EM4325 - EM Microelectronic

EM MICROELECTRONIC - MARIN SA
EM4325
18000-63 Type C (Gen2) and
18000-63 Type C / 18000-64 Type D (Gen2/TOTAL) RFID IC
Description
Features
EM4325 is a Class-3 Generation-2 (Gen2) IC that is
compliant with ISO/IEC 18000-63, ISO/IEC 18000-64
(TOTAL), and EPCTM Class-1 Generation-2. The chip offers
an advanced feature set leading to a performance beyond
that of standard Gen2 chips and can be either battery
powered or beam powered by the RF energy transmitted
from a reader. In a battery assisted passive (BAP)
configuration, the EM4325 offers superior reading range and
reliability compared to purely passive RFID solutions.








EM4325 includes 4096 bits of high speed non-volatile
memory (EEPROM) that is organized into 64 pages with 4
words per page. The chip supports either ISO or EPCTM data
structures that are compliant with EPCglobal Tag Data
Standards, Version 1.8, and is delivered with a Unique
Identifier (UID) to ensure full traceability.





An integrated temperature sensor is included in the EM4325
and supports the temperature range from -40C to +60C.

The temperature sensor may be used in either purely
passive or BAP applications. Temperature readings can be 
made on demand by a reader or the chip may be 
programmed to perform self-monitoring with alarm
conditions.

EM4325 supports advanced applications by providing
programmable external interfaces for an auxiliary function
and a 4-bit I/O port. The auxiliary function may be configured
as an input for tamper detection or as an output for
notification of RF events to external devices. The 4-bit I/O
may be configured to support 4 discrete signals or as a
Serial Peripheral Interface (SPI) bus. The chip may serve as
either an SPI Master device or an SPI Slave device. The
programmable external interfaces allow the EM4325 to
function as an RF front end and protocol handler in
advanced RFID tags or embedded applications. In a
passive configuration, the programmable external interfaces
allow the EM4325 to serve as a SPI Master with energy
harvesting and provide power to external components.







ISO 18000-63 (Gen2) & 18000-64 (TOTAL) compliant
EPCTM Gen2 compliant
AIAGTM B-11 compliant
ATA Spec 2000 Low Memory Tag compliant
4096-bit non-volatile memory (EEPROM)
48-bit manufacturer programmed IC Serial Number
352 bits for UII/EPC encoding
3072 bits for User data / 3008 bits for TOTAL data
128-bit Register File
BlockErase and BlockWrite commands for high speed
memory transactions
BlockPermalock command for User memory
Forward link data rates: 26.7 to 128 kbps assuming
equiprobable data
Return link data rates: 40 to 640 kbps with subcarrier
modulated data rates of 0.625 to 320 kbps
TOTAL data rates: 64, 128, 160, 256, or 320 Kbps
Coordinated Universal Time Clock (UTC)
Integrated temperature sensor: -40C to +60C with
typical accuracy of ±1.0C over the full range and
±0.6C over the typical range for cold chain
Programmable monitoring and alarm conditions for
temperature sensor including time stamp
Programmable auxiliary function: input for tamper
detection or output for notification of RF events
Programmable 4-bit I/O port: configurable as 4 discrete
signals or as a Serial Peripheral Interface (SPI) Bus
Battery assistance for superior reading range and
reading reliability
Rectifier that allows purely passive operation in case the
battery is flat or not present
Battery supply management to prolong battery life
Battery supply range: 1.25V to 3.6V
Low battery alarm threshold: 1.3V or 2.2V
 Extended temperature range: -40C to +85C
Battery supply management is provided to prolong battery
life in BAP applications. The chip supports programmable Applications
duty cycle control, auto-switching between battery powered
 RFID tags:
and beam powered operation, and programmable
Supply chain management, tracking and tracing,
enable/disable of an ultra-low power mode for extended
storage applications.
reusable containers and pallets, access control,
asset control, cold chain monitoring, sensor monitoring,
E-seals, Gen2 side-channel for active RFID tags
 RFID front end for embedded applications:
EPC is a trademark of EPCglobal Inc.
Gen2 communications channel for wireless data
AIAG is a trademark of Automotive Industry Action Group
exchange, configuration and control, RF event
notification
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
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420005-A01, 2.0
EM4325
Table of Contents
Description .......................................................................................................................................................................... 1
Features ............................................................................................................................................................................... 1
Applications ........................................................................................................................................................................ 1
Block Diagram .................................................................................................................................................................... 4
Pin Description.................................................................................................................................................................... 4
Typical Applications ........................................................................................................................................................... 5
Passive tag with temperature reading on demand. .......................................................................................................... 5
Passive tag with tamper detection and temperature reading on demand. ........................................................................ 5
Passive tag with EM4325 as SPI Master with energy harvesting to power another component as SPI Slave. ............... 5
BAP tag with tamper detection, temperature monitoring, and alarm indicators. ............................................................ 6
BAP tag or embedded application with EM4325 as SPI Master and another component as SPI Slave.......................... 6
BAP tag or embedded application with EM4325 as SPI Slave and another component as SPI Master.......................... 6
Absolute Maximum Ratings ............................................................................................................................................... 7
Handling Procedures ........................................................................................................................................................... 7
Operating Conditions .......................................................................................................................................................... 7
Electrical Characteristics..................................................................................................................................................... 7
Timing Characteristics ........................................................................................................................................................ 9
I/O DC Characteristics ........................................................................................................................................................ 9
Temperature Sensor Characteristics .................................................................................................................................. 11
Functional Description ...................................................................................................................................................... 12
Memory Organization ....................................................................................................................................................... 14
Memory Definition ........................................................................................................................................................... 16
Reserved Memory ......................................................................................................................................................... 16
TID Memory ................................................................................................................................................................. 16
UII/EPC Memory .......................................................................................................................................................... 18
User Memory and System Memory .............................................................................................................................. 18
System Memory - Temp Sensor Control Words ........................................................................................................... 19
System Memory - I/O Control Word ............................................................................................................................ 22
System Memory - Battery Management Words ............................................................................................................ 24
System Memory - TOTAL Word .................................................................................................................................. 26
System Memory - SPI Write Enable Words ................................................................................................................. 27
System Memory - Lock Words ..................................................................................................................................... 28
System Memory - Sensor Data ..................................................................................................................................... 29
System Memory - UTC Clock ...................................................................................................................................... 30
System Memory - Register File .................................................................................................................................... 30
System Memory - I/O Word ......................................................................................................................................... 31
System Memory - BAP Mode Word ............................................................................................................................. 31
Memory Restrictions on Select Command ........................................................................................................................ 31
EEPROM Delivery State .................................................................................................................................................. 32
Custom Commands ........................................................................................................................................................... 33
GetUID Command ........................................................................................................................................................ 33
GetSensorData Command ............................................................................................................................................. 34
SendSPI Command ....................................................................................................................................................... 35
ResetAlarms Command ................................................................................................................................................ 37
SPI Operation .................................................................................................................................................................... 38
SPIRequestStatus Command ......................................................................................................................................... 39
SPIBoot Command ....................................................................................................................................................... 39
SPITransponder Commands ......................................................................................................................................... 40
SPIGetSensorData Commands...................................................................................................................................... 40
SPISetFlags Command ................................................................................................................................................. 41
SPIReadWord Command .............................................................................................................................................. 42
SPIWriteWord Command ............................................................................................................................................. 42
SPIReadPage Command ............................................................................................................................................... 43
SPIWritePage Command .............................................................................................................................................. 43
SPISetClock Command................................................................................................................................................. 44
SPIAlarm Commands ................................................................................................................................................... 44
Copyright 2015, EM Microelectronic-Marin SA
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420005-A01, 2.0
EM4325
SPIReadRegisterFileWord Command .......................................................................................................................... 45
SPIWriteRegisterFileWord Command .......................................................................................................................... 45
SPIReqRN Command ................................................................................................................................................... 46
SPIReqNewHandle Command ...................................................................................................................................... 47
SPISetHandle Command............................................................................................................................................... 48
SPISetParams Command .............................................................................................................................................. 49
SPIGetCommParams Command ................................................................................................................................... 50
SPISetSessionFlags Command ..................................................................................................................................... 51
SPI Slave Extensions .................................................................................................................................................... 52
TOTAL Operation ............................................................................................................................................................ 57
Temp Sensor Operation .................................................................................................................................................... 61
Alarms ............................................................................................................................................................................... 61
Battery Management ......................................................................................................................................................... 62
Floor Plan .......................................................................................................................................................................... 64
TSSOP8 Package Outline ................................................................................................................................................. 65
Ordering Information ........................................................................................................................................................ 66
Versions ............................................................................................................................................................................ 66
Standard Versions and Samples ........................................................................................................................................ 67
Product Support ................................................................................................................................................................ 67
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
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420005-A01, 2.0
EM4325
Block Diagram
4325
logic
Analog
Front
End
RF Interface
Core
SPI
Core
General
Purpose
I/O
Test
Logic
or
Temp
Sensor
Control
Temp
Sensor
Memory
Management
Unit
I/O
Control
SPI
Master
Device
I/O
Pads
or
Register File
SPI
Slave
Device
EEPROM
Pin Description
TSSOP8 PINOUT
ANT+
1
8
VSS
AUX
2
7
VBAT
P0_MOSI
3
6
P3_CS
P1_MISO
4
5
P2_SCLK
Pin
Name
I/O
Description
1
ANT+
A
2
AUX
I/O
Auxiliary Function
3
P0_MOSI
I/O
I/O P0 or SPI Master Output / Slave Input
4
P1_MISO
I/O
I/O P1 or SPI Master Input / Slave Output
5
P2_SCLK
I/O
I/O P2 or SPI Serial Clock
6
P3_CS
I/O
I/O P3 or SPI Chip Select (active low)
7
VBAT
A
External supply voltage for BAP operation
8
VSS
A
Supply return and Antenna -
Antenna +
A: Analog, I: Digital Input, O: Digital Output
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420005-A01, 2.0
EM4325
Typical Applications
Passive tag with temperature reading on
demand.
Typical System Memory Configuration:
Temp Sensor Control Word 1 = 0x0000
Temp Sensor Control Word 2 = 0x0000
Temp Sensor Control Word 3 = 0x0000
I/O Control Word = 0x0000
Battery Management Word 1 = 0x0000
Battery Management Word 2 = 0x0000
TOTAL Word = 0x0000
BAP Mode Word = 0x0000
To
Antenna
1
ANT+
2
AUX
VSS
8
VBAT
3
7
P0_MOSI
P3_CS
4
6
P1_MISO
P2_SCLK
5
EM4325
Passive tag with tamper detection and
temperature reading on demand.
Typical System Memory Configuration:
To
Antenna
Continuity Loop
for
Tamper Detection
1
ANT+
VSS
8
2
AUX
3
P0_MOSI
VBAT
7
P3_CS
4
P1_MISO
P2_SCLK
6
5
Temp Sensor Control Word 1 = 0x0000
Temp Sensor Control Word 2 = 0x0000
Temp Sensor Control Word 3 = 0x0000
I/O Control Word = 0x0411
Battery Management Word 1 = 0x0000
Battery Management Word 2 = 0x0000
TOTAL Word = 0x0000
BAP Mode Word = 0x0000
EM4325
Passive tag with EM4325 as SPI Master with
energy harvesting to power another component
as SPI Slave.
To
Antenna
1
ANT+
2
AUX
3
4
Typical System Memory Configuration:
VSS
8
GND
VBAT
7
VSUPPLY
P0_MOSI
P3_CS
6
CS
P1_MISO
P2_SCLK
5
Temp Sensor Control Word 1 = 0x0000
Temp Sensor Control Word 2 = 0x0000
Temp Sensor Control Word 3 = 0x0000
I/O Control Word = 0xE600
Battery Management Word 1 = 0x0000
Battery Management Word 2 = 0x0000 (ext power
when tag detects RF field)
Battery Management Word 2 = 0xC000 (ext power
when tag is selected)
TOTAL Word = 0x0000
BAP Mode Word = 0x0000
EM4325
SCLK
SPI Bus
MISO
MOSI
SPI Slave Device
(sensor, memory, microcontroller)
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4325-DS, Version 7.0, 24-Apr-15
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420005-A01, 2.0
EM4325
BAP tag with tamper detection, temperature
monitoring, and alarm indicators.
To
Antenna
Continuity Loop
for
Tamper Detection
1
ANT+
2
AUX
Typical System Memory Configuration:
VSS
8
VBAT
7
Temp Sensor Control Word 1 = 0x4808
Temp Sensor Control Word 2 = 0x4820
Temp Sensor Control Word 3 = 0x5E4A
(monitor for 5ºC ±3ºC every 10 minutes)
I/O Control Word = 0x05FF
Battery Management Word 1 = 0xE001
Battery Management Word 2 = 0x8005
TOTAL Word = 0x0000
BAP Mode Word = 0x0001
EM4325
3
P0_MOSI
P3_CS
6
Temperature Alarm Indicator
4
P1_MISO
P2_SCLK
5
Tamper Alarm Indicator
No Alarms (all OK) Indicator
BAP tag or embedded application with EM4325
as SPI Master and another component as SPI
Slave.
To
Antenna
Continuity Loop
for
Tamper Detection
Typical System Memory Configuration:
1
ANT+
VSS
8
2
AUX
3
P0_MOSI
VBAT
7
VSUPPLY
P3_CS
6
CS
4
P1_MISO
P2_SCLK
5
Temp Sensor Control Word 1 = 0x0000
Temp Sensor Control Word 2 = 0x0000
Temp Sensor Control Word 3 = 0x0000
I/O Control Word = 0xE400
Battery Management Word 1 = 0xE001
Battery Management Word 2 = 0x8001
TOTAL Word = 0x0000
BAP Mode Word = 0x0001
GND
EM4325
SCLK
SPI Bus
MISO
MOSI
SPI Slave Device
(sensor, RTC, microcontroller)
BAP tag or embedded application with EM4325
as SPI Slave and another component as SPI
Master.
To
Antenna
1
ANT+
2
AUX
3
4
Typical System Memory Configuration:
VSS
8
GND
VBAT
7
VSUPPLY
P0_MOSI
P3_CS
6
CS
P1_MISO
P2_SCLK
5
Temp Sensor Control Word 1 = 0x0000
Temp Sensor Control Word 2 = 0x0000
Temp Sensor Control Word 3 = 0x0000
I/O Control Word = 0xA600 (pull resistors enabled)
I/O Control Word = 0x2600 (pull resistors disabled)
Battery Management Word 1 = 0xE001
Battery Management Word 2 = 0x8001
TOTAL Word = 0x0000
BAP Mode Word = 0x0001
EM4325
SCLK
SPI Bus
MISO
MOSI
WAKE-UP
Broadcast event output from 4325
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
SPI Master Device
(microcontroller)
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420005-A01, 2.0
EM4325
Absolute Maximum Ratings
Parameter
Symbol
Storage
temperature
Handling Procedures
Min.
Max.
Unit
TSTORAGE
-55
125
°C
Voltage on
all pads/pins
except VSS
VPIN
VSS 0.1
VSS +
3.65
V
RF power
into pad/pin
ANT+
PMAX-ABS
25
dBm
2000
V
Electrostatic
discharge on
all pads/pins
other than
ANT+1)
VESD
Electrostatic
discharge on
pad/pin
ANT+1)
VESD_ANT+
-2000
-1000
1000
V
Note 1: Human Body Model (HBM; 100pF; 1.5kOhm) with
reference to substrate VSS.
Stresses above these listed maximum ratings may cause
permanent damages to the device. Exposure beyond
specified operating conditions may affect device reliability
or cause malfunction.
This device has built-in protection against high static
voltages or electric fields; however, anti-static precautions
must be taken as for any other CMOS component. Unless
otherwise specified, proper operation can only occur when
all terminal voltages are kept within the voltage range.
Unused inputs must always be tied to a defined logic
voltage level.
Operating Conditions
Parameter
Symbol
Operating
temperature2)
TOPERATING
RF power into
pad/pin ANT+
PMAX-OP
Min.
-40
Max.
Unit
+85
°C
20
dBm
RF carrier
frequency
FOP
860
960
MHz
Battery
operating
voltage
(between
VBAT and
VSS) 3)
VBAT
1.25
3.65
V
Note 2: Temperature sensor measurements are limited to a
maximum of +64°C.
Note 3: Once Ready state occurs after applying VBAT
Electrical Characteristics
NOTE: T = TOPERATING unless otherwise specified.
Parameter
Low Battery Detection (LBD)
Symbol
Conditions
Min.
Typ.
Max.
Unit
VLBD1.3
LBD 1.3V selected
1.24
1.30
1.36
V
VLBD2.2
LBD 2.2V selected
2.0
2.20
2.35
V
Battery voltage for EEPROM read
operation
VBAT_RD
1.25
3.65
V
Battery voltage for EEPROM power
check, erase, and write operations
VBAT_WR
1.8
3.65
V
Average battery current in Sleep mode
IBAT_S_A
All I/O pins disabled;
Monitor Function
disabled;
Field detector duty
cycle = 12.5%
Average battery current in Ready state
IBAT_R_A
All I/O pins disabled;
Monitor Function
disabled
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
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1.7
2.6
uA
6
8.2
uA
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420005-A01, 2.0
EM4325
Electrical Characteristics (continued)
NOTE: T = 25°C unless otherwise specified.
Parameter
Input impedance (between ANT+ and
VSS) to be used for antenna matching
optimized for BAP mode
Input impedance (between ANT+ and
VSS) to be used for antenna matching
optimized for passive mode
Read sensitivity in passive
mode4)5)
Write sensitivity in passive mode5)
Read / write sensitivity in BAP mode4)5)
Interference rejection
Symbol
Conditions
Min.
