C - ON Semiconductor

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−8
CASE 948S−01
ISSUE C
DATE 20 JUN 2008
SCALE 2:1
K REF
8x
0.20 (0.008) T U
0.10 (0.004)
S
2X
L/2
8
0.20 (0.008) T U
T U
B
−U−
1
J J1
4
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
S
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
K1
K
A
−V−
S
S
5
L
PIN 1
IDENT
M
SECTION N−N
−W−
C
0.076 (0.003)
D
−T− SEATING
DETAIL E
G
PLANE
0.25 (0.010)
N
M
DIM
A
B
C
D
F
G
J
J1
K
K1
L
M
N
F
MILLIMETERS
MIN
MAX
2.90
3.10
4.30
4.50
--1.10
0.05
0.15
0.50
0.70
0.65 BSC
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.114
0.122
0.169
0.177
--0.043
0.002
0.006
0.020
0.028
0.026 BSC
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
GENERIC
MARKING DIAGRAM*
XXX
YWW
AG
G
DETAIL E
XXX
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
STATUS:
98AON00697D
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
TSSOP−8
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON00697D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION.
18 APR 2000
A
ADDED MARKING DIAGRAM INFORMATION. REQ. BY V. BASS.
13 JAN 2006
B
CORRECTED MARKING DIAGRAM PIN 1 LOCATION AND MARKING. REQ. BY C.
REBELLO.
13 MAR 2006
C
REMOVED EXPOSED PAD VIEW AND DIMENSIONS P AND P1. CORRECTED
MARKING INFORMATION. REQ. BY C. REBELLO.
20 JUN 2008
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2008
June, 2008 − Rev. 01C
Case Outline Number:
948S