Standard Variable Output LDO Regulators 2A Standard Variable Output LDO Regulator BD00D0AWHFP No.11023EBT04 ●Description The BD00D0AWHFP is low-saturation regulator. The output voltage can be arbitrarily configured using the external resistance. This IC has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a thermal shutdown circuit that protects the IC from thermal damage due to overloading. ●Features 1) Output Current : 2A 2) High Output Voltage Precision : ±1% 3) Low saturation with PDMOS output 4) Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits 5) Built-in thermal shutdown circuit for protecting the IC from thermal damage due to overloading 6) Low ESR Capacitor 7) HRP5 packaging ●Applications Audiovisual equipments, FPDs, televisions, personal computers or any other consumer device ●Absolute maximum ratings (Ta=25℃) Parameter Symbol Ratings Unit Vcc -0.3～+35.0 V VCTL -0.3～+35.0 V Pd 1.6 W Operating Temperature Range Topr -40～+105 ℃ Storage Temperature Range Tstg -55～+150 ℃ Tjmax +150 ℃ Supply Voltage *1 Output Control Voltage Power Dissipation *2 Maximum Junction Temperature *1 Not to exceed Pd. *2 HRP5: Reduced by 12.8mW / ℃ over Ta = 25℃, when mounted on glass epoxy board: 70mm×70mm×1.6mm. NOTE: This product is not designed for protection against radioactive rays. ●Operating conditions (Ta=25℃) Parameter Symbol Min. Max. Unit Supply Voltage Vcc 4.0 25.0 V Output Control Voltage VCTL 0 25.0 V Output Current Io 0 2.0 A Output Voltage Vo 3.0 15.0 V www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/11 2011.03 - Rev.A Technical Note BD00D0AWHFP ●Electrical characteristics (Unless otherwise specified, Ta=25℃, Vcc=10V,VCTL=5V,Io=0mA,Vo=5.0Vsetting) (The resistor of between ADJ and Vo =56.7kΩ,ADJ and GND =10kΩ) Parameter Symbol Min Typ Max Unit Shut Down Current Isd － 0 10 µA Bias Current Ib － 0.5 1.0 mA ADJ Terminal Voltage VADJ 0.742 0.750 0.758 V Io=50mA Dropout Voltage ΔVd － 0.40 0.55 V Vcc=Vo×0.95, Io=1A Ripple Rejection R.R. 45 55 － dB 1 f=120Hz,ein※ =1Vrms, Io=100mA Line Regulation Reg.I － 20 60 mV Vcc=6→25V Load Regulation Reg.L － V Io=5mA→1A Tcvo.1 － +0.04 － %/℃ Io=5mA,Tj=-40～-20℃ Tcvo.2 － ±0.005 － %/℃ Io=5mA,Tj=-20～+105℃ CTL ON Mode Voltage VthH 2.0 － － V ACTIVE MODE CTL OFF Mode Voltage VthL － － 0.8 V OFF MODE CTL Bias Current ICTL － 25 50 µA Temperature Coefficient of Output Voltage *1 Vo×0.007 Vo×0.014 Conditions VCTL=0V ein : Input Voltage Ripple www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/11 2011.03 - Rev.A Technical Note BD00D0AWHFP ●Electrical characteristic curves (Reference data) (Unless otherwise specified, Ta=25℃, Vcc=10V,VCTL=5V,Io=0mA,Vo=5.0Vsetting) (The resistor of between ADJ and Vo =56.7kΩ,ADJ and GND =10kΩ) STANBY CURRENT : Isd [µA] 0.8 CIRCUIT CURRENT: Ib+I 0.6 0.4 0.2 18 6 15 5 OUTPUT VOLTAGE : Vo [V] FEEDBACK_R [mA] 1.0 12 9 6 3 0.0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 5 5 4 3 2 1 800 3 2 1 700 600 500 400 300 200 100 0 0 10 100 1000 10000 1.0 5 0.8 4 0.6 3 0.4 2 0.2 1 0 -40 0 100000 1000000 FREQUENCY: f [Hz] 0.0 -20 0 20 40 60 80 0 100 400 Fig.8 Output Voltage Temperature Characteristics Fig.7 Ripple Rejection 800 1200 1600 2000 OUTPUT CURRENT : Io [mA] AMBIENT TEMPERATURE : Ta [℃] 100 2000 CIRCUIT CURRENT：Ib+I FEEDBACK_R [mA] OUTPUT VOLTAGE : Vo [V] 70 10 400 800 1200 1600 OUTPUT CURRENT : Io [mA] Fig.6 Dropout Voltage (Vcc＝4.75V) (lo=0mA→2000mA) 6 80 20 0 600 1200 1800 2400 3000 OUTPUT CURRENT : Io [mA] Fig.5 Load Regulation Fig.4 Line Regulation (Io=1000mA) Fig.9 Circuit Current (IFEEDBACK_R≒75µA) 6 6 5 5 90 OUTPUT VOLTAGE : Vo [V] 80 70 60 50 40 30 20 OUTPUT VOLTAGE : Vo [V] RIPPLE REJECTION : R.R. [dB] Fig.3 Line Regulation (Io=0mA) 4 0 2 4 6 8 10 12 14 16 18 20 22 24 