silicon rfic low current amplifier for mobile communications upc8178tb

SILICON RFIC
LOW CURRENT AMPLIFIER
FOR MOBILE COMMUNICATIONS
D
FEATURES
UPC8178TB
POWER GAIN vs. FREQUENCY
• LOW CURRENT CONSUMPTION
ICC = 1.9 mA TYP @ VCC = 3.0 V
+20
VCC = 3.0 V
2.4 GHz
1.0 GHz
• SUPPLY VOLTAGE:
VCC = 2.4 to 3.3 V
TA = -40°C
TA = +25°C
UE
+10
TA = +85°C
0
-10
1.9 GHz
-20
-30
IN
-40
0.1
0.3
1.0
3.0
DESCRIPTION
The UPC8178TB is a silicon monolithic integrated circuit
designed as an amplifier for mobile communications. This IC
can realize low current consumption with an external chip
inductor which cannot be realized on an internal 50 Ω wideband
matched IC. This low current amplifier operates on 3.0 V. This
device is manufactured using NEC's 30 GHz fmax UHS0 (Ultra
High Speed Process) silicon bipolar process which uses direct
silicon nitride passivation film and gold electrodes. These
materials can protect the chip surface from pollution and
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
NT
• EXCELLENT ISOLATION:
ISOL = 39 dB TYP @ f = 1.0 GHz
ISOL = 40 dB TYP @ f = 1.9 GHz
ISOL = 38 dB TYP @ f = 2.4 GHz
• POWER GAIN:
GP = 11.0 dB TYP @ f = 1.0 GHz
GP = 11.5 dB TYP @ f = 1.9 GHz
GP = 11.5 dB TYP @ f = 2.4 GHz
• OPERATING FREQUENCY:
0.1 to 2.4 GHz (Output port LC matching)
• 1 dB GAIN COMPRESSION OUTPUT POWER:
PO(1 dB) = -4.0 dBm TYP @ f = 1.0 GHz
PO(1 dB) = -7.0 dBm TYP @ f = 1.9 GHz
PO(1 dB) = -7.5 dBm TYP @ f = 2.4 GHz
• HIGH-DENSITY SURFACE MOUNTING:
6-pin super minimold package (2.0 x 1.25 x 0.9 mm)
• LOW WEIGHT:
7 mg (Standard Value)
APPLICATIONS
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• Buffer Amplifiers on 0.1 to 2.4 GHz mobile
communications system
NEC's stringent quality assurance and test procedures ensure
the highest reliability and performance.
ELECTRICAL CHARACTERISTICS
(TA = 25°C, VCC = VOUT = 3.0 V, ZS = ZL = 50 Ω, at LC matched frequency unless otherwise specified))
PART NUMBER
PACKAGE OUTLINE
PARAMETERS AND CONDITIONS1
SYMBOLS
ICC
UPC8178TB
S06
Circuit Current (no signal)
GP
Power Gain
ISOL
DI
Isolation
f = 1.0 GHz
f = 1.9 GHz
f = 2.4 GHz
f = 1.0 GHz
f = 1.9 GHz
f = 2.4 GHz
PO(1dB)
1 dB Gain Compression Output Power
NF
Noise Figure
RLin
Input Return Loss
f = 1.0 GHz
f = 1.9 GHz
f = 2.4 GHz
f = 1.0 GHz
f = 1.9 GHz
f = 2.4 GHz
f = 1.0 GHz
f = 1.9 GHz
f = 2.4 GHz
UNITS
MIN
TYP
MAX
mA
1.4
1.9
2.4
dB
dB
dB
dB
dB
dB
dBm
dBm
dBm
dB
dB
dB
dB
dB
dB
9.0
9.0
9.0
34
35
33
-8.0
-11.0
-11.5
–
–
–
4
5
6.5
11.0
11.5
11.5
39
40
38
-4.0
-7.0
-7.5
5.5
5.5
5.5
7
8
9.5
13.0
13.5
13.5
–
–
–
–
–
–
7.0
7.0
7.0
–
–
–
California Eastern Laboratories
UPC8178TB
ABSOLUTE MAXIMUM RATINGS1
RECOMMENDED
OPERATING CONDITIONS
(TA = +25°C unless otherwise specified)
PARAMETERS
UNITS
RATINGS
V
3.6
15
Voltage2
SYMBOLS
VCC
Supply
ICC
Circuit Current
mA
PD
Power Dissipation3
mW
270
TA
Operating Ambient
Temperature
°C
-40 to +85
Storage Temperature
°C
-55 to +150
dBm
+5
TSTG
PIN
Input Power
VCC
TA
PARAMETERS
UNITS MIN
TYP MAX
Supply Voltage1
V
2.4
3.0
3.3
Operating
Ambient Temperature
˚C
-40
+25
+85
Note:
