Freescale KLM Assembly Site Qualification Reliability Data Summary

Freescale KLM Assembly Site Qualification Reliability Data Summary
MPC8572 KLM Assembly Site Qualification Product Reliability Data Summary
Product Information
Product / Technology / Fab / Package Description
Package
Primary: 1023 FC-PBGA, 33 x 33 mm (w fully fitted lid)
Device
MPC8572VT and MPC8572PX [non-Encrypted]
MPC8572EVT and MPC8572EPX [Encrypted]
[VT is lead-free C5 and PX is leaded C5]
Product Specs
Memory
Name/Location of Die Fab
Facility
Process Technology
Poly / Metal layers
C4 Wafer Bump Location
C4 Wafer Bump Size and
Composition
1.1 V+/-5%, 105C max,
2x32KB L1 cache, 1024KB L2 cache
Global Foundries / Singapore
Test Location
Primary: KLM
Secondary: KTM
Primary: KLM
Secondary: ASE-KH
Underfill “A” (KLM Assembly)
Underfill “B” (ASE-KH Assembly)
MSL3: 245°C Reflow (Leaded C4 wafer bump)
Substrate Supplier “M” and “C” (KLM Assembly)
Substrate Supplier “N” (ASE-KH Assembly)
Lead-free Sn96.5, Ag3.5 , 0.6 mm, Leaded Sn62, Pb36, 2Ag; 0.6 mm Diameter
Assembly Location
Underfill Supplier and Part No.
Moisture Sensitivity Level
Substrate Supplier
C5 Sphere Composition and
Size
CMOS90SOI [HIP8SOI]
1P / 8M
Amkor T5, Taiwan
Leaded: Ni-UBM (Ni2), 80um Diameter, 185um pitch, Pb (90%), Sn (10%)
Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548
Report Rev.:1
Description: Freescale KLM Assembly Site Qualification Reliability Report
Revision date: 05/20/13
Technology: Chartered CMOS 90 SOI
Page 1 of 8
Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow
Assy Site / Substrate Supplier / Lots
MSL3 245 C
700 cycles
1000 cycles
KLM/Substrate Supplier “M”/Lot A
0 / 78
0 / 78
0 / 78
KLM/Substrate Supplier “M”/Lot B
0 / 78
0 / 78
0 / 78
KLM/Substrate Supplier “M”/Lot C
0 / 78
0 / 78
0 / 78
KLM/Substrate Supplier “C”/Lot A
0 / 78
0 / 78
0 / 78
KLM/Substrate Supplier “C”/Lot B
0 / 78
0 / 78
0 / 78
KLM/Substrate Supplier “C”/Lot C
0 / 78
0 / 78
0 / 78
Total
0 / 468
0 / 468
0 / 468
Temperature Humidity Bias / 85ºC, 85%R.H., 0.65v with Preconditioning @ MSL3 / 245ºC IR Reflow
Assy Site / Substrate Supplier / Lots
KLM/Substrate Supplier “M”/Lot A
0 / 78
504 hrs
0 / 78
1008 hrs
0 / 78
KLM/Substrate Supplier “M”/Lot B
0 / 78
0 / 78
0 / 78
KLM/Substrate Supplier “M”/Lot C
0 / 78
0 / 78
0 / 78
KLM/Substrate Supplier “C”/Lot A
0 / 78
0 / 78
KLM/Substrate Supplier “C”/Lot B
0 / 78
0 / 78
0 / 78
0 / 78
KLM/Substrate Supplier “C”/Lot C
0 / 78
0 / 78
0 / 78
0 / 468
0 / 468
0 / 468
Total
MSL3 245 C
High Temperature Bake / 150ºC
Assy Site / Substrate Supplier / Lots
504 hrs
1008 hrs
0 / 80
KLM/Substrate Supplier “M”/Lot B
0 / 80
0 / 80
KLM/Substrate Supplier “M”/Lot C
0 / 80
0 / 80
KLM/Substrate Supplier “C”/Lot A
0 / 80
0 / 80
0 / 80
KLM/Substrate Supplier “M”/Lot A
0 / 80
KLM/Substrate Supplier “C”/Lot B
0 / 80
KLM/Substrate Supplier “C”/Lot C
0 / 80
0 / 80
Total
0 / 480
0 / 480
uHAST / 110°C/85%RH/15PSI, with Preconditioning @ MSL3 / 245ºC IR Reflow
Assy Site / Substrate Supplier /
Lots
MSL3 245 C
264 hrs
0 / 80
KLM/Substrate Supplier “M”/Lot B
0 / 80
0 / 80
KLM/Substrate Supplier “M”/Lot C
0 / 80
0 / 80
KLM/Substrate Supplier “C”/Lot A
