DATA SHEET Solid State Relay OCMOS FET PS7141E-2A,PS7141EL-2A 8-PIN DIP, 400 V BREAK DOWN VOLTAGE NORMALLY OPEN TYPE 2-ch Optical Coupled MOS FET −NEPOC Series− DESCRIPTION The PS7141E-2A and PS7141EL-2A are solid state relays containing GaAs LEDs on the light emitting side (input side) and MOS FETs on the output side. They are suitable for analog signal control because of their low offset and high linearity. The PS7141EL-2A has a surface mount type lead. FEATURES PIN CONNECTION (Top View) • 2 channel type (1 a + 1 a output) • Low LED operating current (IF = 5 mA) • Designed for AC/DC switching line changer 8 7 6 5 1 2 3 4 • Small package (8-pin DIP) • Low offset voltage • Ordering number of taping product: PS7141EL-2A-E3, E4 • Pb-Free product 1. 2. 3. 4. 5. 6. 7. 8. LED Anode LED Cathode LED Anode LED Cathode MOS FET MOS FET MOS FET MOS FET • Safety standards <R> • UL approved: File No. E72422 • BSI awaiting approval APPLICATIONS • Exchange equipment • Measurement equipment • FA/OA equipment The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PN10580EJ02V0DS (2nd edition) Date Published June 2006 NS CP(K) Printed in Japan The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. 2005, 2006 PS7141E-2A,PS7141EL-2A PACKAGE DIMENSIONS (in millimeters) PS7141E-2A 9.25±0.5 7.62 3.3±0.3 3.5±0.3 4.15±0.3 6.5±0.5 0 to 15˚ 0.5±0.1 1.34±0.1 0.25 M 2.54 PS7141EL-2A 9.25±0.5 3.5±0.3 0.10+0.10 –0.05 6.5±0.5 1.34±0.1 0.25 M 2 0.9±0.25 2.54 9.60±0.4 Data Sheet PN10580EJ02V0DS PS7141E-2A,PS7141EL-2A MARKING EXAMPLE JAPAN PS7141E-2A NL603 Type Number Assembly Lot N No. 1 pin Mark Initial of NEC (Engraved mark) N L 6 03 Week Assembled Year Assembled (Last 1 Digit) In-house Code (L: Pb-Free) Rank Code Data Sheet PN10580EJ02V0DS 3 PS7141E-2A,PS7141EL-2A <R> ORDERING INFORMATION Part Number Order Number Solder Plating Packing Style Safety Standard Application Part Approval Number Specification PS7141E-2A PS7141E-2A-A Pb-Free PS7141EL-2A PS7141EL-2A-A PS7141EL-2A-E3 PS7141EL-2A-E3-A PS7141EL-2A-E4 PS7141EL-2A-E4-A Magazine case 50 pcs Standard products PS7141E-2A (UL approved) Embossed Tape 1 000 pcs/reel BSI awaiting approval *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit Forward Current (DC) IF 50 mA/ch Reverse Voltage VR 5.0 V PD 50 mW/ch IFP 1 A/ch Break Down Voltage VL 400 V Continuous Load Current IL 100 mA/ch ILP 200 mA/ch PD 375 mW/ch BV 1 500 Vr.m.s. Total Power Dissipation PT 850 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −40 to +100 °C Diode Power Dissipation Peak Forward Current MOS FET Pulse Load Current *1 *2 (AC/DC Connection) Power Dissipation Isolation Voltage *3 *1 PW = 100 µs, Duty Cycle = 1% *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output Pins 1-4 shorted together, 5-8 shorted together. RECOMMENDED OPERATING CONDITIONS (TA = 25°C) Parameter Symbol MIN. TYP. MAX. Unit LED Operating Current IF 5 10 20 mA LED Off