ROHM BA6219BFP-Y_09

For brush motors
Reversible motor drivers
(up to 2A series)
BA6219BFP-Y, BA6222
No.09008EAT03
 Overview
These motor drivers are full bridge drivers for brush motor applications, supporting output currents of up to 2A. The output
modes are available in four modes, normal, reverse, stop (idling), and braking in accordance with input logic (2 inputs). The
output voltage can be optionally set by reference voltage setting pin.
 Features
1) Large output current (lOMAX=2.2A)
2) Built-in thermal shutdown circuit
3) Output voltage can be optionally set by reference voltage setting pin
4) High output voltage can be set by low voltage input because of it has 11.4dB gain (BA6222)
5) Low standby current
 Applications
Audio-visual equipment; PC peripherals; Car audios; Car navigation systems; OA equipments
 Absolute maximum ratings (Ta=25°C, All voltages are with respect to ground)
Parameter
Supply voltage
Output current
All other input pins
Symbol
TSTG
Unit
V
1
2.2*
VIN
Storage temperature
BA6222
24
IOMAX
TOPR
Junction temperature
BA6219BFP-Y
VCC1, VCC2
Operating temperature
Power dissipation
Ratings
-0.3 ~ VCC1
A
-0.3 ~ VCC1+0.3
-25 ~ 75
-55 ~ 150
°C
-55 ~ 125
2
V
3
°C
Pd
1.45*
2.00*
W
Tjmax
150
125
°C
*1 Do not, exceed Pd or ASO (Pulse at 1/100 duty: 500µs).
*2 HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.6mW/°C above 25°C.
*3 HSIP10 package. Derated at 20mW/°C above 25°C.
 Operating conditions (Ta=25°C)
Parameter
Supply voltage
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○
Symbol
Ratings
Unit
VCC1, VCC2
8 ~ 18
V
1/10
2009.04 - Rev.A
Technical Note
BA6219BFP-Y, BA6222
 Electrical characteristics (BA6219BFP-Y, unless otherwise specified, Ta=25°C and VCC1=VCC2=12V)
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Conditions
Supply current 1
ICC1
-
1.2
2.5
mA
Standby mode
Supply current 2
ICC2
-
16
35
mA
FWD/REV mode
Supply current 3
ICC3
-
25
60
mA
Brake mode
Input threshold voltage H
VIH
3.0
-
VCC1
V
Input threshold voltage L
VIL
0
-
1.0
V
VR bias current
IVREF
0.6
1.2
2.4
mA
RL=60Ω, VR=6.8V
CD1 current
ICD1
0.7
1.5
3.0
mA
(IN1, IN2)=(H, L), CD1 -> GND
CD2 current
ICD2
0.7
1.5
3.0
mA
(IN1, IN2)=(L, H), CD2 -> GND
Output leak current
IOL
-
-
1
mA
(IN1, IN2)=(L, L), VCC2 current
Output voltage H
VOH
6.5
-
-
V
RL=60Ω, VR=6.8V
Output voltage L
VOL
-
1.2
V
RL=60Ω, VR=6.8V
 Electrical characteristics (BA6222, unless otherwise specified, Ta=25°C and VCC1=VCC2=12V)
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Conditions
Supply current 1
ICC1
-
1.2
2.5
mA
Standby mode, VR=0V
Supply current 2
ICC2
-
16
35
mA
FWD/REV mode, VR=0V
Supply current 3
ICC3
-
25
60
mA
Brake mode, VR=0V
Input threshold voltage H
VIH
3.0
-
VCC1
V
Input threshold voltage L
VIL
0
-
1.0
V
IVREF
-
1.2
5.0
µA
VR=1.0V
VR-OUT trans. gain
GV
10.35
11.35
12.35
dB
(IN1, IN2)=(H, L) or (L, H), IOUT=0.1A*1
CD1 current
ICD1
0.7
1.5
3.0
mA
(IN1, IN2)=(H, L), CD1 -> GND
CD2 current
ICD2
0.7
1.5
3.0
mA
(IN1, IN2)=(L, H), CD2 -> GND
Output leak current
IOL
-
-
1
mA
(IN1, IN2)=(L, L), VCC2 current
Output voltage H
VOH
9.5
-
-
V
IOUT=0.1A, VR=5V
Output voltage L
VOL
-
0.5
V
IOUT=0.1A, VR=5V
GV = 20 log
Vout2 – Vout1
2V – 1V
VR bias current
*1 Vout1 = VOH-VOL @VR=1V
Vout2 = VOH-VOL @VR=2V
These voltages are stabilized value without any heat radiation board.
