PowerQUICC Integrated Processor MPC8572 Product Family Rev2.1 / Rev2.2.1 1023 Lead FC-PBGA Package Industrial Qualification Report for Global Foundries Silicon Industrial part is 1.1 V at 105oC use Product Information Product / Technology / Fab / Package Description Package Primary: 1023 FC-PBGA, 33 x 33 mm (w fully fitted lid) Device MPC8572VT and MPC8572PX [non-Encrypted; Leaded C4 wafer bump] [VT is lead-free C5 sphere and PX is leaded C5 sphere] MPC8572EVT and MPC8572EPX [Encrypted; Leaded C4 wafer bump] [VT is lead-free C5 sphere and PX is leaded C5 sphere] MPC8572VJ [non-Encrypted] [VJ is lead-free C4 wafer bump and lead-free C5 sphere] Product Specs Die Coating(s) Memory Name/Location of Die Fab Facility Process Technology Poly / Metal layers C4 Wafer Bump Location C4 Wafer Bump Size and Composition Test Location BI Location Assembly Location Underfill Supplier and Part No. Moisture Sensitivity Level Substrate Supplier C5 Sphere Composition and Size MPC8572EVJ [Encrypted] [VJ is lead-free C4 wafer bump and lead-free C5 sphere] 1.1 V+/-5%, 105C max, Polyimide 2x32KB L1 cache, 1024KB L2 cache Global Foundries / Singapore CMOS90SOI [HIP8SOI] 1P / 8M Amkor T5, Taiwan Leaded: Ni-UBM (Ni2), 80um Diameter, 185um pitch, Pb (90%), Sn (10%) Lead-free: Ni-UBM (Ni2), 80um Diameter, 185um pitch, Sn (98.2%), Ag (1.8%) Primary: KLM Secondary: KTM Primary: TTM, KLM Secondary: KESM, KLM Primary: KLM Secondary: ASE-KH Namic 8410-99 (KLM Assembly) UH12 (ASE-KH Assembly) MSL3: 245°C Reflow (Lead-free and leaded C4 wafer bump) Substrate Supplier “M” and “C” (KLM Assembly) Substrate Supplier “N” (ASE-KH Assembly) Lead-free Sn96.5, Ag3.5 , 0.6 mm, Leaded Sn62, Pb36, 2Ag; 0.6 mm Diameter Dev No./Rev.: MPC 8572 / Rev2.1 / Rev2.2.1, Description: PowerQUICC38H Technology: CMOS90 SOI, Global Foundries Report Rev.:3 PRQE: Navin Kumar Package: 33x33 FC-PBGA, 1023 pins Revision date: 01/28/14 Page 1 of 11 MPC8572 Industrial Product Reliability Data Summary High Temperature Operating Life Test (HTOL) – V 1.4V, Tj 130ºC Lot / Mask Set / Rev A B 8 hrs 32 hrs 218 hrs 10 yr NBTI 416 hrs 1025 hrs Industrial [10 yr] QA8057 / 00M55R / Rev 1.1 0/93 0/93 0/93 0/93 0/93 QA8064 / 00M55R / Rev 1.1 0/93 0/93 0/93 0/93 0/93 QA8065 / 00M55R / Rev 1.1 0/93 0/93 0/93 0/93 0/93 QA9031 / 00M20X / Rev 2.0 0/78 - 0 /78 0/78 0/78 QA9032 / 00M20X / Rev 2.0 T48-Readings taken at 48 hrs T189-Readings taken at 189hrs 0/358 0/358 (T48) 1/358 (T189) QA9043 / 01M20X / Rev 2.1 T48 Readings taken at 48 hrs T189 Readings taken at 189hrs 0/92 0/92 (T48) 0/92 (T189) QA0018 / 02M20X / Rev2.2 T3 Readings taken at 3 hrs T189 Readings taken at 189 hrs 0/80 (T3) - 0/80 (T189) Totals 0 / 887 0 / 887 1* / 886 EOS short A 1/357 B 1 / 714 Scan pattern One unit fail shorts (FA concluded EOS), report available One unit fail scan pattern (FA concluded isolated metal line short), report available Unit was included in the FIT rate and meets spec<50 Dev No./Rev.: MPC 8572 / Rev2.1 / Rev2.2.1, Description: PowerQUICC38H Technology: CMOS90 SOI, Global Foundries Report Rev.:3 PRQE: Navin Kumar Package: 33x33 FC-PBGA, 1023 pins Revision date: 01/28/14 Page 2 of 11 0/356 0 / 713 Electrostatic Discharge (ESD) and Latchup Lot / Mask Set / Rev HBM +/-2KV CDM +/-500 V Machine model A +/-150V Latch-up B +/- 200 mA QA8057 / 00M55R / Rev 1.1 0/3 0/3 0/3 0/3 QA8064 / 00M55R / Rev 1.1 0/3 0/3 0/3 0/3 QA8065 / 00M55R / Rev 1.1 0/3 0/3 0/3 0/3 0/ 9 0/ 9 C QA0318 / 04M20X / Rev 2.2.1 0 /3 Totals 0/ 9 0/ 12 A MM does not meet 200 V, Errata in place, listed below are the effected lynx pins that do not meet requirement of 200V but pass at 150 V B C LU is not a requirement for FSL qual due to SOI, however testing is performed as an FYI All pins pass +/-500V CDM with exception of DDR_CLK pin which passes at +/-250V Electrical Characterization Lot / Mask Set / Rev Room, Hot and Cold Temperatures QA8057,QA8064,QA8065 / 01M44J / Rev 1.1 HTOL drift CZ (T0-T1025) 0/279 QA9031 / 01M20X / Rev2.0 HTOL drift CZ (T0-T1025) 0/78 QA9032/ 01M20X / Rev2.0 Electrical CZ Matrix lot QA0318/ 04M20X / Rev2.2.1 Electrical CZ 0/30 Dev No./Rev.: MPC 8572 / Rev2.1 / Rev2.2.1, Description: PowerQUICC38H Technology: CMOS90 SOI, Global Foundries Report Rev.:3 PRQE: Navin Kumar Package: 33x33 FC-PBGA, 1023 pins Revision date: 01/28/14 Page 3 of 11 Environmental stress qualification with Supplier A underfill /S3 Bump Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 400 cycles 700 cycles 1000 cycles ASEKH/NTK/37MG04 0 / 11 0 / 11 0 / 11 0 / 11 ASEKH/NTK/39MG21 0 / 39 0 / 39 0 / 39 0 / 39 ASEKH/NTK/41MG22 0 / 25 0 / 25 0 / 25 0 / 25 Total 0 / 75 0 / 75 0 / 75 0 / 75 Temperature Cycle / -40ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 500 cycles 850 cycles 1000 cycles ASEKH/NTK/37MG21 0 / 80 0 / 80 0 / 80 0 / 80 ASEKH/NTK/41MG22 0 / 79 0 / 79 0 / 79 0 / 79 ASEKH/NTK/47MG39 0 / 80 0 / 80 0 / 80 0 / 80 Total 0 / 239 0 / 239 0 0 / 239 / 239 Temperature Humidity Bias / 85ºC, 85%R.H., 0.65v with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL 504 Hours 1008 Hours ASEKH/NTK/37MG03 0 / 15 0 / 15 0 / 15 ASEKH/NTK/37MG04 0 / 15 0 / 15 0 / 15 ASEKH/NTK/39MG21 0 / 15 0 / 15 0 / 15 Total 0 / 45 0 / 45 0 / 45 High Temperature Bake / 150ºC Assy Site / Substrate Supplier / Lots 504 Hours 1008 Hours Industrial ASEKH/NTK/37MG03 0 / 80 0 / 80 ASEKH/NTK/37MG04 0 / 80 0 / 80 ASEKH/NTK/39MG21 0 / 80 0 / 80 Totals 0 / 240 0 / 240 uHAST / 130°C/85%RH/15PSI, with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 @245 C 96 Hours 144 Hours ASEKH/NTK/39MG21 0 / 80 0 / 80 0 / 80 ASEKH/NTK/41MG22 0 / 80 0 / 80 0 / 80 ASEKH/NTK/47MG39 0 / 80 0 / 80 0 / 80 Totals 0 / 240 