ROHM BD37A19FVM

Datasheet
Voltage
Detectors
Voltage Detector ICs with Watchdog Timer
BD37Axx Series
BD87Axx Series
BD99A41F
●General Description
The BD37A19FVM, BD37A41FVM, BD87A28FVM,
BD87A29FVM, BD87A34FVM, BD87A41FVM and
BD99A41F are watchdog timer reset ICs. It delivers a
high precision detection voltage of 1.5% and a
super-low current consumption of 5 µA (Typ.). It can be
used in a wide range of electronic devices to monitor
power supply voltages and in system operation to
prevent runaway operation.
●Key Specifications
 RESET power supply voltage range:
1.0V to 10V
 WDT power supply voltage range:
2.5V to 10V
 High precision detection voltage:
(Ta = 25℃)
1.5%
(Ta = −40℃ to 105℃)
2.5%
 Super-low current consumption:
5μA(Typ.)
 Operating temperature range:
-40℃ to +105℃
●Packages
 MSOP8
●Features
 Built-in watchdog timer
 Reset delay time can be set with the CT pin's
external capacitance
 Watchdog timer monitor time and reset time can be
set with the CTW pin's external capacitance.
 Output circuit type: N-channel open drain
●Applications
All devices using microcontrollers or DSP, including
vehicle equipment, displays, servers, DVD players,
and telephone systems
 SOP8
W (Typ.) x D (Typ.) x H (Max.)
2.90mm x 4.00mm x 0.90mm
5.00mm x 6.20mm x 1.71mm
●Ordering Information
B
D
3
7
A
1
9
F
V
M
-
TR
Part Number
Detection Voltage
Package
Packaging and forming specification
37A：WDT H Active
87A：WDT L Active
99A：WDT H Active
19：1.9V
28：2.8V
29：2.9V
34：3.4V
41：4.1V
FVM : MSOP8
F
: SOP8
TR: Embossed tape and reel
E2: Embossed tape and reel
●Lineup
Detection voltage (Typ.)
INH logic
1.9V
H: Active
MSOP8
Reel of 3000
BD37A19FVM-TR
4.1V
H: Active
MSOP8
Reel of 3000
BD37A41FVM-TR
2.8V
L: Active
MSOP8
Reel of 3000
BD87A28FVM-TR
2.9V
L: Active
MSOP8
Reel of 3000
BD87A29FVM-TR
3.4V
L: Active
MSOP8
Reel of 3000
BD87A34FVM-TR
4.1V
L: Active
MSOP8
Reel of 3000
BD87A41FVM-TR
4.1V
H: Active
SOP8
Reel of 2500
BD99A41F-E2
○Product structure：Silicon monolithic integrated circuit
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
Package
Orderable
Part Number
○This product has not designed protection against radioactive rays
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25.Apr.2013 Rev.002
BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
●Pin Configurations
MSOP8
(TOP VIEW)
8 7 6 5
SOP8
(TOP VIEW)
8 7 6 5
1 2 3 4
1
2
3
4
Figure 1. Pin Configurations
●Pin Descriptions
BD87AxxFVM / BD99A41F
BD37AxxFVM
No.
Pin
name
1
CLK
2
CT
3
No.
Pin
name
Function
Clock input from microcontroller
1
CTW
WDT time setting capacitor connection pin
Reset delay time setting capacitor
connection pin
2
CT
CTW
WDT time setting capacitor connection pin
3
CLK
Clock input from microcontroller
4
VDD
Power supply pin
4
GND
GND pin
5
N.C.
NC pin
5
VDD
Power supply pin
6
GND
GND pin
6
INH
WDT ON/OFF setting pin
INH=H/L:WDT=OFF/ON(BD87AxxFVM)
INH=H/L:WDT=ON/OFF(BD99A41F)
7
INH
WDT ON/OFF setting pin
INH=H/L:WDT=ON/OFF
7
N.C.
NC pin
8
Function
RESET Reset output pin
Reset delay time setting capacitor
connection pin
8 RESET Reset output pin
●Block Diagrams
BD37AxxFVM
BD87AxxFVM / BD99A41F
VDD
VDD
RESET
RESET
8
CLK
8
CTW
1
1
R
R
+
S
Q
+
Vref
S
Q
Vref
2
N.C.