1. Same voltage applied to pins 4 and 6.
D
SYMBOLS
IN
UE
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage.
2. Pins 4 and 6.
3. Mounted on a double-sided copper clad 50x50x1.6 mm epoxy
glass PWB, TA = +85°C.
SERIES PRODUCTS1 (TA = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 Ω)
1.0 GHz output port
matching frequency
GP
ISOL PO(1 dB)
(dB)
(dB) (dBm)
11
39
-4.0
13.5
44
+3.0
Part No.
UPC8178TB
UPC8179TB
ICC
(mA)
1.9
4.0
UPC8128TB
2.8
12.5
UPC8151TB
4.2
12.5
UPC8152TB
5.6
23
1.9 GHz output port
matching frequency
GP
ISOL PO(1 dB)
(dB) (dB) (dBm)
11.5
40
-7.0
15.5
42
+1.5
39
-4.0
13
38
+2.5
40
-4.5
39
-4.0
15
36
19.5
38
2.4 GHz output port
matching frequency
GP
ISOL PO(1 dB)
(dB)
(dB)
(dBm)
11.5
38
-7.5
15.5
41
+1.0
13
37
-4.0
+1.5
15
34
+0.5
–
-8.5
17.5
35
-8.5
–
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Note:
1. Typical performance.
1.66 GHz output port
matching frequency
GP
ISOL PO(1 dB)
(dB)
(dB) (dBm)
–
–
–
–
–
–
NT
Parameter
–
–
Marking
C3B
C3C
–
C2P
–
–
C2U
–
–
C2V
PIN FUNCTIONS (Pin Voltage is measured at VCC = 3.0 V)
Pin
No.
Pin
Name
Applied
Voltage
(V)
Pin
Voltage
(V)
1
Input
—
0.91
GND
0
—
DI
2
3
5
4
6
Output
VCC
Voltage
same as
VCC
through
external
inductor
2.4 to 3.3
–
Function and Applications
Internal Equivalent Circuit
Signal input pin. An internal matching circuit,
configured with resistors, enables a 50 Ω
connection over a wide band. This pin must be
coupled to the signal source with the capacitor for
DC out.
6
Ground pin. This pin should be connected to the
system ground with minimum inductance. Ground
pattern on the board should be formed as wide
as possible. All the ground pins must be
connected together with a wide ground pattern to
decrease impedance difference.
4
Signal output pin. This pin is designed as the
collector output. Due to the high impedance
output, this pin should be externally equipped
with LC matching circuit to next stage. For L, a
size 1005 chip inductor can be used.
Power supply pin. This pin should be externally
equipped with a bypass capacitor to minimize it's
impedance.