0 / 240 0 / 240 Dev No./Rev.: MPC 8572 / Rev2.1 / Rev2.2.1, Description: PowerQUICC38H Technology: CMOS90 SOI, Global Foundries Report Rev.:3 PRQE: Navin Kumar Package: 33x33 FC-PBGA, 1023 pins Revision date: 01/28/14 Page 4 of 11 Environmental stress qualification with Supplier B underfill/S3 Bump Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 400 cycles 700 cycles 1000 cycles ASEKH/NTK/ 0/160 0/160 0/160 0/160 Total 0 / 160 0 / 160 0 / 160 0 / 160 Temperature Cycle / -40ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 500 cycles 850 cycles 1000 cycles ASEKH/NTK/ 0/160 0/160 0/160 0/160 Total 0 / 160 0 / 160 0 / 160 0 / 160 Temperature Humidity Bias / 85ºC, 85%R.H., 0.65v with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL 504 Hours 1008 Hours ASEKH/NTK 0 / 30 0 / 30 0 / 30 Total 0 / 30 0 / 30 0 / 30 High Temperature Bake / 150ºC Assy Site / Substrate Supplier / Lots 504 Hours 1008 Hours Industrial ASEKH/NTK/ 0 /160 0 /160 Total 0 / 160 0 / 160 uHAST / 130°C/85%RH/15PSI, with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 @245 C 96 Hours 144 Hours ASEKH/NTK 0/160 0/160 0/160 Totals 0 / 160 0 / 160 0 / 160 Dev No./Rev.: MPC 8572 / Rev2.1 / Rev2.2.1, Description: PowerQUICC38H Technology: CMOS90 SOI, Global Foundries Report Rev.:3 PRQE: Navin Kumar Package: 33x33 FC-PBGA, 1023 pins Revision date: 01/28/14 Page 5 of 11 Environmental stress qualification with supplier B underfill/T5 Bump Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 500 cycles 1000 cycles ASEKH/NTK/30MG47 0 / 29 0 / 29 0 / 29 Total 0 / 29 0 / 29 0 / 29 Temperature Cycle / -40ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 500 cycles 1000 cycles ASEKH/NTK/30MG47 0 / 85 0 / 85 0/85 Total 0 / 85 0 / 85 0/85 Electrostatic Discharge (ESD) and Latchup Lot / Mask Set / Rev HBM +/-2KV CDM +/-500 V Machine model +/150V(a) Latch-up +/- 200 ma(b) QA9032 / 00M20X / Rev 2.0 0/3 0/3 0/3 0/3 Totals 0/ 3 0/3 0/ 3 0/ 3 (a) MM does not meet 200 V, Errata in place (b) (b) LU is not a requirement for FSL qual due to SOI, however testing is performed as an FYI MPC8572 KLM Assembly Site Qualification Product Reliability Data Summary Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 700 cycles 1000 cycles KLM/Substrate Supplier “M”/Lot A 0 / 78 0 / 78 0 / 78 KLM/ Substrate Supplier “M”/Lot B 0 / 78 0 / 78 0 / 78 KLM/ Substrate Supplier “M”/Lot C 0 / 78 0 / 78 0 / 78 KLM/Substrate Supplier “C”/Lot A 0 / 78 0 / 78 0 / 78 KLM/Substrate Supplier “C”/Lot B 0 / 78 0 / 78 0 / 78 KLM/Substrate Supplier “C”/Lot C 0 / 78 0 / 78 0 / 78 Total 0 / 468 0 / 468 0 / 468 Dev No./Rev.: MPC 8572 / Rev2.1 / Rev2.2.1, Description: PowerQUICC38H Technology: CMOS90 SOI, Global Foundries Report Rev.:3 PRQE: Navin Kumar Package: 33x33 FC-PBGA, 1023 pins Revision date: 01/28/14 Page 6 of 11 Temperature Humidity