SILICON MMIC LOW CURRENT AMPLIFIER UPC8179TK FOR MOBILE COMMUNICATIONS FEATURES OUTLINE DIMENSIONS (Units in mm) • HIGH DENSITY SURFACE MOUNTING: 6 Pin Leadless Minimold Package (1.5 x 1.1 x 0.55 mm) PACKAGE OUTLINE TK • SUPPLY VOLTAGE: VCC = 2.4 to 3.3 V 1.3±0.05 Top View • OPERATING FREQUENCY: 0.1 to 2.4 GHz (Output port LC matching) • LIGHT WEIGHT: 3 mg APPLICATION • Buffer amplifiers for 0.1 to 2.4 GHz mobile communications systems. 0.16±0.05 0.96 0.48 1.5±0.1 0.2±0.1 • POWER GAIN: GP = 13.5 dB TYP at f = 1.0 GHz GP = 15.5 dB TYP at f = 1.9 GHz GP = 16.0 dB TYP at f = 2.4 GHz • LOW CURRENT CONSUMPTION: ICC = 4.0 mA TYP AT VCC = 3.0 V Bottom View 0.1 0.48 • HIGH EFFICIENCY: PO(1dB) = +2.0 dBm TYP at f = 1.0 GHz PO(1dB) = +0.5 dBm TYP at f = 1.9 GHz PO(1dB) = +0.5 dBm TYP at f = 2.4 GHz • EXCELLENT ISOLATION: ISL = 43 dB TYP at f = 1.0 GHz ISL = 42 dB TYP at f = 1.9 GHz ISL = 42 dB TYP at f = 2.4 GHz 1.1±0.1 0.55±0.03 (0.9) 0.11±+0.1 -0.05 DESCRIPTION NEC's UPC8179TK is a silicon monolithic integrated circuit designed as an amplifier for mobile communications. This IC can realize low current consumption with external chip inductor. The incorporation of a chip identical to the conventional 6pin super minimold package (2.0 x 1.25 x 0.9 mm) µPC8179TB in a 6-pin leadless minimold package (1.5 x 1.1 x 0.55 mm) has enabled a reduction in mounting area of 50 %. The µPC8179TK is ideally suited to replace the µPC8179TB for footprint reduction and increased design density. This IC is manufactured using NEC's 30 GHz fMAX UHS0 (Ultra High Speed Process) silicon bipolar process. This process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent corrosion/ migration. Thus this IC has excellent performance uniformity and reliability. NEC's stringent quality assurance and test procedures assure the highest performance. consistency and reliability. ELECTRICAL CHARACTERISTICS, (Unless otherwise specified, TA = +25°C, VCC = VOUT = 3.0 V, ZS = ZL = 50Ω, at LC matched Frequency) PART NUMBER PACKAGE OUTLINE SYMBOLS PARAMETERS AND CONDITIONS UPC8179TK TK UNITS MIN TYP MAX ICC Circuit Current (no input signal) mA 2.9 4.0 5.4 GP Power Gain, f = 1.0 GHz, PIN = -30 dBm f = 1.9 GHz, PIN = -30 dBm f = 2.4 GHz, PIN = -30 dBm dB 11.0 13.0 14.0 13.5 15.5 16.0 15.5 17.5 18.5 ISOL Isolation, f = 1.0 GHz, PIN = -30 dBm f = 1.9 GHz, PIN = -30 dBm f = 2.4 GHz, PIN = -30 dBm dB 39.0 37.0 37.0 43.0 42.0 42.0 – – – P1dB Output Power at 1 dB gain compression, f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz dBm -0.5 -2.0 -3.0 2.0 0.5 0.5 – – – Noise Figure, f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz dB – – – 5.0 5.0 5.0 6.5 6.5 6.5 Input Return Loss, (without matching circuit) f = 1.0 GHz, PIN = -30 dBm f = 1.9 GHz, PIN = -30 dBm f = 2.4 GHz, PIN = -30 dBm dB 4.0 4.0 6.0 7.0 7.0 9.0 – – – NF RLIN California Eastern