NL17SG125 Bus Buffer with 3-State Output The NL17SG125 MiniGatet is an advanced high−speed CMOS Bus Buffer with 3−State Output in ultra−small footprint. The NL17SG125 input structures provides protection when voltages up to 4.6 V are applied. http://onsemi.com MARKING DIAGRAMS Features Wide Operating VCC Range: 0.9 V to 3.6 V High Speed: tPD = 2.4 ns (Typ) at VCC = 3.0 V, CL = 15 pF Low Power Dissipation: ICC = 0.5 mA (Max) at TA = 25°C SOT−953 CASE 527AE 4.6 V Overvoltage Tolerant (OVT) Input Pins 2 OE 3 4 VCC OE 1 IN A 2 OUT Y GND 3 Figure 1. SOT−953 (Top Thru View) OE GND 6 5 2 3 4 VCC 1 M K = Specific Device Code (K with 270 degree clockwise rotation) M = Month Code 4 OUT Y UDFN6 1.45 x 1.0 CASE 517AQ 1 Figure 2. SC−88A (Top View) M R = Specific Device Code (R with 180 degree clockwise rotation) M = Month Code 6 VCC SC−88A DF SUFFIX CASE 419A NC M IN A 1 5 R GND 5 UDFN6 1.0 x 1.0 CASE 517BX K These are Pb−Free and Halide−Free Devices 1 M 1 F = Specific Device Code (F with 90 degree clockwise rotation) M = Month Code Ultra−Small Packages IN A F • • • • • • A4 M G G 1 OE OUT Y EN OUT Y IN A Figure 3. UDFN6 (Top View) A4 M G Figure 4. Logic Symbol = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. PIN ASSIGNMENT FUNCTION TABLE Pin Number SOT−953 SC−88A UDFN6 1 IN A OE OE 2 GND IN A IN A 3 OE GND GND 4 OUT Y OUT Y OUT Y 5 VCC VCC NC ORDERING INFORMATION VCC See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. 6 © Semiconductor Components Industries, LLC, 2014 March, 2014 − Rev. 4 1 A Input OE Input Y Output L H X L L H L H Z Publication Order Number: NL17SG125/D NL17SG125 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +5.5 V VIN DC Input Voltage −0.5 to +4.6 V −0.5 to VCC +0.5 −0.5 to +4.6 V VIN < GND −20 mA VOUT < GND −20 mA VOUT Parameter DC Output Voltage Output at High or Low State Power−Down Mode (VCC = 0 V) IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Source/Sink Current ±20 mA ICC DC Supply Current per Supply Pin ±20 mA IGND DC Ground Current per Ground Pin TSTG Storage Temperature Range ±20 mA −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias +150 °C MSL Moisture Sensitivity FR Flammability Rating VESD ILATCHUP Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Latchup Performance Above VCC and Below GND at 125°C (Note 4) >2000 >100 V ±100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC Positive DC Supply Voltage 0.9 3.6 V VIN Digital Input Voltage 0.0 3.6 V 0.0 0.0 VCC 3.6 V −55 +125 °C 0 10 ns/V VOUT TA Dt / DV Output Voltage Output at High or Low State Power−Down Mode (VCC = 0 V) Operating Temperature Range VCC = 3.3 V ± 0.3 V Input Transition