Freescale KLM Assembly Site Qualification Reliability Data Summary MPC8572 KLM Assembly Site Qualification Product Reliability Data Summary Product Information Product / Technology / Fab / Package Description Package Primary: 1023 FC-PBGA, 33 x 33 mm (w fully fitted lid) Device MPC8572VT and MPC8572PX [non-Encrypted] MPC8572EVT and MPC8572EPX [Encrypted] [VT is lead-free C5 and PX is leaded C5] Product Specs Memory Name/Location of Die Fab Facility Process Technology Poly / Metal layers C4 Wafer Bump Location C4 Wafer Bump Size and Composition 1.1 V+/-5%, 105C max, 2x32KB L1 cache, 1024KB L2 cache Global Foundries / Singapore Test Location Primary: KLM Secondary: KTM Primary: KLM Secondary: ASE-KH Underfill “A” (KLM Assembly) Underfill “B” (ASE-KH Assembly) MSL3: 245°C Reflow (Leaded C4 wafer bump) Substrate Supplier “M” and “C” (KLM Assembly) Substrate Supplier “N” (ASE-KH Assembly) Lead-free Sn96.5, Ag3.5 , 0.6 mm, Leaded Sn62, Pb36, 2Ag; 0.6 mm Diameter Assembly Location Underfill Supplier and Part No. Moisture Sensitivity Level Substrate Supplier C5 Sphere Composition and Size CMOS90SOI [HIP8SOI] 1P / 8M Amkor T5, Taiwan Leaded: Ni-UBM (Ni2), 80um Diameter, 185um pitch, Pb (90%), Sn (10%) Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548 Report Rev.:1 Description: Freescale KLM Assembly Site Qualification Reliability Report Revision date: 05/20/13 Technology: Chartered CMOS 90 SOI Page 1 of 8 Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 700 cycles 1000 cycles KLM/Substrate Supplier “M”/Lot A 0 / 78 0 / 78 0 / 78 KLM/Substrate Supplier “M”/Lot B 0 / 78 0 / 78 0 / 78 KLM/Substrate Supplier “M”/Lot C 0 / 78 0 / 78 0 / 78 KLM/Substrate Supplier “C”/Lot A 0 / 78 0 / 78 0 / 78 KLM/Substrate Supplier “C”/Lot B 0 / 78 0 / 78 0 / 78 KLM/Substrate Supplier “C”/Lot C 0 / 78 0 / 78 0 / 78 Total 0 / 468 0 / 468 0 / 468 Temperature Humidity Bias / 85ºC, 85%R.H., 0.65v with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots KLM/Substrate Supplier “M”/Lot A 0 / 78 504 hrs 0 / 78 1008 hrs 0 / 78 KLM/Substrate Supplier “M”/Lot B 0 / 78 0 / 78 0 / 78 KLM/Substrate Supplier “M”/Lot C 0 / 78 0 / 78 0 / 78 KLM/Substrate Supplier “C”/Lot A 0 / 78 0 / 78 KLM/Substrate Supplier “C”/Lot B 0 / 78 0 / 78 0 / 78 0 / 78 KLM/Substrate Supplier “C”/Lot C 0 / 78 0 / 78 0 / 78 0 / 468 0 / 468 0 / 468 Total MSL3 245 C High Temperature Bake / 150ºC Assy Site / Substrate Supplier / Lots 504 hrs 1008 hrs 0 / 80 KLM/Substrate Supplier “M”/Lot B 0 / 80 0 / 80 KLM/Substrate Supplier “M”/Lot C 0 / 80 0 / 80 KLM/Substrate Supplier “C”/Lot A 0 / 80 0 / 80 0 / 80 KLM/Substrate Supplier “M”/Lot A 0 / 80 KLM/Substrate Supplier “C”/Lot B 0 / 80 KLM/Substrate Supplier “C”/Lot C 0 / 80 0 / 80 Total 0 / 480 0 / 480 uHAST / 110°C/85%RH/15PSI, with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 264 hrs 0 / 80 KLM/Substrate Supplier “M”/Lot B 0 / 80 0 / 80 KLM/Substrate Supplier “M”/Lot C 0 / 80 0 / 80 KLM/Substrate Supplier “C”/Lot A 0 / 80 0 / 80 KLM/Substrate Supplier “C”/Lot B 0 / 80 0 / 80 KLM/Substrate Supplier “C”/Lot C 0 / 80 0 / 80 0 / 480 0 / 480 KLM/Substrate Supplier “M”/Lot A Total 0 / 80 Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548 Report Rev.:1 Description: Freescale KLM Assembly Site Qualification Reliability Report Revision date: 05/20/13 Technology: Chartered CMOS 90 SOI Page 2 of 8 MPC8533 KLM Assembly Site Qualification Product Reliability Data Summary MPC8533 Product Family 783 Lead FC-PBGA Package 90nm SOI CMOS Product Information Product / Technology / Fab / Package Description Package Primary: 783 FC-PBGA, 29 x 29 mm (w/o lid) Device MPC8533VT [VT is lead-free C5] Die Coating(s) Product Specs Memory Name/Location of Die Fab Facility Process Technology Poly / Metal layers Gox Thickness C4 Wafer Bump Location C4 Wafer Bump Size and Composition Polyimide 1.0V+/-5%, 105C max, 14w 2x32KB L1 cache, 256KB L2 cache (all with ECC) GlobalFoundries Test Location Primary: KLM Back-up: OHT KLM MSL3: 260°C Reflow (Leaded C4 wafer bump) Assembly Location Moisture Sensitivity Level Underfill Supplier and Part No. Substrate Supplier(s) C5 Sphere Composition and Size CMOS90SOI, bit cell size 1.115, SiCOH/SiCOH Mx 1P / 7M 15Å Amkor T5 Leaded: Ni-UBM (Ni2), 80um Diameter, 185um pitch, Pb (90%), Sn (10%) Underfill “A” Primary: Substrate Supplier “M”; Substrate Supplier “C” Lead-free Sn96.5, Ag3.5 , 0.6 mm, Leaded Sn62, Pb36, 2Ag; 0.6 mm Diameter Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548 Report Rev.:1 Description: Freescale KLM