specification for approval

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SPECIFICATION FOR APPROVAL
1/8W, 0402, Low Resistance Chip Resistor (Lead / Halogen Free)
1. Scope
This specification applies to1.0mm x 0.5mm size 1/8W, fixed thick film low resistance value chip
resistors rectangular type.
2. Type Designation
RLT0510 - 2 - □□□□
(1) (2)
(3)
Where
□
(4)
(1) Size No.
(2) Power Rating:
2 = 1/8W
(3) Resistance value:
For example -R075 = 0.075Ω
R100 = 0.100Ω
The “R” shall be used as a decimal point
(4) Resistance tolerance:
F = ±1.0%, G= ±2%, J= ±5%
3. Outline Dimensions
L
a
a
W
t
b
Code Letter
Dimension
L
1.00 ± 0.10
W
0.50 ± 0.10
t
0.35 +0.15/-0.10
a
0.25 ± 0.10
b
0.30 ± 0.10
Unit : mm
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SPECIFICATION FOR APPROVAL
4. Ratings
4-1 Specification
Table 1
Power Rating*
1/8W
Resistance Tolerance
1%(F), 2%(G), 5%(J)
Resistance Range
Temperature Coefficient of
Resistance(ppm/℃)
0.065 ~ <0.60Ω
0.60 ~ 1.0Ω
±300
±200
Operating Temperature Range
-55℃ to 125℃
Note*:
Power Rating is based on continuous full load operation at rated ambient temperature of 70℃.
For resistor operated at ambient temperature in excess of 70℃,the maximum load
shall be derated in accordance with the following curve.
RATED LOAD(%)
100
0
-55
70
125
AMBIENT TEMPERATURE(℃)
4-2 Rated Voltage
The d.c. or a.c. r.m.s. voltage shall be calculated from the following expression
V =
P× R
Where V
: Rated voltage (V)
P : Rated power (W)
R : Nominal resistance (Ω)
4-3 Operating and Storage Temperature Range
-55 to +125℃
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SPECIFICATION FOR APPROVAL
5. Characteristics
5-1 Electrical
Item
Specification and Requirement
Test Method (JIS 5201)
Temperature Coefficient As follow table 1.
Room temperature
of Resistance (TCR)
Room temperature+100℃
Short Time Overload
(1) Applied voltage: 2.5 x rated
△ R:±1.0%
voltage
Without damage by flashover, spark,
(2)
Test time: 5 seconds
arcing, burning or breakdown
Insulation Resistance
Voltage Proof
(1)
Over 100 MΩ on Overcoat layer
(2)
face up
(3)
Over 1,000 MΩ on Substrate side
face up
Resistance range:±1.0%
(1)
Without damage by flashover, spark, (2)
arcing, burning or breakdown
(3)
Pressure Rod
(Metal)
Setup as figure 1
Test voltage: 100VDC±15VDC
Test time: 60 + 10 / - 0 seconds
Setup as figure 1
Test voltage: 100VAC(rms.)
Test time: 60 + 10 / - 0 seconds
Insulation Plate
Measurement Point A
(R=0.5 mm)
Substrate
A
Over coat Film
B
Spring
Sample Electrode
Voltage Supply
Metal Block
Measurement Point B
Substrate Side
Figure 1 : Measurment Setup
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SPECIFICATION FOR APPROVAL
5-2 Mechanical
Item
Specification and Requirement
Solderability
The surface of terminal immersed
shall be minimum of 95% covered
with a new coating of solder
Resistance to Solder
Heat
△ R: ± 1.0%
Without distinct deformation in
appearance
Bending Test
Test Method (JIS 5201)
Solder bath:
After immersing in flux, dip in
245 ± 5℃ molten solder bath for 2 ±
0.5 seconds
(1) Pre-heat: 100~110℃
for 30 seconds
(2) Immersed at solder bath of
270 ± 5℃ for 10 ± 1
seconds
(3) Measuring resistance 1
hour after test
Bending value: 3 mm for 30 ± 1
△ R: ± 1.0%
Without mechanical damage such as seconds
break
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SPECIFICATION FOR APPROVAL
5-3 Endurance
Item
Specification and Requirement
Test Method (JIS 5201)
Rapid Change of
Temperature
△ R:±1.0%
Without distinct damage in
appearance
Moisture with Load
△ R: ±5.0%
Without distinct damage in
appearance
Load Life
△ R: ±5.0%
Without distinct
damage in appearance
(1) Repeat 5 cycle as follow:
(-55 ± 3℃,30minutes)
→(Room temperature, 2~3
minutes)
→(+125 ± 2℃,30minutes)
→(Room temperature 2~3
minutes)
(2) Measuring resistance