SUPPLY VOLTAGE : Vcc [V] CIRCUIT CURRENT : ICTL [μA] 0 2 4 6 8 10 12 14 16 18 20 22 24 SUPPLY VOLTAGE : Vcc [V] 0 0 30 1 6 8 10 12 14 16 18 20 22 24 SUPPLY VOLTAGE : Vcc [V] DROPOUT VOLTAGE : ΔVd [mV] 6 OUTPUT VOLTAGE : Vo [V] OUTPUT VOLTAGE : Vo [V] 6 40 2 Fig.2 Shut Down Current Fig.1 Circuit Current (IFEEDBACK_R≒75µA） 50 3 0 0 2 4 SUPPLY VOLTAGE: Vcc [V] 60 4 4 3 2 1 4 3 2 1 10 0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 CONTROL VOLTAGE : VＣＴＬ[V] Fig.10 CTL Voltage vs CTL Current www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 0 2 4 6 8 10 12 14 16 18 20 22 24 CONTROL VOLTAGE : VCTL [V] Fig.11 CTL Voltage vs Output Voltage 3/11 0 130 140 150 160 170 180 190 AMBIENT TEMPERATURE : Ta [℃] Fig.12 Thermal Shutdown Circuit Characteristics 2011.03 - Rev.A Technical Note BD00D0AWHFP ●Measurement Circuit for Reference Data A Vo Vcc Vo Vcc 56.7kΩ 56.7kΩ 1µF CTL GND 2.2µF ADJ CTL 10kΩ 5V Vo Vcc GND 56.7kΩ 1µF 2.2µF ADJ 10kΩ A CTL GND 2.2µF ADJ V 10kΩ 5V IFEEDBACK _R Measurement Circuit of Fig.2 Measurement Circuit of Fig.1 Measurement Circuit of Fig.3 V Vo Vcc Vo Vcc 56.7kΩ 2.2µF 1µF CTL GND 56.7kΩ 2.2µF 1µF ADJ CTL V GND ADJ 1µF ～ CTL GND CTL 56.7kΩ 1µF 2.2µF GND ADJ CTL V 2.2µF GND ADJ 10V 100mA 10kΩ 5V Vo Vcc 10V 10V A 10kΩ 56.7kΩ 1µF 2.2µF ADJ ADJ Measurement Circuit of Fig.6 Vo Vcc 56.7kΩ 1Vrms GND 5V Measurement Circuit of Fig.5 Vo Vcc 10kΩ 5V Measurement Circuit of Fig.4 CTL 4.75V 500mA 10kΩ 2.2µF 1µF A 10V 5V Vo Vcc 56.7kΩ 10kΩ 10kΩ 5V IFEEDBACK _R 5V A Measurement Circuit of Fig.7 Vo Vcc Vo Vcc 56.7kΩ 1µF A GND Vo Vcc 56.7kΩ 2.2µF CTL Measurement Circuit of Fig.9 Measurement Circuit of Fig.8 1µF ADJ 10V 56.7kΩ 2.2µF CTL GND ADJ 10kΩ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. CTL GND ADJ V 10V 10V Measurement Circuit of Fig.10 2.2µF 1µF V 10kΩ Measurement Circuit of Fig.11 4/11 5V 10kΩ Measurement Circuit of Fig.12 2011.03 - Rev.A Technical Note BD00D0AWHFP ●Block diagrams GND FIN － VREF VREF：Bandgap Reference OCP：Over Current Protection Circuit TSD：Thermal Shut Down Circuit Driver：Power Transistor Driver Driver + OCP TSD 1 2 3 4 5 CTL Vcc GND Vo ADJ Fig.13 Pin No. Pin Name 1 CTL Function Output Control Pin 2 Vcc Power Supply Pin 3 GND GND 4 Vo 5 ADJ Output Pin Adjustable Pin Fin GND GND ●TOP VIEW〈Package dimension〉 HRP5 8.82 ± 0.1 (6.5) 0.08±0.05 1.2575 1 2 3 4 0.835±0.2 1.523±0.15 8.0±0.13 (7.49) 1.905±0.1 10.54±0.13 1.017±0.2 9.395±0.125 (MAX 9.745 include BURR) 5 +5.5° 4.5°−4.5° +0.1 0.27 −0.05 1.72 0.73±0.1 0.08 S S www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. (Unit : mm) 5/11 2011.03 - Rev.A Technical Note BD00D0AWHFP ●Input / Output Equivalent Circuit Diagrams CTL Pin Vcc Pin 200kΩ Vcc 1kΩ CTL 200kΩ IC ADJ Pin Vo Pin Vcc Vo 1kΩ 20 kΩ ADJ Vo 35kΩ ●Output Voltage Configuration Method Please connect resistors R1 and R2 (which determines the output voltage) as shown in Fig.14. Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistors with large values are used. The use of resistors with R1=5kΩ to 10kΩ is recommended. Vo R2 IC Vo ≒ ADJ × (R1+R2) / R1 ADJ≒0.75V (TYP.) ADJ pin R1 Fig.14 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/11 2011.03 - Rev.A Technical Note BD00D0AWHFP ●Thermal Design 10 10 Mounted on a Rohm standard board Board size : 70 ㎜×70 ㎜×1.6 ㎜ θja=78.1(℃/W) 8 Power dissipation Pd （W) Power dissipation Pd （W) 8 6 4 1.6W ③ 7.3W 6 ② 5.5W Mounted on a Rohm standard board Board size : 70 ㎜×70 ㎜×1.6 ㎜ (board contains a thermal) ①2-layer board (back surface copper foil area :15 ㎜×15 ㎜) ②2-layer board (back surface copper foil area :70 ㎜×70 ㎜) ③4-layer board (back surface copper foil area :70 ㎜×70 ㎜) ①:θja=54.3℃/W ②:θja=22.7℃/W ③:θja=17.1℃/W 4 ① 2.3W 2 2 0 0 0 25 50 75 100 125 Temperature