3
1
0.3
2
-0.3
ON
ON
ON
3
0
ON
ON
OFF
3
0
-0.1
ON
ON
OFF
0
-0.1
-Calculation-
1. Input offset Voltage (Vio)
Vio =
|VF1|
1+Rf/Rs
1.8
5.5
Calculation
EK
-2.7
0
3
3
0.3
4
[V]
2. Large signal voltage gain (Av)
3. Common-mode rejection ratio (CMRR)
4. Power supply rejection ratio (PSRR)
0.47[µF]
Rf
50[kΩ]
S1
0.1[uF]
RK
EK
VDD
500[kΩ]
0.01[µF]
RS= 50[Ω]
Ri= 1[MΩ]
Vicm
Ri= 1[MΩ]
RS= 50[Ω]
0.1[uF]
+15[V]
500[kΩ]
DUT
RK
VSS
S3
RL
S2
50[kΩ]
Fig.2 Test Circuit 1 (one channel only)
11/16
NULL
-15[V]
VF
●Test circuit2 switch condition
Unit : [V]
SW No.
SW
1
SW
2
SW
3
SW
4
supply current
OFF
maximum output voltage RL=10 [kΩ]
OFF
ON
ON
OFF OFF OFF OFF OFF
ON
ON
ON
output current
OFF OFF OFF OFF OFF
ON
response time
ON
OFF OFF
OFF
ON
SW
5
SW
6
SW
7
OFF OFF
OFF
ON
SW
8
ON
OFF
OFF OFF
ON
VDD=3[V]
-
+
SW1
SW2
SW3
SW4
SW5
SW6
SW7
SW8
GND
RL
VIN-
CL
VIN+
Vo
Fig3. Test circuit2 (one channel only)
V IN
[V]
V IN
Input
Wave
入力波形
[V]
1.6[V]
Input
Wave
入力波形
1.6[V]
100mV over drive
Vref=1.5[V]
Vref=1.5[V]
100mV over drive
1.4[V]
1.4[V]
V OUT
[V]
t
V OUT
[V]
Output Wave
出力波形
3[V]
Output Wave
出力波形
3[V]
1.5[V]
0[V]
1.5[V]
0[V]
t
TPHL
t
TPLH
Fig4. Slew rate
12/16
● Description of electrical characteristics
Described here are the terms of electric characteristics used in this technical note. Items and symbols used are also shown.
Note that item name and symbol and their meaning may differ from those on another manufacture’s document or general document.
1. Absolute maximum ratings
Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of absolute
Maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
1.1
Power supply voltage(VDD/VSS)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal
without deterioration or destruction of characteristics of internal circuit.
1.2
Differential input voltage (Vid)
Indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without deterioration and
destruction of characteristics of IC.
1.3
Input common-mode voltage range (Vicm)
Indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without deterioration or destruction of
characteristics. Input common-mode voltage range of the maximum ratings not assure normal operation of IC. When normal
operation of IC is desired, the input common-mode voltage of characteristics item must be followed.
1.4
Power dissipation (Pd)
Indicates the power that can be consumed by specified mounted board at the ambient temperature 25℃(normal temperature). As for
package product, Pd is determined by the temperature that can be permitted by IC chip in the package(maximum junction temperature)
and thermal resistance of the package
2. Electrical characteristics item
2.1
Input offset voltage (Vio)
Indicates the voltage difference between non-inverting terminal and inverting terminal. It can be translated into the input voltage
difference required for setting the output voltage at 0 [V]
2.2
Input offset current (Iio)
Indicates the difference of input bias current between non-inverting terminal and inverting terminal.
2.3
Input bias current (Ib)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias current at non-inverting terminal
and input bias current at inverting terminal.
2.4
Input common-mode voltage range (Vicm)
Indicates the input voltage range where IC operates normally.
2.5
Large signal voltage gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting
terminal.