CT
INH
CT
7
2
7
VDD
Pulse
Generation
Circuit
CTW
+
R
3
+
VthH
VDD
S
+
CLK
GND
Q
Pulse
Generation
Circuit
VthL
4
+
VthH
S
Q
INH
6
VthL
GND
N.C.
VDD
R
3
6
VDD
4
5
5
CT pin capacitor: 470pF to 3.3µF
CTW pin capacitor: 0.001µF to 10µF
Figure 2.Block Diagrams
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BD37Axx Series
BD87Axx Series
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Power supply voltage
*1
CT pin voltage
CTW pin voltage
Datasheet
BD99A41F
Ratings
Unit
VDD
−0.3 to 10
V
VCT
−0.3 to VDD + 0.3
V
VCTW
−0.3 to VDD + 0.3
V
VRESET
−0.3 to VDD + 0.3
V
INH pin voltage
VINH
−0.3 to VDD + 0.3
V
CLK pin voltage
VCLK
−0.3 to VDD + 0.3
V
RESET pin voltage
*2
Power dissipation
470
Pd
mW
550*3
Operating ambient temperature
Topr
−40 to + 105
℃
Storage temperature
Tstg
−55 to + 125
℃
Tjmax
125
℃
Maximum junction temperature
*1 Do not exceed Pd.
*2 MSOP8 : Reduced by 4.70 mW/℃ over 25℃, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).
*3 SOP8 : Reduced by 5.50 mW/℃ over 25℃, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).
●Recommended Operating Ratings(Ta = −40℃ to 105℃)
Parameter
Symbol
Min.
RESET power supply voltage
WDT power supply voltage
Max.
Unit
VDD RESET
1.0
10
V
VDD WDT
2.5
10
V
●Electrical Characteristics
(Unless otherwise specified, Ta = −40℃ to 105℃, VDD = 5V)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
[Overall]
Total supply current 1
(during WDT operation)
Total supply current 2
(when WDT stopped)
IDD1
—
5
14
µA
INH : WDT ON Logic Input
CTW = 0.1µF
IDD2
—
5
14
µA
INH : WDT OFF Logic Input
Output leak current
Ileak
—
—
1
µA
VDD = VDS = 10V
Output current capacity
IOL
0.7
—
—
mA
VDD = 1.2V, VDS = 0.5V
1.9V Detect
VDET1
1.871
1.900
1.929
V
Ta = 25℃
2.8V Detect
VDET1
2.758
2.800
2.842
V
Ta = 25℃
2.9V Detect
VDET1
2.886
2.930
2.974
V
Ta = 25℃
3.4V Detect
VDET1
3.349
3.400
3.451
V
Ta = 25℃
4.1V Detect
VDET1
4.039
4.100
4.162
V
Ta = 25℃
1.9V Detect
VDET2
1.852
1.900
1.948
V
Ta = −40℃ to 105℃
2.8V Detect
VDET2
2.730
2.800
2.870
V
Ta = −40℃ to 105℃
2.9V Detect
VDET2
2.857
2.930
3.003
V
Ta = −40℃ to 105℃
3.4V Detect
VDET2
3.315
3.400
3.485
V
Ta = −40℃ to 105℃
4.1V Detect
VDET2
4.007
4.100
4.202
V
Ta = −40℃ to 105℃
1.9V Detect
Vrhys
VDET×0.03
VDET×0.13
VDET×0.19
V
Ta=−40℃～105℃
2.8V Detect
Vrhys
VDET×0.018 VDET×0.045 VDET×0.060
V
Ta=−40℃～105℃
2.9V Detect
Vrhys
VDET×0.02
VDET×0.05
VDET×0.06
V
Ta=−40℃～105℃
3.4V Detect
Vrhys
VDET×0.02
VDET×0.05
VDET×0.07
V
Ta=−40℃～105℃
4.1V Detect
Vrhys
VDET×0.018 VDET×0.035 VDET×0.050
V
Ta=−40℃～105℃
[RESET]
Detection
voltage 1
Detection
voltage 2
Hysteresis
width
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BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
●Electrical Characteristics - Continued
(Unless otherwise specified, Ta = −40℃ to 105℃, VDD = 5V)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
RESET transmission
delay time: low  high
TPLH
3.9
6.9
10.1
ms
CT = 0.001µF *1
When VDD = VDET 0.5V
Delay circuit resistance
Rrst
5.8
10.0
14.5
MΩ
VCT = GND
VCTH
VDD×0.3
VDD×0.45
VDD×0.6
V
RL = 470KΩ
ICT
150
—
—
µA
VDD = 1.50V, VCT = 0.5V
VOPL
1.0
—
—
V
VOL ≤ 0.4V, RL = 470KΩ
WDT monitor time
TwH
7.0
10.0
20.0
ms
CTW = 0.01µF *2
WDT reset time
TwL
2.4
3.3
7.0
ms
CTW = 0.01µF *3
Clock input pulse width
TWCLK
500
—
—
ns
CLK high threshold voltage
VCLKH
VDD × 0.8
—
VDD
V
CLK low threshold voltage
VCLKL
0
—
VDD × 0.3
V
INH high threshold voltage
VINHH
VDD × 0.8
—
VDD
V
INH low threshold voltage
VINHL
0
—
VDD × 0.3
V
CTW charge current
ICTWC
0.25
0.50
0.75
µA
VCTW = 0.2V
CTW discharge current
ICTWO
0.75
1.50
2.00
µA
VCTW = 0.8V
Delay pin threshold voltage
Delay pin output current
Min. operating voltage
[WDT]
*1
*2
*3
TPLH can be varied by changing the CT capacitance value.