Typ.
Max.
6.5 - j172
7.9 - j158
9.1 - j151

ZA_BAT
BAP Mode enabled;
PDUT = -30dBm;
Die form
fA = 866MHz
fA = 915MHz
fA = 953MHz
Same as above but
in TSSOP8
fA = 866MHz
fA = 915MHz
fA = 953MHz
7.4 - j122
7.6 - j114
7.6 - j108

BAP Mode
disabled;
PDUT = -9dBm;
Die form
fA = 866MHz
fA = 915MHz
fA = 953MHz
18.1 - j169
15.2 - j159
14.9 - j154

BAP Mode
disabled;
PDUT = -7dBm;
TSSOP8
fA = 866MHz
fA = 915MHz
fA = 953MHz
23.3 - j145
17.6 - j113
14.5 - j95

ZA_PAS
Unit








PWU_PAS
BAP Mode disabled
-8.3
dBm
PWRITE_PAS
BAP Mode disabled
-7
dBm
BAP Mode enabled;
RF Fade Control =
10; VBAT > 1.8V for
write sensitivity;
BAP Mode
sensitivity = 00
-31
dBm
Same as above but
BAP Mode
sensitivity = 01
-28
dBm
Same as above but
BAP Mode
sensitivity = 10
-22
dBm
Same as above but
BAP Mode
sensitivity = 11
-17
dBm
4
dB
PWU_BAT
REJ
Note 4: Power from simulated conjugate match ‘antenna’ using a high-quality tuner that can handle a high SWR (e.g. the Maury Microwave
Coaxial Manual Tuner Model 8045N). EM4325 device is configured with TOTAL mode disabled, all I/O pins disabled, UII/EPC encoding of 96
bits, reader using only inventory commands with Tari = 12.5 µs and BLF = 250 KHz.
Note 5: Sensitivity values are for TSSOP8 devices and do not include antenna gain.
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420005-A01, 2.0
EM4325
Timing Characteristics
NOTE: T = TOPERATING unless otherwise specified.
Parameter
Symbol
Conditions
Erase / write endurance
TCYC
T = 25°C
Retention
TRET
T ≤ 100°C
Min.
Typ.
Max.
Unit
100,000
Cycles
10
Years
I/O DC Characteristics
NOTE: T = TOPERATING unless otherwise specified.
Parameter6)
Symbol
Conditions7)
Min.
Typ.
Max.
Unit
TEST, AUX, P0_MOSI,
P1_MISO, P2_SCLK, P3_CS
Input Low Voltage
Input High Voltage
VIL
VIH
BAP Mode enabled;
VBAT ≥ 1.25V
VSS
0.3*VBAT
V
BAP Mode disabled
VSS
0.3*VCC
V
BAP Mode enabled;
VBAT ≥ 1.25V
0.7*VBAT
VBAT
V
BAP Mode disabled
0.7*VCC
VCC
V
15K
Ohm
TEST
Input pull-down
RPDTEST
5K
10K
4.5
10
AUX
IOL drive
IOLAUX
VBAT = 2.0V; VOL = 0.3V
IOH drive
IOHAUX
VBAT = 2.0V;
VOH = VBAT - 0.3V
VCC = 1.05V; VOH = VCC - 0.3V;
BAP Mode disabled;
Input pull-down
mA
-4
-2
mA
-0.7
-0.3
mA
150K
Ohm
RPDAUX
Tamper detection enabled
50K
100K
IOLP0
IOLP1
VBAT = 2.0V; VOL = 0.3V;
BAP Mode enabled and
Alarms Out enabled
4.5
10
mA
IOLP0
IOLP0
VCC = 1.05V; VOL = 0.3V;
BAP Mode disabled or Alarms
Out disabled
0.3
1
mA
IOHP0
IOHP0
VBAT = 2.0V; VOH = VBAT - 0.3V;
BAP Mode enabled and
Alarms Out enabled
-4
-2
mA
IOHP0
IOHP0
VCC = 1.05V, VOH = VCC - 0.3V;
BAP Mode disabled or Alarms
Out disabled
-0.7
-0.3
mA
RPDP0
Device is SPI Slave and Pull
Enabled
50K
100K
150K
Ohm
RPDP0
Device is SPI Slave and Pull
Enabled
50K
100K
150K
Ohm
P0_MOSI, P1_MISO
IOL (strong driver)
IOL (weak driver)
IOH (strong driver)
IOH (weak driver)
Input pull-down
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I/O DC Characteristics (continued)
NOTE: T = TOPERATING unless otherwise specified.
Parameter6)
Symbol
Conditions7)
Min.
Typ.
Max.
Unit
VBAT = 2.0V; VOL = 0.3V;
BAP Mode enabled and
Alarms Out enabled
4.5
10
mA
VCC = 1.05V; VOL = 0.3V;
BAP Mode disabled or Alarms
Out disabled
0.3
1
mA
P2_SCLK
IOL (strong driver)
IOL (weak driver)
IOH (strong driver)
IOH (weak driver)
IOLP2
IOLP2
IOHP2
IOHP2
VBAT = 2.0V; VOH = VBAT - 0.3V;
BAP Mode enabled and
Alarms Out enabled
-4
-2.4
mA
VCC = 1.05V, VOH = VCC - 0.3V;
BAP Mode disabled or Alarms
Out disabled
-0.7
-0.3
mA
Input pull-down
RPDP2
Device is SPI Slave and
CPOL = 0 and Pull Enabled
50K
100K
150K
Ohm
Input pull-up
RPUP2
Device is SPI Slave and
CPOL = 1 and Pull Enabled
50K
100K
150K
Ohm
IOLP3
VBAT = 2.0V; VOL = 0.3V;
BAP Mode enabled and
Alarms Out enabled
4.5
10
mA
VCC = 1.05V; VOL = 0.3V;
BAP Mode disabled or Alarms
Out disabled
0.3
1
mA
P3_CS
IOL (strong driver)
IOL (weak driver)
IOH (strong driver)
IOH (weak driver)
Input pull-up
IOLP3
IOHP3
IOHP3
RPUP3
VBAT = 2.0V; VOH = VBAT - 0.3V;
BAP Mode enabled and
Alarms Out enabled
-4
-2.4
mA
VCC = 1.05V, VOH = VCC - 0.3V;
BAP Mode disabled or Alarms
Out disabled
-0.7
-0.3
mA
100K
150K
Ohm
Device is SPI Slave and Pull
Enabled
50K
Note 6: IOL (strong driver) and IOH (strong driver) values are stated for each I/O pad/pin when it is in strong driver state and all other I/O
pads/pins are not.
Note 7: VCC is the rectified voltage obtained from RF field and is the supply voltage used by I/O’s when BAP Mode is disabled. VCC is limited
by design to provide a maximum of 3V and approximately 1mA of current.
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
10
www.emmicroelectronic.com
420005-A01, 2.0
EM4325
Temperature Sensor Characteristics
NOTE: TOPERATING: -40°C to 60°C, VBAT: 1.25V to 3.6V, no RF field present
Parameter
Symbol
Conditions
Min.
Range
TRANGE
-40
Resolution
TRES
Measurement time
TTEMP
Accuracy8)
EM Calibrated9)10)
TERR1
-1°C ≤ T ≤ +13°C
TERR2
-40°C ≤ T ≤ -1°C
+13°C ≤ T ≤ +60°C
(full range)
Customer
TUSR1
-1°C ≤ T ≤ +13°C
RecRecalibrated11)
TUSR2
-40°C ≤ T ≤ -1°C
+13°C ≤ T ≤ +60°C
(full range)
RF Sensitivity for passive
mode operation of temp
sensor12)
PTS_PAS
+5°C
Typ.
Max.
60
Unit
°C
°C
ms
±0.6
±1.5
°C
±1.0
±2.0
°C
±0.4
±0.8
°C
±0.5
±1.2
°C
±0.25
8
-4.5
dBm
Note 8: Prolonged exposure to high level RF fields may cause self-heating within EM4325 and affect temperature measurements such that
they do not achieve the specified accuracy performance.
Note 9: EM4325 is calibrated at +5.0°C on wafer during manufacturing.
Note 10: Actual accuracy may be influenced by the final product form factor.
Note 11: Improved accuracy may be achieved by calibrating the temperature sensor at +5.0°C in the final product form factor. These numbers
assume a reference probe accuracy of ±0.2°C and that customer makes proper adjustments to the Fine Trim value in the Temp Sensor
Calibration Word.
Note 12: Power from simulated conjugate match; Sensitivity is for TSSOP8 packaged devices and do not include antenna gain.
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
11
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420005-A01, 2.0
EM4325
Functional Description
The EM4325 is used in passive, or battery assisted passive (BAP), UHF read-only or read/write transponder applications
operating at 860 MHz - 960 MHz. It is powered either by a battery or by the RF energy transmitted by the reader, which is
received and rectified to generate a supply voltage for the device.
The device is normally off if it is used in a passive application and normally ready to receive commands if used in a BAP
application. Once the device completes its power-on reset (POR), a Boot Sequence is performed that loads configuration data
and other commonly used information from EEPROM into registers and then transitions the device into either a Tag Only
Talks After Listening (TOTAL) protocol or into a Reader Talk First (RTF) protocol.
In the TOTAL protocol, the devices listens for a short period of time to determine if a reader is attempting to use the RTF
protocol. If the RTF protocol is not detected then the device assumes the reader is waiting for an automated response and will
initiate communications. The device continues to listen for the reader to use the RTF protocol and will automatically switch to
RTF protocol if it is detected and then switch back to TOTAL protocol when the RTF communications are completed.
In the RTF protocol, the reader initiates communications to the device and the device provides a response to the reader only
when appropriate. Additional custom commands/responses are implemented in this device to support SPI operation and
temperature readings. RTF protocol supports read/write EEPROM operations.
The device includes a programmable auxiliary function that can be used to support:
- Tamper detection feature that checks impedance of a continuity loop. Tamper detection can be implemented using a simple
continuity loop, with heat sensitive fuse wire, with sensors having both high and low impedance states, or with external
devices controlling an electronic switch such as a MOSFET.
- Notification of an RF event to external devices. RF events that are available for output are the detection of an RF field, the
detection of Gen2/6C commands, the detection that the device has been singulated, or the present state of the Select flag.
A programmable 4-bit I/O port can be configured to provide four general purpose I/O signals or an SPI bus. The SPI bus
allows communications to/from an SPI device on a tag and allows for control and data exchange between a reader and other
components on a tag. The device uses the configuration data to determine if it is an SPI Master or an SPI Slave device.
An integrated temperature sensor provides an absolute temperature reading on demand. BAP applications can be
programmed to set temperature alarm conditions, provide continuous temperature monitoring, and provide the time stamp for
when an alarm condition occurs.
This device is in full compliance with ISO/IEC 18000-63, ISO/IEC 18000-64, EPCTM Class-1 Generation-2, AIAGTM B-11, and
ATA Spec 2000 Chapter 9 Low Memory Tag Model specifications according to the following documents:
"ISO/IEC 18000-63 Information technology – Radio frequency identification for item management – Part 63:
Parameters for air interface communications at 860 MHz to 960 MHz Type C”
"ISO/IEC 18000-64 Information technology – Radio frequency identification for item management – Part 64:
Parameters for air interface communications at 860 MHz to 960 MHz Type D”
"EPC Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF RFID, Protocol for Communications at
860 Mhz - 960 MHz, Version 1.2.0” from EPCglobal Inc.
"EPCglobal Tag Data Standards, Version 1.8" from EPCglobal Inc.
“B-11, Item Level Radio Frequency Identification (RFID) Standard”, Revision 8, from Automotive Industry Action
Group
“ATA Spec 2000 Chapter 9, Automated Identification and Data Capture (AIDC)”, from Air Transport Association
The ISO/IEC 18000-63, ISO/IEC 18000-64, and the EPCTM Class-1 Generation-2 specifications have many optional features
and the following table identifies which of them are supported by this device.
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
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420005-A01, 2.0
EM4325
Optional Features
Spec
Optional Feature / Command
Supported
Comments
ISO & EPC
Kill Password
Yes
ISO & EPC
Access Password
Yes
ISO & EPC
Extended TID
Yes
ISO & EPC
User Memory
Yes
ISO & EPC
Proprietary Commands
No
ISO & EPC
Custom Commands
Yes
ISO & EPC
Access Command
Yes
ISO & EPC
BlockWrite Command
Yes
Block is defined to be one page (4 words) in
EEPROM. Can write from 1 to 4 words at a time
within a block. Cannot write across block
boundaries. Cannot be used for page 0 of UII/EPC
memory bank.
ISO & EPC
BlockErase Command
Yes
Block is defined to be one page (4 words) in
EEPROM. Can erase from 1 to 4 words at a time
within a block. Cannot erase across block
boundaries. Cannot be used for page 0 of UII/EPC
memory bank or the UTC Clock.
ISO & EPC
BlockPermalock Command
Yes
Block is defined to be one page (4 words) in
EEPROM. Only for User memory.
ISO & EPC
Error Specific Codes
Yes
ISO & EPC
ASK and/or PSK Backscatter
Modulation
Yes
ISO & EPC
Extended Protocol Control (XPC_W1)
Yes
ISO & EPC
XPC_W2
No
ISO & EPC
Recommissioning
No
ISO only
Battery Assisted Passive (BAP)
Yes
ISO only
BAP Persistence Maximums
No
ISO only
Dead Battery Response (DBR)
Yes
ISO only
Full-function Sensor
No
ISO only
HandleSensor command
No
ISO only
BroadcastSync Command
Yes
Only supported in BAP mode with time stamp
required for temperature sensor monitoring
ISO only
Type D
Yes
Also known as TOTAL.
ISO only
Type D PPE and/or Miller Encoding
Yes
Both are supported.
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
Extended TID used for EPCglobal applications and
includes fields for XTID Header, Serial Number,
Optional Command Support, BlockWrite and
BlockErase, and User Memory and BlockPermalock
Only ASK.
13
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420005-A01, 2.0
EM4325
Memory Organization
The EEPROM is organized into 64 pages with each page having 4 words. The ISO/IEC 18000-63 and the EPCTM Class-1
Generation-2 specifications define four memory banks: Reserved, TID, UII/EPC, and User, with the last 5 pages within the
User memory bank being allocated by EM as System memory in this device. The four memory banks are contiguous in
EEPROM. The TID memory bank is permalocked at time of manufacture.
The EEPROM is allocated to the four memory banks as described in the following manner:
Memory Bank
Memory
Configuration
Reserved
1 page
Kill Password
32 bits
Access Password
32 bits
TID
4 pages
Maximum IC Serial Number
UII/EPC
48 bits
6 pages
Maximum UII/EPC encoding
User (includes System memory)
352 bits
53 pages
Maximum User data
3072 bits
Maximum TOTAL data
3008 bits
The memory map is available on the following page.
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
14
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420005-A01, 2.0
EM4325
Memory
Bank
Name
Logical
Page
Number
(decimal)
Reserved
0
TID
0-3
9
(Not in EEPROM)
Logical
Word
Address
(hex)
00 - 01
02 - 03
00 - 0F
26 - 27
28 - 29
Physical
Page
Number
(decimal)
0
1-4
n/a
n/a
00
0
UII/EPC
User
1-5
8
(Not in EEPROM)
0 - 47
59
Temp Sensor Page
60
Control Page
System
(User)
61
SPI WE Page
62
Lock Page (A)
63
Lock Page (B)
01
02 - 03
04 - 17
Physical
Word
Address
(hex)
00 - 01
02 - 03
04 - 13
n/a
n/a
Contents
14
5
6 - 10
15
16 - 17
18 - 2B
Access Protection
for RF Commands
Access Protection
for SPI Commands
Read
Write
Read
Write
Kill Password
Access Password
TID
SSD Address
UTC Address
CRC-16
(Not in EEPROM)
PC
STD
STD
NP
NP
NP
STD
STD
STD
NA
NA
STD
STD
NP
NA
NA
STD+SWE
STD+SWE
STD+SWE
NA
NA
NP
NA
NP
NA
NP
STD
NP
STD+SWE
UII/EPC
NP
STD
NP
STD+SWE
21
n/a
n/a
XPC_W1
NP
NA
NA
NA
00 - BF
EC
ED
EE
EF
F0
F1
F2
F3
11 - 58
2C - EB
EC
ED
EE
EF
F0
F1
F2
F3
User Defined
Temp Sensor Control Word 1
Temp Sensor Control Word 2
Temp Sensor Control Word 3
Temp Sensor Calibration Word
I/O Control Word
Battery Management Word 1
Battery Management Word 2
TOTAL Word
NP
NP
NP
NP
NP
NP
NP
NP
NP
STD
STD
STD
STD
STD
STD
STD
STD
STD
NP
NP
NP
NP
NP
NP
NP
NP
NP
SWE
NA
NA
NA
NA
NP
NP
NP
NP
F4 - F7
61
F4 - F7
SPI Write Enable Words
NP
STD
NP
NA
F8 - FB
62
F8 - FB
Lock Words (A)
BlockPermalock
BlockPermalock
NP
NA
FC - FF
59
60
63
FC - FF
Lock Words (B)
BlockPermalock
BlockPermalock
NP
NA
64
Sensor/Clock Page
(Not in EEPROM)
100
101
102
103
64
100
101
102
103
Sensor Data (MSW)
Sensor Data (LSW)
UTC Clock (MSW)
UTC Clock (LSW)
NP
NP
NP
NP
NP
NA
NP
NP
SPIGetSensorData
SPIGetSensorData
SPIGetSensorData
SPIGetSensorData
NA
NA
SPISetClock
SPISetClock
65 - 66
Register File Pages
(Not in EEPROM)
104 - 10B
65 - 66
104 - 10B
Register File
NP
IOC
NP
NP
67
I/O Page
(Not in EEPROM)
10C
10D
10E
10F
67
10C
10D
10E
10F
I/O Word
BAP Mode Word
Not Used
Not Used
NP
NP
NA
NA
STD
NP
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
Access Protection Codes:
BlockPermalock = RF command to access
IOC = I/O Control Word
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
NA = No Access (operation never allowed)
NP = No Protection (operation always allowed)
15
SPIGetSensorData = SPI command to access
SPISetClock = SPI command to access
STD = Standard Bits for Lock and/or Permalock
SWE = SPI Write Enable Bit for Page
www.emmicroelectronic.com
420005-A01, 2.0
EM4325
Memory Definition
Reserved Memory
Reserved memory is as defined in ISO/IEC 18000-63 and EPC Class 1 Gen 2 specs.