It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage fluctuation) / (Input offset fluctuation)
2.6
Circuit current (ICC)
Indicates the IC current that flows under specified conditions and no-load steady status.
2.7
Output sink current (OL)
Indicates the maximum current that can be output under specified output condition (such as output voltage and load condition).
2.8
Output saturation voltage, Low level output voltage (VOL)
Indicates the voltage range that can be output under specified load conditions.
2.9
Output leakage current, High level output current(I leak)
Indicates the current that flows into IC under specified input and output conditions.
2.10
Response Time (Tre)
The interval between the application of an input and output condition.
2.11
Common-mode rejection ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the fluctuation of DC.
CMRR =(Change of Input common-mode voltage)/(Input offset fluctuation)
2.12
Power supply rejection ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC.
PSRR=(Change of power supply voltage)/(Input offset fluctuation)
13/16
● Derating curve
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).IC is heated
when it consumed power, and the temperature of IC ship becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power
dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of
package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the
storage package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in
the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the
package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal
resistance, represented by the symbol θj-a[℃/W]. The temperature of IC inside the package can be estimated by this thermal
resistance. Fig.6 (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta,
junction temperature Tj, and power dissipation Pd can be calculated by the equation below :
θja = (Tj-Ta) / Pd
[℃/W]
・・・・・
(Ⅰ)
Derating curve in Fig.6 (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Fig7(c)-(f) show a derating curve for an example of BU7251family, BU7252 family, BU7231
family, BU7232 family.
Power dissipation Pd:[W]
LSIの消費電力[W]
Pd(max)
θja = ( Tj ー Ta ) / Pd [℃/W]
P2
θja2 < θja1
Ambient temperature Ta [℃]
θja2
P1
Tj(max)
θja1
Chip surface temperature Tj [℃]
0
Power dissipation P [W]
25
50
75
Ambient
temperature:Ta[℃]
周囲温度Ta[℃]
100
125
BU7251/BU7231
T j(max)
(b) Derating curve
(a) Thermal resistance
Fig6. Thermal resistance and power dissipation
1000
POWER DISSIPATION [mW] .
POWER DISSIPATION [mW] .
800
600
540[mw]
BU7251G(*8)
BU7231G(*8)
400
200
0
800
620[mw]
600
480[mw] BU7252FVM(*10)
BU7232FVM(*10)
400
200
0
0
50
85 100
150
0
AMBIENT TEMPERATURE [℃]
(c) BU7251G
(d) BU7252F/FVM
BU7231G
600
540[mw]
POWER DISSIPATION [mW] .
POWER DISSIPATION [mW] .
100
85
150
BU7232F/FVM
1000
BU7251SG(*8)
BU7231SG(*8)
400
200
800
620[mw]
BU7252SF(*9)
BU7232SF(*9)
480[mw] BU7252SFVM(*10)
BU7232SFVM(*10)
600
400
200
0
0
0
50
100 105
0
150
(e) BU7251SG
(*9) (*10)
6.2
4.8
105
100
50
BU7231SG
(f) BU7252S F/FVM
BU72432S F/FVM
Unit
[mW/℃]
When using the unit above Ta=25[℃], subtract the value above per degree[℃]. Permissible dissipation is the value
when FR4 glass epoxy board 70[mm]×70[mm]×1.6[mm] (cooper foil area below 3[%]) is mounted.
Fig7.
150
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
5.4
50
AMBIENT TEMPERATURE [℃]
800
(*8)
BU7252F(*9)
BU7232F(*9)
Derating curve
14/16
150
● Cautions on use
1) Absolute maximum ratings
Absolute maximum ratings are the values which indicate the limits,
within which the given voltage range can be safely charged to the terminal.
However, it does not guarantee the circuit operation.
2) Applied voltage to the input terminal
For normal circuit operation of voltage comparator, please input voltage for its
input terminal within input common mode voltage VDD+0.3[V].
Then, regardless of power supply voltage,VSS-0.3[V] can be applied to input
terminals without deterioration or destruction of its characteristics.
