BIPOLAR ANALOG INTEGRATED CIRCUIT UPC8181TB D 3 V, SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS FEATURES NOISE FIGURE, POWER GAIN vs. FREQUENCY UE • SUPPLY VOLTAGE: VCC = 2.7 to 3.3 V 30 • CIRCUIT CURRENT: ICC = 23.0 mA TYP at VCC = 3.0 V VCC = 3.0 V • MEDIUM OUTPUT POWER: PO(1dB) = +8.0 dBm TYP at f = 0.9 GHz PO(1dB) = +7.0 dBm TYP at f = 1.9 GHz PO(1dB) = +7.0 dBm TYP at f = 2.4 GHz 15 5 10 4 5 3 0 NF 0.1 0.3 NT • UPPER LIMIT OPERATING FREQUENCY: fU = 4.0 GHz TYP at 3 dB bandwidth (Standard value) • HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package (2.0 x 1.25 x 0.9 mm) GP 20 IN • POWER GAIN: GP = 19.0 dB TYP at f = 0.9 GHz GP = 21.0 dB TYP at f = 1.9 GHz GP = 22.0 dB TYP at f = 2.4 GHz Gain, GP (dB) 25 1.0 3.0 Frequency, f (GHz) APPLICATIONS DESCRIPTION The UPC8181TB is a silicon Monolithic Microwave Integrated Circuit designed as an amplifier for mobile communications. This IC operates at 3 volts. The medium output power is suitable for RF-TX of mobile communication systems. • Buffer amplifiers for 1.9 GHz to 2.4 GHz mobile communication systems. SC O This IC is manufactured using the 30 GHz f max UHS0 (Ultra High Speed process) silicon bipolar process. This process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent corrosion/migration. This IC has excellent performance, uniformity, and reliability. Stringent quality assurance and test procedures ensure the highest reliability and performance. ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = VOUT = 3.0 V, ZS = ZL = 50Ω) PART NUMBER PACKAGE OUTLINE PARAMETERS AND CONDITIONS DI SYMBOLS UPC8181TB S06 UNITS MIN TYP MAX ICC Circuit Current (no signal) mA – 23.0 30.0 GP Power Gain, f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz dB 16.0 18.0 19.0 19.0 21.0 22.0 22.0 24.0 25.0 NF Noise Figure, f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz dB – – – 4.5 4.5 4.5 6.0 6.0 6.0 fU ISL Upper Limit Operating Frequency, 3 dB down below from gain at f = 0.1 GHz Isolation, f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz GHz – 4.0 – dB 28.0 27.0 26.5 33.0 32.0 31.5 – – – UPC8181TB ELECTRICAL CHARACTERISTICS (cont.) (TA = 25°C, VCC = VOUT = 3.0 V, ZS = ZL = 50Ω) PART NUMBER PACKAGE OUTLINE PARAMETERS AND CONDITIONS PO(1dB) UNITS 1 dB Gain Compression Output Level, f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz Saturated Output Power Level, f = 0.9 GHz, PIN = -5 dBm f = 1.9 GHz, PIN = -5 dBm f = 2.4 GHz, PIN = -5 dBm Input Return Loss, f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz RLout Output Return Loss, f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz ABSOLUTE MAXIMUM RATINGS1 VCC PARAMETERS Supply ICC Voltage2 Power Dissipation3 TA Operating Ambient Temperature TSTG Storage Temperature Input Power4 3.6 mA 60 mW 270 °C -40 to +85 °C -55 to +150 dBm +10 SC O PIN RATINGS V Total Cicuit Current PD UNITS +8.0 +7.0 +7.0 – – – – – – +9.5 +9.0 +9.0 – – – dB 4.5 7.5 8.0 7.5 10.5 11.0 – – – dB 6.0 7.0 9.0 9.0 10.0 12.0 – – – dBm RECOMMENDED OPERATING CONDITIONS SYMBOLS PARAMETERS VCC Voltage1 NT SYMBOLS MAX +5.5 +4.5 +4.5 IN RLin TYP UE PO(SAT) dBm MIN D SYMBOLS UPC8181TB S06 Supply UNITS MIN V TYP MAX 2.7 3.0 Note: 1. Same voltage applied to pins 4 and 6 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage. 2. TA = 25°C, pins 4 and 6. 