BIPOLAR ANALOG INTEGRATED CIRCUIT 3 V, SUPER MINIMOLD MEDIUM POWER SI MMIC AMPLIFIER FEATURES • HIGH OUTPUT POWER: PSAT = +11 dBm at 900 MHz GAIN vs. FREQUENCY AND TEMPERATURE • HIGH GAIN: 20 dB at 1.9 GHz • SUPER SMALL PACKAGE: SOT-363 package • TAPE AND REEL PACKAGING OPTION AVAILABLE DESCRIPTION TA = +85°C 22 18 TA = -40°C TA = +25°C 20 TA = +85°C TA = +25°C TA = -40°C 16 14 12 IN The UPC2763TB is a Silicon Monolithic integrated circuit which is manufactured using the NESAT™ III process. The NESAT™ III process produces transistors with fT approaching 20 GHz. The UPC2763TB is pin compatible and has comparable performance to the larger UPC2763T, so it is suitable for use as a replacement to help reduce system size. The IC is housed in a 6 pin super minimold or SOT-363 package. Operating on a 3 volt supply this IC is ideally suited for handheld, portable designs. Insertion Power Gain, GP (dB) • WIDE BANDWIDTH: 2.7 GHz at -3 dB UE 24 • LOW VOLTAGE: 3.0 V TYP, 2.7 V MIN D UPC2763TB 10 8 6 0.1 0.3 VCC = 3.0 V 1.0 3.0 NT Frequency, f (MHz) Stringent quality assurance and test procedures ensure the highest reliability and performance. ELECTRICAL CHARACTERISTICS (TA = 25°C, ZL = ZS = 50 Ω, VCC = 3.0 V) SC O PART NUMBER PACKAGE OUTLINE SYMBOLS PARAMETERS AND CONDITIONS UNITS UPC2763TB S06 MIN TYP MAX ICC Circuit Current (no signal) mA 27 35 GS Small Signal Gain, dB dB 18 18 20 21 23 24 fU Upper Limit Operating Frequency (The gain at fu is 3 dB down from the gain at 0.1 GHz) GHz 2.3 2.7 P1dB Output Power at 1 dB Compression Point, f = 900 MHz f = 1900 MHz dBm dBm +7 +4 +9.5 +6.5 PSAT Saturated Output Power, f = 900 MHz f = 1900 MHz dBm dBm 11 8 5.5 5.5 NF f = 900 MHz f = 1900 MHz Noise Figure, f = 900 MHz f = 1900 MHz dB dB Input Return Loss, f = 900 MHz f = 1900 MHz dB dB 8 8 11 11 RLOUT Output Return Loss, f = 900 MHz f = 1900 MHz dB dB 5 6 7 9 ISOL Isolation, f = 900 MHz f = 1900 MHz dB dB 25 24 30 29 DI RLIN OIP3 PADJ SSB Output Third Order Intercept Point f = 900, 902 MHz f = 1900, 1902 MHz dBm dBm +17 +11 Adjacent Channel Power, f = 900 MHz, π/4 QPSK wave1, PO = +4 dBm Δf = ±50 KHz Δf = ±100 KHz dBc dBc -61 -62 POUT = +4 dBm Note: 1. π/4 QPSK modulated wave input, data rate 42 kbps. 7.0 7.5 UPC2763TB ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) VCC Supply Voltage UNITS RATINGS SYMBOLS V 3.6 VCC Supply Voltage V 2.7 3 3.3 TOP Operating Temperature °C -40 25 85 ICC Total Supply Current mA 70 PIN Input Power dBm +10 mW 200 Dissipation2 PARAMETERS UNITS MIN TYP MAX TEST CIRCUIT PT Total Power TOP Operating Temperature °C -40 to +85 TSTG Storage Temperature °C -55 to +150 D PARAMETERS VCC Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Mounted on a 50 x 50 x 1.6 mm epoxy glass PWB (TA = 85°C). 