atmosphere Ta(℃) 0 150 25 Fig.15 50 75 100 125 Temperature atmosphere Ta(℃) 150 Fig.16 (Reference data) When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.15. and Fig.16. The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at temperatures less than the maximum junction temperature Tjmax. Fig.15 and Fig.16 shows the acceptable loss and heat reducing characteristics of the HRP5 package. Even when the ambient temperature Ta is a normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures less than the acceptable loss Pd. The calculation method for power consumption Pc(W) is as follows :(Fig.16③) Pc=(Vcc－Vo)×Io+Vcc×Ib Acceptable loss Pd≧Pc Solving this for load current Io in order to operate within the acceptable loss, Vcc: Vo: Io: Ib: Ishort: Input voltage Output voltage Load current Circuit current Short current Pd－Vcc×Ib (Please refer to Fig.9 for Ib.) Vcc－Vo It is then possible to find the maximum load current IoMax with respect to the applied voltage Vcc at the time of thermal design. Io≦ Calculation Example)When Ta=85℃,Vcc=10V,Vo=5V Io≦ 3.796－10×Ib 5 Io≦758.2mA Fig.16③:θja=17.1℃/W → -58.4mW/℃ 25℃=7.3W → 85℃=3.796W (Ib:0.5mA) Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is : Pc=Vcc×(Ib+Ishort) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. (Please refer to Fig. 5 for Ishort) 7/11 2011.03 - Rev.A Technical Note BD00D0AWHFP ●Notes for use 1. Absolute maximum ratings Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. 2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external circuits and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics. 3. GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics. 4. Ground wiring pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by poor soldering or foreign objects) may result in damage to the IC. 6. Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications where strong electromagnetic fields may be present. 7. Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Thermal consideration Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions. (Pd≧Pc) Tjmax : Maximum junction temperature=150[℃] , Ta : Peripheral temperature[℃] , θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W], Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current Package Power dissipation Power dissipation : Pd (W)=(Tjmax－Ta)/θja : Pc (W)=(Vcc－Vo)×Io+Vcc×Ib 9. Vcc pin Insert a capacitor(Vo≧5V:capacitor≧1µF～, Vo＜5V:capacitor≧2.2µF～) between the Vcc and GND pins. The appropriate capacitance value varies by application. Be sure to allow a sufficient margin for input voltage levels. Electric capacitance IC Ceramic capacitors, Low ESR capacitors www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/11 2011.03 - Rev.A Technical Note BD00D0AWHFP 10. Output pin It is necessary to place capacitors between each output pin and GND to prevent oscillation on the output. Usable capacitance values range from 2.2µF to 1000µF. Ceramic capacitors can be used as long as their ESR value is low enough to prevent oscillation (0.001Ω to 20Ω). Abrupt fluctuations in input voltage and load conditions may affect the output voltage. Vcc＝4V～25V Vo＝3V～15V Io＝0A～2A Ta＝-40℃～+105℃ R1＝5kΩ～10kΩ Vcc＝4V～25V Vo＝3V～15V Ta＝-40℃～+105℃ R1＝5kΩ～10kΩ Cin＝2.2µF～100µF Cout＝2.2µF～100µF 100 100 Unstable operating region 1 Stable operating region Unstable operating region Cin（μF） Cout_ESR (Ω） 10 10 0.1 Stable operating region 0.01 1 0.001 1 0 400 800 1200 1600 2.2 10 100 2000 Cout（μF） Io(mA) Cout_ESR vs Io(reference data) Cin vs Cout(reference data) Cout(2.2µF～) ESR (0.001Ω～) Vcc (4～25V) Vcc Vo CTL ADJ R2 Cin (2.2µF～) GND Io(ROUT) VCTL (5V) R1 (5k～10kΩ) ※Operation Notes 10 Measurement circuit 11. CTL pin Do not make voltage level of chip enable pin keep floating level, or in between VthH and VthL. Otherwise, the output voltage would be unstable or indefinite. 