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2/10
2009.04 - Rev.A
Technical Note
BA6219BFP-Y, BA6222
 Electrical characteristic curves (Reference data)
25
1.5
1.0
0.5
40
-25°C
25°C
75°C
20
15
10
8
10
12
14
16
18
10
14
16
18
8
1.5
1.0
0.5
16
20
15
10
Supply Voltage: Vcc [V]
12
14
16
Output High Voltage: VOH [V] _
7.5
7.0
-25°C
25°C
75°C
8
0.5
1
10
1.5
10.0
9.5
0.5
1
Fig.6 Supply current 3 (brake)
(BA6222)
2.5
2.0
1.5
1.0
75°C
25°C
-25°C
0.5
1.5
2
0
0.5
1
1.5
2
Output Current: Iout [A]
Fig.8 Output high voltage
(BA6222)
Fig.9 Output low voltage
(BA6219BFP-Y)
3
3
i) Without heat sink
ii) Mounted on ROHM standard PCB
2.5
(70mm x 70mm x 1.6mm FR4 glas s-epox y board)
i) 2.0W
i) Package only
2
1.5
1.0
Pd [W]
2
2.0
Pd [W]
Output Low Voltage: VOL [V]_
18
Output Current: Iout [A]
Output Current: Iout [A]
3.0
16
0.0
0
Fig.7 Output high voltage
(BA6219BFP-Y)
14
3.0
75°C
25°C
-25°C
10.5
2
12
Supply Voltage: Vcc [V]
9.0
6.0
0
-25°C
25°C
75°C
Fig.5 Supply current 2 (reverse)
(BA6222)
11.0
6.5
20
Supply Voltage: Vcc [V]
75°C
25°C
-25°C
18
30
18
Output Low Voltage: VOL [V]_
8.0
16
10
8
Fig.4 Supply current 1 (standby)
(BA6222)
14
40
-25°C
25°C
75°C
18
12
Fig.3 Supply current 3 (brake)
(BA6219BFP-Y)
10
14
10
Supply Voltage: Vcc [V]
Supply Current: Icc3 [mA]_
Stand-by Current: Icc2 [mA]_
Circuit Current: Icc1 [mA] _
12
25
-25°C
25°C
75°C
12
-25°C
25°C
75°C
Fig.2 Supply current 2 (reverse)
(BA6219BFP-Y)
2.0
10
20
Supply Voltage: Vcc [V]
Fig.1 Supply current 1 (standby)
(BA6219BFP-Y)
8
30
10
8
Supply Voltage: Vcc [V]
Output High Voltage: VOH [V] _
Supply Current: Icc3 [mA]_
-25°C
25°C
75°C
Stand-by Current: Icc2 [mA]_
Circuit Current: Icc1 [mA] _
2.0
ii)1.45W
1
75°C
25°C
-25°C
0.5
0.0
0
0.5
1
1.5
1
i)0.85W
0
2
Output Current: Iout [A]
Fig.10 Output low voltage
(BA6222)
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○
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [°C]
Fig.11 Thermal derating curve
(HSOP25)
3/10
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [°C]
Fig.12 Thermal derating curve
(HSIP10)
2009.04 - Rev.A
Technical Note
BA6219BFP-Y, BA6222
 Block diagram and pin configuration
BA6219BFP-Y
10
VCC2
24
6
CTRL
IN2
R1
C1
11
TSD
IN1
Table 1 BA6219BFP-Y
VCC1
OUT1
OUT2
M
C4
15
8
19
20
FIN
GND
7
VR
4
CD2
13
2
C3
GND
GND
CD1
C2
ZD
Fig.13 BA6219BFP-Y
NC
CD1
NC
VR
NC
IN1
GND
GND
IN2
NC
VCC1
VCC2
NC
CD2
Pin
Name
Function
2
CD1
Cross conduction control pin
4
VR
Reference voltage setting pin
6
IN1
Control input (forward)
7
GND
8
IN2
GND
Control input (reverse)
10
VCC1
Power supply (small signal)
11
VCC2
Power supply (driver stage)
13
CD2
Cross conduction control pin
15
OUT2
Driver output
NC
OUT1
NC
NC
NC
GND
19
GND
GND
20
GND
GND
24
OUT1
Driver output
GND
FIN
GND
GND
GND
NC
NC
NC
OUT2
NC
Note: All pins not described above are NC pins.