TID Memory
TID memory is formatted by EM Microelectronic-Marin SA based on the version of the device that is ordered. There are
four formats available: ISO E0, ISO E3, EPC, and legacy TOTAL.
ISO E0 Format
Word
(hex)
MSB
0
1
2
0
1
1
1
1
0
1
3
4
5
6
7
8
0
0
0
0
0
0
Configuration (see below)
2
9
A
B
C
D
E
LSB
F
0
0
1
0
1
1
0
Customer Number (0x00 - 0x0F for EM)
IC Serial Number [31:16]
3
IC Serial Number [15:0]
4
CRC-16 for the 64-bit UID
5
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
6
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
9
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
A
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
B
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
D
EM Temp Sensor Calibration Word
E
EM Data Word 1 (see below)
F
EM Data Word 2 (see below)
ISO E3 Format
Word
(hex)
MSB
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
LSB
F
0
1
1
1
0
0
0
1
1
0
0
0
1
0
1
1
0
1
1
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
2
0
1
Configuration (see below)
Customer Number (0x00 - 0x0F for EM)
3
IC Serial Number [31:16]
4
IC Serial Number [15:0]
5
CRC-16 for the 80-bit UID
6
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
9
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
A
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
B
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
D
EM Temp Sensor Calibration Word
E
EM Data Word 1 (see below)
F
EM Data Word 2 (see below)
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
16
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420005-A01, 2.0
EM4325
EPC Format
Word
(hex)
MSB
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
LSB
F
0
1
1
1
0
0
0
1
0
1
0
0
0
0
0
0
0
1
1
0
1
1
0
0
0
0
0
1
2
0
0
1
1
1
1
0
0
0
0
3
Configuration (see below)
0
Customer Number (0x00 - 0x0F for EM)
4
0
0
0
0
0
IC Serial Number [39:32]
IC Serial Number [31:16]
5
IC Serial Number [15:0]
6
0
0
0
1
1
1
0
1
1
1
0
1
0
1
1
0
7
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
8
0
0
0
0
1
0
0
1
0
0
0
0
0
1
0
0
9
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
A
0
0
0
0
1
0
0
1
0
0
0
0
0
1
0
0
B
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
C
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
B
C
D
E
LSB
F
D
EM Temp Sensor Calibration Word
E
EM Data Word 1 (see below)
F
EM Data Word 2 (see below)
Configuration Field
MSB
LSB
SMS
0: Disabled
1: Enabled
RFU
Temp Sensor
0: Calibrated
1: Uncalibrated
RFU
Legacy TOTAL Format
Word
(hex)
MSB
0
1
2
3
4
5
0
0
1
0
0
0
1
1
6
7
8
9
A
Customer Number
IC Serial Number [31:16]
2
IC Serial Number [15:0]
3
TOTAL CRC-16 for the 48-bit UID
4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
5
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
6
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
9
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
A
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
B
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
D
EM Temp Sensor Calibration Word
E
EM Data Word 1 (see below)
F
EM Data Word 2 (see below)
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
17
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420005-A01, 2.0
EM4325
EM Data Word 1
Bit
MSB
0
Content
Demo
1
2
3
UID Word
Count
4
5
6
7
Wafer Lot Digit 5
8
9
A
B
Wafer Lot Digit 4
C
D
LSB
F
E
Wafer Lot Digit 3
EM Data Word 2
Bit
Content
MSB
0
1
2
3
Wafer Lot Digit 2
4
5
6
7
Wafer Lot Digit 1
8
9
A
B
Wafer Number Digit 2
C
D
E
LSB
F
Wafer Number Digit 1
UII/EPC Memory
UII/EPC memory is as defined in ISO/IEC 18000-63 and EPC Class 1 Gen 2 specs.
User Memory and System Memory
User memory (other than System memory) is as defined in ISO/IEC 18000-63 and EPC Class 1 Gen 2 specs. System
memory is read during a Boot Sequence and used to configure device features. All configuration data read from
EEPROM during a Boot Sequence remain valid until the next Boot Sequence occurs.
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
18
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420005-A01, 2.0
EM4325
System Memory - Temp Sensor Control Words
Writing to any of these words resets the UTC Clock, Monitor Function, and the alarms for Aux, Under Temp, and Over
Temp.
The Temp Sensor and Monitor Function are controlled by the three Temp Sensor Control Words. The Monitor Function is
only performed when BAP Mode is enabled and it is used to monitor Tamper Detection (if enabled), Low Battery, Under
Temp, and Over Temp conditions. The Monitor Function uses a programmable sampling interval that defines when to
check for alarm conditions. Time is measured using a clock signal derived from the system oscillator and will be
shortened by some portion of one clock period and have the same accuracy as the system oscillator. The Monitor
Function uses three counters for the Under Temp Count, the Over Temp Count, and the number of Aborted Temp
Measurements. Monitoring is enabled when the sampling interval is non-zero and if a time stamp is required, then the
Monitor Function will not begin until the UTC Clock is set non-zero by an external command.
The Temp Sensor only supports measurements in the valid range -40.00°C to +63.75°C. Setting either the Under Temp
Threshold (Low Limit) or the Over Temp Threshold (High Limit) to a value outside of the valid range will have undefined
results.
Temp Sensor Control Word 1
Bit
Content
MSB
0
0
1
2
Reset
Alarms
EN
3
4
5
6
Under Temp Samples
Required for Alarm
(Zero means no Under
Temp Threshold)
7
8
9
A
B
C
D
Under Temp Threshold
(2’s complement with LSB = 0.25°C)
Min value = 100000000 = -64.00°C
Mid value = 000000000 = 0.00°C
Max value = 011111111 = +63.75°C
Content
Description
Reset Alarms Enable
0: Disable ResetAlarms command,
1: Enable ResetAlarms command
Under Temp Samples Required for Alarm
Number of consecutive samples below the Under Temp
Threshold for an Under Temp alarm condition to occur.
Under Temp Threshold
Under Temp threshold used for monitoring function.
Temperature sensor performance below that of the
minimum operating temperature for the device is not
specified.
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
19
E
LSB
F
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420005-A01, 2.0
EM4325
Temp Sensor Control Word 2
Bit
Content
MSB
0
RFU
1
2
Time
Stamp
Required
3
4
5
6
7
8
9
A
B
C
D
E
LSB
F
Over Temp Threshold
(2’s complement with LSB = 0.25°C)
Min value = 100000000 = -64.00°C
Mid value = 000000000 = 0.00°C
Max value = 011111111 = +63.75°C
Over Temp Samples
Required for Alarm
(Zero means no Over
Temp Threshold)
Content
Description
RFU
Reserved for Future Use
Time Stamp Required
0: Time stamp is not required for Monitor Function,
1: Time stamp is required for Monitor Function
Over Temp Samples Required for Alarm
Number of consecutive samples above the Over Temp
Threshold for an Over Temp alarm condition to occur.
Over Temp Threshold
Over Temp threshold used for monitoring function.
Temperature sensor performance below that of the
minimum operating temperature for the device is not
specified.
Temp Sensor Control Word 3
Bit
Content
MSB
0
1
Monitor
Delay
Units
2
3
4
5
6
7
8
9
Sample
Interval
Units
Monitor Delay Value
(Zero value means no delay)
A
B
C
Description
Monitor Delay Units
00: 1 Second
01: 1 Minute
10: 1 Hour
11: 1 Sampling Interval
Monitor Delay Value
Time until first measurement is performed
Sampling Interval Units
00: 1 Second
01: 1 Minute
10: 1 Hour
11: 5 Minutes
Sampling Interval Value
Time between measurements
20
E
LSB
F
Sampling Interval
(Zero value means no sampling)
Content
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420005-A01, 2.0
EM4325
System Memory - Temp Sensor Calibration Word
Temp sensor calibration occurs during wafer testing. It is possible to re-calibrate the temp sensor after wafer testing if
desired. Writing to this word resets the UTC Clock, Monitor Function, and the alarms for Aux, Under Temp, and Over
Temp.
Bit
Content
MSB
0
1
2
3
4
5
6
7
8
9
NOTE: Reserved for EM and shall not be changed.
(Any changes to this word must preserve these data bits)
A
B
C
D
E
Fine Trim
LSB
F
2’s complement value used for
offset adjustment.
Min value = 10000 = -4.00°C
Mid value = 00000 = 0.00°C
Max value = 01111 = +3.75°C
It is possible to re-calibrate the temp sensor after wafer testing if the Temp Sensor Page is not BlockPermalocked. A copy
of the original value of the Temp Sensor Calibration Word determined during wafer testing is available in TID Memory as
the EM Temp Sensor Calibration Word.
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EM4325
System Memory - I/O Control Word
Bit
MSB
0
1
Content
Pull
EN
SPI
Config
Content
Pull Enable
SPI Config
SPI CPOL & SPI CPHA
AUX EN
AUX Out
SPI Slave Config
Alarms Out
I/O P3 EN, I/O P2 EN,
I/O P1 EN, I/O P0 EN
I/O P3 Out, I/O P2 Out,
I/O P1 Out, I/O P0 Out
2
3
4
5
6
SPI
CPOL
SPI
CPHA
AUX
EN
AUX
Out
7
8
9
Alarms
Out
P3
EN
P2
EN
A
B
C
SPI Slave Config
P1 P0
P3
EN EN Out
D
E
LSB
F
P2
Out
P1
Out
P0
Out
Description
0: Disable pull resistors on P3_CS, P2_SCLK, P1_MISO, and P0_MOSI,
1: Enable pull resistors on P3_CS, P2_SCLK, P1_MISO, and P0_MOSI when they are
enabled as inputs
0: SPI interface disabled,
1: SPI interface enabled as SPI Slave using half-duplex communications,
2: SPI interface enabled as SPI Master using full-duplex communications,
3: SPI interface enabled as SPI Master using half-duplex communications
See text below.
0: Aux function disabled (HI-Z state on AUX pin), 1: Aux function enabled
0: Aux function is for tamper detection when device is not an SPI Slave and tamper test
signal is output on MOSI pin and input on AUX pin,
1: Aux function is for an RF event condition and output on AUX pin
When SPI Config is “1”:
0: SPI Slave operation is normal and extensions are disabled,
Other values: SPI Slave extensions are enabled as defined in the section on SPI Slave
Extensions
When SPI Config is “0” and an I/O pin is enabled for output:
0: Output for the I/O pin is from the I/O Word,
1: Output for the I/O pin is for an alarm condition
P3 = Temperature Alarm (Under Temp OR Over Temp),
P2 = Aux Alarm,
P1 = No Alarms,
P0 = Tamper test signal when Aux function enabled for tamper detection,
Output in I/O Word when Aux function not enabled for tamper detection
When SPI Config is “0”:
0: P(n) is high impedance (HI-Z), 1: P(n) enabled for I/O
When SPI Config is “0” and P(n) EN is “1”:
0: P(n) is input, 1: P(n) is output
NOTE: Outputs maintain state when device is in Sleep Mode. If P3 is enabled as an input
AND the device is using TOTAL AND presently muted, then a rising edge on P3 will
terminate the muting, perform the Boot Sequence, and initiate transmissions of TOTAL
TagMsg’s in the same manner as when a TOTAL MUTE timeout occurs. If in BAP mode
AND P3 is enabled as an input AND the device is not using TOTAL AND the AUX function
is configured for tamper detection, then a rising edge on P3 will indicate a tamper event
and logged as an AUX alarm.
The SPI CPOL bit and the SPI CPHA bit are used to define the behaviour of SCLK and when data is latched with respect
to SCLK. If the phase of the clock is zero (CPHA is “0”), data is latched at the rising edge of SCLK when CPOL is “0” and
at the falling edge of SCLK when CPOL is “1”. If the phase of the clock is one (CPHA is “1”), data is latched at the rising
edge of SCLK when CPOL is “1” and at the falling edge of SCLK when CPOL is “0”. The combination of the two bits is
also known as the SPI Mode and defined as follows:
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
SPI Mode
CPOL
CPHA
0
0
0
1
0
1
2
1
0
3
1
1
22
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420005-A01, 2.0
EM4325
The timing diagrams for each combination of CPOL and CPHA are shown below.
CPOL=0 CPHA=1
CPOL=0 CPHA=0
CS
CS
SCLK
SCLK
MOSI
b7
...
b0
MOSI
b7
...
b0
MISO
b7
...
b0
MISO
b7
...
b0
CPOL=1 CPHA=1
CPOL=1 CPHA=0
CS
CS
SCLK
SCLK
MOSI
b7
...
b0
MOSI
b7
...
b0
MISO
b7
...
b0
MISO
b7
...
b0
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420005-A01, 2.0
EM4325
System Memory - Battery Management Words
These words provide a means to control the duty cycle to prolong battery life. Timed values are measured using a clock
signal derived from the system oscillator and will be shortened by some portion of one clock period and have the same
accuracy as the system oscillator.
Battery Management Word 1
Bit
Content
MSB
0
1
RF Field
Detector
Duty
Cycle
2
3
RF Fade
Control
for Active
to Sleep
Transition
Content
RF Field Detector Duty Cycle
RF Fade Control for Active to Sleep
Timeout
Idle Timeout Units
BAP Mode Sensitivity
4
5
6
7
Initial Command
Detection Timeout
for Active to Sleep
Transition
(LSB = 10 ms)
(Zero means
no timeout)
8
9
Idle
and/or
TOTAL
Mute
Timeout
Units
A
B C D
Idle Timeout
for Active to Sleep
Transition
and/or
TOTAL Mute
Timeout
(Zero means no
timeout)
E
LSB
F
BAP
Mode
Sensitivity
Description
00: 100% duty cycle (always on),
01: 50% duty cycle (50 s on, 50 s off),
10: 25% duty cycle (50 s on, 150 s off),
11: 12.5% duty cycle (50 s on, 350 s off)
Amount of time that the field is no longer detected before an Active
to Sleep transition will occur. Field detection for RF fade control is
only performed when the device is not processing an RF command
and the timing operation is reset with every RF command. RF fade
control times :
00: 125 s,
01: 1 ms,
10: 10 ms,
11: 100 ms
00: 10 ms,
01: 1 sec,
10: 4 sec,
11: 64 sec
00: best (maximum) sensitivity,
01: default sensitivity,
10: degraded sensitivity,
11: most degraded (minimum) sensitivity
NOTE: BAP Mode Sensitivity value is read from EEPROM and
latched during a POR Boot Sequence. Writing a new value into
EEPROM does not go into effect until the next POR Boot Sequence
occurs. A POR Boot Sequence is initiated when the device becomes
energized by an RF field and BAP Mode is disabled, by applying a
sufficient voltage to VBAT when BAP Mode is enabled, or by
execution of a SPIBoot command.
Timeout values are implemented such that a timeout will occur between the specified count (N) and up to one additional
period (N+1). For example, setting a timeout value to 50 ms will result in having the timeout occur between 50 ms and 60
ms.
Copyright 2015, EM Microelectronic-Marin SA
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420005-A01, 2.0
EM4325
Battery Management Word 2
Bit
Content
MSB
0
1
AUX
EVENT
2
3
RTF
IDLE
TOUT
EN
TOTAL
MUTE
TOUT
EN
4
5
6
7
Sleep
Timeout
(Zero means
no duty cyle
control)
8
9
A
B
C
Number of TOTAL
TagMsg’s to Transmit
Before Self Muting
(Zero means
no self muting)
D
E
Alarms
Blink
EN
LBD
Level
LSB
F
BAP
CTRL
EN
Content
Description
AUX Event Condition
00: RF field is present meaning the device state is not Sleep
01: Device is participating in the current inventory round meaning the device state is
Arbitrate, Reply/TagMsg, Acknowledged, Open, or Secured
10: Device is singulated meaning the device state is Acknowledged, Open, or Secured
11: Device is selected meaning the Select Flag is set. The signal is gated in Sleep
state and during the Boot Sequence.
RTF Idle Timeout Enable
0: RTF Idle timeout is disabled,
1: RTF Idle timeout is enabled
NOTE: This should be enabled whenever TOTAL Mute Timeout is enabled.
TOTAL Mute Timeout Enable
When TOTAL is enabled,
0: TOTAL Mute timeout is disabled,
1: TOTAL Mute timeout is enabled
Sleep Timeout
When BAP Mode is enabled and Idle Timeout is non-zero,
000: Duty cycle control disabled,
001: Duty cycle control enabled, Sleep Timeout = Idle Timeout,
010: Duty cycle control enabled, Sleep Timeout = 2X Idle Timeout,
011: Duty cycle control enabled, Sleep Timeout = 4X Idle Timeout,
100: Duty cycle control enabled, Sleep Timeout = 8X Idle Timeout,
101: Duty cycle control enabled, Sleep Timeout = 16X Idle Timeout,
110: Duty cycle control enabled, Sleep Timeout = 32X Idle Timeout,
111: Duty cycle control enabled, Sleep Timeout = 64X Idle Timeout,
Number of TOTAL TagMsg’s
Number of TagMsg’s to transmit before self muting occurs.