Assembly Site Qualification Reliability Report Revision date: 05/20/13 Technology: Chartered CMOS 90 SOI Page 3 of 8 Assy Site / Substrate Supplier / Lots MSL3 245 C 700 cycles 1000 cycles KLM/Substrate Supplier “M”/Lot A 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “M”/Lot B 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “M”/Lot C 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot A 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot B 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot C 0 / 25 0 / 25 0 / 25 Total 0 / 150 0 / 150 0 / 150 MPC8535, MPC8536 KLM Assembly Site Qualification Product Reliability Data Summary Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548 Report Rev.:1 Description: Freescale KLM Assembly Site Qualification Reliability Report Revision date: 05/20/13 Technology: Chartered CMOS 90 SOI Page 4 of 8 MPC8536, MPC8535 Product Family 783 Lead/Lead Free FC-PBGA Package 90nm SOI CMOS Product / Technology / Fab / Package Description Package Primary: 783 FC-PBGA, 29 x 29 mm ( w/o lid) Device MPC8536VT [VT is lead-free C5] Die Coating(s) Product Specs Memory Name/Location of Die Fab Facility Process Technology Polyimide 1.1V+/-5%, 90C max, 10w , Extended temp -45C 2x32KB L1 cache, 512KB L2 cache (all with ECC) GlobalFoundries CMOS90SOI, Poly / Metal layers Gox Thickness C4 Bump Site 1P / 8M 15Å Amkor T5 C4 Sphere Size and Composition Assembly Location Ni-UBM (Ni2), 80um Diameter, 185um pitch, Pb (90%), Sn (10%) Underfill Supplier and Part No. Moisture Sensitivity Level Final Test Site Substrate Supplier C5 spheres Primary: KLM Secondary: ASE-KH Primary: Underfill “A” Secondary: Underfill “B” Primary: MSL3 / 260°C Reflow KLM Primary: Suppliers “M” and “C” Secondary: Supplier “N” Lead-free Sn96.5, Ag3.5 , 0.6 mm, Leaded Sn62, Pb36, 2Ag; 0.6 mm Diameter Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548 Report Rev.:1 Description: Freescale KLM Assembly Site Qualification Reliability Report Revision date: 05/20/13 Technology: Chartered CMOS 90 SOI Page 5 of 8 Assy Site / Substrate Supplier / Lots MSL3 245 C 700 cycles 1000 cycles KLM/Substrate Supplier “M”/Lot A 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “M”/Lot B 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “M”/Lot C 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot A 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot B 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot C 0 / 25 0 / 25 0 / 25 Total 0 / 150 0 / 150 0 / 150 MPC8548 KLM Assembly Site Qualification Product Reliability Data Summary Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548 Report Rev.:1 Description: Freescale KLM Assembly Site Qualification Reliability Report Revision date: 05/20/13 Technology: Chartered CMOS 90 SOI Page 6 of 8 MPC8548 Product Family 783 Lead PBGA Package 90nm SOI CMOS Product Information Product / Technology / Fab / Package Description Package 783 FC-HiCTE (HX, VT), 29x29, with footed Lid Device MPC8548 PowerQUICC 38 Rev 3.0 (a.k.a. Rev D) Die Coating(s) Polyimide Name/ Location of Die Fab Facility GlobalFoundries Process Technology 90nm SOI Poly / Metal layers 1P / 7M Assembly Location Primary: KLM Secondary: ASE-KH C4 Bump Location Amkor T5 Moisture Sensitivity Level MSL3 / 260°C Reflow C5 Sphere Composition Standard: 62% Sn, 36% Pb, 2% Ag Pb Free: 95.5% Sn, 3.8% Ag, 0.7% Cu Substrate Supplier Primary: Supplier “M” and “C” Secondary: Supplier “M” and “C” Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548 Report Rev.:1 Description: Freescale KLM Assembly Site Qualification Reliability Report Revision date: 05/20/13 Technology: Chartered CMOS 90 SOI Page 7 of 8 Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 700 cycles 1000 cycles KLM/Substrate Supplier “M”/Lot A 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “M”/Lot B 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “M”/Lot C 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot A 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot B 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot C 0 / 25 0 / 25 0 / 25 Total 0 / 150 0 / 150 0 / 150 Revision History Revision History Revision Original Date 05/20/2013 Comment Author KLM Assembly Site Qualification Report for MPC8572, MPC8533, MPC8548 and MPC8535/MPC8536 Navin Kumar Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548 Report Rev.:1 Description: Freescale KLM Assembly Site Qualification Reliability Report Revision date: 05/20/13 Technology: Chartered CMOS 90 SOI Page 8 of 8