MC-7833

DATA SHEET
GaAs MULTI-CHIP MODULE
MC-7833
UE
D
870 MHz CATV 25 dB PUSH-PULL AMPLIFIER
DESCRIPTION
The MC-7833 is a GaAs Multi-chip Module designed for use in CATV applications up to 870 MHz. This unit has
low distortion, low noise figure and return loss across the entire frequency band.
Reliability and performance uniformity are assured by our stringent quality and control procedures.
FEATURES
• Low return loss
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• Low distortion
• High linear gain
GL = 25.0 dB MIN. @f = 870 MHz
ORDERING INFORMATION
Part Number
<R>
MC-7833
Order Number
Package
Supplying Form
7-pin special with heatsink (Pb-
MC-7833-AZ
25 pcs MAX./Tray
Free)
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: MC-7833-AZ
ABSOLUTE MAXIMUM RATINGS (T A = +25C)
Parameter
Symbol
Ratings
Unit
VDD
30
V
Vi
65.0
dBmV
Operating Case Temperature
TC
30 to +100
C
Storage Temperature
Tstg
40 to +100
C
Supply Voltage
SC
Note
Input Voltage
DI
Note In case of single tone
Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
Document No. PG10092EJ04V0DS (4th edition)
Date Published December 2006 NS CP(N)
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
MC-7833
RECOMMENDED OPERATING CONDITIONS (Z S = ZL = 75 )
Supply Voltage
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
23.5
24.0
24.5
V

19.0
25.5
dBmV
30
25
85
C
TYP.
MAX.
Unit
25.0

26.0
dB
1.0

1.8
dB
f = 40 to 870 MHz, Peak to valley


0.7
dB


5.5
dB


6.0
dB
180

240
mA
110 channel,


57
dBc
VO = 44 dBmV, Flat


50
dBc


57
dBc
VDD
Input Voltage
Vi
Operating Case Temperature
TC
110 channel, Flat
D
Parameter
ELECTRICAL CHARACTERISTICS (T C = 30  5C, VDD = 24 V, ZS = ZL = 75 )
Symbol
Linear Gain
GL
Gain Slope
GSlope
Test Conditions
f = 870 MHz
f = 40 to 870 MHz
Gain Flatness
GFlatness
Noise Figure 1
NF1
f = 50 MHz
Noise Figure 2
NF2
f = 870 MHz
Composite Triple Beat
Cross Modulation
IDD
Pin = None
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Operating Current
MIN.
UE
Parameter
CTB
XM
CSO
Input / Output Return Loss 1
RL1
f = 40 to 160 MHz
20


dB
Input / Output Return Loss 2
RL2
f = 160 to 320 MHz
19


dB
Input / Output Return Loss 3
RL3
f = 320 to 640 MHz
17.5


dB
Input / Output Return Loss 4
RL4
f = 640 to 870 MHz
16


dB
DI
SC
Composite 2nd Order Beat
2
Data Sheet PG10092EJ04V0DS
MC-7833
PACKAGE DIMENSIONS
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UE
D
7-PIN SPECIAL WITH HEATSINK (UNIT: mm)
DI
SC
PIN CONNECTION
Data Sheet PG10092EJ04V0DS
3
MC-7833
NOTES ON CORRECT USE
(1) The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired
stress to the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance.
Recommended that space is 2.0 to 3.0 mm typical.
(2) Recommended torque strength of the screw is 59 to 78 Ncm.
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(3) Form the ground pattern as wide as possible to minimize ground impedance.
(to prevent undesired oscillation)
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
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RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Recommended Condition Symbol
Note
Peak temperature (pin temperature)
: 350C or below
Soldering time (per pin of device)
: 3 seconds or less
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Partial Heating
Soldering Conditions

DI
SC
Note The point of pin part heating must be kept more than 1.2 mm distance from the root of lead.
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Data Sheet PG10092EJ04V0DS
MC-7833
Caution GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the
following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
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1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
DI
SC
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• Do not lick the product or in any way allow it to enter the mouth.
Data Sheet PG10092EJ04V0DS
5