1000 pF UE SYMBOLS RECOMMENDED OPERATING CONDITIONS L = 300 nH 6 50 Ω IN 1000 pF CIRCUIT CURRENT vs. SUPPLY VOLTAGE 50 40 30 SC O 20 10 Circuit Current, ICC (mA) NT No signal Circuit Current, ICC (mA) 2, 3, 5 CIRCUIT CURRENT vs. OPERATING TEMPERATURE 50 0 2 1 3 No signal VCC = 3.0 V 40 30 20 10 0 0 -60 4 -40 -20 0 20 40 60 80 100 Supply Voltage, VCC (V) Operating Temperature, TOP (°C) NOISE FIGURE AND INSERTION POWER GAIN vs. FREQUENCY AND VOLTAGE INPUT AND OUTPUT RETURN LOSS vs. FREQUENCY 0 24 22 VCC = 3.0V VCC = 3.3 V RLout GP 20 -10 VCC = 2.7 V 14 7 VCC = 3.3 V 12 6 NF 10 VCC = 3.0 V 8 5 VCC = 2.7 V 4 6 0.1 0.3 1.0 Frequency, f (GHz) 3 3.0 Noise Figure, NF (dB) 16 Return Loss (dB) VCC = 3.0 V 18 DI Insertion Power Gain, GP (dB) OUT 1000 pF IN TYPICAL PERFORMANCE CURVES (TA = 25°C) 50 Ω 4 1 RLin -20 -30 -40 0.1 0.3 1.0 Frequency, f (GHz) 3.0 UPC2763TB TYPICAL PERFORMANCE CURVES (TA = 25°C) OUTPUT POWER vs. INPUT POWER AND VOLTAGE ISOLATION vs. FREQUENCY 0 15 VCC = 3.0V VCC = 3.3V Output Power, POUT (dBm) -20 -30 -40 -50 VCC = 3.0V 5 VCC = 2.7V 0 -5 -10 0.1 0.3 1.0 3.0 -25 Output Power, POUT (dBm) TA = +25°C SC O -5 -10 -20 -15 -10 VCC = 3.0V 10 NT TA = -40°C TA = +85°C -5 0 0 -5 -10 +5 -25 TA = +25°C TA = -40°C TA = +85°C 0 TA = +25°C -5 -10 -25 -20 -15 -10 Input Power, PIN (dBm) -5 0 -10 -5 0 +15 Saturated Output Power, PO(SAT) (dBm) DI Output Power, POUT (dBm) TA = -40°C 5 -15 SATURATED OUTPUT POWER vs. FREQUENCY AND VOLTAGE 15 10 -20 Input Power, PIN (dBm) OUTPUT POWER vs. INPUT POWER AND TEMPERATURE TA = +85°C VCC = 2.7V 5 Input Power, PIN (dBm) f = 1.9 GHz VCC = 3.0 V 0 VCC = 3.3V f = 1.9 GHZ 10 0 -5 15 TA = +85°C TA = -40°C -10 OUTPUT POWER vs. INPUT POWER AND VOLTAGE 15 5 -15 Input Power, PIN (dBm) OUTPUT POWER vs. INPUT POWER AND TEMPERATURE f = 0.9 GHZ VCC = 3.0 V -20 IN Frequency, f (GHz) Output Power, POUT (dBm) 10 UE Isolation, ISOL (dB) -10 D f = 900 MHZ PIN = -3 dBm +13 VCC = 3.3 V +11 VCC = 3.0 V +9 VCC = 2.7 V +7 +5 +3 0.1 0.3 1.0 Frequency, f (GHz) 3.0 UPC2763TB TYPICAL PERFORMANCE CURVES (TA = 25°C) SATURATED OUTPUT POWER vs. FREQUENCYAND TEMPERATURE +15 PIN = -3 dBm TA = +85°C +11 TA = -40°C +9 TA = +25°C +7 +5 +3 0.1 0.3 1.0 3.0 f1 = 1.900 GHZ f2 = 1.902 GHZ VCC = 3.3 V -40 VCC = 3.0 V -30 VCC = 2.7 V -20 -10 0 -15 -10 -5 0 +5 +10 Output Power of Each Tone, PO (EACH) (dBm) DI VCC = 3.3 V -40 VCC = 3.0 V VCC = 2.7 V -30 -20 -10 0 -15 -10 -5 0 +5 +10 Output Power of Each Tone, PO (EACH) (dBm) NT -50 SC O Third Order Intermodulation Distortion, IM3 (dBc) -60 -50 IN Frequency, f (GHz) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE AND VOLTAGE f1 = 0.900 GHZ f2 = 0.902 GHZ UE Output Power, POUT (dBm) +13 -60 D Third Order Intermodulation Distortion, IM3 (dBc) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE AND VOLTAGE UPC2763TB D TYPICAL SCATTERING PARAMETERS (TA = +25°C, VCC = VOUT = 3.0 V) 3.0 GHz 0.1 GHz 0.1 GHz 1.0 GHz 2.0 GHz 2.0 GHz UE 3.0 GHz 1.0 GHz S22 VCC = VOUT = 3.0 V, ICC = 28 mA FREQUENCY S11 S21 IN S11 S12 S22 K MAG ANG MAG ANG MAG ANG MAG ANG 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 