Bias / 85ºC, 85%R.H., 0.65v with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 504 hrs 1008 hrs KLM/ Substrate Supplier “M”/Lot A 0 / 25 0 / 25 0 / 25 KLM/ Substrate Supplier “M”/Lot B 0 / 25 0 / 25 0 / 25 KLM/ Substrate Supplier “M”/Lot C 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot A 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot B 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot C 0 / 25 0 / 25 0 / 25 Total 0 / 150 0 / 150 0 / 150 High Temperature Bake / 150ºC Assy Site / Substrate Supplier / Lots 504 hrs 1008 hrs KLM/ Substrate Supplier “M”/Lot A 0 / 78 0 / 78 KLM/ Substrate Supplier “M”/Lot B 0 / 78 0 / 78 KLM/ Substrate Supplier “M”/Lot C 0 / 78 0 / 78 KLM/Substrate Supplier “C”/Lot A 0 / 78 0 / 78 KLM/Substrate Supplier “C”/Lot B 0 / 78 0 / 78 KLM/Substrate Supplier “C”/Lot C 0 / 78 0 / 78 0 / 468 0 / 468 Total uHAST / 110°C/85%RH/15PSI, with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 264 hrs 0 / 80 0 / 80 0 / 80 KLM/ Substrate Supplier “M”/Lot B KLM/ Substrate Supplier “M”/Lot C 0 / 80 0 / 80 KLM/Substrate Supplier “C”/Lot A 0 / 80 0 / 80 KLM/Substrate Supplier “C”/Lot B 0 / 80 0 / 80 KLM/Substrate Supplier “C”/Lot C 0 / 80 0 / 80 0 / 480 0 / 480 KLM/ Substrate Supplier “M”/Lot A Total 0 / 80 Dev No./Rev.: MPC 8572 / Rev2.1 / Rev2.2.1, Description: PowerQUICC38H Technology: CMOS90 SOI, Global Foundries Report Rev.:3 PRQE: Navin Kumar Package: 33x33 FC-PBGA, 1023 pins Revision date: 01/28/14 Page 7 of 11 MPC8572 Pb-free Package Qualification in KLM Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 400 cycles 700 cycles 1000 cycles KLM/Substrate Supplier “M”/Lot A 0 / 25 0 / 25 0 / 25 0 / 25 KLM/ Substrate Supplier “M”/Lot B 0 / 25 0 / 25 0 / 25 0 / 25 KLM/ Substrate Supplier “M”/Lot C 0 / 25 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot A 0 / 25 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot B 0 / 25 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot C 0 / 25 0 / 25 0 / 25 0 / 25 Total 0 / 150 0 / 150 0 / 150 0 / 150 Temperature Humidity Bias / 85ºC, 85%R.H., 0.65v with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 504 hrs 1008 hrs KLM/ Substrate Supplier “M”/Lot A 0 / 25 0 / 25 0 / 25 KLM/ Substrate Supplier “M”/Lot B 0 / 25 0 / 25 0 / 25 KLM/ Substrate Supplier “M”/Lot C 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot A 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot B 0 / 25 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot C 0 / 25 0 / 25 0 / 25 Total 0 / 150 0 / 150 0 / 150 High Temperature Bake / 150ºC Assy Site / Substrate Supplier / Lots 500 hrs 1000 hrs KLM/ Substrate Supplier “M”/Lot A 0 / 77 0 / 77 KLM/Substrate Supplier “C”/Lot A 0 / 77 0 / 77 Total 0 / 154 0 / 154 uHAST Cond B (110°C/85%RH/15PSI), with Preconditioning @ MSL3 / 245ºC IR Reflow Assy Site / Substrate Supplier / Lots MSL3 245 C 264 hrs KLM/ Substrate Supplier “M”/Lot B 0 / 25 0 / 25 0 / 25 0 / 25 KLM/ Substrate Supplier “M”/Lot C 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot A 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot B 0 / 25 0 / 25 KLM/Substrate Supplier “C”/Lot C 0 / 25 0 / 25 Total 0 / 150 0 / 150 KLM/ Substrate Supplier “M”/Lot A Dev No./Rev.: MPC 8572 / Rev2.1 / Rev2.2.1, Description: PowerQUICC38H Technology: CMOS90 SOI, Global Foundries Report Rev.:3 PRQE: Navin Kumar Package: 33x33 FC-PBGA, 1023 pins Revision date: 01/28/14 Page 8 of 11 MSL Pb-free Assembly Rework CZ (MSL6 (8 hrs TOL) with 1x reflow 245°C) Assy Site / Substrate Supplier / Lots Rework CZ KLM/ Substrate Supplier “M”/Lot A KLM/ Substrate Supplier “M”/Lot B 0 / 11 0 / 11 KLM/Substrate Supplier “C”/Lot A 0 / 11 KLM/Substrate Supplier “C”/Lot B 0 / 11 Total 0 / 44 MSL3/245°C CZ Assy Site / Substrate Supplier / Lots MSL3 245 C KLM/ Substrate Supplier “M”/Lot A KLM/ Substrate Supplier “M”/Lot B 0/5 0/5 KLM/ Substrate Supplier “M”/Lot C 0/5 KLM/Substrate Supplier “C”/Lot A 0/5 KLM/Substrate Supplier “C”/Lot B 0/5 KLM/Substrate Supplier “C”/Lot C 0/5 Total 0 / 30 Dev No./Rev.: MPC 8572 / Rev2.1 / Rev2.2.1, Description: PowerQUICC38H Technology: CMOS90 SOI, Global Foundries Report Rev.:3 PRQE: Navin Kumar Package: 33x33 FC-PBGA, 1023 pins Revision date: 01/28/14 Page 9 of 11 FITs vs Junction Temperature: MPC8572 Thermal and Voltage Acceleration eA = 0.7 eV, Beta = 10.5, 60% Confidence 50.00 Fit Rate (Failures/1E9 Device Hours) 0.9 V 1V 1.1 V 1.00 0.02 0 20 40 60 80 100 120 0.00 Junction Temperature (°C) Tj 85C 90C 105C 0.9V 1 1 3 1V 3 4 10 1.1V 9 12 30 Dev No./Rev.: MPC 8572 / Rev2.1 / Rev2.2.1, Description: PowerQUICC38H Technology: CMOS90 SOI, Global Foundries Report Rev.:3 PRQE: Navin Kumar Package: 33x33 FC-PBGA, 1023 pins Revision date: 01/28/14 Page 10 of 11 MTBF vs Junction Temperature: MPC8572 Thermal and Voltage Acceleration eA = 0.7 eV, Beta = 10.5, 60% Confidence 1.00E+08 0.9 V 1V 1.1 V 1.00E+07 1.00E+06 MTBF (years) 1.00E+05 1.00E+04 1.00E+03 1.00E+02 1.00E+01 1.00E+00 Tj 85C 90C 105C 0 20 40 60 80 Junction Temperature (°C) 0.9V 1.00E+05 7.50E+04 3.10E+04 1V 3.60E+04 2.60E+04 1.10E+04 1.1V 1.20E+04 9.10E+03 3.80E+03 100 120 Revision History Revision History Revision Date Comment Author MPC8572 Industrial Qualification Report Indira Gupta 03/24/11 Add r2.2.1 Qualification Data Keith Minwell 05/22/13 Added Freescale KLM Assembly Site Qualification Data Navin Kumar 01/28/14 Added Pb-free C4 Bump Qualification Data Navin Kumar Original 12/21/09 1 2 3 Dev No./Rev.: MPC 8572 / Rev2.1 / Rev2.2.1, Description: PowerQUICC38H Technology: CMOS90 SOI, Global Foundries Report Rev.:3 PRQE: Navin Kumar Package: 33x33 FC-PBGA, 1023 pins Revision date: 01/28/14 Page 11 of 11