APX823/APX824/APX825A

APX823/APX824/APX825A
PROCESSOR SUPERVISORY CIRCUITS
Description
Pin Assignments
The APX823/APX824/APX825A family of supervisors
provides circuit initialization and timing supervision, primarily
for DSP and processor-based systems.
(Top View)
RESET
During power-on, RESET is asserted when supply voltage
VCC becomes higher than 1.1V. Thereafter, the supply
voltage supervisor monitors VCC and keeps RESET active as
long as VCC remains below the threshold voltage VTH-. An
internal timer delays the return of the output to the inactive
state (high) to ensure proper system reset. The delay time, td
starts after VCC has risen above the threshold voltage VTH-.
When the supply voltage drops below the threshold voltage
VTH-, the output becomes active (low) again. No external
components are required. All the devices of this family have a
fixed-sense threshold voltage VTH- set by an internal voltage
divider.
GND 2
MR
GND 2
•
•
•
Note:
4 WDI
SOT25
(Top View)
6 VCC
RESET 1
GND 2
APX825A
RESET 3
5 WDI
4 MR
SOT26
•
•
APX824
RESET 3
•
•
5 VCC
RESET 1
Applications
•
4 WDI
(Top View)
Features
•
3
In applications where the input to the WDI pin may be active
(transitioning high and low) when the APX823/APX824/APX8
25A asserting RESET the APX823/APX824/APX825A does
not return to a non-reset state when the input voltage is
above Vt. The product spectrum is designed for supply
voltage of 2.5V, 3V, 3.3V and 5V. The circuits are available in
a
SOT25
and
SOT26
packages.
The
APX823/APX824/APX825A devices are characterized for
o
o
operation over a temperature range of -40 C to 105 C.
•
APX823
SOT25
The APX823/APX825A devices incorporate a manual reset
input, MR . A low level at MR causes RESET to become
active. The APX824/APX825A devices include a high-level
output RESET. APX823/APX824/APX825A have a watchdog
timer that is periodically triggered by a positive or negative
transition at WDI. When the supervising system fails to
retrigger the watchdog circuit within the time-out interval,
ttout, RESET becomes active for the time period td. This
event also reinitializes the watchdog timer. Leaving WDI
unconnected disables the watchdog.
Power-on reset generator with fixed delay time of 200ms
Typ
Manual reset input (APX823/APX825A)
Reset output available in active-low
(APX823/APX824/APX825A), active-high
(APX824/APX825A)
Supply voltage supervision range 2.5V, 3V, 3.3V, 5V
Watchdog timer
Supply current of 30μA (Typ.)
Temperature range: -40°C to 85°C
SOT25 and SOT26: Available in “Green” Molding
Compound (No Br, Sb)
Lead Free Finish/RoHS Compliant (Note 1)
5 VCC
1
•
•
•
•
•
•
•
Applications Using DSPs, Microcontrollers, or
Microprocessors
Industrial Equipment
Programmable Controls
Automotive Systems
Portable/Battery-Powered Equipment
Intelligent Instruments
Wireless Communications Systems
Notebook/Desktop Computers
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
APX823/APX824/APX825A
Document number: DS31323 Rev. 4 - 2
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APX823/APX824/APX825A
PROCESSOR SUPERVISORY CIRCUITS
Typical Application Circuit
VCC
CIN
100nF
VCC
RESET
RESET
APX8XX
MR
VCC
Microprocessor
WDI
I/O
GND
GND
Pin Descriptions
Pin Name
GND
RESET
Description
Ground
Reset output pin
(RESET)
VCC
Operating voltage input
WDI
Watchdog input
MR
Manual reset
Functional Block Diagram
APX823/APX824/APX825A
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APX823/APX824/APX825A
PROCESSOR SUPERVISORY CIRCUITS
Absolute Maximum Ratings (Over operating ambient temperature range, unless otherwise noted)*
Symbol
Parameter
ESD HBM Human Body Model ESD Protection
ESD MM Machine Model ESD Protection
VCC
VRESET
Supply Voltage
RESET, RESET , MR , WDI
ICC
Input Current VCC
IO
Maximum High Output Current
Derating Factor Above
TA = 25oC
o
PD
Continuous Total Power
Dissipation
TA = 25 C Power Rating
TA = 70oC Power Rating
TA = 85oC Power Rating
Rating
Unit
5
200
KV
V
6.0
V
-0.3 to (VCC+0.3)
V
20
mA
20
mA
SOT25
6.2
SOT26
5.8
SOT25
500
SOT26
470
SOT25
SOT26
SOT25
SOT26
220
210
125
120
mW/°C
mW
mW
mW
TOP
Operating Junction Temperature Range
-40 to 105
°C
TST
Storage Temperature Range
-65 to 150
°C
* Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolutemaximum-rated conditions for extended periods may affect device reliability.