0 / 80
0 / 80
KLM/Substrate Supplier “C”/Lot B
0 / 80
0 / 80
KLM/Substrate Supplier “C”/Lot C
0 / 80
0 / 80
0 / 480
0 / 480
KLM/Substrate Supplier “M”/Lot A
Total
0 / 80
Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548
Report Rev.:1
Description: Freescale KLM Assembly Site Qualification Reliability Report
Revision date: 05/20/13
Technology: Chartered CMOS 90 SOI
Page 2 of 8
MPC8533 KLM Assembly Site Qualification Product Reliability Data Summary
MPC8533 Product Family
783 Lead FC-PBGA Package
90nm SOI CMOS
Product Information
Product / Technology / Fab / Package Description
Package
Primary: 783 FC-PBGA, 29 x 29 mm (w/o lid)
Device
MPC8533VT
[VT is lead-free C5]
Die Coating(s)
Product Specs
Memory
Name/Location of Die Fab
Facility
Process Technology
Poly / Metal layers
Gox Thickness
C4 Wafer Bump Location
C4 Wafer Bump Size and
Composition
Polyimide
1.0V+/-5%, 105C max, 14w
2x32KB L1 cache, 256KB L2 cache (all with ECC)
GlobalFoundries
Test Location
Primary: KLM
Back-up: OHT
KLM
MSL3: 260°C Reflow (Leaded C4 wafer bump)
Assembly Location
Moisture Sensitivity Level
Underfill Supplier and Part No.
Substrate Supplier(s)
C5 Sphere Composition and
Size
CMOS90SOI, bit cell size 1.115, SiCOH/SiCOH Mx
1P / 7M
15Å
Amkor T5
Leaded: Ni-UBM (Ni2), 80um Diameter, 185um pitch, Pb (90%), Sn (10%)
Underfill “A”
Primary: Substrate Supplier “M”; Substrate Supplier “C”
Lead-free Sn96.5, Ag3.5 , 0.6 mm, Leaded Sn62, Pb36, 2Ag; 0.6 mm Diameter
Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow
Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548
Report Rev.:1
Description: Freescale KLM Assembly Site Qualification Reliability Report
Revision date: 05/20/13
Technology: Chartered CMOS 90 SOI
Page 3 of 8
Assy Site / Substrate Supplier / Lots
MSL3 245 C
700 cycles
1000 cycles
KLM/Substrate Supplier “M”/Lot A
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “M”/Lot B
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “M”/Lot C
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “C”/Lot A
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “C”/Lot B
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “C”/Lot C
0 / 25
0 / 25
0 / 25
Total
0 / 150
0 / 150
0 / 150
MPC8535, MPC8536 KLM Assembly Site Qualification Product Reliability Data Summary
Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548
Report Rev.:1
Description: Freescale KLM Assembly Site Qualification Reliability Report
Revision date: 05/20/13
Technology: Chartered CMOS 90 SOI
Page 4 of 8
MPC8536, MPC8535 Product Family
783 Lead/Lead Free FC-PBGA Package
90nm SOI CMOS
Product / Technology / Fab / Package Description
Package
Primary: 783 FC-PBGA, 29 x 29 mm ( w/o lid)
Device
MPC8536VT
[VT is lead-free C5]
Die Coating(s)
Product Specs
Memory
Name/Location of Die Fab
Facility
Process Technology
Polyimide
1.1V+/-5%, 90C max, 10w ,
Extended temp -45C
2x32KB L1 cache, 512KB L2 cache (all with ECC)
GlobalFoundries
CMOS90SOI,
Poly / Metal layers
Gox Thickness
C4 Bump Site
1P / 8M
15Å
Amkor T5
C4 Sphere Size and
Composition
Assembly Location
Ni-UBM (Ni2), 80um Diameter, 185um pitch, Pb (90%), Sn (10%)
Underfill Supplier and Part No.