Voltage VF 0 0.5 V 4 Data Sheet PN10580EJ02V0DS *1 PS7141E-2A,PS7141EL-2A ELECTRICAL CHARACTERISTICS (TA = 25°C) Parameter Diode MOS FET Coupled Symbol Conditions Forward Voltage VF IF = 10 mA Reverse Current IR VR = 5 V Off-state Leakage Current ILoff VD = 400 V Output Capacitance Cout VD = 0 V, f = 1 MHz LED On-state Current IFon IL = 100 mA On-state Resistance Ron1 IF = 10 mA, IL = 10 mA MIN. TYP. MAX. Unit 1.2 1.4 V 5.0 µA 1.0 µA 0.01 36 pF/ch 5.0 mA 36 50 Ω Ron2 IF = 10 mA, IL = 100 mA, t ≤ 10 ms 25 35 Turn-on Time *1, 2 ton IF = 10 mA, VO = 5 V, RL = 500 Ω, 0.4 1.0 Turn-off Time *1, 2 toff PW ≥ 10 ms 0.07 0.2 Isolation Resistance RI-O VI-O = 1.0 kVDC Isolation Capacitance CI-O V = 0 V, f = 1 MHz 10 ms Ω 9 1.1 pF/ch *1 Test Circuit for Switching Time IF Pulse Input VL 50% Input 0 VO = 5 V Input monitor 90% VO monitor Output Rin RL 10% ton toff *2 The turn-on time and turn-off time are specified as input-pulse width ≥ 10 ms. Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off time will increase. Data Sheet PN10580EJ02V0DS 5 PS7141E-2A,PS7141EL-2A TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE 300 Maximum Load Current IL (mA) Maximum Forward Current IF (mA) 100 80 60 40 20 0 –25 0 25 75 85 50 200 100 0 –25 100 0 25 75 85 50 Ambient Temperature TA (˚C) Ambient Temperature TA (˚C) FORWARD VOLTAGE vs. AMBIENT TEMPERATURE OUTPUT CAPACITANCE vs. APPLIED VOLTAGE 1.8 100 200 IF = 50 mA 30 mA 20 mA 10 mA 5 mA 1 mA 1.6 1.4 Output Capacitance Cout (pF) Forward Voltage VF (V) f = 1 MHz 1.2 1.0 0.8 –25 0 25 50 75 150 100 50 0 100 20 40 80 100 120 Applied Voltage VD (V) OFF-STATE LEAKAGE CURRENT vs. APPLIED VOLTAGE LOAD CURRENT vs. LOAD VOLTAGE 200 IF = 10 mA TA = 85˚C Load Current IL (mA) 10–7 10–8 25˚C 10–9 10–10 0 100 200 300 400 100 –4.0 500 –2.0 0 –100 –200 Load Voltage VL (V) Applied Voltage VD (V) Remark The graphs indicate nominal characteristics. 6 60 Ambient Temperature TA (˚C) 10–6 Off-state Leakage Current ILoff (A) <R> Data Sheet PN10580EJ02V0DS 2.0 4.0 PS7141E-2A,PS7141EL-2A ON-STATE RESISTANCE DISTRIBUTION ON-STATE RESISTANCE DISTRIBUTION 30 30 n = 50 pcs, IF = 10 mA, IL = 10 mA 20 25 Number (pcs) Number (pcs) 25 15 10 n = 50 pcs, IF = 10 mA, IL = 100 mA 5 20 15 10 5 0 36 35 0 38 37 24 26 25 On-state Resistance Ron1 (Ω) On-state Resistance Ron2 (Ω) ON-STATE RESISTANCE vs. LOAD CURRENT ON-STATE RESISTANCE vs. FORWARD CURRENT 40 40 IF = 10 mA On-state Resistance Ron (Ω) On-state Resistance Ron (Ω) IL = 10 mA 35 30 25 20 0 20 40 60 80 100 120 35 30 100 mA 25 20 0 140 6 8 10 12 TURN-ON TIME DISTRIBUTION TURN-ON TIME vs. FORWARD CURRENT 12 30 VO = 5 V, RL = 500 Ω 10 n = 50 pcs, IF = 10 mA, VO = 5 V 25 8 Number (pcs) Turn-on Time ton (ms) 4 Forward Current IF (mA) Load Current IL (mA) 6 4 20 15 10 5 2 0 2 5 10 15 20 25 30 0 0.4 0.5 0.6 Turn-on Time ton (ms) Forward Current IF (mA) Remark The graphs indicate nominal characteristics. Data