Laboratories UPC8179TK ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) SYMBOLS PARAMETERS UNITS RATINGS RECOMMENDED OPERATING CONDITIONS VCC Supply Voltage V 3.6 SYMBOLS ICC Circuit Current mA 15 VCC mW 232 TA °C -40 to +85 °C -55 to +150 dBm +5 Dissipation2 PD Power TOP Operating Temperature TSTG Storage Temperature PIN Input Power PARAMETERS UNITS MIN TYP MAX Supply Voltage V 2.4 3.0 3.3 Operating Ambient Temperature °C -40 +25 +85 Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Mounted on a 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85°C). PIN CONNECTIONS (Top View) 2 6C 1 (Bottom View) 3 6 6 1 5 5 2 4 4 3 PIN NO. PIN NAME 1 INPUT 2 GND 3 GND 4 OUTPUT 5 GND 6 VCC Caution: pin arrangement differs from the conventional 6 pin super minimold type UPC8179TB – SERIES PRODUCTS1 (TA = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 Ω) Parameter 1.0 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11 39 -4.0 11 40 -5.5 1.9 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11.5 40 -7.0 11.0 41 -8.0 2.4 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11.5 38 -7.5 11.0 42 -8.0 Part No. UPC8178TB UPC8178TK ICC (mA) 1.9 1.9 UPC8179TB 4.0 13.5 44 +3.0 15.5 UPC8179TK 4.0 13.5 43 +2.0 UPC8128TB 2.8 12.5 39 -4.0 UPC8151TB 4.2 12.5 38 UPC8152TB 5.6 23 40 +1.5 15.5 41 +1.0 6 pin super minimold 15.5 42 +0.5 16.0 42 +0.5 6 pin leadless minimold 13 37 -4.0 – – – 6 pin super minimold +2.5 15 34 +0.5 – – – 6 pin super minimold -4.5 17.5 35 -8.5 – – – 6 pin super minimold SYSTEM APPLICATION EXAMPLE Location examples in digital cellular LNA RX I Q DEMOD ÷N PLL PLL I 0˚ TX φ PA 6 pin super minimold 6 pin leadless minimold 42 Note: 1. Typical performance. SW Package 90˚ Q UPC8179TK EVALUATION BOARD, 0.9 GHz Vcc GND P2 P1 VCC C4 C5 RFout C1 C3 DEVICE ORIENTATION C2 C3 C4 IFin J1 C2 C3C PIN 1 Vcc J2 OUT IN C3C U1 L1 6 C1 C5 L1 C6 1 50Ω 4 C6 50Ω 2,3,5 ADD TAB UPC8179TK Er=4.2 H=.028 GETEK COMPONENT LIST FORM Chip Capacitor Chip Inductor SYMBOL VALUE C6 1 pF C1, C5 51 pF C2, C3, C4 1800 pF L1 10 nH 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes EVALUATION BOARD, 1.9 GHz Vcc GND P2 P1 Vcc VCC C3C PIN 1 C3 DEVICE ORIENTATION J1 C2 IFin C2 C3 C4 RFout C7 C8 C1 C5 J2 C7 C8 C5 C3C U1 C4 C6 L2 L1 L1 6 C1 L2 C6 OUT IN 50Ω ADD TAB UPC8179TK GETEK H=.028 1 4 2,3,5 Er=4.2 COMPONENT LIST FORM Chip Capacitor Chip Inductor SYMBOL VALUE C7, C8 10 pF C6 .4 pF C1, C5 51 pF C2, C3, C4 1000 pF L2 22 nH L1 2.7 nH 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes 50Ω UPC8179TK EVALUATION BOARD, 2.4 GHz Vcc GND P2 P1 VCC J1 C2 IFin PIN 1 C7 C3C U1 C3 C2 C4 C3 C4 RFout C8 C1 C3C Vcc DEVICE ORIENTATION C8 J2 C7 C5 C5 L2 L1 C6 6 C1 IN 50Ω 1 L2 L1 4 OUT C6 2,3,5 ADD TAB UPC8179TK GETEK H=.028 Er=4.2 COMPONENT LIST FORM Chip Capacitor Chip Inductor SYMBOL VALUE C7 5.6 pF C6 0.5 pF C1, C5 51 pF C2, C3, C4, C8 1000 