TPLH (s)  0.69 × Rrst (MΩ) × CT (µF) Rrst = 10 MΩ (Typ.)
TwH can be varied by changing the CTW capacitance value.
TwH (s)  (0.5 × CTW (µF))/ICTWC (µA) ICTWC = 0.5 µA
TwL can be varied by changing the CTW capacitance value.
TwL (s)  (0.5 × CTW (µF))/ICTWO (µA) ICTWO = 1.5 µA
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(Typ.)
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BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
●Typical Performance Curves
(Unless otherwise specified, Ta = 25℃) : 4.1V Detection
10
10
CIRCUIT CURRENT: IDD [μA]
RESET VOLTAGE: VRESET [V] .
12
8
6
4
2
8
Ta=105℃
6
Ta=25℃
4
Ta=-40℃
2
0
0
0
2
4
6
8
0
10
4
6
8
10
SUPPLY VOLTAGE: VDD [V]
SUPPLY VOLTAGE: VDD [V]
Figure 3. Detection Voltage
Figure 4. Total Supply Current
2
400
CTW PIN CURRENT: ICTW [µA]
350
CT PIN CURRENT: ICT [μA] .
2
300
250
200
150
100
1.5
1
0.5
0
-0.5
50
-1
0
0
1
2
3
4
5
SUPPLY VOLTAGE: VDD [V]
Figure 5. Delay Pin Current vs Power Supply Voltage
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1
2
3
4
CTW PIN VOLTAGE: VCTW [V]
Figure 6. CTW Charge Discharge Current
TSZ02201-0T2T0AN00130-1-2
25.Apr.2013 Rev.002
5
BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
●Typical Performance Curves – continued
(Unless otherwise specified, Ta = 25℃) : 4.1V Detection
10000
OUTPUT DELAY TIME: TPLH [ms] .
RESET CURRENT: IRESET [mA]
2
Ta=105℃
1.5
1
Ta=25℃
Ta=-40℃
0.5
1000
100
10
1
0.0001
0
0
2
4
6
8
10
5
DETECTION VOLTAGE: VDET [V]
10000
WDT RESET TIME: Tw [ms]
0.1
Figure 8. T RESET Transmission
Delay Time vs Capacitance
Figure 7. Output Current
1000
Moniter Time
10
Reset Time
1
0.1
0.001
0.01
CT PIN CAPACITY: CT [µF]
RESET VOLTAGE: VRESET [V]
100
0.001
4.75
4.5
L→H
4.25
4
H→L
3.75
3.5
0.01
0.1
1
10
-40
0
40
80
CTW PIN CAPACITY: CTW [V]
AMBIENT TEMPERATURE: Ta [℃]
Figure 9. WDT Time vs Capacitance
Figure 10. Detection Voltage vs Temperature
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BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
●Typical Performance Curves – continued
(Unless otherwise specified, Ta = 25℃) : 4.1V Detection
OUTPUT DELAY RESISTANCE: Rrst [MΩ]
OPERATING VOLTAGE: VOPL [V]
1
0.75
0.5
0.25
0
-40
0
40
13
12
11
10
9
8
80
-40
AMBIENT TEMPERATURE: Ta [℃]
40
80
AMBIENT TEMPERATURE: Ta [℃]
Figure 11. Operating Marginal Voltage
vs Temperature
Figure 12. CT Pin Circuit Resistance
vs Temperature
10
15
9
12
WDT RESET TIME: Tw [ms]
OUTPUT DELAY TIME: TPLH [ms]
0
8
7
6
9
6
3
0
5
-40
0
40
-40
80
40
80
AMBIENT TEMPERATURE: Ta [℃]
AMBIENT TEMPERATURE: Ta [℃]
Figure 13. RESET Transmission Delay Time
vs Temperature
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Figure 14. WDT Time vs Temperature
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BD37Axx Series
BD87Axx Series
●Timing chart
VDD
Datasheet
BD99A41F
VDETH
VDET
VDETH=VDET+Vrhys
WDT circuit turns off when INH is low
0
INH
(BD37AxxFVM／BD99A41F)
0
WDT circuit turns off when INH is high
INH
(BD87AxxFVM)
0
CLK
0
*4 TWCLK TWCLK
VCT VCTH
0
VCTW
VthH
VthL
0
*2
*1
*3
TWH
TWL
TPLH
RESET
0
①②③
④⑤
④⑤ ⑥
⑦
⑦
④ ⑤⑧
⑨
④ ⑤⑩
②③
④ ⑤ ⑩ ②③
④ ⑤⑩ ⑪