Recommended Operating Conditions
Symbol
VCC
VIN
Parameter
Min
Supply Voltage
Input Voltage
Max
Unit
1.1
5.5
V
0
(VCC+0.3)
V
0.7 × VCC
-
V
VIH
High-level Input Voltage at MR and WDI
VIL
Low-level Voltage
-
0.3 × VCC
V
Input Transition Rise and Fall Rate at MR or WDI
-
100
ns/V
-40
85
-
100
Δt/ΔV
TA
Operating Ambient Temperature Range
TR
VCC Rising Time (VCC = 0~VT)
APX823/APX824/APX825A
Document number: DS31323 Rev. 4 - 2
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C
V/ uS
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APX823/APX824/APX825A
PROCESSOR SUPERVISORY CIRCUITS
Electrical Characteristics (Over recommended operating ambient temperature range, unless otherwise noted)
Symbol
VOH
Parameter
Test Conditions
APX823/APX824/APX825A 29/26/23
VCC= VTH-+0.2V
APX823/APX824/APX825A RESET 40/31
VCC= VTH-+0.2V
High-level
Output Voltage
RESET
VCC= VTH-+0.2V
APX824/APX825A
-29/26/23
VCC > 1.8V,
APX824/APX825A 46/44/40/31
VCC > 1.8V,
APX824/APX825A
-29/26/23
VCC= VTH-+0.2V
APX824/APX825A -46/44
Low-level
Output Voltage
Note:
Unit
0.8 ×VCC
-
-
V
VCC-1.5V
-
-
V
0.8 ×VCC
-
-
V
-
-
0.4
V
-
-
0.4
V
-
-
0.4
V
2.21
2.25
2.30
2.59
2.88
3.02
3.93
4.31
4.56
2.20
2.63
2.93
3.08
4.00
4.38
4.63
2.25
2.69
3.00
3.15
4.08
4.47
4.72
2.30
2.57
2.86
3.00
3.92
4.29
4.54
2.63
2.93
3.08
4.00
4.38
4.63
2.69
3.00
3.15
4.08
4.47
4.72
IOL=1mA
VCC= VTH-+0.2V
IOL=1.2mA
VCC= VTH-+0.2V
IOL=3mA
VCC= VTH--0.2V
IOL=1mA
IOL=1.2mA
VCC= VTH--0.2V
IOL=3mA
VCC > 1.1V,
IOL=20μA
APX823/APX824/APX825A -23
APX823/APX824/APX825A -26
APX823/APX824/APX825A -29
APX823/APX824/APX825A -31
APX823/APX824/APX825A -40
APX823/APX824/APX825A -44
APX823/APX824/APX825A -46
APX823/APX824/APX825A -23
APX823/APX824/APX825A -26
APX823/APX824/APX825A -29
APX823/APX824/APX825A -31
APX823/APX824/APX825A -40
APX823/APX824/APX825A -44
APX823/APX824/APX825A -46
Max
IOH = -150μA
APX823/APX824/APX825A -
VRESET Power-up Reset Voltage (see Note 2)
VTH-
IOH = -100μA
VCC= VTH--0.2V
APX823/APX824/APX825A 46/44
Negative-going
Input Threshold
Voltage
(see Note 3)
IOH=-120μA
APX823/APX824/APX825A 29/26/23
RESET 40/31
Typ.
IOH=-30μA
APX823/APX824/APX825A
–46/44
RESET APX824/APX825A -40/31
VOL
IOH=-20μA
Min
o
o
TA = 0 C -85 C
o
o
TA= -40 C -85 C
V
V
2. The lowest supply voltage at which RESET becomes active. TR , VCC > 15μs/V.
3. To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1μF) should be placed near the supply terminals.
APX823/APX824/APX825A
Document number: DS31323 Rev. 4 - 2
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APX823/APX824/APX825A
PROCESSOR SUPERVISORY CIRCUITS
Electrical Characteristics (cont.)