Fig.14 HSOP25
BA6222
7
8
TSD
IN1
2
x4
5
VCC2
10
x4
6
1
FIN
VR
4
CD2
9
3
C3
C5
R1
C1
OUT1
CTRL
IN2
Table 2 BA6222
VCC1
OUT2
M
C4
GND
CD1
C2
ZD
CD2
Name
1
GND
GND
Function
2
OUT1
Driver output
3
CD1
Cross conduction control pin
4
VR
Reference voltage setting pin
5
IN1
Control input (forward)
6
IN2
Control input (reverse)
7
VCC1
Power supply (small signal)
8
VCC2
Power supply (driver stage)
9
CD2
Cross conduction control pin
10
OUT2
Driver output
FIN
GND
GND
OUT2
VCC2
IN2
VCC1
VR
IN1
CD1
GND
OUT1
Fig.15 BA6222
Pin
Fig.16 HSIP10
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4/10
2009.04 - Rev.A
Technical Note
BA6219BFP-Y, BA6222
 External application components
1) Resistor for the current limitation, R1
This is a current limiting resistor for collector loss reduction and at the time of short-circuited output. It depends on the
power supply voltage used, etc., but choose resistance of about 5 to 10Ω. In addition, set resistance with utmost care
to voltage drop caused by inrush current that flows when the motor is started.
2) Zener diode for the output high voltage setting, ZD
This is the zener diode used when output high voltage (VR pin voltage) is set.
BA6219BFP-Y: Output high voltage ≈ zener voltage
BA6222: Output high voltage ≈ fourfold zener voltage
3) Stabilization capacitor for the power supply line, C1
Please connect the capacitor of 1μF to 100μF for the stabilization of the power supply line, and confirm the motor
operation.
4) Capacitors for the cross conduction control of output transistors, C2 and C3
Simultaneous ON is prevented by delaying base potential buildup of transistors which enter output high state. Set the
capacitors from 0.01μF to 1μF and make sure inrush current caused by simultaneous output ON does not flow when
output mode is switched.
5) Phase compensating capacitor, C4
Noise is generated in output pins or oscillation results in accord with the set mounting state such as power supply
circuit, motor characteristics, PCB pattern artwork, etc. As noise oscillation measures, connect 0.01μF to 0.1μF
capacitors.
6) Phase compensating capacitor, C5 (BA6222 only)
The gain about fourfold VR pin voltage in output high voltage is set, and the output oscillates easily. Please connect the
capacitor of 3300pF to 0.1µF as an oscillation prevention measures when the oscillation is seen in the output voltage.
 Functional descriptions
1) Operation modes
Table 3 Logic table
IN1
IN2
OUT1
OUT2
Operation
L
L
OPEN*
OPEN*
Stop (idling)
H
L
H
L
Forward (OUT1 > OUT2)
L
H
L
H
Reverse (OUT1 < OUT2)
H
H
L
L
Brake (stop)
* OPEN is the off state of all output transistors. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay.
a) Stand-by mode
In stand-by mode, all output power transistors are turned off, and the motor output goes to high impedance.
b) Forward mode
This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low.