Figure 15. Timing Chart
●Explanation
① The RESET pin voltage (RESET) switches to low when the power supply voltage (VDD) falls to 0.8 V.
②
The external capacitor connected to the CT pin begins to charge when VDD rises above the reset detection voltage
(VDETH). The RESET signal stays low until VDD reaches the VDETH voltage and switches to high when VDD reaches
or exceeds the VDETH voltage. The RESET transmission delay time TPLH allowed to elapse before RESET switches
from low to high is given by the following equation:
TPLH (s)  0.69 × Rrst × CT (µF)   [1]
Rrst denotes the IC's built-in resistance and is designed to be 10 MΩ (Typ.). CT denotes the external capacitor
connected to the CT pin.
③
The external capacitor connected to the CTW pin begins to charge when RESET rises, triggering the watchdog timer.
④ The CTW pin state switches from charge to discharge when the CTW pin voltage (VCTW) reaches VthH, and RESET
switches from high to low. The watchdog timer monitor time TWH is given by the following equation:
TWH (s)  (0.5 × CTW (µF))/(ICTWC)   [2]
ICTWC denotes the CTW charge current and is designed to be 0.50 µA (Typ.). CTW denotes the external capacitor
connected to the CTW pin.
⑤
The CTW pin state switches from charge to discharge when VCTW reaches VthL, and RESET switches from low to
high. The watchdog timer reset time TWL is given by the following equation:
TWL (s)  (0.5 × CTW (µF))/(ICTWO)   [3]
ICTWO denotes the CTW discharge current and is designed to be 1.50 µA (Typ.).
⑥ The CTW pin state may not switch from charge to discharge when the CLK input pulse width TWCLK is short. Use a
TWCLK input pulse width of at least 500 ns.
TWCLK ≥ 500 ns (Min.)
⑦ When a pulse (positive edge trigger) of at least 500 ns is input to the CLK pin while the CTW pin is charging, the CTW
state switches from charge to discharge. Once it discharges to VthL, it will charge again.
⑧ Watchdog timer operation is forced off when the INH pin switches to low (L: BD37Axx Series. BD99A41F, H:
BD87AxxSeries). At that time, only the watchdog timer is turned off. Reset detection is performed normally.
⑨
The watchdog timer function turns on when the INH pin switches to high(H: BD37Axx Series. BD99A41F, L:
BD87AxxSeries). The external capacitor connected to the CTW pin begins to charge at that time.
⑩
RESET switches from high to low when VDD falls to the RESET detection voltage (VDET) or lower.
⑪
When VDD falls to 0 V, the RESET signal stays low until VDD reaches 0.8 V.
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BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
●Power Dissipation
MSOP8
SOP8
800
800
When mounted on a glass epoxy board
(70 mm  70 mm  1.6mm) ja = 181.8 (°C /W)
POWER DISSIPATION: Pd [mW]
POWER DISSIPATION: Pd [mW]
When mounted on a glass epoxy board
(70 mm  70 mm  1.6mm) ja = 212.8 (°C /W)
600
470mW
400
200
105℃
0
600
550mW
400
200
105℃
0
0
25
50
75
100
125
0
AMBIENT TEMPERATURE: Ta [℃]
25
50
75
100
125
AMBIENT TEMPERATURE: Ta [℃]
Figure 16. Power Dissipation
●I/O equivalence circuit
CLK
INH
CT
VDD
VDD
VDD
VDD
10MΩ(Typ.)