Symbol
Parameter
Test Conditions
Min
Typ.
Max
-
50
-
Unit
APX823/APX824/APX825A -23
Vhys
TS
APX823/APX824/APX825A -26
APX823/APX824/APX825A -29
APX823/APX824/APX825A -31
APX823/APX824/APX825A -40
APX823/APX824/APX825A -44
APX823/APX824/APX825A -46
Hysteresis at VCC
Input
Set-up Time
IIH(AV)
Average Highlevel Input
Current
IIL(AV)
Average Lowlevel Input
Current
mV
-
VCC = VTH to (VTH – 100mV)
WDI
50
μs
20
WDI=VCC,
Time average
(dc=88%)
-
120
-
μA
WDI=0.3V,
VCC=5.5V time
average (dc=12%)
-
-15
-
μA
IIH
High-level Input
Current
WDI
WDI=VCC
-
120
160
μA
IIL
Low-level Input
Current
WDI
WDI=0.3V,
VCC=5.5V
-
120
160
μA
ICC
Supply Current
WDI and MR
Unconnected, Outputs
unconnected
VCC = VTH-+0.2V
-
30
40
μA
-
60
-
kΩ
50
-
o
ppm/ C
5
-
pF
Internal Pull-up Resistor at MR
TC
VOUT Temperature Coefficient
Ci
Input Capacitance at MR , WDI
θJA
Thermal Resistance Junction-to-Ambient
θJC
Thermal Resistance Junction-to-Case
Note:
VI = 0V to 5.5V
SOT25
SOT26
SOT25
SOT26
(Note 4)
(Note 4)
(Note 4)
(Note 4)
-
161
169
27
28
o
C/W
o
C/W
4. Test condition for SOT25 and SOT26: Devices mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
APX823/APX824/APX825A
Document number: DS31323 Rev. 4 - 2
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APX823/APX824/APX825A
PROCESSOR SUPERVISORY CIRCUITS
Timing Requirements (@ RL = 1mΩ, CL = 50pF, TA = 25°C)
Symbol
tW
Parameter
Pulse Width
at MR
at WDI
Test Conditions
Min
Typ.
Max
Unit
VCC> VTH-+0.2V, VIL=0.3 × VCC, VIH=0.7 × VCC
100
-
-
ns
VCC> VTH-+0.2V, VIL=0.3 × VCC, VIH=0.7 × VCC
50
-
-
ns
Switching Characteristics (@ RL = 1mΩ, CL = 50pF, TA = 25°C)
Symbol
ttout
td
Parameter
Test Conditions
Watchdog Time Out
APX823/APX824/APX825A
VCC> VTH-+0.2V,
See timing diagram
Delay Time
APX823/APX824/APX825A
VCC> VTH-+0.2V,
See timing diagram
Propagation (Delay)
delay (APX823/APX825A)
Time, High-to-low-level
Output
VCC to RESET delay
MR to RESET delay
tPLH
Propagation (Delay)
(APX824/APX825A)
Time, Low-to-high-level
Output
VCC to RESET delay
(APX824/APX825A)
APX823/APX824/APX825A
Document number: DS31323 Rev. 4 - 2
Typ.