3) Operating power supply (split power supply/single power supply)
The voltage comparator operates if a given level of voltage is applied between VDD and
VSS. Therefore, the operational amplifier can be operated under single power supply
or split power supply.
4) Power dissipation (pd)
If the IC is used under excessive power dissipation. An increase in the chip temperature will cause
deterioration of the radical characteristics of IC.
For example, reduction of current capability. Take consideration of the effective power dissipation and
thermal design with a sufficient margin. Pd is reference to the provided power dissipation curve.
5) Short circuits between pins and incorrect mounting
Short circuits between pins and incorrect mounting when mounting the IC on a printed circuits board,
take notice of the direction and positioning of the IC.
If IC is mounted erroneously, It may be damaged. Also, when a foreign object is inserted between
output, between output and VDD terminal or VSS terminal which causes short circuit, the IC may be
damaged.
6) Using under strong electromagnetic field
Be careful when using the IC under strong electromagnetic field because it may malfunction.
7) Usage of IC
When stress is applied to the IC through warp of the printed circuit board,
The characteristics may fluctuate due to the piezo effect.
Be careful of the warp of the printed circuit board.
8) Testing IC on the set board
When testing IC on the set board, in cases where the capacitor is connected to the low impedance,
make sure to discharge per fabrication because there is a possibility that IC may be damaged by stress.
When removing IC from the set board, it is essential to cut supply voltage.
As a countermeasure against the static electricity, observe proper grounding during fabrication process
and take due care when carrying and storage it.
9) The IC destruction caused by capacitive load
The transistors in circuits may be damaged when VDD terminal and VSS terminal is shorted with the charged
output terminal capacitor.When IC is used as a operational amplifier or as an application circuit,
where oscillation is not activated by an output capacitor,the output capacitor must be kept below
0.1[μF] in order to prevent the damage mentioned above.
10) Decupling capacitor
Insert the deculing capacitance between VDD and VSS, for stable operation of operational amplifier.
11) Latch up
Be careful of input vltage that exceed the VDD and VSS. When CMOS device have sometimes occur
latch up operation. And protect the IC from abnormaly noise
15/16
● Dimensions
SSOP5
SOP8
MSOP8
● Model number construction
・Specify the product by the model number
when placing an order.
・Make sure of the combinations of items.
・Start with the leftmost space without leaving
any empty space between characters.
B U 7 2 5 2 S F
ROHM
・BU7251
・BU7231
・BU7252
・BU7232
Package type
BU7251S
BU7231S
BU7252S
BU7232S
Packing
specification name
Quantity
SSOP5
TR
3000
Embossed carrier tape
X X X
X X X
X X X
X X X
X X X
X X X
X X X
X X X
X X X
X X X
Direction of feed
1Pin
Reel
X X
X
X
X X X
X X
X
X
X X X
1Pin
Reel
16/16
1234
X X
X
X
X X X
1234
3000
1234
TR
1,2
1Pin
Reel
MSOP8
1234
1234
2500
1234
E2
1234
SOP8
Direction of feed
X X
X
X
XX X
E 2
E2 Embossed tape on reel with pin 1 near far when pulled out
TR Embossed tape on reel with pin 1 near far when pulled out
・G : SSOP5
・F : SOP8
・FVM : MSOP8
Packing specification reference
Package
-
X X
X
X
XX X
Direction of feed
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level
of reliability and the malfunction of which would directly endanger human life (such as medical
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers
and other safety devices), please be sure to consult with our sales representative in advance.
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM
cannot be held responsible for any damages arising from the use of the products under conditions out of the
range of the specifications or due to non-compliance with the NOTES specified in this catalog.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact your nearest sales office.
ROHM Customer Support System
www.rohm.com
Copyright © 2007 ROHM CO.,LTD.
THE AMERICAS / EUPOPE / ASIA / JAPAN
Contact us : webmaster@ rohm.co. jp
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Appendix1-Rev2.0