3. Mounted on a double-sided copper clad 50x50x1.6 mm epoxy glass PWB, TA = +85°C. 4. TA = +25 °C TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C) CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE CIRCUIT CURRENT vs. SUPPLY VOLTAGE 40 40 No Signal 25 20 15 10 5 No Signal VCC = 3.0 V 35 Circuit Current, ICC (mA) 30 DI Circuit Current, ICC (mA) 35 30 25 20 15 10 5 0 0 1 2 3 Supply Voltage, VCC (V) 4 0 -60 -40 -20 0 +20 +40 +60 +80 +100 Operating Ambient Temperature, TA (°C) 3.3 UPC8181TB TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C) INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY ISOLATION vs. FREQUENCY 0 -5 VCC = 3.0 V -30 -40 -10 RLout -15 0.1 0.3 1.0 3.0 0.1 Frequency, f (GHz) +10 +5 0 -5 -10 -15 SC O -20 -40 -30 -20 -10 0 +5 0 -5 -10 -15 -20 -30 -50 +10 OUTPUT POWER vs. INPUT POWER +5 0 -5 -10 -15 -20 -25 -30 -50 -40 -30 -20 -10 Input Power, PIN (dBm) 0 +10 -30 -20 -10 0 +10 SATURATED OUTPUT POWER vs. FREQUENCY +12 Saturated Output Power, PO(sat) (dBm) f = 2.4 GHz VCC = 3.0 V DI Output Power, POUT (dBm) +10 -40 Input Power, PIN (dBm) Input Power, PIN (dBm) +15 f = 1.9 GHz VCC = 3.0 V -25 -25 -30 -50 3.0 IN NT f = 0.9 GHz VCC = 3.0 V +10 1.0 OUTPUT POWER vs. INPUT POWER +15 +15 0.3 Frequency, f (GHz) OUTPUT POWER vs. INPUT POWER Output Power, POUT (dBm) RLin UE -20 Output Power, POUT (dBm) Isolation, ISOL (dB) -10 D Input Return Loss, RLIN (dB) Output Return Loss, RLOUT (dBm) VCC = 3.0 V VCC = 3.3 V +10 VCC = 3.0 V +8 VCC = 2.7 V +6 +4 +2 0 0.1 0.3 1.0 Frequency, f (GHz) 3.0 UPC8181TB TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 0 f1 = 900 MHz f2 = 902 MHz -10 -20 VCC = 3.0 V -40 -50 -60 -15 -10 -5 0 +5 +10 -20 VCC = 3.0 V -30 -40 -50 -10 -5 0 +5 +10 Output Power of Each Tone, POUT (dBm) DI -60 -15 -30 -40 -50 -10 IN NT -10 SC O Thirf Order Intermodulation Distortion, IM3 (dBc) f1 = 2400 MHz f2 = 2402 MHz VCC = 3.0 V -5 0 +5 +10 Output Power of Each Tone, POUT (dBm) Output Power of Each Tone, POUT (dBm) 0 -20 -60 -15 +15 THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE -10 UE -30 f1 = 1900 MHz f2 = 1902 MHz D Thirf Order Intermodulation Distortion, IM3 (dBc) Third Order Intermodulation Distortion, IM3 (dBc) 0 UPC8181TB D TYPICAL SCATTERING PARAMETERS (TA = 25˚C) 0.1 G 3.0 G 1.0 G UE 4.0 G 0.1 G 2.0 G 3.0 G 1.0 G 4.0 G 2.0 G Coordinates in Ohms Frequency in GHz VCC = VOUT = 3.0 V, ICC = 23 S22 VCC = VOUT = 3.0 V, ICC = 23.0 mA FREQUENCY S11 S21 IN S11 S12 MAG ANG MAG ANG 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 0.452 0.467 0.470 0.460 0.438 0.415 0.397 0.395 0.399 0.404 0.396 0.394 0.385 0.368 0.347 0.335 0.327 0.328 0.327 0.325 0.316 0.295 0.288 0.291 0.303 0.317 0.335 0.349 0.347 0.345 0.341 0.331 0.323 0.311 0.302 0.289 0.266 0.253 0.238 0.238 0.244 -2.7 -5.7 -7.5 -9.3 -11.5 -14.7 -18.6 -22.4 -25.6 -28.1 -29.0 -28.5 -28.0 -28.8 -29.5 -30.9 -31.5 -31.2 -29.4 -29.4 -28.5 -29.4 -30.8 -34.1 -38.3 -41.1 -41.3 -41.0 -39.4 -43.2 -45.4 -47.9 -49.8 -52.1 -52.6 -54.9 -56.5 -61.5 -65.6 -70.7 -74.0 9.078 9.098 9.143 9.237 9.284 9.442 9.670 9.897 10.166 10.496 10.903 11.329 11.895 12.145 12.356 12.670 12.966 13.410 13.722 14.151 14.412 14.747 15.144 15.463 15.264 15.137 14.774 14.176 13.710 12.808 12.313 11.587 11.003 10.638 10.228 9.985 9.543 9.184 8.816 8.488 8.186 -2.0 -4.9 -6.9 -10.1 -11.9 -14.6 -17.0 -19.7 -22.7 -26.0 -29.0 -32.8 -37.9 -42.4 -47.6 -51.8 -56.4 -61.4 -66.8 -72.3 -78.1 -84.1 -90.3 -97.4 -104.6 -112.6 -119.8 -127.7 -133.7 -139.8 -146.0 -149.3 -154.5 -157.7 -162.0 -166.5 -170.1 -174.5 -177.7 178.2 174.3 SC O DI S22 MAG ANG MAG ANG K 0.020 0.021 0.021 0.021 0.021 0.022 0.022 0.022 0.023 0.022 0.023 0.025 0.025 0.024 0.025 0.026 0.024 0.026 0.027 0.026 0.028 0.027 0.029 0.029 0.029 0.028 0.029 0.031 0.029 0.029 0.031 0.029 0.031 0.031 0.029 0.030 0.030 0.031 0.030 0.032 0.032 4.3 4.2 8.2 9.8 11.4 8.1 11.5 16.3 14.5 13.4 18.0 16.6 17.4 22.0 24.3 20.6 21.4 23.2 27.5 24.6 26.4 26.5 27.5 27.1 27.7 25.5 25.5 25.0 32.9 24.8 28.9 31.6 31.2 29.5 32.5 31.4 39.6 34.1 36.2 38.9 37.0 0.338 0.346 0.344 0.335 0.328 0.337 0.350 0.354 0.342 0.331 0.332 0.353 0.376 0.374 0.361 0.356 0.356 0.366 0.367 0.369 0.363 0.361 0.359 0.346 0.323 0.303 0.294 0.299 0.304 0.317 0.325 0.318 0.315 0.307 0.302 0.303 0.301 0.294 0.275 0.270 0.266 -1.6 -2.1 -1.0 -2.7 -4.8 -7.5 -7.9 -6.8 -6.0 -7.9 -10.8 -13.4 -14.3 -15.0 -16.3 -19.3 -22.0 -23.9 -25.6 -28.5 -31.7 -35.4 -37.1 -39.0 -40.6 -43.1 -43.9 -43.0 -41.3 -44.9 -46.7 -48.7 -52.1 -56.1 -60.0 -63.7 -65.1 -67.5 -68.8 -71.0 -75.1 1.89 1.73 1.72 1.75 1.84 1.73 1.72 1.69 1.56 1.60 1.48 1.33 1.26 1.28 1.28 1.22 1.29 1.17 1.11 1.11 1.05 1.08 1.02 1.01 1.04 1.09 1.07 1.03 1.09 1.15 1.13 1.25 1.27 1.32 1.44 1.47 1.54 1.55 1.71 1.70 1.75 NT GHz UPC8181TB PIN FUNCTIONS (Pin Voltage is measured at VCC = 3.0 V) Applied Voltage Pin Voltage 1 INPUT — 0.99 2 3 5 GND 0 — 4 VCC 2.7 to 3.3 — Equivalent Circuit Signal input pin. An internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. A multi- feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. GND pin. This pin should be connected to the system ground with minimuim inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. 6 4 1 Signal output pin. The inductor must be attached between VCC and output pins to supply current to the internal output transistors. 2 3 — Power supply pin, which biases the internal input transistor. This pin should be externally equipped with bypass capacitor to minimize its impedance. GND GND NT IN 6 OUTPUT Voltage as same as VCC through external inductor Description D Pin Name UE Pin No. APPLICATION EXAMPLE (Digital Cellular Telephone) SC O RX ÷N DI PA : UPC8181TB I Q PLL SW TX DEMO PLL I 0˚ Phase Shifter 90˚ Q 5 UPC8181TB OUTLINE DIMENSIONS (Units in mm) LEAD CONNECTIONS (Top View) 6-PIN SUPER MINIMOLD (Bottom View) +0.1 -0.05 0.2 0.65 1.3 0.65 1 1. 2. 3. 4. 5. 6. 3 5 5 2 6 6 1 INPUT GND GND OUTPUT GND VCC IN 0 to 0.1 0.15 +0.1 -0.05 0.7 0.9 ± 0.1 0.1 MIN 4 UE 2.0 ±0.2 2 4 D 3 1.25 ±0.1 C3E 2.1 ±0.1 ORDERING INFORMATION PART NUMBER PACKAGE QUANTITY UPC8181TB-E3-A 6-pin super minimold 3kpcs/Reel TEST CIRCUIT NT Note: Embossed tape 8 mm wide. Pins 1,2,3 face tape perforation side. APPLICATION BOARD VCC SC O C3 100 nH 6 50Ω 4 1 C2 51 pF 51 pF 50Ω OUT J2 J1 RF IN 2,3,5 DI IN C1 Si MMIC AMPLIFIER C1 L1 U1 1 CXX 1000 pF RF OUT C2 C3 Vcc GND P1 Note: 1. double sided copper clad GETEK board (H = .028, εr = 4.2.) 2. Back side: GND pattern. 3. Solder plated on patterns. 4. o O : Through holes. EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 Internet: http://WWW.CEL.COM DATA SUBJECT TO CHANGE WITHOUT NOTICE 02/15/2002