Sheet PN10580EJ02V0DS 7 PS7141E-2A,PS7141EL-2A TURN-OFF TIME vs. FORWARD CURRENT TURN-OFF TIME DISTRIBUTION 30 0.6 VO = 5 V, RL = 500 Ω 25 0.4 Number (pcs) Turn-off Time toff (ms) 0.5 0.3 0.2 0.1 5 10 15 20 25 15 10 0 30 0.06 0.07 0.08 Turn-off Time toff (ms) NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE 6.0 2.0 1.5 1.0 0.5 0 25 50 100 75 Normalized Turn-off Time toff Normalized to 1.0 at TA = 25˚C, IF = 10 mA, VO = 5 V 2.5 0.0 –25 4.0 3.0 2.0 1.0 0.0 –25 3.0 Normalized to 1.0 at TA = 25˚C, IF = 10 mA, IL = 10 mA 2.0 1.5 1.0 0.5 0.0 –25 0 25 50 75 0 25 50 75 Ambient Temperature TA (˚C) ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE 2.5 Normalized to 1.0 at TA = 25˚C, IF = 10 mA, VO = 5 V 5.0 Ambient Temperature TA (˚C) On-state Resistance Ron (Ω) 0.05 Forward Current IF (mA) 3.0 Normalized Turn-on Time ton 20 5 0 100 Ambient Temperature TA (˚C) Remark The graphs indicate nominal characteristics. 8 n = 50 pcs, IF = 10 mA, VO = 5 V Data Sheet PN10580EJ02V0DS 100 PS7141E-2A,PS7141EL-2A TAPING SPECIFICATIONS (in millimeters) 4.5 MAX. 10.3±0.1 7.5±0.1 1.5 +0.1 –0 16.0±0.3 2.0±0.1 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 4.0±0.1 10.4±0.1 1.55±0.1 12.0±0.1 0.3 Tape Direction PS7141EL-2A-E3 PS7141EL-2A-E4 Outline and Dimensions (Reel) 2.0±0.5 R 1.0 21.0±0.8 100±1.0 330±2.0 2.0±0.5 13.0±0.2 17.5±1.0 21.5±1.0 Packing: 1 000 pcs/reel Data Sheet PN10580EJ02V0DS 15.9 to 19.4 Outer edge of flange 9 PS7141E-2A,PS7141EL-2A RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (˚C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260˚C MAX. 220˚C to 60 s 180˚C 120˚C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature 260°C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120°C or below (package surface temperature) • Number of times One • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) <R> (3) Soldering by soldering iron • Peak temperature (lead part temperature) 350°C or below • Time (each pins) 3 seconds or less • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100°C. (4) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 10 Data Sheet PN10580EJ02V0DS PS7141E-2A,PS7141EL-2A <R> USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Data Sheet PN10580EJ02V0DS 11 PS7141E-2A,PS7141EL-2A • The information in this document is current as of June, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 12 Data Sheet PN10580EJ02V0DS PS7141E-2A,PS7141EL-2A Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices Hong Kong Limited E-mail: [email protected] Hong Kong Head Office TEL: +852-3107-7303 FAX: +852-3107-7309 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office TEL: +82-2-558-2120 FAX: +82-2-558-5209 NEC Electronics (Europe) GmbH http://www.eu.necel.com/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Compound Semiconductor Devices Division NEC Electronics Corporation URL: http://www.ncsd.necel.com/ 0604