846C-01

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN8 3x3, (MICRO8 LEADLESS)
CASE 846C−01
ISSUE D
1
SCALE 4:1
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
INDEX AREA
2X
T
W
Y
A
J
SEATING
PLANE
AA
8
7
B
NOTE 6
6
5
0.15 T
K AA
C
2X
TOP VIEW
0.15 T
NOTE 4
0.08 T
0.10 T W Y
E
0.05 T W
G
L
SIDE VIEW
8X
8X
6X
8
1
7
2
6
3
5
4
L1
NOTE 4
F
P
DETAIL Z
DETAIL Z
U
4X
H
SOLDERING FOOTPRINT*
1.23
1.50
MILLIMETERS
MIN
MAX
3.30 BSC
3.30 BSC
0.85
0.95
0.25
0.35
1.30
1.50
2.55
2.75
0.65 BSC
0.95
1.15
0.25 BSC
0.00
0.05
0.35
0.45
0.00
0.10
1.28
1.38
0.17 TYP
GENERIC
MARKING DIAGRAM*
XXXX
AYWWG
G
XXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
2.75
8X
DIM
A
B
C
D
E
F
G
H
J
K
L
L1
P
U
1
VIEW AA−AA
0.40
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. THE TERMINAL #1 IDENTIFIER AND TERMINAL
NUMBERING CONVENTION SHALL CONFORM TO
JESD 95-1 SPP-012. DETAILS OF TERMINAL #1
IDENTIFIER ARE OPTIONAL, BUT MUST BE
LOCATED WITHIN THE ZONE INDICATED. THE
TERMINAL #1 IDENTIFIER MAY BE EITHER A
MOLD OR MARKED FEATURE.
4. DIMENSION D APPLIES TO METALLIZED
TERMINAL AND IS MEASURED BETWEEN
0.25 MM AND 0.30 MM FROM TERMINAL TIP.
DIMENSION L1 IS THE TERMINAL PULL BACK
FROM PACKAGE EDGE, UP TO 0.1 MM IS
ACCEPTABLE. L1 IS OPTIONAL.
5. DEPOPULATION IS POSSIBLE IN A
SYMMETRICAL FASHION.
6. OPTIONAL SIDE VIEW CAN SHOW LEADS 5 AND
8 REMOVED.
0.10 T
8X
D
DATE 28 JUN 2010
3.60
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.58
0.65 PITCH
8X 0.33
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON11449D
ON SEMICONDUCTOR STANDARD
http://onsemi.com
DFN8 3X3, (MICRO8 LEADLESS)
1
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON11449D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY A. SAM.
29 MAR 2002
A
REMOVED TIE BARS ON CENTER FLAG. REMOVED DIMENSIONS R AND S.
ADJUSTED BOTTOM VIEW AND ISOMETRIC PICTURE ACCORDINGLY.
CHANGED DIMENSION D TO 0.25 MM AND 0.35 MM. REQ. BY P. CELAYA.
03 AUG 2005
B
CHANGED SIDE VIEW DRAWING. CHANGED DIMENSIONS A AND B TO BASIC
DIMENSIONS. REMOVED DIMENSIONS M AND N. ADDED DIMENSION L1. ADDED NOTE 6. REQ. BY P. CELAYA.
20 SEP 2005
C
CHANGED DIMENSION U TO 0.17 TYP. REQ. BY P. CELAYA.
06 MAR 2006
D
ADMINISTRATIVE CHANGE TO REFLECT THE INITIAL RELEASE OF
DOCUMENT. REQ. BY V. ILAS.
28 JUN 2010
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2010
June, 2010 − Rev. 01D
Case Outline Number:
846C