Moisture Sensitivity Level
Final Test Site
Substrate Supplier
C5 spheres
Primary: KLM
Secondary: ASE-KH
Primary: Underfill “A”
Secondary: Underfill “B”
Primary: MSL3 / 260°C Reflow
KLM
Primary: Suppliers “M” and “C”
Secondary: Supplier “N”
Lead-free Sn96.5, Ag3.5 , 0.6 mm, Leaded Sn62, Pb36, 2Ag; 0.6 mm Diameter
Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow
Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548
Report Rev.:1
Description: Freescale KLM Assembly Site Qualification Reliability Report
Revision date: 05/20/13
Technology: Chartered CMOS 90 SOI
Page 5 of 8
Assy Site / Substrate Supplier / Lots
MSL3 245 C
700 cycles
1000 cycles
KLM/Substrate Supplier “M”/Lot A
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “M”/Lot B
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “M”/Lot C
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “C”/Lot A
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “C”/Lot B
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “C”/Lot C
0 / 25
0 / 25
0 / 25
Total
0 / 150
0 / 150
0 / 150
MPC8548 KLM Assembly Site Qualification Product Reliability Data Summary
Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548
Report Rev.:1
Description: Freescale KLM Assembly Site Qualification Reliability Report
Revision date: 05/20/13
Technology: Chartered CMOS 90 SOI
Page 6 of 8
MPC8548 Product Family
783 Lead PBGA Package
90nm SOI CMOS
Product Information
Product / Technology / Fab / Package Description
Package
783 FC-HiCTE (HX, VT), 29x29, with footed Lid
Device
MPC8548 PowerQUICC 38 Rev 3.0 (a.k.a. Rev D)
Die Coating(s)
Polyimide
Name/ Location of Die Fab
Facility
GlobalFoundries
Process Technology
90nm SOI
Poly / Metal layers
1P / 7M
Assembly Location
Primary: KLM
Secondary: ASE-KH
C4 Bump Location
Amkor T5
Moisture Sensitivity Level
MSL3 / 260°C Reflow
C5 Sphere Composition
Standard: 62% Sn, 36% Pb, 2% Ag
Pb Free: 95.5% Sn, 3.8% Ag, 0.7% Cu
Substrate Supplier
Primary: Supplier “M” and “C”
Secondary: Supplier “M” and “C”
Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548
Report Rev.:1
Description: Freescale KLM Assembly Site Qualification Reliability Report
Revision date: 05/20/13
Technology: Chartered CMOS 90 SOI
Page 7 of 8
Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow
Assy Site / Substrate Supplier / Lots
MSL3 245 C
700 cycles
1000 cycles
KLM/Substrate Supplier “M”/Lot A
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “M”/Lot B
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “M”/Lot C
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “C”/Lot A
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “C”/Lot B
0 / 25
0 / 25
0 / 25
KLM/Substrate Supplier “C”/Lot C
0 / 25
0 / 25
0 / 25
Total
0 / 150
0 / 150
0 / 150
Revision History
Revision History
Revision
Original
Date
05/20/2013
Comment
Author
KLM Assembly Site Qualification Report for MPC8572, MPC8533, MPC8548 and
MPC8535/MPC8536
Navin Kumar
Dev No./Rev.: MPC8572, MPC8533, MPC8535, MPC8536, MPC8548
Report Rev.:1
Description: Freescale KLM Assembly Site Qualification Reliability Report
Revision date: 05/20/13
Technology: Chartered CMOS 90 SOI
Page 8 of 8