INH
CLK
CTW
VDD
CT
RESET
VDD
RESET
CTW
Figure 17. I/O equivalence circuit
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BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
●External settings for pins and precautions
1) Connect a capacitor (0.001 µF to 1,000 µF) between the VDD and GND pins when the power line impedance is high. Use
of the IC when the power line impedance is high may result in oscillation.
2) External capacitance
A capacitor must be connected to the CTW pin. When using a large capacitor such as 1 µF, the INH pin must allow a
CTW discharge time of at least 2 ms. The power-on reset time is given by equation [1] on page 8. The WDT time is given
by equations [2] and [3] on page 8. The setting times are proportional to the capacitance value from the equations, so the
maximum and minimum setting times can be calculated from the electrical characteristics according to the capacitance.
Note however that the electrical characteristics do not include the external capacitor's temperature characteristics.
●Operational Notes
1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If
any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.
2) GND voltage
The potential of GND pin must be minimum potential in all operating conditions.
3) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
4) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
5) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
6) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
7) Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic
diode or transistor. For example, the relation between each potential is as follows:
○When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
○When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
Transistor (NPN)
B
Resistor
(Pin A)
(Pin B)
C
(Pin B)
E
B
C
E
P
P+
P+
P
P+
N
N
N
GND
P+
N
N
P
Parasitic element or
transistor
N
P substrate
(Pin A)
Parasitic element
GND
Parasitic element
or transistor
GND
Parasitic element
Figure 18. Example of IC structure
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BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
8) Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external components, either.
9) Applications or inspection processes with modes where the potentials of the VDD pin and other pins may be reversed
from their normal states may cause damage to the IC’s internal circuitry or elements. Use an output pin capacitance of
1000 µF or lower in case VDD is shorted with the GND pin while the external capacitor is charged. It is recommended to
insert a diode for preventing back current flow in series with VDD or bypass diodes between Vcc and each pin.
Back current prevention diode
Bypass diode
VDD
Pin
Figure 19.
10) When VDD falls below the operating marginal voltage, output will be open. When output is being pulled up to input,
output will be equivalent to VDD.
11) Input pin
The CLK and INH pins comprise inverter gates and should not be left open. (These pins should be either pulled up or
down.) Input to the CLK pin is detected using a positive edge trigger and does not affect the CLK signal duty. Input the
trigger to the CLK pin within the TWH time.
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/15
TSZ02201-0T2T0AN00130-1-2
25.Apr.2013 Rev.002
BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
●Physical Dimension, Tape and Reel Information
Package Name
MSOP8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1pin
Direction of feed
Reel
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
∗ Order quantity needs to be multiple of the minimum quantity.
12/15
TSZ02201-0T2T0AN00130-1-2
25.Apr.2013 Rev.002
BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
●Physical Dimension, Tape and Reel Information – continued
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
)
∗ Order quantity needs to be multiple of the minimum quantity.
13/15
TSZ02201-0T2T0AN00130-1-2
25.Apr.2013 Rev.002
BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
●Marking Diagrams
MSOP8(TOP VIEW)
SOP8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
Part Number Marking
Package
Part Number
D3719
MSOP8
Reel of 3000
BD37A19FVM-TR
D3741
MSOP8
Reel of 3000
BD37A41FVM-TR
D8728
MSOP8
Reel of 3000
BD87A28FVM-TR
D8729
MSOP8
Reel of 3000
BD87A29FVM-TR
D8734
MSOP8
Reel of 3000
BD87A34FVM-TR
D8741
MSOP8
Reel of 3000
BD87A41FVM-TR
99A41
SOP8
Reel of 2500
BD99A41F-E2
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/15
TSZ02201-0T2T0AN00130-1-2
25.Apr.2013 Rev.002
BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
●Revision History
Date
Revision
12.Apr.2013
001
25.Apr.2013
002
Changes
New Release
P.8 Explanation ⑨ modified.
P.9 Figure 17. I/O equivalence circuit the error in writing of the part of CLK was corrected.
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/15
TSZ02201-0T2T0AN00130-1-2
25.Apr.2013 Rev.002
Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.