Alarms Blink Enable
When SPI Config is “0” and Alarms Out is “1” and the I/O pins are enabled for outputs,
0: Alarm outputs are continuous and active low signals,
1: Alarm outputs are active low pulses approximately 40 ms in duration and occurring
approximately every 8 seconds
NOTE: Blinking alarm outputs are not pulsed simultaneously and are staggered
approximately one second apart.
LBD Level
0: LBD level = 1.3V; 1: LBD level = 2.2V
BAP Control Enable
0: BAP control disabled, 1: BAP control enabled
NOTE: Allows a reader to change the BAP Mode setting in the BAP Mode Word and
enable/disable the use of an ultra-low power mode.
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
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420005-A01, 2.0
EM4325
System Memory - TOTAL Word
TOTAL Word
Bit
MSB
0
1
Content
Page
Link
EN
Fixed Slot
Count
(7 = infinite)
2
3
4
5
6
Mute
Function
Adaptive
Hold-off
EN
Include
Sensor
Data
7
8
Data
Encoding
Type
9
A
BLF
B
C
Maximum
Hold-off
Time
D
E
LSB
F
Initial Listen Time
(Zero means
no TOTAL)
Content
Description
Page Link Enable
When Data Encoding Type is Miller subcarrier M=2 or M=4,
0: Page links are disabled, 1: Page links are enabled
Fixed Slot Count
Number of slots having fixed delay times before slots start using random delay times.
Fixed delay time is always equal to the initial listen time.
Mute Function
0: Mute function uses RTF command decoder only,
1: Mute function uses RTF command decoder and simplified detection
Adaptive Hold-off Enable
0: Adaptive Hold-off is disabled, 1: Adaptive Hold-off is enabled
Include Sensor Data
When Sensor Page is enabled as part of the TagMsg,
0: Sensor data is not included in TOTAL Sensor page,
1: Sensor data is included in TOTAL Sensor page
NOTE: When sensor data is included, the signal levels on I/O’s P3, P2, P1, P0 will be
stored in bit positions 31 to 28 and the temperature data for the last measurement
taken will be stored in bit positions 24 to 16 of the TOTAL Sensor page
Data Encoding Type
00: PPE,
01: FM0,
10: Miller subcarrier (M = 2),
11: Miller subcarrier (M = 4)
Backscatter Link Frequency
(BLF)
00: 128 KHz,
01: 256 KHz,
10: 320 KHz,
11: 512 KHz (using PPE) or 640 KHz (using non-PPE)
Maximum Hold-off Time
Maximum time between TOTAL TagMsgs’s assuming no muting occurs:
00: 6.4 ms,
01: 12.8 ms,
10: 25.6 ms,
11: 51.2 ms
Initial Listen Time
Minimum time TOTAL will initially listen for RTF protocol:
000: TOTAL disabled,
001: 1 ms,
010: 2 ms,
011: 3 ms,
100: 4 ms,
101: 5 ms,
110: 10 ms,
111: 20 ms
This word provides a means to enable TOTAL mode and configure the protocol parameters. TOTAL mode is not allowed
for tags in the Killed state. When TOTAL mode is enabled, User Memory pages 1 - 46 are used as TOTAL memory pages
with User Memory page 47 being the TOTAL System page. See section on TOTAL operation for more information.
Copyright 2015, EM Microelectronic-Marin SA
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EM4325
System Memory - SPI Write Enable Words
The SPI Write Enable Words contain bits for each EEPROM page that a user may define as having write permission for
the SPI interface when operating as an SPI Slave device. If the corresponding bit is 0, then the SPI interface is not
allowed to write to that EEPROM page. Note that the write enable bit is only one condition for writing to the EEPROM
page and is used in conjunction with the memory lock bits (except for User memory) to control EEPROM write operations.
If using the memory lock bits to prevent the SPI interface from writing to EEPROM, then both the pwd-write and
permalock bits must be set.
SPI Write Enable Word 1
Bit
MSB
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
LSB
F
Content
EE
Pg
0
EE
Pg
1
EE
Pg
2
EE
Pg
3
EE
Pg
4
EE
Pg
5
EE
Pg
6
EE
Pg
7
EE
Pg
8
EE
Pg
9
EE
Pg
10
EE
Pg
11
EE
Pg
12
EE
Pg
13
EE
Pg
14
EE
Pg
15
SPI Write Enable Word 2
Bit
MSB
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
LSB
F
Content
EE
Pg
16
EE
Pg
17
EE
Pg
18
EE
Pg
19
EE
Pg
20
EE
Pg
21
EE
Pg
22
EE
Pg
23
EE
Pg
24
EE
Pg
25
EE
Pg
26
EE
Pg
27
EE
Pg
28
EE
Pg
29
EE
Pg
30
EE
Pg
31
SPI Write Enable Word 3
Bit
MSB
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
LSB
F
Content
EE
Pg
32
EE
Pg
33
EE
Pg
34
EE
Pg
35
EE
Pg
36
EE
Pg
37
EE
Pg
38
EE
Pg
39
EE
Pg
40
EE
Pg
41
EE
Pg
42
EE
Pg
43
EE
Pg
44
EE
Pg
45
EE
Pg
46
EE
Pg
47
E
LSB
F
SPI Write Enable Word 4
Bit
MSB
0
1
2
3
4
5
6
7
8
9
A
Content
EE
Pg
48
EE
Pg
49
EE
Pg
50
EE
Pg
51
EE
Pg
52
EE
Pg
53
EE
Pg
54
EE
Pg
55
EE
Pg
56
EE
Pg
57
EE
Pg
58
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C
D
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System Memory - Lock Words
Each Lock Word is physically mapped to two words in the EEPROM.
Lock Word 1
Bit
MSB
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
LSB
F
Content
Blk
0
Blk
1
Blk
2
Blk
3
Blk
4
Blk
5
Blk
6
Blk
7
Blk
8
Blk
9
Blk
10
Blk
11
Blk
12
Blk
13
Blk
14
Blk
15
Lock Word 2
Bit
MSB
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
LSB
F
Content
Blk
16
Blk
17
Blk
18
Blk
19
Blk
20
Blk
21
Blk
22
Blk
23
Blk
24
Blk
25
Blk
26
Blk
27
Blk
28
Blk
29
Blk
30
Blk
31
Bit
MSB
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
LSB
F
Content
Blk
32
Blk
33
Blk
34
Blk
35
Blk
36
Blk
37
Blk
38
Blk
39
Blk
40
Blk
41
Blk
42
Blk
43
Blk
44
Blk
45
Blk
46
Blk
47
Lock Word 3
Lock Word 4
Bit
MSB
0
Content
Kill
Flag
1
2
Kill
Pwd
3
4
Access
Pwd
5
6
EPC
Memory
7
8
TID
Memory
9
A
User
Memory
B
C
D
E
LSB
F
Blk
59
Blk
60
Blk
61
Trim
Lock
Active
Flag
Content
Description
Blk xx (permalock bit for block xx)
As defined in ISO/IEC 18000-63 and EPC Class 1 Gen 2 specs
Kill Flag
0: Tag alive, 1: Tag killed
Kill Pwd
As defined in ISO/IEC 18000-63 and EPC Class 1 Gen 2 specs
Access Pwd
As defined in ISO/IEC 18000-63 and EPC Class 1 Gen 2 specs
EPC Memory
As defined in ISO/IEC 18000-63 and EPC Class 1 Gen 2 specs
TID Memory
As defined in ISO/IEC 18000-63 and EPC Class 1 Gen 2 specs
User Memory
As defined in ISO/IEC 18000-63 and EPC Class 1 Gen 2 specs
Trim Lock
0: Trim values are not locked,
1: Trim values are locked
NOTE: The Trim Lock bit is the permalock bit for the trim values and is
considered to be Block 62 when using the BlockPermalock command.
Active Flag
0: Lock page inactive, 1: Lock page active
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System Memory - Sensor Data
The sensor data is read-only and updated by the Monitoring Function. A reader can request sensor measurements be
made on demand by either writing to the Sensor Data (MSW) word or using the custom command GetSensorData. The
device will perform tamper detection (if enabled), low battery detection (if BAP Mode is enabled), and make a temperature
measurement (if possible). The Low Battery Alarm and Aux Alarm will be updated with the new sample information.
Temperature measurements on demand are not possible when BAP Mode is disabled and the RF field strength is too
low. Temperature measurements made on demand are not used as part of the Monitoring function and have no effect on
the Under Temp Alarm or the Over Temp Alarm. See sections on Temp Sensor Operation and Alarms for more
information.
Sensor Data (MSW)
Bit
Content
MSB
0
1
Low
Battery
Alarm
2
Aux
Alarm
3
Over
Temp
Alarm
4
Under
Temp
Alarm
5
P3
Input
6
7
8
9
A
B
C
D
E
LSB
F
Monitor
EN
0
Temperature
(2’s complement with LSB = 0.25°C)
Min value = 100000001 = -63.75°C
Mid value = 000000000 = 0.00°C
Max value = 011111111 = +63.75°C
(100000000 = invalid measurement)
8
A
B
Sensor Data (LSW)
Bit
Content
MSB
0
1
2
3
4
5
Aborted Temp Measurements
6
7
9
Under Temp Count
C
D
E
LSB
F
Over Temp Count
Content
Description
Low Battery Alarm
0: No problem, 1: Low battery detected
Aux Alarm
0: No problem, 1: Tamper detected or SPI Alarm declared
Over Temp Alarm
0: No problem, 1: Continuous Over Temp detected when Monitor Enabled is “1”
Under Temp Alarm
0: No problem, 1: Continuous Under Temp detected when Monitor Enabled is “1”
P3 Input
Signal level on I/O P3 when used as an input pin, else zero
Monitor Enabled
0: Monitoring disabled, 1: Monitoring enabled
NOTE: Monitoring is enabled when BAP Mode is enabled AND the Sampling Interval is nonzero and if a time stamp is required then the UTC Clock value must be non-zero.
Temperature
Most recent temperature measurement. Temperature sensor performance below that of the
minimum operating temperature for the device is not specified.
Aborted Temp
Measurements
Count of the number of temp measurements that were aborted for any reason. The count
value is incremented until it achieves its max value or until an Under Temp Alarm or Over
Temp Alarm is declared. The count value is reset to zero when the alarms are cleared.
Aborted temp measurements have a value of -64.00.
Under Temp Count
Current count of consecutive samples that are Under Temp
NOTE: This count is incremented by the Monitor Function whenever a temp measurement is
made and found to be less than the Under Temp Threshold; otherwise, the count is reset to
zero. If the count ever reaches the number of samples required for a sustained under temp
condition, then the Under Temp Alarm will be set and the count is reset to zero. The Monitor
Function will then continue to increment the count so long as the sustained under temp
condition persists and will stop once the max count value is reached or when the under temp
condition no longer exists and will not reset the count until the Under Temp Alarm is cleared.
Over Temp Count
Current count of consecutive samples that are Over Temp
NOTE: This count functions in the same manner as described for the Under Temp Count
except that it is used for temp measurements found to be greater than the Over Temp
Threshold.
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System Memory - UTC Clock
The UTC Clock is a 32-bit counter that is clocked approximately every second in BAP Mode and has the same accuracy
as the system oscillator. The counter is enabled for counting when the 8 MSB’s of the 32-bit value are not all zeroes and
none of the following alarms are set: Aux, Under Temp, and Over Temp. The current time can only be set via external
commands (e.g. BroadcastSync or Write) and the 8 MSB’s of the 32-bit value to be written cannot all be zeroes.
Additionally, the UTC Clock can only be set when none of the following alarms are set: Aux, Under Temp, and Over
Temp. The UTC Clock is reset to all zeroes during POR, when BAP Mode transitions from “0” to “1”, when the custom
command ResetAlarms is executed, or when a reader performs a successful write operation to any word in the Temp
Sensor Page.
UTC Clock (MSW)
Bit
MSB
0
1
2
3
4
Content
5
6
7
8
9
A
B
C
D
E
LSB
F
Current Time (LSB = 65536 seconds)
UTC Clock (LSW)
Bit
MSB
0
1
2
3
4
Content
5
6
7
8
9
A
B
C
D
E
LSB
F
B
C
D
E
LSB
F
Current Time (LSB = 1 second)
System Memory - Register File
Register File Words 1 - 8
Bit
MSB
0
1
2
3
Content
4
5
6
7
8
9
A
User Defined
The Register File is volatile and occupies two memory pages that are accessible to a reader and/or an SPI Master device.
The first Register File page contains Words 1 - 4 and the second Register File page contains Words 5 - 8. During the
Boot Sequence after POR, the 4 MSB’s of Register File Word 1 are initialized to zeroes and all other bits in all of the
Register File Words are in an unknown state until written by either the reader or the SPI Master device.
The Register File can be used as a communications buffer for high speed transactions between a reader and an SPI
Master device. RF interface read times are the same as for other types of memory but the write times are very fast with
typical T1 times being ~180 s for one word or ~370 s for an entire page. SPI bus read time is ~250 s when the device
is not in Sleep state (~410 s when in Sleep state) plus the transfer time to the SPI Master. SPI bus write time is ~490 s
when the device is not in Sleep state (~650 s when in Sleep state) plus the transfer time from the SPI Master.
If the device is configured as an SPI Slave, then the use of the Register File may be altered using SPI Slave Extensions.
Either one or both of the Register File pages may be used for EPC/UII pages. These configurations prevent write access
from the RF interface to the Register File pages used for EPC/UII pages. The SPI Master always has write access to the
Register File pages even when the EPC/UII Memory is locked or permalocked.
The Boot Sequence that occurs after every transition from Sleep state to Ready state may also initialize the 4 MSB’s of
Register File Word 1 to zeroes. The contents of all other bits in Register File Words are retained during Sleep state and
the transition to Ready state. The 4 MSB’s of Register File Word 1 are retained when the first Register File page is being
used as an EPC/UII page; otherwise, the 4 MSB’s of Register File Word 1 are set to zeroes.
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System Memory - I/O Word
I/O Word
Bit
MSB
0
Content
High
Field
1
2
3
4
5
6
7
8
9
A
B
RFU
C
D
E
LSB
F
P3
P2
P1
P0
Content
Description
High Field
High Field Present (read-only)
RFU
Reserved for Future Use
I/O P3
I/O P3 when SPI Config is “0” and P3 EN is “1”
I/O P2
I/O P2 when SPI Config is “0” and P2 EN is “1”
I/O P1
I/O P1 when SPI Config is “0” and P1 EN is “1”
I/O P0
I/O P0 when SPI Config is “0” and P0 EN is “1”
System Memory - BAP Mode Word
BAP Mode Word
Bit
MSB
0
1
2
3
4
5
Content
6
7
8
9
A
B
C
D
E
LSB
F
BAP
Mode
RFU
Content
Description
RFU
Reserved for Future Use
BAP Mode
0: Battery Assisted Passive Mode disabled,
1: Battery Assisted Passive Mode enabled
BAP Mode may only be changed when BAP Control Enable is “1”, the device is not configured as an SPI Slave, and the
RF field strength is sufficient to perform the operation. This word is used to enable/disable the use of an ultra-low power
mode to extend battery life. Transitions to or from the ultra-low power mode will occur after successfully changing the
BAP Mode value and then leaving the Open or Secured States. The device will operate only in passive mode while the
ultra-low power mode is enabled.
BAP Mode is required for SPI Slave operation and the use of the UTC Clock and the Monitor Function for checking alarm
conditions.
Memory Restrictions on Select Command
The Select command is not allowed over the Sensor/Clock Page in System Memory (User Memory page 64).
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EEPROM Delivery State
The default configurations are the following:
Memory Bank
Word(s)
Word Address
(hex)
Wafer/Die Value
(hex)
TSSOP8 Value
(hex)
EM4325V26
Value
(hex)
Kill Password
0x00 – 0x01
0x0000
0x0000
0x0000
Access Password
0x02 – 0x03
0x0000
0x0000
0x0000
TID
All words
0x00 – 0x0F
version defined
and specified in
section on TID
Memory
version defined
and specified in
section on TID
Memory
version defined
and specified
in section on
TID Memory
UII/EPC
PC Word
0x01
0x3000
0x3000
0x3000
UII/EPC
0x02 – 0x07
copy of
TID Words
0x00 – 0x05
With 8 MSB’s of
TID Word 0 set
to 0x00
copy of
TID Words
0x00 – 0x05
With 8 MSB’s of
TID Word 0 set
to 0x00
copy of
TID Words
0x00 – 0x05
With 8 MSB’s
of
TID Word 0 set
to 0x00
0x08 – 0x13
0x0000
0x0000
0x0000
Reserved
User
System
0x14 – 0x17
variable
variable
variable
All words
0x00 – 0xBF
0x0000
0x0000
0x0000
Temp Sensor Word 1
0xEC
0x0000
0x0000
0x0000
Temp Sensor Word 2
0xED
0x0000
0x0000
0x0000
Temp Sensor Word 3
0xEE
0x0000
0x0000
0x0000
Temp Sensor Calibration
Word
0xEF
variable
variable
variable
I/O Control Word
0xF0
0x0000
0xA600
0xA680
Battery Management Word 1
0xF1
0xE001
0xE001
0xC001
Battery Management Word 2
0xF2
0x8001
0x8001
0x0000
TOTAL Word
0xF3
0x0000
0x0000
0x0000
SPI Write Enable Word 1
0xF4
0x0000
0xFFFF
0xFFFF
SPI Write Enable Word 2
0xF5
0x0000
0xFFFF
0xFFFF
SPI Write Enable Word 3
0xF6
0x0000
0xFFFF
0xFFFF
SPI Write Enable Word 4
0xF7
0x0000
0xFFFF
0xFFFF
Lock Word 1A
0xF8
0x0000
0x0000
0x0000
Lock Word 2A
0xF9
0x0000
0x0000
0x0000
Lock Word 3A
0xFA
0x0000
0x0000
0x0000
Lock Word 4A
0xFB
0x0183
0x0183
0x8183
Lock Word 1B
0xFC
0x0000
0x0000
0x0000
Lock Word 2B
0xFD
0x0000
0x0000
0x0000
Lock Word 3B
0xFE
0x0000
0x0000
0x0000
Lock Word 4B
0xFF
0x0182
0x0182
0x8182
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Custom Commands
Several custom commands/responses are implemented in this device to support quick access to the tag Unique ID,
temperature reading, SPI operation, and to reset alarm conditions. SPI operation is only possible via the custom command but
all other functions are possible via combinations of normal read/write commands.
