1/4 STRUCTURE Silicon Monolithic Integrated Circuit PRODUCT SERIES Motor Driver for electronic camera module TYPE BD6360GUL FEATURES ・Built in 2 Full-ON H BridgeDrivers ・Built in 1 comparator with hysteresis for photo-interrupter output waveform shaping ・Built in 1 voltage-regulator for photo-interrupter Absolute maximum ratings (Ta=+25°C) Parameter Symbol Power supply voltage VCC Control input voltage VIN Power dissipation Pd Operating Topr temperature range Junction temperature Tjmax Storage temperature range Tstg H-bridge output current Iout Limit -0.3 to +6.5 -0.3 to VCC+0.3 730※1 Unit V V mW -25 to +85 °C +150 -55 to +150 -500 to +500※2 °C °C mA/ch ※1 Reduced by 5.84mW/°C over 25°C, when mounted on a glass epoxy board (50mm 58mm 1.75mm; 8 layers) ※2 Must not exceed Pd, ASO, or Tjmax of 150°C. Operating Conditions (Ta= -25°C to +85°C) Parameter Symbol Power supply voltage VCC Control input voltage VIN H-bridge output current Iout ※3 Must not exceed Pd or ASO. Min. 2.3 0 - Typ. 3.0 - REV. B Max. 5.5 VCC 3 400※ Unit V V mA/ch 2/4 BD6360GUL Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=3.0V) Parameter Symbol Limit Unit Conditions Min. Typ. Max. ICCST - 0 5 μA PS=0V ICC - 1.1 1.8 mA PS=3V with no signal, and no load Overall Circuit current during standby operation Circuit current Control input (VIN= IN1A, IN1B, IN2A, IN2B, SEL, and PS) High level input voltage VINH 1.5 - VCC V Low level input voltage VINL 0 - 0.5 V High level input current IINH 15 30 60 μA VINH=3V, pull down resistance typ.100kΩ Low level input current IINL -1 0 - μA VINL=0V VUVLO 1.6 - 2.2 V IBIPI -3 0 3 μA Output low level voltage VLOPI 0 - 0.5 V Io=+1mA Output high level voltage VHIPI VCC-0.5 - VCC V Io=-1mA Threshold voltage VTHPI 1.2 1.3 1.4 V Lo→Hi threshold voltage Hysteresis voltage VHYSPI 200 300 400 mV RONSW - - 10 Ω Io=-30mA ILSW -1.0 0 - μA BIAS=0V RON - 1.00 1.25 Ω Io=+400mA on high and low sides in total Turn-on time ton - 0.6 2.0 μs Io=±400mA Turn-off time toff - 0.08 0.5 μs Io=±400mA Rise time tr 0.1 0.15 1.0 μs Io=±400mA Fall time tf - 0.03 0.2 μs Io=±400mA UVLO UVLO voltage Photo-interrupter (PI) comparator Input bias current Hi→Lo threshold voltage VTHPI-VHYSPI Photo-interrupter (PI) regulator ON-Resistance OFF current Full-ON Drive block (ch1 and ch2) Output ON-Resistance Output AC characteristic Photo-interrupter I/O Timing Chart H PS L 1.3V CIN 1.0V VCC COUT 0V Hi impedance Fig.1 Photo-interrupter I/O Timing Chart REV. B 3/4 Pin Arrangement (Top View) Package Outline 1PIN MARK 2.1 ± 0.1 AAG Top View 1 2 3 4 A OUT2B CIN COUT BIAS B OUT2A IN2A VCC C OUT1B IN1B IN2B SEL D OUT1A GND IN1A PS Lot No. 0.1 ± 0.05 0.55 MAX 2.1 ± 0.1 S 0.5 15－φ0.25 ± 0.05 φ0.05 Side View POST S 0.3 ± 0.1 0.08 INDEX A B A B C (φ0.15)INDEX POST B P=0.5×3 D Fig.3 BD6360GUL Pin Arrangement (Top View) Bottom View A 1 0.3 ± 0.1 2 3 4 P=0.5×3 Fig.2 VCSP50L2 Package (Unit; mm) Block Diagram I/O Truth Table VCC Tab. 1 BD6360GUL I/O Truth Table 4B INPUT PS 4D Power Save TSD & UVLO OUTPUT MODE BandGap PS SEL INxA INxB OUTxA OUTxB L X Z Z H L H L H H L H L L Z Z L H L H H L H L H H L L X X Z Z VCC 1D OUT1A IN1A 3D H bridge IN1B 2C Logic 1C OUT1B Pre Driver IN2A 3B EN/IN L 1B OUT2A H bridge IN2B 3C H 1A OUT2B SEL 4C 2D GND VCC BandGap PS_ IN/IN VREF 4A 2A 3A BIAS CIN COUT Fig.4 BD6360GUL Block Diagram - L : Low, REV. B H L X H : High, X : Don’t care, Z : Hi impedance 4/4 I/O Switching Waveform 100% VIN 50% 50% 0% ton ton toff toff 90% 90% 50% 50% 10% -10% motor current 10% 0% -10% -50% -50% -90% tf 100% -90% tr -100% tf tr Fig.5 BD6360GUL I/O Switching Waveform Operation Notes (1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range (Topr) may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. The implementation of a physical safety measure such as a fuse should be considered when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. (2) Power supply lines Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the power supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full consideration of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and ground pins. (3) Ground potential (4) Setting of heat (5) Actions in strong magnetic field (6) ASO (7) Thermal shutdown circuit Ensure a minimum GND pin potential in all operating conditions. Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or ASO. This IC incorporates a TSD (thermal shutdown) circuit (TSD circuit). If the temperature of the chip reaches the following temperature, the motor coil output will be opened. The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. (8) TSD ON temperature [°C] (Typ.) Hysteresis temperature [°C] (Typ.) 175 25 Ground Wiring Pattern When using both small signal GND and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. REV. B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. 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