When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2.
c) Reverse mode
This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high.
When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1.
d) Brake mode
This operating mode is used to quickly stop the motor (short circuit brake).
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5/10
2009.04 - Rev.A
Technical Note
BA6219BFP-Y, BA6222
2) Output high voltage setting
This function optionally sets output voltage by the output high voltage setting pin and controls the motor rotating speed.
However, when the output high voltage is set to a low level, consumption at IC increases. Carry out thermal design with
sufficient margin incorporated with the power dissipation (Pd) under the actual application condition taken into account.
a) BA6219BFP-Y
The circuit diagram associated with the output high voltage setting VR pin is as
per shown on the right. The maximum output voltage VOMAX is expressed by:
VCC1
Q1
Q2
VCC2
Q3
VOMAX = VCC1 - ( VSAT(Q1) + VF(Q2) + VF(Q3) + VF(Q4) )
Q5
Q6
Q4
Q7
In addition, the relation of VR voltage to output voltage at VOMAX or lower is
expressed by:
OUT
VR
Fig. 17
VOH = VR + ( VF(Q5) + VF(Q6) + VF(Q7) ) - ( VF(Q2) + VF(Q3) + VF(Q4) )
VOH = VR + ΔVF ≈ VR
ΔVF depends on the output current but is nearly VOH=VR. (Reference values; VSAT ≈ 0.25V, VF ≈ 0.75V)
b) BA6222
As the relationship between the output high voltage setting pin VR
voltage and output high voltage VOH is expressed by:
VOH
VCC1 - 3VF - VSAT
BA6222
VOH ≈ 4 x VR + VOFS
BA6219BFP-Y
In such event, VOFS means the offset voltage, which varies in accord
with output current and chip temperature.
The VR voltage region can be classified into three categories in accord
with the output state:
(A) Output high voltage 0V offset region
(B) Fourfold gain region
(C) Output voltage saturated region
(A)
(B)
(C)
VR
Fig. 18
Using this function with the VR pin connected to a load which has output impedance of several hundreds ohm may
result in oscillation. In such event, connect a capacitor of 3300pF or higher to about 0.1μF across VR and GND and
make sure that the motor is free of oscillation.
c) Power supply voltage range of VR voltage
When output voltage control pin (VR) is used:
VOH
VR < VCC1 - ( VSAT(Q1) + VF(Q5) + VF(Q6) + VF(Q7) )
VR ≈ VCC1 - 2.5V
VR < VCC2 - ( VSAT(Q3) - VF(Q3) - VF(Q2) ) - ( VF(Q5) + VF(Q6) + VF(Q7) )
VR ≈ VCC2 - 1V
The output voltage control function does not operate in the region
outside this range. In addition, when the VR pin is not used, use by
shorting VR to VCC1.
Control range
Saturation range
VR
Fig. 19
3) Switching of rotating direction (FWD/REV)
When the rotating direction is changed over by the motor rotating condition, switch the direction after the motor is
temporarily brought to the BRAKE condition or OPEN condition. It is recommended to keep the relevant conditions as
follows:
via BRAKE: Longer than braking time*.
(* the time required for the output L terminal to achieve potential below GND when brake is activated.)
via OPEN: The time longer than 1 ms is recommended.
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6/10
2009.04 - Rev.A
Technical Note
BA6219BFP-Y, BA6222
 Interfaces
IN1
IN2
20k
10k
VR
10k
10k
Fig. 20 IN1, IN2 (BA6219BFP-Y, BA6222)
Fig.21 VR (BA6222)
VCC2
VCC1
CD1
CD2
OUT1
OUT2
VR
GND
Fig. 22 VCC1, VCC2, VR, CD1, CD2, GND (BA6219BFP-Y)
VCC2
VCC1
CD1
CD2
OUT1
OUT2
GND
Fig. 23 VCC1, VCC2, CD1, CD2, GND (BA6222)
 Notes for use
1) Absolute maximum ratings
Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating.
Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important
to consider circuit protection measures – such as adding fuses – if any value in excess of absolute maximum ratings is
to be implemented.
2) Connecting the power supply connector backward
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply lines, such as adding an external direction diode.
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7/10
2009.04 - Rev.A
Technical Note
BA6219BFP-Y, BA6222
3) Power supply lines
Return current generated by the motor’s Back-EMF requires countermeasures, such as providing a return current path
by inserting capacitors across the power supply and GND (10µF, ceramic capacitor is recommended). In this case, it is
important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors –
including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient
current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which
may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To
help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage
clamping diode across the power supply and GND.
4) Electrical potential at GND
Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to
determine whether there is any terminal that provides voltage below GND, including the voltage during transient
phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set’s
reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that
voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the
same way, care must be taken to avoid changes in the GND wire pattern in any external connected component.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating
conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error, or if pins are shorted together.
7) Operation in strong electromagnetic fields
Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with
electromagnetic fields.
8) ASO - Area of Safety Operation
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
9) Built-in thermal shutdown (TSD) circuit
The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or
guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated,
and do not operate the IC in an environment where activation of the circuit is assumed.
BA6219BFP-Y
BA6222
TON [°C]
180
150
THYS [°C]
15
15
*All temperature values are typical.
10) Capacitor between output and GND
In the event a large capacitor is connected between the output and GND, if VCC and VIN are short-circuited with 0V or
GND for any reason, the current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor
smaller than 1μF between output and GND.
11) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress.
Therefore, always discharge capacitors after each process or step. Always turn the IC's power supply off before
connecting it to or removing it from the test setup during the inspection process. Ground the IC during assembly steps
as an antistatic measure. Use similar precaution when transporting or storing the IC.
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8/10
2009.04 - Rev.A
Technical Note
BA6219BFP-Y, BA6222
12) Regarding the input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them
isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by
which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin.
Resistor
Pin A
Pin B
C
Transistor (NPN)
B
Pin A
N
P+
N
P+
P
Parasitic
element
N
N
B
N
P+
P+
P
P substrate
N
C
E
P substrate
GND
Parasitic element
Pin B
E
GND
GND
Parasitic element
GND
Parasitic
element
Other adjacent elements
Appendix: Example of monolithic IC structure
Ordering part number
B
A
ROHM part
number
6
2
Type
6219B
6222
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c 2009 ROHM Co., Ltd. All rights reserved.
○
1
9
B
F
P
Package
FP-Y: HSOP25
None: HSIP10
9/10
-
Y
-
E
2
Packaging spec.
E2: Embossed taping
None: Container tube
2009.04 - Rev.A
Technical Note
BA6219BFP-Y, BA6222
HSOP25
<Dimension>
<Tape and reel information>
13.6 ± 0.2
7.8 ± 0.3
0.3Min.
13
1.95 ± 0.1
Embossed carrier tape
2000pcs
Direction
of feed
E2
(Holding the reel with the left hand and pulling the tape out with the right,
pin 1 will be on the upper left-hand side.)
0.25 ± 0.1
1234
1234
1234
1Pin
Reel
(Unit:mm)
1234
1234
0.1
0.36 ± 0.1
1234
0.8
1234
0.11
1
1.9 ± 0.1
14
5.4 ± 0.2
25
2.75 ± 0.1
Tape
Quantity
Direction of feed
*Orders should be placed in multiples of package quantity.
HSIP10
<Dimension>
<Tape and reel information>
26.5 ± 0.3
3.6 ± 0.2
25 ± 0.2
Tube
Quantity
500pcs
Direction
of feed
Direction of products is fixed in a container tube.
8.4 ± 0.3
1.2
1.6
16.2 ± 0.2
6.4 ± 0.5
27.0 ± 0.5
R1.6
Container
1
10
2.54
0.6
0.8
1.3
0.5 ± 0.1
(Unit:mm)
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c 2009 ROHM Co., Ltd. All rights reserved.
○
*Orders should be placed in multiples of package quantity.
10/10
2009.04 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
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