pF L2 3.9 nH L1 2.7 nH 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes 50Ω UPC8179TK TYPICAL SCATTERING PARAMETERS (TA = 25˚C) +90° +90° +135° +45° +135° 2 +180° 4 6 8 10 +0° S21 +45° 1 +180° 2 3 4 +0° S11 S22 -45° -135° -45° -135° Coordinates in Ohms Frequency in GHz -90° -90° 0.100 to 3.000 GHz by 0.100 VCC = VOUT = 3.0 V FREQUENCY S11 S21 S12 S22 GHz MAG (lin) ANG (deg) MAG (lin) ANG (deg) MAG (lin) ANG (deg) MAG (lin) ANG (deg) K MAG Unitless dB 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800 0.900 1.000 1.100 1.200 1.300 1.400 1.500 1.600 1.700 1.800 1.900 2.000 2.100 2.200 2.300 2.400 2.500 2.600 2.700 2.800 2.900 3.000 0.84 0.71 0.62 0.57 0.53 0.51 0.50 0.49 0.48 0.48 0.48 0.48 0.48 0.48 0.47 0.47 0.46 0.46 0.45 0.44 0.43 0.42 0.41 0.40 0.39 0.39 0.38 0.37 0.37 0.36 -15.44 -23.58 -26.85 -27.79 -28.46 -29.20 -30.41 -31.91 -33.73 -35.99 -38.71 -41.75 -45.45 -49.58 -54.02 -58.93 -64.06 -69.22 -74.64 -80.15 -85.84 -91.30 -97.01 -102.52 -107.66 -112.50 -117.21 -121.34 -125.50 -129.41 0.000 0.001 0.003 0.004 0.004 0.005 0.005 0.006 0.006 0.006 0.007 0.007 0.006 0.006 0.006 0.006 0.005 0.006 0.005 0.005 0.005 0.004 0.004 0.004 0.005 0.005 0.005 0.005 0.005 0.006 144.28 74.92 79.88 74.10 69.27 64.73 57.60 55.38 52.35 50.82 46.83 44.54 43.45 40.78 41.20 41.10 46.39 41.00 41.04 46.54 48.59 58.65 70.83 78.30 83.94 86.81 91.39 100.87 108.40 110.47 1.10 1.11 1.18 1.29 1.43 1.58 1.76 1.94 2.14 2.34 2.54 2.74 2.94 3.14 3.32 3.48 3.63 3.75 3.85 3.92 3.95 3.98 3.97 3.95 3.90 3.86 3.79 3.73 3.64 3.57 -177.39 -172.09 -167.46 -163.89 -162.03 -161.77 -162.65 -164.38 -167.03 -170.16 -174.19 -178.44 176.74 171.66 166.25 160.62 154.76 148.78 142.70 136.64 130.61 124.75 119.03 113.51 108.09 103.05 97.97 93.14 88.56 84.13 1.00 0.99 0.98 0.97 0.97 0.96 0.95 0.94 0.94 0.93 0.92 0.92 0.91 0.90 0.90 0.89 0.88 0.88 0.87 0.87 0.86 0.86 0.86 0.86 0.85 0.85 0.85 0.85 0.85 0.85 -1.76 -3.33 -4.59 -5.92 -7.05 -8.16 -9.33 -10.38 -11.45 -12.51 -13.62 -14.78 -15.97 -17.28 -18.52 -19.81 -21.15 -22.35 -23.73 -25.15 -26.53 -27.99 -29.67 -31.15 -32.65 -34.43 -35.87 -37.50 -39.28 -40.88 0.21 3.26 2.99 3.20 3.64 3.83 3.87 3.64 3.54 3.41 3.29 3.28 3.53 3.56 3.67 4.05 4.19 4.06 4.76 4.90 5.61 6.26 7.20 6.49 5.82 5.48 6.19 6.53 5.80 5.16 Note: 1. Data taken at Device Under Test pins 33.63 20.89 18.84 17.29 16.66 16.34 16.49 16.74 17.08 17.48 17.79 18.12 18.29 18.55 18.71 18.93 19.03 19.12 19.06 19.06 18.93 18.88 18.71 18.60 18.38 18.33 18.08 17.91 17.71 17.50 UPC8179TK OUTLINE DIMENSIONS (Units in mm) PACKAGE OUTLINE TK 1.3±0.05 1.1±0.1 Bottom View 0.1 0.48 0.96 1.5±0.1 0.48 0.16±0.05 Top View 0.2±0.1 0.55±0.03 (0.9) +0.1 0.11± -0.05 ORDERING INFORMATION PART NUMBER UPC8179TK-E3 QTY 3K/Reel Note: Embossed tape, 8 mm wide. Pins 1, 2, 3 are in tape pull-out direction. Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 10/28/2003