GetUID Command
The custom command GetUID is implemented as described below. It allows a reader to get the UID from the tag with a
single command.
Reader =>
Tag
Command
Code
RN
CRC-16
# of bits
16
16
16
Description
E000 (hex)
Prior RN16 or handle
A tag in Reply, Acknowledged, Open or Secured state backscatters {'0', UID, RN16, CRC-16} upon a GetUID command
with a valid RN16 or handle. The length and format of the UID is defined by the Allocation Class which shall be either E0
(hex) or E3 (hex) for ISO, E2 (hex) for EPCglobal, or any of 44 (hex), 45 (hex), 46 (hex), 47 (hex) for legacy TOTAL
applications. The state transition and link timing are the same as for the ACK command and the tag reply is analogous to
the tag reply upon a Read command.
Tag =>
Reader
Header
UID
RN
CRC-16
# of bits
1
64, 80, or 96
16
16
0
Tag Unique
Identifier
(Allocation Class
determines length)
RN16
(Prior RN16 or handle)
CRC-16
('0'+UID+RN)
Description
UID for Allocation Class E0 (hex) ISO/IEC 7816-6
Class
MID
SN
8
8
48
E0 (hex)
Manufacturer ID
NOTE: '00010110' for EM
IC Serial Number
UID for Allocation Class E3 (hex) ISO/IEC 7816-6
Class
MID
UM
SN
8
8
16
48
E3 (hex)
Manufacturer ID
NOTE: '00010110' for EM
User Memory
And Size
IC Serial Number
UID for Allocation Class E2 (hex) EPCglobal
Class
XTID
8
E2 (hex)
MDID
MN
XTIDHDR
SN
1
11
12
16
48
1
Mask Designer ID
NOTE: '00000001011' for EM
Model Number
XTID Header
IC Serial Number
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UID for Allocation Classes 44 (hex), 45 (hex), 46 (hex), 47 (hex) Legacy TOTAL Applications
MDID
CN
6
10
32
16
Customer Number
IC Serial
Number
CRC-16
(MDID+CN+SN)
Mask Designer ID
NOTE: '010001' for EM
SN
CRC-16
GetSensorData Command
The custom command GetSensorData is implemented as described below. It allows a reader to get the UID and sensor
information from the tag with a single command. Sensors may also be sampled on demand from the reader when it
receives this command. If the reader requests a new sample, the device will perform tamper detection (if enabled), low
battery detection (if BAP Mode is enabled), and make a temperature measurement (if possible). The Low Battery Alarm
and Aux Alarm will be updated with the new sample information. Temperature measurements on demand are not
possible when BAP Mode is enabled and a Low Battery Alarm is declared OR BAP Mode is disabled and the RF field
strength is too low. Temperature measurements that are made on demand are not used as part of the Monitoring function
and have no effect on the Under Temp Alarm or the Over Temp Alarm.
Reader =>
Tag
Command
Code
Send
UID
New
Sample
RN
CRC-16
# of bits
16
1
1
16
16
Description
E001 (hex)
0: Do not send UID
1: Do send UID
0: Get last sample
1: Get new sample
Prior RN16
or handle
A tag in Reply, Acknowledged, Open or Secured state backscatters {'0', UID, Sensor, UTC, RN16, CRC-16} upon a
GetSensorData command with a valid RN16 or handle. The length and format of the UID is defined above for the GetUID
command and the UID field will only be included in the tag response when the UID is requested by the reader. The state
transition is the same as for the ACK command and the tag reply is analogous to the tag reply upon a Read command
except that the extended preamble is used regardless of the value of TRext specified in the Query. If the reader
commands a new temperature measurement be made (New Sample = 1), then the link timing must allow the tag up to 20
ms to reply to the reader.
Tag =>
Reader
Header
UID
Sensor
UTC
RN
CRC-16
# of bits
1
64, 80, or 96
32
32
16
16
0
Tag Unique
Identifier
(Allocation Class
determines length)
Sensor
Data
UTC
Time
Stamp
RN16
(Prior RN16
or handle)
CRC-16
('0'+UID+Sensor+
UTC+RN)
Description
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SendSPI Command
The custom command SendSPI is implemented as described below to support SPI Master operation. It allows a reader to
use the SPI interface in this device to send an SPI command to an attached SPI Slave device. The SPI command is only
executed if this device is configured as an SPI Master device and SPI operation is enabled. Note that this is essentially a
pass-through or bridge operation that allows a reader to communicate with an SPI Slave device that is connected to this
device.
Reader =>
Tag
Command
Code
SPI Packet
# of bits
16
20 - 76
Description
RN
CRC-16
16
16
Prior RN16
or handle
E002 (hex)
SPI Packet
SPI
Response
Size
SPI
SCLK
SPI
Delay Time to
Initial SCLK
SPI
Delay Time
Between
Bytes
SPI
Command
3
3
2
2
2
8 - 64
Number of bytes
in command
(0 = 8 bytes)
Number of
bytes in
response
(0 = no
response)
00: 40 KHz
01: 80 KHz
10: 160 KHz
11: 320 KHz
SPI
Command
Size
00: 1 SCLK
00: none
01: 50 s
01: 50 s
10: 500 s
11: 5 ms
10: 100 s
Data to
SPI Slave
11: 500 s
A tag in Acknowledged, Open or Secured state backscatters {'0', SPI-RESP, RN16, CRC-16} upon a SendSPI command
with a valid RN16 or handle. There shall be no state transition, and the link timing T1 is extended by the SPI Packet
communication. The tag reply is analogous to the tag reply upon a Read command except that the extended preamble is
used regardless of the value of TRext specified in the Query. The SPI SCLK and SPI Delay Times are derived from the
system oscillator and have the same accuracy as the system oscillator.
Tag =>
Reader
Header
SPI
Response
RN
CRC-16
# of bits
1
0 - 56
16
16
Description
0
Data from
SPI Slave
RN16
(Prior RN16 or handle)
CRC-16
('0'+SPI-RESP+RN)
Three examples are provided to illustrate the use of this device as an SPI Master to communicate with an external SPI
Slave device.
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SPI Master Example #1: A single byte command is sent to the SPI Slave that will initiate a single byte response from the
SPI Slave using half-duplex communication. The Delay Time to Initial SCLK is set to 1 SCLK and the Delay Time
Between Bytes is set to none or no delay.
CS
SCLK
MOSI
b7
b6
b5
b4
b3
b2
b1
b0
MISO
b7
b6
SPI Delay Time to Initial SCLK
(minimum delay is 1 SCLK)
b5
b4
b3
b2
b1
b0
SPI Delay Time Between Bytes
(minimum delay is none)
SPI Master Example #2: A single byte command is sent to the SPI Slave while a two byte response from the SPI Slave
occurs using full-duplex communication. The Delay Time to Initial SCLK is set to 1 SCLK and the Delay Time Between
Bytes is set to none or no delay.
CS
SCLK
MOSI
b7
b6
b5
b4
b3
b2
b1
b0
MISO
b15
b14
b13
b12
b11
b10
b9
b8
SPI Delay Time to Initial SCLK
(minimum delay is 1 SCLK)
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b7
b6
b5
b4
b3
b2
b1
b0
SPI Delay Time Between Bytes
(minimum delay is none)
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SPI Master Example #3: A three byte command is sent to the SPI Slave that will initiate a two byte response from the
SPI Slave using half-duplex communication. SCLK is set to 40 KHz, the Delay Time to Initial SCLK is set to 500 s and
the Delay Time Between Bytes is set to 50 s.
t1
t2
t2
t2
t2
CS
SCLK
MOSI
Byte 1
Byte 2
MISO
Byte 3
Byte 1
t1 = SPI Delay Time to Initial SCLK
Byte 2
t2 = SPI Delay Time Between Bytes
ResetAlarms Command
The custom command ResetAlarms is implemented as described below. It allows a reader to reset/clear the alarm
conditions for Aux, Under Temp, and Over Temp. The command also resets the UTC Clock and the Monitor Function.
This command is enabled/disabled via the Reset Alarms Enable bit in Temp Sensor Control Word 1.
Reader =>
Tag
Command
Code
Fill
# of bits
16
Description
E004 (hex)
RN
CRC-16
4
16
16
0101
Prior RN16 or
handle
A tag in Secured state backscatters {'0', RN16, CRC-16} upon a ResetAlarms command with a valid RN16 or handle and
provided the command is enabled. There shall be no state transition, and the tag reply is analogous to the tag reply upon
a Read command except that the extended preamble is used regardless of the value of TRext specified in the Query, and
the link timing must allow the tag up to 10 ms to reply to the reader.
Tag =>
Reader
Header
RN
CRC-16
# of bits
1
16
16
Description
0
RN16
(Prior RN16
or handle)
CRC-16
('0'+RN)
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SPI Operation
A BAP tag with this device may be configured with the SPI Control word to enable the SPI interface and select between
operation as either an SPI Master or an SPI Slave.
SPI Master operation requires this device to be the source of the SPI clock signal (SCLK) and also to control the SPI Chip
Select (CS) for a connected SPI Slave device. The SPI polarity and phase settings are set via the SPI Control word. The
actual SPI commands/responses to a connected SPI Slave device originate from a reader using the SendSPI command. Note
that the SPI interface is only active starting after reception of the SendSPI command and ending with the beginning of the
reply back to the reader. If using half-duplex communication, MOSI is set to high impedance (HI-Z) when the device
transitions from sending to receiving to support SPI Slave devices that may only have a 3-wire SPI interface. Examples of SPI
Master operation are provided with the description of the custom command SendSPI.
SPI Slave operation requires this device to accept an SPI clock that is asynchronous to all other operations within the device.
SPI polarity and phase settings are set via the SPI Control word. The maximum SCLK frequency from the SPI Master shall be
4 MHz when VBAT is 1.8V or higher; otherwise, the maximum SCLK frequency shall be 2 MHz. The SPI Master must deassert CS for a minimum of 15 s between SPI commands. This device will output a data value of ‘0’ on MISO before and
after any reply back to the SPI Master. The maximum response time to an SPI command is 20 ms. The start of any reply
always begins with a data value of ‘1’. The following example is provided to illustrate the use of this device as an SPI Slave to
communicate with an external SPI Master device.
SPI Slave Example: A two byte command is sent from the SPI Master that will initiate a three byte response from the SPI
Slave using half-duplex communication. Note that no fixed timing exists for the device to respond to the SPI Master and that
the start of the response is determined by the first “1” bit that occurs on MISO.
CS
SCLK
MOSI
Byte 1
Byte 2
MISO
Byte 1
Byte 2
Byte 3
Start of SPI Slave response always
begins with the first data bit of the
first byte being a ‘1’ bit and all
remaining data bits are output on
consecutive SCLK’s.
The following commands are implemented for use as an SPI Slave device when connected to an SPI Master device.
Processing times indicated for the commands do not include the transfer times for the command to be received nor the
response to be sent as these are a function of the SCLK frequency being used by the external SPI Master.
Some commands require the use of a "dummy" byte to be transmitted by the SPI Master to enable the command to be
processed. The "dummy" byte SCLK clock is used to synchronize the requested SPI command operation with the RF
interface, and SPI Master is required to generate the SCLK frequency faster than 0.5/Tari. When no RF transaction is being
processed at the same time, the requested SPI command is executed within the "dummy" byte transmission. Otherwise, the
requested SPI command execution is delayed until the RF transaction is finished.
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SPIRequestStatus Command
The SPI command SPIRequestStatus is implemented as described below. It allows an SPI Master to get the current
status for the device. There is no processing time required for this operation.
Master =>
Slave
Command
Code
Comment
# of bits
8
N/A
Description
E0 (hex)
Get current device status
Slave =>
Master
Status
# of bits
8
Description
Reply Status
The reply status is defined here and is the same for all other SPI commands.
Reply Status:
Header
Transponder
Device
State
Memory
Busy
Command
Response
1
1
3
1
2
1
0 = Disabled
1 = Enabled
000 = Ready/Listen
001 = Arbitrate
010 = Reply/TagMsg
011 = Acknowledged
100 = Open
101 = Secured
110 = Killed
111 = Sleep
0 = Not Busy
1 = Busy
00 = ACK (command executed)
01 = NACK (invalid command)
10 = NACK (command failed)
11 = NACK (memory locked)
Command failed means memory
power check failed or memory
was busy
SPIBoot Command
The SPI command SPIBoot is implemented as described below. It allows an SPI Master to force the device to perform the
Boot Sequence in the same manner as if a POR occurred. The Boot Sequence will complete in less than 2 ms and is
performed after the reply status has been sent to the SPI Master. The reply status is defined above in the
SPIRequestStatus command.
Master =>
Slave
Command
Code
Comment
# of bits
8
N/A
Description
E1 (hex)
Force Boot Sequence to occur
Slave =>
Master
Status
# of bits
8
Description
Reply Status
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SPITransponder Commands
The SPI commands SPITransponder are implemented as described below. They allow an SPI Master to enable/disable
the transponder (RF interface) for the device. Disabling the transponder has the same effect as if a loss of RF field
occurred. It may take up to 200 s to disable the transponder when the device is in Sleep State. Once disabled, the SPI
Master should wait a minimum of 50 s before enabling the transponder. The transponder is enabled by default during
the Boot Sequence. The reply status is defined above in the SPIRequestStatus command.
Master =>
Slave
Command
Code
Comment
# of bits
8
N/A
E2 (hex)
Disable transponder (RF interface)
E3 (hex)
Enable transponder (RF interface)
Description
Slave =>
Master
Status
# of bits
8
Description
Reply Status
SPIGetSensorData Commands
The SPI commands SPIGetSensorData are implemented as described below. They allow an SPI Master to get the sensor
information from the device memory. Sensors may also be sampled on demand from the SPI Master when it receives this
command. If the SPI Master requests a new sample, the device will perform low battery detection and make a
temperature measurement (if possible). The Low Battery Alarm will be updated with the new sample information.
Temperature measurements on demand are not possible when a Low Battery Alarm is declared. Temperature
measurements that are made on demand are not used as part of the Monitoring function and have no affect on the Under
Temp Alarm or the Over Temp Alarm. The SPI Master must allow up to 20 ms for the reply to occur. The reply status is
defined above in the SPIRequestStatus command.
Master =>
Slave
# of bits
Description
Command
Code
Comment
8
N/A
E4 (hex)
Get sensor data
E5 (hex)
Get sensor data after new sample
Slave =>
Master
Status
# of bits
8
32
32
Reply Status
Sensor Data
(MSW+LSW)
UTC Time Stamp
(MSW+LSW)
Description
Sensor
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SPISetFlags Command
The SPI command SPISetFlags is implemented as described below. It allows an SPI Master to set flags used in the XPC
Word during response to an ACK command and make the UID anonymous. Refer to SPI Operation section for use of
“Dummy Byte” and typical processing time for this operation. All settings made by the SPI Master are retained until the
next POR, SPISetFlags command, or SPIBoot command occurs. The reply status is defined above in the
SPIRequestStatus command.
Master =>
Slave
Command
Code
# of bits
8
8
E6 (hex)
XPC
Flags
Description
XPC
Flags
RFU
Flags
UID
ANON
Dummy
Byte
Comment
8
8
8
N/A
RFU
Flags
UID
Anonymous
00000000
Set XPC flags and make UID
anonymous.
XPC Flags:
X1
X2
X3
X6
X9
XA
XB
XC
1
1
1
1
1
1
1
1
0: Clear
1: Set
0: Clear 0: Clear 0: Clear 0: Clear 0: Clear 0: Clear 0: Clear
1: Set
1: Set
1: Set
1: Set
1: Set
1: Set
1: Set
RFU Flags:
RFU0
RFU1
RFU2
RFU3
RFU4
RFU5
RFU6
RFU7
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
UID Anonymous:
XD
XE
XF
RFU
ANONYMOUS
1
1
1
4
1
0: Clear
1: Set
0: Clear 0: Clear
1: Set
1: Set
Slave =>
Master
Status
# of bits
8
Description
Reply Status
0: All TID Words are unmasked
1: TID Words 2 - F are masked (seen as zeroes) and all other
TID Words are unmasked. This only applies to the RF interface.