Max
Unit
1.12
1.6
2.4
s
140
200
280
ms
-
-
0.1
μs
-
-
25
μs
-
-
0.1
μs
-
-
25
μs
VCC> VTH-+0.2V,
MR to RESET
tPHL
Min
VIL=0.3 × VCC,
VIH=0.7 × VCC
VIL= VTH--0.2V,
VIH= VTH-+0.2V
VCC> VTH-+0.2V,
VIL=0.3 × VCC,
VIH=0.7 × VCC
VIL= VTH--0.2V,
VIH= VTH-+0.2V
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APX823/APX824/APX825A
PROCESSOR SUPERVISORY CIRCUITS
Timing Diagram
RESET vs Vcc Timing Diagram
Vth
Vcc
Vth
td
td
td
td
/RESET
Vth
RESET
RESET vs /MR Timing Diagram
Vth
Vcc
/MR
td
td
/RESET
RESET vs WDI Timing Diagram
Vth
Vcc
WDI
td
tWD
td
tWD
td
/RESET
APX823/APX824/APX825A
Document number: DS31323 Rev. 4 - 2
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Typical Characteristics
RESET Threshold Voltage vs. Temperature
RESET Timeout Period vs. Temperature
3.2
RESET Thershold Voltage (V)
RESET Timeout Period (mS)
250
240
230
220
210
200
190
180
170
160
150
-40℃ -25℃
0℃
25℃
50℃
3.15
3.1
3.05
3
2.95
2.9
2.85
2.8
85℃ 105℃ 125℃
-40℃
Temperature
0℃
25℃
50℃
85℃
105℃ 125℃
Temperature
Supply Curreny vs. Vcc
Vcc Supply Current vs. Temperature
(Vcc=3.3V Vth=2.93V)
35
40
34
35
Supply Current (uA)
Vcc Supply Current (uA)
-25℃
33
32
31
30
29
28
27
30
25
20
15
10
5
26
0
25
-40℃
-25℃
0℃
25℃
50℃
85℃
105℃ 125℃
Document number: DS31323 Rev. 4 - 2
2.5V
3.3V
4.0V
5.0V
5.5V
Vcc
Temperature
APX823/APX824/APX825A
1.5V
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Ordering Information
APX82 XX - XX XX G - 7
Part No.
Voltage
Package
Green
Packing
3 : APX823
4 : APX824
5A : APX825A
46 : 4.63
44 : 4.38
40 : 4.00
31 : 3.08
29 : 2.93
26 : 2.63
23 : 2.25
W5 : SOT25
W6 : SOT26
G : Green
7 : Tape & Reel
Device
Packaging
(Note 5)
Quantity
W5
W5
W6
SOT25
SOT25
SOT26
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
APX823-XXW5G-7
APX824-XXW5G-7
APX825A-XXW6G-7
Notes:
7” Tape and Reel
Part Number Suffix
Package Code
-7
-7
-7
5. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
Marking Information
(1) SOT25
( Top View )
4
7
5
XX Y W X
1
2
3
XX : Identification code
Y : Year 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Green
(2) SOT26
( Top View )
4
7
5
7
6
XX Y W X
1
APX823/APX824/APX825A
Document number: DS31323 Rev. 4 - 2
2
3
XX : Identification code
Y : Year 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Green
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Marking Information (cont.)
Marking Table
Device
Package Type
Identification Code
APX823-46W5
SOT25
W1
APX823-44W5
SOT25
W2
APX823-40W5
SOT25
W3
APX823-31W5
SOT25
W4
APX823-29W5
SOT25
W5
APX823-26W5
SOT25
W6
APX823-23W5
SOT25
W7
APX824-46W5
SOT25
T2
APX824-44W5
SOT25
T3
APX824-40W5
SOT25
T4
APX824-31W5
SOT25
T5
APX824-29W5
SOT25
T6
APX824-26W5
SOT25
T7
APX824-23W5
SOT25
T8
APX825A-46W6
SOT26
T9
APX825A-44W6
SOT26
TA
APX825A-40W6
SOT26
TB
APX825A-31W6
SOT26
TC
APX825A-29W6
SOT26
TD
APX825A-26W6
SOT26
TE
APX825A-23W6
SOT26
TF
Package Outline Dimensions (All Dimensions in mm)
(1) Package Type: SOT25
APX823/APX824/APX825A
Document number: DS31323 Rev. 4 - 2
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PROCESSOR SUPERVISORY CIRCUITS
Package Outline Dimensions (cont.) (All Dimensions in mm)
(2) Package Type: SOT26
Notes:
6. Package outline dimensions as shown on Diodes Inc. package outline dimensions document AP02002, which can be found on our website at
http://www.diodes.com/datasheets/ap02002.pdf
APX823/APX824/APX825A
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS
DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A
PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability
arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any
license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described
herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies
whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized
sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names
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LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without
the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided
in the labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected
to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or
systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements
concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems,
notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further,
Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes
Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
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Document number: DS31323 Rev. 4 - 2
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