0.231 0.242 0.250 0.425 0.242 0.241 0.263 0.291 0.316 0.322 0.318 0.309 0.322 0.344 0.371 0.380 0.388 0.378 0.378 0.375 0.369 0.351 0.331 0.306 0.300 0.294 0.290 0.270 0.248 0.219 0.198 -1.4 -0.2 2.7 2.8 2.0 -2.2 -5.3 -5.6 -5.1 -4.0 -5.4 -9.0 -14.2 -20.6 -23.7 -27.5 -30.6 -36.4 -42.1 -46.6 -50.5 -53.8 -59.8 -66.4 -73.1 -75.8 -77.1 -77.7 -78.7 -82.3 -88.7 10.210 10.305 10.464 10.655 10.863 11.093 11.544 11.843 12.291 12.676 13.066 13.311 13.661 13.845 13.824 13.890 13.634 13.236 12.724 12.290 11.707 11.130 10.524 9.824 9.152 8.583 8.029 7.610 7.240 6.827 6.516 -3.8 -8.5 -12.9 -18.2 -22.8 -28.1 -33.2 -39.0 -45.1 -52.4 -59.8 -67.3 -75.8 -83.9 -93.0 -101.5 -110.5 -119.6 -127.9 -136.1 -144.0 -151.7 -159.1 -165.9 -172.3 -178.2 176.2 170.6 166.1 161.2 156.9 0.023 0.023 0.024 0.024 0.026 0.027 0.028 0.029 0.029 0.030 0.031 0.031 0.033 0.033 0.035 0.035 0.036 0.035 0.035 0.035 0.035 0.036 0.036 0.034 0.035 0.034 0.035 0.037 0.039 0.039 0.040 2.4 7.8 9.3 13.4 16.1 19.9 22.3 22.5 23.9 25.6 24.1 27.0 28.8 28.5 30.1 28.1 29.2 29.9 30.9 32.9 33.0 35.7 36.8 38.7 40.1 43.8 46.3 47.7 51.1 53.6 55.1 0.406 0.412 0.407 0.407 0.405 0.414 0.419 0.424 0.424 0.425 0.438 0.442 0.441 0.434 0.435 0.439 0.439 0.428 0.411 0.393 0.385 0.373 0.359 0.336 0.321 0.306 0.299 0.288 0.270 0.253 0.244 -4.1 -7.5 -9.9 -13.9 -17.6 -21.6 -24.6 -27.7 -31.9 -37.1 -42.5 -47.8 -51.2 -56.0 -62.2 -68.9 -74.6 -81.3 -87.0 -93.4 -99.6 -104.9 -110.3 -117.5 -123.3 -129.4 -133.9 -138.6 -143.6 -150.1 -156.2 DI SC O NT GHz 1.68 1.66 1.58 1.55 1.44 1.37 1.25 1.16 1.09 1.02 0.96 0.96 0.90 0.87 0.82 0.80 0.78 0.84 0.89 0.94 0.99 1.06 1.13 1.31 1.41 1.55 1.58 1.63 1.67 1.79 1.88 UPC2763TB OUTLINE DIMENSIONS (Units in mm) LEAD CONNECTIONS 3 1.25±0.1 4 0.65 2 5 1 6 0.2 +0.1 -0 1 DOT ON BACK SIDE 0.9 ± 0.1 0.7 +0.1 0.15 -0.5 PIN DESCRIPTIONS Pin No. Pin Name Applied Voltage (V) 1 Input – 6 3 5 2 1 6 INPUT GND GND OUTPUT GND VCC Internal Equivalent Circuit Description Signal input pin. An internal matching circuit, configured with resistors, enables 50 Ω connection over a wide bandwidth. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to the signal source with a blocking capacitor. Signal output pin. Connect an inductor between this pin and VCC to supply current to the internal output transistors. SC O Output 1. 2. 3. 4. 5. 6. 5 NT 0 ~0.1 4 2 4 UE 1.3 0.65 3 4 IN 2.0±0.2 (Bottom View) D 2.1±0.1 C2A (Top View) PACKAGE OUTLINE S06 6 VCC 2.7 to 3.3 Power supply pin. This pin should be externally equipped with a bypass capacitor to minimize ground impedance. 2 3 5 GND 0 Ground pins. These pins should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to minimize impedance difference. 6 4 1 3 2 5 ORDERING INFORMATION PART NUMBER DI UPC2763TB-E3-A QTY 3K/Reel Note: Embossed Tape, 8 mm wide. Pins 1, 2 and 3 face perforated side of tape. EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM 06/21/2000 DATA SUBJECT TO CHANGE WITHOUT NOTICE