0000
FOR REFERENCE
Defined XPC Word
Bit
MSB
LSB
0
1
Content
XEB
RFU
Name
X0
X1
2
3
MOB
X2
X3
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4325-DS, Version 7.0, 24-Apr-15
4
5
6
GA
SS
FS
X4
X5
X6
7
8
BAP
X7
X8
41
9
A
TC
X9
B
C
D
XC
XD
RFU
XA
XB
E
F
RECOM
XE
XF
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420005-A01, 2.0
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SPIReadWord Command
The SPI command SPIReadWord is implemented as described below. It allows an SPI Master to read a word from the
device memory. Typical processing time for the read operation is 75 s but it may take up to 255 s to perform the actual
memory read operation when the transponder is enabled and the device is in Sleep State. The reply status is defined
above in the SPIRequestStatus command.
Master =>
Slave
Command
Code
Memory
Address
Comment
# of bits
8
8
N/A
Description
E7 (hex)
Word
Address
Read word from physical memory address.
NOTE: It is not possible to access physical memory
addresses 100 - 10F (hex) using this command.
Slave =>
Master
Status
Data
# of bits
8
16
Description
Reply Status
Word
Data
SPIWriteWord Command
The SPI command SPIWriteWord is implemented as described below. It allows an SPI Master to write a word into the
device memory. The write operation is only possible when the SPI Write Enable bit is set to allow writing to the EEPROM
page containing the word, and the memory lock bits (except for User memory) do not prevent writing to the EEPROM
page. Typical processing time for the write operation is 7485 s, but it may take up to 8405 s to perform the actual
memory write operation when the transponder is enabled and the device is in Sleep State. The reply status is defined
above in the SPIRequestStatus command.
Master =>
Slave
Command
Code
Memory
Address
Data
# of bits
8
8
16
N/A
Word
Data
Write word to physical memory address.
NOTE: It is not possible to access physical
memory addresses EC - EF (hex) or
F4 - 10F (hex) using this command.
Description
E8 (hex)
Slave =>
Master
Status
# of bits
8
Description
Reply Status
Word
Address
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SPIReadPage Command
The SPI command SPIReadPage is implemented as described below. It allows an SPI Master to read a page from the
device memory. Typical processing time for the read operation is 150 s, but it may take up to 335 s to perform the
actual memory read operation when the transponder is enabled and the device is in Sleep State. The reply status is
defined above in the SPIRequestStatus command.
Master =>
Slave
Command
Code
RFU
Page
Number
Comment
# of bits
8
1
7
N/A
Description
E9 (hex)
0
Page
Number
Read page from memory.
Slave =>
Master
Status
# of bits
8
64
Reply Status
Page
Data
Description
Page
Data
SPIWritePage Command
The SPI command SPIWritePage is implemented as described below. It allows an SPI Master to write a page into the
device memory. The write operation is only possible when the SPI Write Enable bit is set to allow writing to the EEPROM
page, and the memory lock bits (except for User memory) do not prevent writing to the EEPROM page. The Register File
Pages, which are not in EEPROM, are always accessible to an SPI Master for write operations. Typical processing time
for the write operation to EEPROM is 7485 s but it may take up to 8405 s to perform the actual memory write operation
when the transponder is enabled and the device is in Sleep State. Typical processing time for the write operation to the
Register File is 300 s, but it may take up to 500 s to perform the actual memory write operation when the transponder
is enabled and the device is in Sleep State. The reply status is defined above in the SPIRequestStatus command.
Master =>
Slave
Command
Code
RFU
Page
Number
Page
Data
# of bits
8
1
7
64
N/A
Page
Data
Write page into memory.
NOTE: It is not possible to access
physical memory pages 59 (dec),
61 - 64 (dec), or 67 (dec) using
this command.
Description
Slave =>
Master
EA (hex)
0
Page
Number
Comment
Status
# of bits
8
Description
Reply Status
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SPISetClock Command
The SPI command SPISetClock is implemented as described below. It allows an SPI Master to set the UTC clock
provided that none of the alarm conditions exist for Aux, Under Temp, or Over Temp. There is no processing time
required for this operation. A valid SPISetClock command requires having at least one of the 8 MSB’s of the current time
field being non-zero. The reply status is defined above in the SPIRequestStatus command.
Master =>
Slave
Command
Code
UTC
Comment
# of bits
8
32
N/A
Description
EB (hex)
Current Time
Set the UTC Clock to current time.
Slave =>
Master
Status
# of bits
8
Description
Reply Status
SPIAlarm Commands
The SPI command SPIAlarm is implemented as described below. It allows an SPI Master to set/clear the Aux Alarm state
in the Sensor Data. The SPI Master must allow up to 20 ms for the reply to occur. The reply status is defined above in the
SPIRequestStatus command.
Master =>
Slave
# of bits
Description
Command
Code
Comment
8
N/A
EC (hex)
Clear Aux Alarm condition.
ED (hex)
Set Aux Alarm condition.
Slave =>
Master
Status
# of bits
8
Description
Reply Status
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SPIReadRegisterFileWord Command
The SPI command SPIReadRegisterFileWord is implemented as described below. It allows an SPI Master to read a word
from the Register File. Typical processing time for the read operation is 75 s, but it may take up to 255 s to perform the
actual memory read operation when the transponder is enabled and the device is in Sleep State. The reply status is
defined above in the SPIRequestStatus command.
Master =>
Slave
Command
Code
RFU
# of bits
8
Description
EE (hex)
Register
File Word
Comment
5
3
N/A
00000
000: Word 1
001: Word 2
010: Word 3
011: Word 4
100: Word 5
101: Word 6
110: Word 7
111: Word 8
Read word from the Register File.
Slave =>
Master
Status
Data
# of bits
8
16
Description
Reply Status
Word
Data
SPIWriteRegisterFileWord Command
The SPI command SPIWriteRegisterFileWord is implemented as described below. It allows an SPI Master to write a word
to the Register File. Typical processing time for the write operation is 115 s but it may take up to 300 s to perform the
actual memory write operation when the transponder is enabled and the device is in Sleep State. The reply status is
defined above in the SPIRequestStatus command.
Master =>
Slave
Command
Code
RFU
# of bits
8
Description
EF (hex)
Slave =>
Master
Status
# of bits
8
Description
Reply Status
Register
File Word
Data
Comment
5
3
16
N/A
00000
000: Word 1
001: Word 2
010: Word 3
011: Word 4
100: Word 5
101: Word 6
110: Word 7
111: Word 8
Word
Data
Write word to the Register File.
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SPIReqRN Command
The SPI command SPIReqRN is implemented as described below. It allows an SPI Master to obtain a random number
when the device is not in Sleep state. There is no processing time required for this operation. A minimum time of 30 s
should occur between requests for random numbers. The reply status is defined above in the SPIRequestStatus
command.
Master =>
Slave
Command
Code
Comment
# of bits
8
N/A
Description
F0 (hex)
Get a random number.
Slave =>
Master
Status
Random Number
# of bits
8
16
Description
Reply Status
Random Number
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SPIReqNewHandle Command
The SPI command SPIReqNewHandle is implemented as described below. It allows an SPI Master to request the
generation of a new handle for RF communications. Refer to SPI Operation section for use of “Dummy Byte” and typical
processing time for this operation. This SPI command is only valid when the device is configured as an RF Modem using
State Machine Shared operation and the device is in Acknowledged, Open, or Secured state. It is an invalid command for
all other device configurations. The device state does not change as a result of this command. If the device is in
Acknowledged, Open, or Secured state, the new handle immediately replaces the previous handle and it remains valid
until changed by the SPI Master or the device enters into a new inventory session. The reply status is defined above in
the SPIRequestStatus command.
Master =>
Slave
Command
Code
Dummy
Byte
Comment
# of bits
8
8
N/A
Description
F1 (hex)
00000000
Request new handle.
Slave =>
Master
Status
New
Handle
Backscatter
Settings
# of bits
8
16
8
Description
Reply Status
Tag
Handle
Backscatter
Settings
Old Handle
16
RN16 or handle
(depends on present tag state)
Backscatter Settings:
RFU
TRext
3
1
000
0: No Pilot Tone
1: Use Pilot Tone
Data Encoding
4
0000: Miller-1 (FM0)
0001: Miller-2
0010: Miller-4
0011: Miller-8
Others are not used
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SPISetHandle Command
The SPI command SPISetHandle is implemented as described below. It allows an SPI Master to define a new handle for
RF communications. Refer to SPI Operation section for use of “Dummy Byte” and typical processing time for this
operation. This SPI command is only valid when the device is configured as an RF Modem using State Machine Shared
operation and the device is in Acknowledged, Open, or Secured state. It is an invalid command for all other device
configurations. The device state does not change as a result of this command. If the device is in Acknowledged, Open, or
Secured state, the new handle immediately replaces the previous handle and it remains valid until changed by the SPI
Master or the device enters into a new inventory session. The reply status is defined above in the SPIRequestStatus
command.
Master =>
Slave
Command
Code
Handle
Dummy
Byte
Comment
# of bits
8
16
8
N/A
Description
F2 (hex)
Handle
00000000
Set handle.
Slave =>
Master
Status
# of bits
8
Description
Reply Status
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SPISetParams Command
The SPI command SPISetParams is implemented as described below. It allows an SPI Master to set BAP mode
sensitivity, BLF clock used by the SPI Master, and some air interface protocol settings. Refer to SPI Operation section for
use of “Dummy Byte” and typical processing time for this operation. This SPI command is only valid when the device is
configured as an RF Modem and either State Machine Bypassed operation or State Machine Shared operation. It is an
invalid command for all other device configurations. All settings are set to zero during POR and once changed by the SPI
Master they are retained until the next POR, SPISetParams command, or SPIBoot command occurs. The reply status is
defined above in the SPIRequestStatus command.
Master =>
Slave
Command
Code
# of bits
Description
Params
Dummy
Byte
Comment
8
16
8
N/A
F3 (hex)
Control Params
00000000
Set control params.
Control Params:
BAP Mode
Sensitivity
Idle Timeout
1
0: Timeout disabled
1: Timeout enabled
Note: Feature only applies
to State Machine Shared
configurations and uses
Idle Timeout value in
Battery Management
Words to time EXT_CMD
being asserted. Timeout
results in a transition to
Sleep state.
Protocol
Features
BLF Clock for SPI Master
2
00: Use EEPROM
01: Default
10: Default + 6 dBm
11: Default + 12 dBm
Note: The EEPROM
setting in Battery
Management Word 1 is
used until
SPISetParams
command occurs.
Adjustments relative to
default sensitivity are
approximate values.
5
00000: 2X BLF clock derived from
Query command.
11111: BLF clock derived from Query
command.
Other values (bbbbb): Fixed clock
derived from decoder oscillator divided
by [[(bbbbb) + 1] / 2].
8
See below
Note: No clock signal is output in Sleep
state or Killed state. Decoder oscillator
clock is output after a Boot Sequence
and prior to receiving a Query
command for cases 00000 and 11111.
Protocol Features:
RFU
2
00
No
Req_RN
Command
No Select
Command
on Memory
1
0: Req_RN
command is
enabled.
1: Req_RN
command is
disabled.
Note: Feature
only applies to
State Machine
Shared with
limited command
set configuration.
1
0: Select
command on
memory is
enabled.
1: Select
command on
memory is
disabled
meaning that
only Select
commands
having a zerolength Mask field
will be executed.
Slave =>
Master
Status
# of bits
8
Description
Reply Status
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RFU
1
0
No T2 Timeout
1
0: T2 Timeout
processing is
enabled.
1: T2 Timeout
processing is
disabled.
Note: Feature
only applies to
State Machine
Shared
configurations.
49
ACK Command
Processing is
Shared
No
XPC
Word
1
0: All ACK commands are
processed by the device.
1: ACK command
processing is shared.
1
0: XPC Word is
enabled.
1: XPC Word and
SSD reply are
disabled. This means
Note: Feature only applies the XI bit in the PC
to State Machine Shared
Word is zero and the
with limited command set
XPC_W1 Word does
configuration. The device
not exist in the
processes ACK commands UII/EPC Memory
except during Open state,
address space.
then ACK commands are
processed externally.
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SPIGetCommParams Command
The SPI command SPIGetCommParams is implemented as described below. It allows an SPI Master to obtain the
current tag state, backscatter settings, flag settings, and the handle being used for the tag. Refer to SPI Operation section
for use of “Dummy Byte” and typical processing time for this operation. This SPI command is only valid when the device
is configured as an RF Modem and either State Machine Bypassed operation or State Machine Shared operation. It is an
invalid command for all other device configurations. The reply status is defined above in the SPIRequestStatus command.
Master =>
Slave
Command
Code
Dummy
Byte
Comment
# of bits
8
8
N/A
Description
F4 (hex)
00000000
Get current tag state, backscatter settings, flag settings, and handle.
Slave =>
Master
Status
Backscatter
Settings
Flag
Settings
# of bits
8
8
8
Description
Reply Status
Backscatter
settings
Flag settings
Tag Handle
16
RN16 or handle
(depends on present tag state)
Backscatter Settings:
Valid Settings
Inventory
Session
TRext
1
2
1
0: Backscatter
settings are invalid
1: Backscatter
settings are valid
meaning the device is
participating in the
current inventory
round
00: S0
01: S1
10: S2
11: S3
0: No
Pilot
Tone.
1: Use
Pilot
Tone.
Data Encoding
4
0000: Miller-1 (FM0)
0001: Miller-2
0010: Miller-4
0011: Miller-8
Others are not used.
Flag Settings:
RFU
Low
Battery
Alarm
AUX
Alarm
SL
1
1
1
1
0
0: No alarm
1: Alarm
0: No alarm
1: Alarm
0: Deasserted
1: Asserted
S0
S1
1
1
0: A
1: B
0: A
1: B
S2
S3
1
1
0: A
1: B
0: A
1: B
Flag settings for SL, S0, S1, S2, and S3 are the values at the time of processing for the last Query command.
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SPISetSessionFlags Command
The SPI command SPISetSessionFlags is implemented as described below. It allows an SPI Master to set the device
inventory session and select flags. Refer to SPI Operation section for use of “Dummy Byte” and typical processing time
for this operation. This SPI command is only valid when the device is configured as an RF Modem with State Machine
Shared operation. It is an invalid command for all other device configurations. The reply status is defined above in the
SPIRequestStatus command.
Session Flag
Settings
Select Flag
Setting and
Dummy Byte
Comment
8
8
8
N/A
F5 (hex)
Session Flag
Settings
Select Flag
Setting
Sets the inventory session
flags and select flag
Master =>
Slave
Command
Code
# of bits
Description
Select Flag Setting:
S0 Mask
S1 Mask
S2 Mask
S3 Mask
S0
S1
S2
S3
1
1
1
1
1
1
1
1
0: A
1: B
0: A
1: B
0: A
1: B
0: A
1: B
0: Skip
1: Write
0: Skip
1: Write
0: Skip
1: Write
0: Skip
1: Write
Select Flag Setting:
SL Mask
1
0: Skip
1: Write
SL
Dummy
1
6
0: Not selected
1: Selected
000000
Slave =>
Master
Status
# of bits
8
Description
Reply Status
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SPI Slave Extensions
SPI Slave extensions offer additional functionality when the device is configured for SPI Slave operation. The SPI Slave
extensions are selected via the SPI Slave Config field in the I/O Control Word.
The signaling feature allows the SPI Slave to alert the SPI Master that a particular event is present. The general concept
is that the SPI bus is used in the normal manner when the SPI Chip Select (CS) is low, and the SPI bus is used in a
different manner when CS is high. Signaling may be done using either the Monitor Function indicating a temperature
measurement is currently in progress, or using the Comm Buffer Semaphore indicating handshake status with a reader
during high speed communication. The Comm Buffer Semaphore is the MSB of Register File Word 1.
The RF modem feature allows an external SPI Master device to receive the output of the demodulator and directly control
the input to the modulator for backscatter operation. The general concept is that the SPI bus is used in the normal
manner when the SPI Chip Select (CS) is low, and the SPI bus is used in a different manner when CS is high. The RF
modem feature allows the SPI Master to bypass the air interface protocol processing with the device.
When using RF Modem with State Machine Bypassed, the BYPASS signal asserted enables the entire AFE, prevents
transitions to Sleep state, prevents Initial Command Detection Timeout, and no command processing is performed by the
device. The external SPI Master performs all command processing and tag replies while BYPASS is asserted. The device
does not change states when the external SPI Master processes commands but the SPI Master can command the device
to Ready state via the falling edge of BYPASS signal unless the device is in Killed state in which case it remains in the
Killed state.
When using RF Modem with State Machine Shared with limited command set, the device is responsible for five states
(Sleep, Ready, Arbitrate, Reply, Acknowledged), eight commands (Select, Query, QueryAdjust, QueryRep, ACK, NAK,
Req_RN, BroadcastSync), and two custom commands (GetUID, GetSensorData) if custom EM4325 command
processing is enabled. Once the device has reached Acknowledged state and if Req_RN command is disabled, any
command other than the eight identified commands will cause the device to transition to Open state. If EXT_STATE is
asserted while in Acknowledged or Open state, any command that cannot be processed by the device will cause the
EXT_CMD signal to be asserted. The EXT_CMD signal asserted enables the entire AFE, prevents transitions to Sleep
state, and no command processing is performed by the device. The external SPI Master performs all command
processing and tag replies while EXT_CMD is asserted and signals to the device via the falling edge of EXT_STATE that
EXT_CMD shall be de-asserted. The device does not change states when the external SPI Master processes commands
but the SPI Master can command the device to Ready state via the falling edge of EXT_RDY signal.