12. For a steep change of the Vcc voltage Because MOS FET for output Transistor is used when an input voltage change is very steep, it may evoke large current. When selecting the value of external circuit constants, please make sure that the operation on the actual application takes these conditions into account. 13. For an infinitesimal fluctuations of output voltage. At the use of the application that infinitesimal fluctuations of output voltage caused by some factors (e.g. disturbance noise, input voltage fluctuations, load fluctuations, etc.), please take enough measures to avoid some influence (e.g. insert the filter, etc.). 14. Over current protection circuit (OCP) The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output capacity. This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous or transitive operation of the protection circuits. 15. Thermal shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used after this function has activated, or in applications where the operation of this circuit is assumed. 16. Applications or inspection processes where the potential of the Vcc pin or other pins may be reversed from their normal state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000µF or lower in case Vcc is shorted with the GND pin while the external capacitor is charged. Insert a diode in series with Vcc to prevent reverse current flow, or insert bypass diodes between Vcc and each pin. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/11 2011.03 - Rev.A Technical Note BD00D0AWHFP 17. Positive voltage surges on VCC pin A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 35V on the VCC pin. Vcc GND 18. Negative voltage surges on VCC pin A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on the VCC pin. Vcc GND 19. Output protection diode Loads with large inductance components may cause reverse current flow during startup or shutdown. protection diode should be inserted on the output to protect the IC. In such cases, a 20. Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes and/or transistors. For example (refer to the figure below): ○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode ○When GND > Pin B, the PN junction operates as a parasitic transistor Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Transistor (NPN) Resistor B (Pin B) (Pin A) (Pin B) E C B N P P+ N P P+ N P+ N GND P+ N N Parasitic elements GND P N P substrate Parasitic elements or transistors C E GND Parasitic elements or transistors (Pin A) Parasitic elements Example of Simple Monolithic IC Architecture www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/11 2011.03 - Rev.A Technical Note BD00D0AWHFP ●Ordering part number B D 0 ROHM model Name 0 D Output Voltage 00:Variable 0 A Current capacity D0A:2A W H F P - Shutdown switch Package W: With HFP: HRP5 switch None : Without switch T R Packaging and forming specification TR:Embossed tape and reel HRP5 <Tape and Reel information> 8.82 ± 0.1 (6.5) 0.08±0.05 1.2575 1 2 3 4 0.835±0.2 1.523±0.15 8.0±0.13 (7.49) 1.905±0.1 10.54±0.13 1.017±0.2 9.395±0.125 (MAX 9.745 include BURR) Tape Embossed carrier tape Quantity 2000pcs Direction of feed TR direction is the 1pin of product is at the upper right when you hold ( The ) reel on the left hand and you pull out the tape on the right hand 1pin 5 +5.5° 4.5°−4.5° +0.1 0.27 −0.05 1.72 0.73±0.1 0.08 S S www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Direction of feed Reel (Unit : mm) 11/11 ∗ Order quantity needs to be multiple of the minimum quantity. 2011.03 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A