2
3
1
5
UPC8178TB
TEST CIRCUIT 1 (f = 1.0 GHz)
VCC
C3
D
C4
Output port matching circuit
L1
6
C1
4
1
C2 C3 50 Ω
OUT
UE
50Ω
IN
2, 3, 5
IN
EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD
f = 1.0 GHz
C3B
L1
NT
AMP. 4
Top View
IN
Connector
Mounting direction
C1
C5
SC
O
C4
COMPONENT LIST
DI
1.0 GHz Output Port Matching
C1, C3, C5
1000 pF
C2
0.75 pF
C4
10 pF
L1
12 nH
C2
C3
OUT
Connector
UPC8178TB
TEST CIRCUIT 2 (f = 1.9 GHz)
VCC
C4
C5
D
C6
Output port matching circuit
L1
6
C1
C2 C3 50 Ω
OUT
4
1
UE
50Ω
IN
2, 3, 5
IN
EXAMPLE OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD
f = 1.9 GHz
C3B
L1
NT
AMP. 4
Top View
IN
Connector
Mounting direction
C1
C6
SC
O
C4
COMPONENT LIST
1.9 GHz Output Port Matching
DI
C1, C3, C5, C6
C2
1000 pF
0.5 pF
C4
10 pF
L1
3.9 nH
C5
C2
C3
OUT
Connector
UPC8178TB
TEST CIRCUIT 3 (f = 2.4 GHz)
VCC
C3
C4
D
C5
Output port matching circuit
L1
6
C1
50 Ω
OUT
4
1
UE
50Ω
IN
L2
C2
2, 3, 5
IN
EXAMPLE OF TEST CIRCUIT 3 ASSEMBLED ON EVALUATION BOARD
f = 2.4 GHz
C3B
L2
IN
Connector
C1
C5
Mounting direction
C3
SC
O
C4
COMPONENT LIST
2.4 GHz Output Port Matching
DI
C1, C3, C4, C5
1000 pF
C3
10 pF
L1
1.8 nH
L2
2.7 nH
NOTES:
1. 42 x 35 x 0.4 mm double sided copper clad polyimide board.
2. Solder plated on pattern.
3. Back side: GND pattern.
4.
Through holes.
L1
NT
AMP. 4
Top View
C2
OUT
Connector
UPC8178TB
OUTLINE DIMENSIONS (Units in mm)
PIN CONNECTIONS
PACKAGE OUTLINE S06
(Bottom View)
(Top View)
2
+0.10
0.2 -0.05
0.65
1
1.3
PIN NO.
0.1 MIN
0.9 ± 0.1
0.7
0.15 +0.10
-0.05
LNA
SW
SC
O
÷N
TX
DI
PA
5
5
2
6
6
1
PIN NAME
1
Input
2
GND
3
GND
4
Output
5
GND
6
VCC
NT
SYSTEM APPLICATION EXAMPLE
RX
3
IN
Note:
All dimensions are typical unless otherwise specified.
Location examples in digital cellular
4
UE
0.65
0 to 0.1
4
D
3
1.25 ±0.1
2.0 ±0.2
C3B
2.1 ±0.1
I
Q
DEMOD
PLL
PLL
I
0˚
φ
90˚
Q
ORDERING INFORMATION
Part Number
Quantity
UPC8178TB-E3-A
3 K pcs/reel
Note: Embossed tape, 8 mm wide. Pins 1, 2 and 3 face the tape
Life Support Applications
perforation side.
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
EXCLUSIVE NORTH AMERICAN AGENT FOR
RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM
06/20/2001
DATA SUBJECT TO CHANGE WITHOUT NOTICE
D
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile: (408) 988-0279
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Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
IN
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
Restricted Substance
per RoHS
Lead (Pb)
Mercury
Concentration Limit per RoHS
(values are not yet fixed)
< 1000 PPM
Concentration contained
in CEL devices
-A
Not Detected
< 1000 PPM
Not Detected
< 100 PPM
Not Detected
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Cadmium
NT
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Hexavalent Chromium
< 1000 PPM
Not Detected
PBB
< 1000 PPM
Not Detected
PBDE
< 1000 PPM
Not Detected
-AZ
(*)
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
DI
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content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information
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See CEL Terms and Conditions for additional clarification of warranties and liability.
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