BD1926 Dual Band 2-Way SMT Power Divider 1700~2300MHz PCS, WCDMA & TD-SCDMA Device Features Typical Isolation = 24.5 dB Typical Insertion Loss = 0.6 dB MSL 3 moisture rating Small Size and Low Profile Lead-free/RoHS-compliant SOT-26 Plastic Package BD19XX(XX=Wafer number) Product Description Typical Performance1 BeRex’s Divider BD1926 is designed for PCS, WCDMA & TD-SCDMA band with low Insertion Loss and Isolation. This chip is fully passivated for enhanced performance and reliability and packaged in RoHS-compliant with SOT-26 surface mount package. Parameter Min Frequency Range Insertion Loss 1700 Isolation 16.5 Typical 0.6 Max Unit 2300 0.8 MHz dB 24.5 dB IRL(S11) -16.0 -11.5 dBm ORL(S22/S33) Amplitude Balance Phase Balance -24.0 0.07 1.5 -19.5 0.2 2.0 dBm dB deg *All specifications apply to the following test conditions, 1. Device performance _ measured on BeRex E/B at 25°C, 50ohm system. 2. Insertion Loss: Above 3.0dB. Applications Absolute Maximum Ratings Base station Infrastructure Commercial/Industrial/Military wireless system Parameter Input Power Storage Temperature Operating Temperature Rating 1W CW dBm -55 to +155°C -40 to +85°C Operation of this device above any of these parameters may result in permanent damage. Evaluation Board Drawing Function Block Diagram Pins 2,4 and 6 must be DC and RF grounded. BeRex ●website: www.berex.com ●email: [email protected] 1 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. D BD1926 Dual Band 2-Way SMT Power Divider 1700~2300MHz PCS, WCDMA & TD-SCDMA Typical Test Data BeRex Parameters Unit PCS, WCDMA & TD-SCDMA Frequency Range MHz 1700 1800 1900 2075 2250 Insertion Loss dB 0.51 0.51 0.55 0.63 0.76 Isolation dB 20.1 22.5 24.8 21.6 16.8 IRL(S11) dB -17.4 -17.1 -16.3 -14.1 -11.9 ORL(S22,S33) dB -24.9 -25.0 -24.4 -22.7 -19.9 Phase Diff. deg 1.4 1.5 1.5 1.5 1.4 Amplitude Balance dB 0.04 0.07 0.07 0.06 0.04 Insertion Loss vs. Frequency Isolation vs. Frequency IRL vs. Frequency ORL vs. Frequency ●website: www.berex.com ●email: [email protected] 2 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. D BD1926 Dual Band 2-Way SMT Power Divider 1700~2300MHz PCS, WCDMA & TD-SCDMA Package Outline Drawing Suggested PCB Land Pattern and PAD Layout PCB Land Pattern PCB Mounting Ø0.8 2.3 0.4 0.9 0.65 2.2 Ø0.8 Note : All dimension _ millimeters PCB lay out _ on BeRex website BeRex ●website: www.berex.com ●email: [email protected] 3 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. D BD1926 Dual Band 2-Way SMT Power Divider 1700~2300MHz PCS, WCDMA & TD-SCDMA Package Marking XX = Wafer No. Tape & Reel SOT-26 Packaging information: Tape Width (mm): 8 Reel Size (inches): 7 Device Cavity Pitch (mm): 4 Devices Per Reel: 3000 Lead plating finish 100% Tin Matte finish (All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin whisker growth concerns.) MSL / ESD Rating MSL Rating: Level 3 at +265°C convection reflow Standard: JEDEC Standard J-STD-020 NATO CAGE code: 2 BeRex N 9 6 F ●website: www.berex.com ●email: [email protected] 4 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. D