When using RF Modem with State Machine Shared with full command set, the device is responsible for all states, all
mandatory and optional commands implemented in the device, and all EM4325 custom commands (if enabled). For all
states except Killed, if EXT_STATE is asserted and an unknown optional command is received then it will cause the
EXT_CMD signal to be asserted. Unknown optional commands must use command codes starting with either 0xC (hex),
0xD (hex), or 0xE (hex). The EXT_CMD signal asserted enables the entire AFE, prevents transitions to Sleep state, and
no command processing is performed by the device. The external SPI Master performs all command processing and tag
replies while EXT_CMD is asserted and signals to the device via the falling edge of EXT_STATE that EXT_CMD shall be
de-asserted. The device does not change states when the external SPI Master processes commands but the SPI Master
can command the device to Ready state via the falling edge of EXT_RDY signal.
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SPI Slave Config field in the I/O Control Word:
Bit
MSB
7
Content
RFU
8
9
A
SPI Bus
Operation
B
C
Register
File Pages
D
E
LSB
F
User Memory
Read Protect
Custom
Commands
Kill
Command
Content
Description
SPI Bus
Operation
00x: Normal,
010: Signaling with Monitor Function,
011: Signaling with Comm Buffer Semaphore,
10x: RF Modem with State Machine Bypassed,
110: RF Modem with State Machine Shared with limited command set.
111: RF Modem with State Machine Shared with full command setset
Register File
Pages
00: Both Register File pages are used normally,
01: First Register File page is used normally and the second Register File page is used to replace
UII/EPC page 1,
10: Both Register File pages are used to replace UII/EPC pages 0 and 1 (except for the UMI and
XI bits in the PC Word). NOTE: Unpredictable memory operations may occur when BAP Mode is
enabled and the battery is depleted (VBAT < minimum battery operating voltage),
11: Both Register File pages are used to replace UII/EPC pages 1 and 2
NOTE: Register File pages replacing UII/EPC pages are write protected from the RF interface.
User Memory
Read Protect
0: Disable read protection for RF interface to access User Memory,
1: Enable read protection for RF interface to access User Memory
NOTE: Read protection prevents the RF interface from using either the Select or Read commands
to access User Memory unless the device is in the Secured state.
Custom
Commands
0: Enable all EM4325 custom commands,
1: Disable all EM4325 custom commands
Kill Command
0: Enable Kill Command,
1: Disable Kill Command
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I/O Signals for SPI Slave Extensions
EM4325
Pads/Pins
AUX
Output
or HI-Z
P0_MOSI
Input
Normal
HI-Z when AUX
Enable is ‘0’.
Selected RF event is
output when AUX
Enable is ‘1’.
MOSI when P3_CS is
‘0’.
Signaling
HI-Z when AUX Enable is
‘0’.
Selected RF event is output
when AUX Enable is ‘1’.
MOSI when P3_CS is ‘0’.
Not used when P3_CS is
Not used when P3_CS ‘1’.
is ‘1’.
RF Modem with State
Machine Bypass
HI-Z when AUX Enable is ‘0’.
RF Modem with State
Machine Shared
HI-Z when AUX Enable is ‘0’.
Selected RF event is output
when AUX Enable is ‘1’ and
P3_CS is ‘0’.
Selected RF event is output
when AUX Enable is ‘1’ and
P3_CS is ‘0’.
Selected RF event is output
when AUX Enable is ‘1’,
P3_CS is ‘1’, BYPASS is ‘0’,
and SELECT is ‘0’.
Selected RF event is output
when AUX Enable is ‘1’,
P3_CS is ‘1’, and
EXT_STATE is ‘0’.
Tx is output when AUX
Enable is ‘1’, P3_CS is ‘1’,
BYPASS is ‘0’, and SELECT
is ‘1’.
(BLF clock AND EXT_CMD)
is output when AUX Enable is
‘1’, P3_CS is ‘1’, and
EXT_STATE is ‘1’. NOTE:
EXT_CMD requests external
processing of commands.
(BLF clock AND RF Event) is
output when AUX Enable is
‘1’, P3_CS is ‘1’, and
BYPASS is ‘1’.
MOSI when P3_CS is ‘0’.
SELECT when P3_CS is ‘1’
and BYPASS is ‘0’.
Tx when P3_CS is ‘1’ and
BYPASS is ‘1’.
P1_MISO
Output
or HI-Z
MISO when P3_CS is
‘0’.
HI-Z when P3_CS is
‘1’.
P2_SCLK
Input
SCLK when P3_CS is
‘0’.
MISO when P3_CS is ‘0’.
MISO when P3_CS is ‘0’.
Event signal (Monitor
Function or Comm Buffer
Semaphore) is output when
P3_CS is ‘1’.
(Rx AND RF Event AND
Field OK) when P3_CS is ‘1’.
SCLK when P3_CS is ‘0’.
Not used when P3_CS is
Not used when P3_CS ‘1’.
is ‘1’.
P3_CS
Input
When ‘0’, SPI bus is
active. When ‘1’, SPI
bus is inactive.
When ‘0’, SPI bus is active.
When ‘1’, SPI bus is
inactive.
SCLK when P3_CS is ‘0’.
BYPASS when P3_CS is ‘1’.
NOTE: BYPASS should hold
low and high levels for at least
1 s and a falling edge on
BYPASS commands the
device State Machine to Ready
state unless the device is in
Killed state in which case it
remains in the Killed state.
When ‘0’, SPI bus is active.
When ‘1’, SPI bus is inactive.
MOSI when P3_CS is ‘0’.
EXT_RDY when P3_CS is ‘1’
and EXT_STATE is ‘0’.
NOTE: EXT_RDY should
hold low and high levels for at
least 1 s and a falling edge on
EXT_RDY commands the
device State Machine to Ready
state.
Tx when P3_CS is ‘1’ and
EXT_STATE is ‘1’.
MISO when P3_CS is ‘0’.
(Rx AND RF Event AND
(Field OK OR EXT_CMD))
when P3_CS is ‘1’.
NOTE: Tx may also be
observed in addition to Rx.
SCLK when P3_CS is ‘0’.
EXT_STATE when P3_CS is
‘1’. There must be at leat
100ns separation between any
edges on EXT_STATE with
respect to any edges on
EXT_RDY.
When ‘0’, SPI bus is active.
When ‘1’, SPI bus is inactive.
Rx = Received signal (output from demodulator)
Tx = Transmit signal (input to backscatter switch)
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Examples using State Machine Bypass
State Machine Bypass – Gen2 Protocol Customization
AUX
RF Event
P0_MOSI
SELECT
P1_MISO
Rx
P2_SCLK
BYPASS
Tx
P3_CS
state
ready
ready
ready
arbitrate
reply
action
waiting for
command
Select Cmd
Query Cmd
QueryRep Cmd
(slot ≠ 0)
QueryRep Cmd
(slot = 0)
continued
BLF Clock
AUX
Tx
RF Event
P0_MOSI
SELECT
P1_MISO
Rx
P2_SCLK
BYPASS
Tx
SELECT
P3_CS
state
acknowledged
open
open
ready
ACK Cmd
Req_RN Cmd
Command processing by
external uC
waiting for
command
continued
action
State Machine Bypass – Other Protocols
BLF Clock
AUX
RF Event
P0_MOSI
SELECT
P1_MISO
Rx
P2_SCLK
BYPASS
RF Event
Tx
P3_CS
state
ready
ready
ready
action
waiting for
command
External uC detects its protocol.
Command processing done by external uC
waiting for
command
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Examples using State Machine Shared
State Machine Shared
AUX
RF Event
P0_MOSI
EXT_RDY
P1_MISO
Rx
P2_SCLK
EXT_STATE
P3_CS
state
ready
ready
ready
arbitrate
reply
action
waiting for
command
Select Cmd
Query Cmd
QueryRep Cmd
(slot ≠ 0)
QueryRep Cmd
(slot = 0)
continued
BLF Clock
AUX
RF Event
P0_MOSI
EXT_RDY
P1_MISO
Rx
P2_SCLK
EXT_STATE
RF Event
Tx
EXT_RDY
P3_CS
state
acknowledged
open
continued
action
ACK Cmd
Req_RN Cmd
open
open
open
SPI Bus Cmd
Unknown Cmd
& external uC
ready for
command
processing
external uC
command
processing
done
SPIGetCommParams
BLF Clock
AUX
RF Event
P0_MOSI
EXT_RDY
P1_MISO
Rx
P2_SCLK
EXT_STATE
BLF Clock
RF Event
Tx
RF Event
EXT_RDY
Tx
EXT_RDY
P3_CS
state
open
open
open
open
open
ready
action
external uC
command
processing
done
Unknown Cmd
& external uC
ready for
command
processing
external uC
command
processing
done
Unknown Cmd
& external uC
ready for
command
processing
external uC
commands
ready state
waiting for
command
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TOTAL Operation
TOTAL is an enhanced version of the IP-XTM protocol (IP-X is a trademark of IPICO) and is used for many applications. It is a
simple protocol that does not require a forward link for readers to work with tags, and the tags work in a listen-before-talk
manner. Once a TOTAL tag is powered up, it listens for any modulation on the reader signal, and if none is detected, it
backscatters its message and then repeats the listen-and-backscatter cycle again and again. If modulation is detected, then
the tag will switch into RTF to communicate with the reader using the normal Gen2/6C commands and responses.
The amount of time a TOTAL tag spends listening is the sum of two components: a fixed time defined to be the minimum
listening time and a random hold-off delay time. Listen times are meant to be of random duration in general as this is
fundamental to the collision arbitration scheme used by the TOTAL protocol.
TOTAL backscatters a TagMsg consisting of one or more packets. Each packet contains 64 bits of data, with bit 63 being the
MSB and bit 0 being the LSB. The first packet(s) always contain the TID which is stored in the TID Memory bank. The first
byte (8 MSB’s of the 64-bit page) is the Allocation Class and provides additional information for multi-packet TagMsg’s.
There are several configuration words to enable TOTAL mode and configure the protocol parameters. The primary control
word is the TOTAL Word located in the Control Page of EEPROM. The Initial Listen Time parameter in the TOTAL Word must
be set non-zero to enable TOTAL. The Initial Listen Time is used to define the minimum time after RF field detection before
the first TagMsg may be transmitted. A Subsequent Listen Time of 125 s is used to define the minimum time between all
other transmissions of TagMsg’s except where noted below. The maximum time between transmissions of TagMsg’s is
defined by the Maximum Hold-off Time parameter. The general concept for the protocol is illustrated by the following figure:
Initial
Listen
Time
Boot
Sequence
Random
Hold-off
Time 1
Listen for
Reader
Modulation
Subseq Random
Listen Hold-off
Time Time 2
Transmit
TagMsg
Listen for
Reader
Modulation
Subseq
Listen
Time
Transmit
TagMsg
Random
Hold-off
Time 3
Listen for
Reader
Modulation
Transmit
TagMsg
RF Field
Detect
A variation of the general concept is having a number of fixed time slots at the start of the TOTAL protocol. The Fixed Slot
Count parameter is used to identify the number of fixed time slots to use before the start of random time slots. Fixed time slots
always use the time specified by the Initial Listen Time parameter and have no additional random hold-off time added. This
variation to the general concept for the TOTAL protocol is illustrated using 2 fixed times slots in the following figure:
Initial
Listen
Time
Boot
Sequence
Listen for
Reader
Modulation
Initial
Listen
Time
Transmit
TagMsg
Listen for
Reader
Modulation
Subseq
Listen
Time
Transmit
TagMsg
Random
Hold-off
Time 1
Listen for
Reader
Modulation
Transmit
TagMsg
RF Field
Detect
The Data Encoding Type parameter defines what format is used for bit encoding during transmission of the TagMsg. Available
formats are PPE, FM0, Miller-2, and Miller-4.
The BLF parameter defines the link frequency to be derived from the decoder oscillator. This device supports five BLF values
of 1280/2 = 640 KHz, 1280/2.5 = 512 KHz, 1280/4 = 320 KHz, 1280/5 = 256 KHz, and 1280/10 = 128 KHz. The 512 KHz BLF
is used only for PPE and the 640 KHz BLF is used only for non-PPE.
The Sensor Page CRC Enable parameter allows for hardware generation of a CRC-5 value for the TOTAL Sensor Page that
is included as the 5 LSB’s of the 64-bit data. This CRC-5 value is computed starting with the MSB of the TOTAL Sensor Page.
The Adaptive Hold-off Enable parameter allows the device to dynamically increase the Maximum Hold-off Time based upon
the number of TagMsg’s that have been transmitted.
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If TOTAL is enabled, then the User Memory bank is also used for TOTAL user memory and the TOTAL System Page. The
highest page in User memory (User page 47) is defined to be the TOTAL System Page and its format and function are
described below at the end of this section. The TOTAL System Page contains two important parameters to define the first
page of TOTAL user memory and the number of consecutive pages to be included in the TagMsg. If either of these
parameters is zero, then there are no TOTAL user memory pages to follow the TID in the TagMsg. Since the User Memory
bank is used for TOTAL, all the normal Gen2/6C commands (Read, Write, Lock, BlockErase, BlockWrite, BlockPermalock)
can be used for accessing or locking the memory.
The amount of data transmitted in the TagMsg is dependent upon the settings in the TOTAL System Page. Allocation Classes
E0, E2, and E3 are used for ISO structured data formats and will transmit pages in the sequence: TID Pages, then TOTAL
memory pages. All other Allocation Classes use an unstructured data format and will transmit pages in the sequence: TID
Page, then TOTAL memory pages (if any defined).
TagMsg with Unstructured Data Format
for Legacy Allocation Classes
Page 0
TID
TagMsg: TID only
Page 0
Page 1
Page 2
TID
Page 3
...
Page n
Unstructured Data
TagMsg: TID + n pages of unstructured data
TagMsg with Structured Data Format
for Allocation Classes E2 (hex) and E3 (hex)
Page 0
Page 1
TID
MSB’s
TID
LSB’s
Page 2
P
C
Page 3
UII/EPC
C
R
C
TagMsg: TID with 96-bit UII/EPC
Page 0
TID
MSB’s
Page 1
TID
LSB’s
Page 2
P
C
Page 3
UII/EPC
Page 4
C
R
C
D
S
F
I
D
...
Item Related Data
Page n
C
R
C
Not
used
TagMsg: TID with 96-bit UII/EPC and (n-3) pages of item related data
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The TagMsg’s with ISO structured data formats illustrated above will actually have all the structures and CRC’s generated by
a reader and stored into TOTAL memory with the exception of the TOTAL TID Pages.
ISO structured data encoding has a number of encoding segments that occur in the following sequence:
1) A mandatory UII/EPC segment that starts with the TID and is followed by the Protocol Control Word, the UII/EPC itself,
and ends with a CRC-16 that is calculated over the entire UII/EPC segment. If no other segments exist for the TagMsg,
then zero-filled data is used after the CRC-16 until the end of the page.
2) An optional Item Related Data segment that starts with the segment DSFID and is followed by the item related data
and ends with a CRC-16 that is calculated over the entire Item Related Data segment. If needed, then zero-filled data is
used after the CRC-16 until the end of the page.
The UII/EPC shall be encoded from the beginning of the first page after the TID and may require less than one complete
page, exactly one page, or more than one page to encode the UII/EPC. Bit positions 63 to 48 of Page 1 shall encode the
Protocol Control word. The UII/EPC is encoded from bit 47 of Page 1 until the end of the UII/EPC.
The Item Related Data segment immediately follows the UII/EPC segment and may require less than one complete page,
exactly one page, or more than one page. The first byte in this segment contains the length of the segment in words and the
second byte shall encode the segment DSFID and defines the encoding rules and the data format assigned to the Item
Related Data for a particular application.
TagMsg’s are transmitted using packets consisting of a preamble followed by a 64-bit page of data. The preamble for PPE
encoded data uses 11 data symbols so the packet length is 75 bits (11 preamble bits + 64 data bits). The preamble for FM0
encoded data uses 18 data symbols and 1 ending bit so the packet length is 83 bits (18 preamble bits + 64 data bits + 1
ending bit). The preamble for Miller (M=2, M=4) encoded data uses 22 data symbols and 1 ending bit so the packet length is
87 bits (22 preamble bits + 64 data bits + 1 ending bit). TagMsg’s consisting of multiple pages are transmitted as a sequence
of packets with a time period equal to 8 data symbols in between transmission of consecutive packets.
A feature for multi-packet transmissions uses the concept of a page linking mechanism with a hardware generated packet
down-count along with a hardware generated CRC-5 on a per packet basis. The concept is to extend each packet by an
additional 8 bits after the 64-bit page data to support a 3-bit packet number followed by a 5-bit CRC value. The packet number
is a modulo 8 value and represents how many additional packets are still to follow in the TagMsg. It can be used to
reconstruct the entire TagMsg when not all the packets are correctly received by a reader in a single TOTAL TagMsg
transmission. The CRC-5 value is to be calculated starting with the CRC-5 from the previous packet and including the 64-bit
page data of the current packet plus the 3-bit packet number of the current packet. Calculating the CRC-5 for the first packet
of the TagMsg shall use a zero value as the CRC-5 from the previous packet. This feature for multi-packet transmissions can
only be applied when using a data encoding type that is a Miller subcarrier (M = 2 or 4) and its presence is indicated to the
reader by terminating the preamble with an alternate synch pattern. The normal synch pattern of “010111” is used to indicate
the page linking mechanism is not included in the packet and the alternate synch pattern of “010110” is used to indicate the
page linking mechanism is included in the packet.