1 hour after test
(1) Environment condition:
40 ± 2℃,90~95% RH
(2) Applied Voltage: rated voltage
(3) Test period: (1.5 hour ON)
→(0.5 hour OFF) cycled for
total
1,000 + 48 / - 0 hours
(4) Measuring resistance
1 hour after test
(1) Test temperature: 70 ± 3℃
(2) Applied Voltage: rated voltage
(3) Test period: (1.5 hour ON)
→(0.5 hour OFF) cycled for
total
1,000 + 48 / - 0 hours
(4) Measuring resistance
1 hour after test
(1) Store temperature:
-55 ± 3℃ for total
1,000 + 48 / - 0 hours
(2) Measuring resistance
1 hour after test
(1) Store temperature:
+125 ± 2℃ for total
1,000 + 48 / - 0 hours
(2) Measuring resistance
1 hour after test
Low Temperature Store △ R: ± 5.0%
Without distinct
damage in appearance
High Temperature Store △ R: ± 5.0%
Without distinct
damage in appearance
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SPECIFICATION FOR APPROVAL
6. Recommend Land Pattern Dimensions
A
C
A
0.6~1.0
B
2.0~2.4
C
0.6~1.0
Unit : mm
B
7. Construction Drawing
Resin coating(Epoxy)
Dielectric coating
Thick film Resistor
Alumina substrate ( Al2O3 )
Thin electrode film:NiCr+NiCu
Side Electrode: Cu+Ni+Sn plating
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SPECIFICATION FOR APPROVAL
8. Packaging
8-1 Dimensions
8-1-1 Tape packaging dimensions
0.42±0.05
¯1.5±0.1
4.0±0.1
Sprocket hole
2.0±0.05
C
A
B
Chip
0.48 ± 0.1
D
A=0.68±0.05
B=1.18±0.05
4.0±0.1
Carrier cavity
Pulling direction
C=1.75±0.1
D=3.5±0.05
Unit : mm
Remark: Leader tape length≧30 cm( 150 Hollow carrier cavity)
Reel dimensions
2.0
¯56.0±1
20min.
¯60.0+0/-1
¯13.0±0.2
¯180+0/-3
8-1-2
9.0±0.3
Unit : mm
13±1.4
8.0±0.3
SPECIFICATION FOR APPROVAL
8-2 Peel force of top cover tape
The peel speed shall be about 300 mm/min.
The peel force of top cover tape shall be between 0.1 to 0.7 N.
Top Cover Tape
165 ~ 180°
0.1~0.7 N
8-3 Numbers of taping 10,000 pieces /reel
8-4 Label making
The following items shall be marked on the reel.
(1) Type designation.
(2) Quantity
(3) Manufacturing date code
(4) Manufacturer’s name
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SPECIFICATION FOR APPROVAL
9. Carenote
9-1 Care note for storage
(1) Chip resistor shall be stored in a room where temperature and humidity must be controlled.
(temperature 5 to 35℃, humidity 45 to 85% RH) However, a humidity keep it low, as it is
possible.
(2) Chip resistor shall be stored as direct sunshine doesn’t hit on it.
(3) Chip resistor shall be stored with no moisture, dust, a material that will make solderability
inferior, and a harmful gas (Chloridation hydrogen, sulfurous acid gas, and sulfuration
hydrogen)
9-2 Carenote for operating and handling
(1) It is necessary to protect the edge and protection coat of resistors from mechanical stress.
(2) Handle with care when printing circuit board (PCB) is divided or fixed on support body,
because bending of printing circuit board (PCB) mounting will make mechanical stress for
resistors.
(3) Resistors shall be used with in rated range shown in specification. Especially, if voltage more
than specified value will be loaded to resistor, there is a case it will make damage for machine
because of temperature rise depending on generating of heat, and increase resistance value or
breaks.
(4) In case that resistor is loaded a rated voltage, it is necessary to confirms temperature of a
resistor and to reduce a load power according to load reduction curve, because a temperature
rise of a resistor depends on influence of heat from mounting density and neighboring
element.
(5) Observe Limiting element voltage and maximum overload voltage specified in each
specification
(6) If there is possibility that a large voltage (pulse voltage, shock voltage) charge to resistor, it is
necessary that operating condition shall be set up before use.