This device can be configured to support legacy Tag Talks Only (TTO) applications and has other features that are not
included in the ISO/IEC 18000-64 spec. In order to fully comply with ISO/IEC 18000-64, the fields in the TOTAL Word must be
set as follows:
Page Link Enable = 0 or 1
Fixed Slot Count = 000
Mute Function = 1
Adaptive Hold-off Enable = 0 or 1
Data Encoding = 00 or 10
BLF = 11
Copyright 2015, EM Microelectronic-Marin SA
4325-DS, Version 7.0, 24-Apr-15
Maximum Hold-off Time = 11 when Adaptive Hold-off
Enable = 0; otherwise, any value is compliant
Initial Listen Time = 101 or 110 or 111
(NOTE: Miller-2 data encoding is not compliant)
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Definition of the TOTAL System Page (User page 47):
TOTAL Config Word (First word in TOTAL System Page)
Bit
MSB
0
1
Content
2
3
4
5
6
7
8
9
A
C
D
E
LSB
F
Number of TOTAL
memory pages to transmit
(Valid range is 0 to 47)
(Zero means no pages)
First TOTAL memory page to
transmit after TID
(Valid range is 0 to 47)
(Zero means no pages)
RFU
B
Proprietary Data Word 1 (Second word in TOTAL System Page)
Bit
MSB
0
1
2
3
4
Content
5
6
7
8
9
A
B
C
D
E
LSB
F
B
C
D
E
LSB
F
B
C
D
E
LSB
F
Proprietary data defined by user
Proprietary Data Word 2 (Third word in TOTAL System Page)
Bit
MSB
0
1
2
3
4
Content
5
6
7
8
9
A
Proprietary data defined by user
Proprietary Data Word 3 Fourth word in TOTAL System Page)
Bit
MSB
0
1
2
3
4
Content
5
6
7
8
9
A
Proprietary data defined by user
Content
Description
RFU
Reserved for Future Use
First TOTAL memory page to
transmit after TID
Beginning of TOTAL memory pages to transmit in TagMsg
Number of TOTAL memory
pages to transmit
Number of TOTAL memory pages to transmit in TagMsg
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Temp Sensor Operation
The temp sensor can be used both in passive mode and in BAP mode. If a temperature measurement cannot be made for
any reason then the temp sensor will report a value of -64°C.
A reader can request a temperature measurement be made on demand by either writing to the Sensor Data (MSW) word or
using the custom command GetSensorData. Measurements made on demand are not used by the device for temperature
monitoring and have no effect on temperature alarms. For passive tags, the RF field must remain on from the time a
temperature measurement is requested until the result is read. This can be used to support applications using only passive
tags with the temperature monitoring performed by readers.
For BAP tag applications, the Temp Sensor and Monitor Function are controlled by the three Temp Sensor Control Words.
The Monitor Function is only performed when BAP Mode is enabled and it is used to monitor Low Battery, Tamper (if
enabled), Under Temp, and Over Temp conditions. The Monitor Function uses a programmable sampling interval that
defines when to check for alarm conditions. Time is measured using a clock signal derived from the system oscillator and
will be shortened by some portion of one clock period and have the same accuracy as the system oscillator. The Monitor
Function uses three counters for the Under Temp Count, the Over Temp Count, and the number of Aborted Temp
Measurements. Monitoring is enabled when the sampling interval is non-zero and if a time stamp is required, then the
Monitor Function will not begin until the UTC Clock is set by an external command (e.g. BroadcastSync or Write) such that
the 8 MSB’s of the 32-bit value are not all zeroes.
At every sample interval, the Monitor Function will perform Low Battery detection and update the Low Battery Alarm
accordingly.
Custom sensor operation allows for more flexibility and increased range for programmed values. It allows for monitoring of
both Under Temp and Over Temp conditions when there is a very large temperature difference between the two conditions.
A reader can get detailed status of the custom sensor by using the Read command or the GetSensorData command.
Alarms
There are four alarms possible using this device: Low Battery, Aux, Under Temp, and Over Temp. The Low Battery alarm is
a registered value (volatile memory) and the other alarms are both registered values and in non-volatile memory. Alarms for
Aux, Under Temp, and Over Temp are reported as an OR of their corresponding registered and non-volatile values. The
Sensor Alarm bit in the XPC_W1 word is an OR of all four alarms.
Low Battery detection is performed only when BAP Mode is enabled. A Low Battery condition is checked as part of the
Monitor Function when the Monitor Function is performed and also checked every transition from Power-up/Sleep to Active.
The battery voltage is compared against the selected LBD threshold and the Low Battery Alarm condition is set accordingly.
Note that the Low Battery Alarm condition indicates only that the battery voltage was below the selected LBD threshold
during the most recent comparison and any previous information is not kept. A reader cannot set or reset the Low Battery
Alarm.
Tamper detection is performed regardless if BAP Mode is enabled or disabled. Tamper detection, if enabled and the Aux
Alarm is not set, is checked as part of the Monitor Function when the Monitor Function is performed and also checked every
transition from Power-up/Sleep to Active. Tamper detection is also performed in BAP mode with a rising edge on P3 when
the AUX function is configured for tamper detection and the device is not an SPI Slave. Tamper is reported via the Aux
Alarm and is in non-volatile memory and will retain its state during power-off/power-on cycles. A reader can directly reset
the Aux Alarm via the custom command ResetAlarms provided the commanded is enabled in the Temp Sensor Control
Words. A reader can indirectly reset the Aux Alarm by successfully writing to the Temp Sensor Calibration Word or any of
the Temp Sensor Control Words.
Under Temp and Over Temp detection is performed only when BAP Mode is enabled and the Monitor Function is
performed. The programmable Monitor Function determines when it is time to sample the current temperature and compare
the measurement against the programmable Under Temp and Over Temp thresholds. Separate counts are kept as
registered values for the number of consecutive samples that are below the Under Temp threshold or above the Over Temp
threshold. When a count value reaches the programmable limit for declaring a sustained event, then the corresponding
Alarm is set. The Under Temp Alarm and Over Temp Alarm are in non-volatile memory and will retain their states during
power-off/power-on cycles. A reader can directly reset the Under Temp Alarm and Over Temp Alarm via the custom
command ResetAlarms provided the commanded is enabled in the Temp Sensor Control Words. A reader can indirectly
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reset the Under Temp Alarm and Over Temp Alarm by successfully writing to the Temp Sensor Calibration Word or any of
the Temp Sensor Control Words.
Battery Management
If a BAP tag is known to be in storage or a controlled area, then an ultra-low power mode exists to extend battery life. This
feature is enabled via the BAP Control Enable bit in EEPROM. The ultra-low power mode is enabled/disabled by a reader
command that writes to the BAP Mode bit. A reader can only change the BAP Mode bit when the RF field strength is
sufficient to perform the operation. Transitions to or from the ultra-low power mode will occur after successfully changing the
BAP Mode value and then returning the device to the Ready State, or if POR occurs.
The device will auto-switch between battery powered and beam powered based upon which power source is presently
providing the higher voltage. Other battery management features described below are configured via the TOTAL Word and
the Battery Management Words in EEPROM.
Sleep mode disables the decoder oscillator and has the lowest current consumption for BAP tags. During Sleep mode, the
Field Detector in the AFE is used to determine the presence of an RF field. A 2-bit programmable value that is the RF Field
Detector Duty Cycle determines how frequently the Field Detector is used to check for the presence of an RF field. Once an
RF field has been detected, the Field Detector will use a 100% duty cycle to perform confirmation processing and a new
field measurement is made approximately every 25 s. If the RF field is detected for four consecutive field measurements
(initial detection followed by three confirmations), then a valid RF field is declared present and a transition occurs from
Sleep mode to Active mode. If the RF field cannot be confirmed, then the Field Detector returns to using its original duty
cycle.
The Sleep to Active transition enables the decoder oscillator and initiates the relevant portions of the Boot Sequence. The
2-bit programmable value chosen for the RF Field Detector Duty Cycle represents a performance trade-off between:
1) Average current consumption during Sleep mode, and
2) The tag transition time to Ready/Listen state for a valid RF wake-up.
Once the device transitions from Sleep mode to Active mode, the Field Detector uses a 100% duty cycle to monitor the
presence of the RF field. A 2-bit programmable value that is the RF Fade Control determines how quickly a transition
occurs from Active Mode to Sleep Mode when the RF field is no longer detected. During Active mode, there are different
mechanisms for battery management depending on whether TOTAL is in use or not.
For TOTAL tags not in Sleep state:
A TOTAL tag will normally transmit its TagMsg forever so long as an RF field is detected and no mute conditions are
encountered. A feature exists to allow the TOTAL tag to perform self muting after transmitting a specified number of
TagMsg's. This is a 6-bit programmable value that is the Number of TOTAL TagMsg’s to Transmit Before Self Muting. This
feature can be used for both passive tags and BAP tags.
A TOTAL tag that is muted will normally remain so until the RF field is seen to drop below the RF field detection threshold.
A feature exists to use the P3 input such that a rising edge on P3 will terminate the muting and initiate transmissions of
TOTAL TagMsg’s again. Another feature exists to allow the TOTAL tag to terminate the mute condition after a specified
amount of time and begin transmitting its TagMsg again. This is a 6-bit programmable value comprised of the 4-bit TOTAL
Mute Timeout and the 2-bit Timeout Units. There is also a separate TOTAL MUTE TOUT EN bit to enable this feature. This
feature can be used for both passive tags and BAP tags.
The TagMsg duty cycle is specified with the Maximum Hold-off Time value in the TOTAL Word. The tag is in its high current
consumption state a short period of time during transmission of the TagMsg and then in a lower current consumption state
for a much longer period of time while listening for a mute condition or valid RTF command. The self muting and mute
timeout features allow for specifying a different type of duty cycle for when a BAP TOTAL tag is in the presence of long
duration RF fields that may last for minutes, hours, or even days. A BAP TOTAL tag will transmit TagMsg’s until self muting
occurs, wait until the mute timeout occurs, reset the TagMsg counter and transmit TagMsg’s until self muting occurs again,
and repeat this cycle until the RF field drops below the RF field detection threshold.
Normally, a BAP TOTAL tag never returns to Sleep mode until the RF field drops below the RF field detection threshold. It
is always ready to receive RTF commands except when actually transmitting the TagMsg. A feature exists to encourage a
BAP TOTAL tag to enter Sleep mode and obtain a desired duty cycle for Active mode. This feature is enabled whenever
BAP Mode is enabled, RTF Idle Timeout is enabled, the Sleep Timeout is non-zero, the Number of TOTAL TagMsg’s to
Transmit Before Self Muting is non-zero, the TOTAL Mute Timeout is non-zero, and the BAP Mode sensitivity has not been
Copyright 2015, EM Microelectronic-Marin SA
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set via the SPISetParams command. This set of conditions will imply that the TOTAL MUTE TOUT EN bit is also enabled.
The Active mode duty cycle that is actually achieved will depend upon the RF environment but a nominal value is
approximately:
Active mode duty cycle = Active mode time / (Active mode time + Sleep mode time)
where:
Active mode time = 2 * ((time required for self muting to occur) + (time for mute timeout to occur))
Sleep mode time = time for sleep timeout to occur
For RTF tags not in Sleep state:
An RTF tag will normally remain Active but idle in the Ready state forever so long as an RF field is detected. It is always
ready to receive RTF commands. A feature exists to allow the RTF tag to terminate the Active mode after a specified
amount of time. This is a 6-bit programmable value comprised of the 4-bit Idle Timeout for Active to Sleep Transition and
the 2-bit Timeout Units. There is also a separate RTF IDLE TOUT EN bit to enable this feature and it can be used for both
passive tags and BAP tags. This feature can be used to force a duty cycle but provides only a little help in prolonging
battery life because the best case Active mode duty cycle is ~93%. A forced duty cycle also results in having an off time
during which a tag may not detect and cannot respond to any RTF command.
A feature exists to encourage a BAP RTF tag to enter Sleep mode and obtain a desired duty cycle for Active mode. This
feature is enabled whenever BAP Mode is enabled, the Sleep Timeout is non-zero, and the Idle Timeout for Active to Sleep
Transition is non-zero, and the BAP Mode sensitivity has not been set via the SPISetParams command. This set of
conditions will imply that the RTF IDLE TOUT EN bit is also enabled. The feature also makes use of the 4-bit programmable
value that is the Initial Command Detection Timeout that is the amount of time allowed after completion of the Boot
Sequence until the initial RTF command must be detected or the tag will transition from Active mode back to Sleep mode.
The Active mode duty cycle that is actually achieved will depend upon the RF environment but a nominal value is
approximately:
Active mode duty cycle = Active mode time / (Active mode time + Sleep mode time)
where:
If Initial Command Detection Timeout is non-zero then
Active mode time = 6 * (time required for initial command detection to timeout)
If Initial Command Detection Timeout is zero then
Active mode time = 2 * (time required for idle timeout to occur)
Sleep mode time = time for sleep timeout to occur
Copyright 2015, EM Microelectronic-Marin SA
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Floor Plan
1827
80
5
6
4
7
3
140.425
2
1
353.725
703.725
1058.15
1404.575
1412.575
1050
700
350
1662
80
4.1
8
9
10
EM4325
Y
113
2053
X
All dimensions in m
Pad size : 68 X 68
Pad
Name
I/O
Description
1
P1_MISO
I/O
I/O P1 or SPI Master Input / Slave Output (see note)
2
P0_MOSI
I/O
I/O P0 or SPI Master Output / Slave Input (see note)
3
TEST_A
A
4
AUX
I/O
5
ANT+
A
Antenna +
6
VSS
A
Supply return and Antenna -
7
VBAT
A
External supply voltage for BAP operation
8
TEST
I
N/A (active high)
9
P3_CS
I/O
I/O P3 or SPI Chip Select (active low) (see note)
10
P2_SCLK
I/O
I/O P2 or SPI Serial Clock (see note)
N/A
Auxiliary Function (see note)
A: Analog, I: Digital Input, O: Digital Output
NOTE: The pads for the AUX function and the I/O functions may be shorted together when not used for an application to
ease inlay assembly if desired.
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TSSOP8 Package Outline
1.00
1.00
4
3
2
1
e
A
E
1.00
A1
E1
D
5
6
7
8
TOP VIEW
S
Y
M
B
O
L
SIDE VIEW
COMMON DIMENSIONS
N
O
MIN.
NOM.
MAX.
E
1.10
A
A1
T
0.05
0.10
D
3.00 BSC
E
6.40 BSC
E1
4.40 BSC
e
0.65 BSC
0.15
BSC - Basic Spacing between Centers
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EM4325
Ordering Information
The following charts show the general offering. For detailed Part Number to order, please see the table “Standard Versions”
below. For wafer form delivery, please refer to EM4325 wafer specification document.
Packaged Device:
EM4325
Device in Die Form:
V%%
TP8B+
EM4325
V%%
Version
Check table below
WS
7
Version
Check table below
Die Form
WW = Wafer
WS = Sawn Wafer/Frame
Package
TP8B+ = TSSOP8 (3mm x 4.4mm),
in Tape & Reel of 4000 pieces
Thickness
7 = 7 mils (178um)
11 =11 mils (280um)
Bumping
(blank) = no bumping
E = with gold bumps
Versions
Versions are identified with “V” followed by a two digit code “XY” that are defined in the following tables.
X
SMS
Temp Sensor
Y
1
2
3
4
TID Format
No
Calibrated
1
EPC
No
Uncalibrated
2
ISO E0
Yes
Calibrated
3
ISO E3
Yes
Uncalibrated
4
Legacy TOTAL
Remarks:


For ordering, please use table in “Standard Versions and Samples”.
For specifications of Delivery Form, including gold bumps, tape and bulk, as well as possible other delivery form or
packages, please contact EM Microelectronic-Marin S.A.
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Standard Versions and Samples
The versions below are considered standard and should be readily available. For other versions or other
delivery form, please contact EM Microelectronic-Marin S.A. For samples, please order exclusively from the standard
versions.
Part Number
SMS Temp Sensor Calibrated
Package / Die Form
Delivery Form
Sawn wafer / bumped die – thickness of 7 mils
Wafer on frame
EM4325V11WS7E
No
Yes
EM4325V11TP8B+
No
Yes
TSSOP8
Tape & Reel
EM4325V21WS7E
No
No
Sawn wafer / bumped die – thickness of 7 mils
Wafer on frame
EM4325V21TP8B+
No
No
TSSOP8
Tape & Reel
EM4325V26TP8B+
No
No
TSSOP8
Tape & Reel
EM4325V31TP8B+
Yes
Yes
TSSOP8
Tape & Reel
EM4325V41TP8B+
Yes
No
TSSOP8
Tape & Reel
Custom
Custom
EM4325VXY%%%
NOTE: EM4325V26TP8B+ is intended for use as a RF / analog front end for a microcontroller and it disables all RF
command processing while the SPI bus functionality remains intact. This requires an external microcontroller to implement
all aspects of an air interface protocol.
Product Support
Check our website at www.emmicroelectronic.com under Products/RF Identification section. Questions can be submitted to
[email protected] .
EM Microelectronic-Marin SA (“EM”) makes no warranties for the use of EM products, other than those expressly contained in EM's
applicable General Terms of Sale, located at http://www.emmicroelectronic.com. EM assumes no responsibility for any errors which may
have crept into this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does
not make any commitment to update the information contained herein.
No licenses to patents or other intellectual property rights of EM are granted in connection with the sale of EM products, neither expressly
nor implicitly.
In respect of the intended use of EM products by customer, customer is solely responsible for observing existing patents and other
intellectual property rights of third parties and for obtaining, as the case may be, the necessary licenses.
Important note: The use of EM products as components in medical devices and/or medical applications, including but not limited
to, safety and life supporting systems, where malfunction of such EM products might result in damage to and/or injury or death
of persons is expressly prohibited, as EM products are neither destined nor qualified for use as components in such medical
devices and/or medical applications. The prohibited use of EM products in such medical devices and/or medical applications is
exclusively at the risk of the customer.
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