Rise or Fail Rate Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. http://onsemi.com 2 NL17SG125 DC ELECTRICAL CHARACTERISTICS TA = 255C Symbol Parameter VIH High-Level Input Voltage VIL VOH VOL Conditions Low-Level Input Voltage High-Level Output Voltage Low-Level Output Voltage VIN = VIH or VIL VIN = VIH or VIL Max TA = -555C to +1255C VCC (V) Min Min 0.9 VCC VCC 1.1 to 1.3 0.7xVCC 0.7xVCC 1.4 to 1.6 0.65xVCC 0.65xVCC 1.65 to 1.95 0.65xVCC 0.65xVCC 2.3 to 2.7 1.7 1.7 3.0 to 3.6 2.0 2.0 Max Unit V 0.9 GND GND 1.1 to 1.3 0.3xVCC 0.3xVCC 1.4 to 1.6 0.35xVCC 0.35xVCC 1.65 to 1.95 0.35xVCC 0.35xVCC 2.3 to 2.7 0.7 0.7 3.0 to 3.6 0.8 0.8 IOH = −20 mA 0.9 0.75 0.75 IOH = -0.3 mA 1.1 to 1.3 0.75xVCC 0.75xVCC IOH = -1.7 mA 1.4 to 1.6 0.75xVCC 0.75xVCC IOH = -3.0 mA 1.65 to 1.95 Vcc-0.45 Vcc-0.45 IOH = -4.0 mA 2.3 to 2.7 2.0 2.0 IOH = -8.0 mA 3.0 to 3.6 2.48 2.48 IOL = 20 mA 0.9 0.1 0.1 IOL = 0.3 mA 1.1 to 1.3 0.25xVCC 0.25xVCC IOL = 1.7 mA 1.4 to 1.6 0.25xVCC 0.25xVCC IOL = 3.0 mA 1.65 to 1.95 0.45 0.45 IOL = 4.0 mA 2.3 to 2.7 0.4 0.4 IOL = 8.0 mA 3.0 to 3.6 0.4 0.4 V V V IIN Input Leakage Current 0 ≤ VIN ≤ 3.6 V 0 to 3.6 $0.1 $1.0 mA ICC Quiescent Supply Current VIN = VCC or GND 3.6 1.0 10.0 mA IOZ 3−State Output Leakage Current VIN = VIH or VIL VOUT = 0 to 3.6 V 0.9 to 3.6 1.0 10.0 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. http://onsemi.com 3 NL17SG125 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) TA = -555C to +1255C TA = 25 5C Symbol Parameter Test Condition VCC (V) Min Typ Max Min Max Unit tPLH, tPHL Propagation Delay, A to Y CL = 10 pF, RL = 1 MW 0.9 - 11.3 13.6 - 15.9 ns 1.1 to 1.3 - 8.3 10.4 - 12.8 CL = 15 pF, RL = 1 MW CL = 30 pF, RL = 1 MW tPZH, tPZL Output Enable Time, OE to Y 1.4 to 1.6 - 5.0 8.5 - 10.0 1.65 to 1.95 - 4.0 6.2 - 6.7 2.3 to 2.7 - 2.6 3.9 - 4.4 3.0 to 3.6 - 2.1 3.1 - 3.7 0.9 - 12.6 14.7 - 17.0 1.1 to 1.3 - 9.6 11.5 - 15.2 1.4 to 1.6 - 5.6 9.3 - 11.2 1.65 to 1.95 - 4.5 6.9 - 7.1 2.3 to 2.7 - 2.9 4.4 - 5.0 3.0 to 3.6 - 2.4 3.4 - 3.9 0.9 - 14.5 16.3 - 19.6 1.1 to 1.3 - 11.3 13.6 - 17.5 1.4 to 1.6 - 8.2 13.1 - 15.9 1.65 to 1.95 - 6 9.2 - 9.6 2.3 to 2.7 - 4 5.7 - 6.1 3.0 to 3.6 - 3.3 4.4 - 4.8 ns ns ns CL = 10 pF; RL = 100 kW 0.9 - 11.0 13.3 - 15.8 RL = 5 kW 1.1 to 1.3 - 8.4 10.9 - 13.0 RL = 5 kW 1.4 to 1.6 - 5.3 7.8 - 8.3 RL = 5 kW 1.65 to 1.95 - 3.9 5.5 - 5.9 RL = 5 kW 2.3 to 2.7 - 2.5 3.5 - 3.8 RL = 5 kW 3.0 to 3.6 - 2.1 2.7 - 3 ns CL = 15 pF; RL = 100 kW 0.9 - 12.0 14.8 - 17.0 RL = 5 kW 1.1 to 1.3 - 9.0 11.7 - 13.8 RL = 5 kW 1.4 to 1.6 - 5.9 8.9 - 11 RL = 5 kW 1.65 to 1.95 - 4.4 6.3 - 6.5 RL = 5 kW 2.3 to 2.7 - 2.9 3.9 - 4.2 RL = 5 kW 3.0 to 3.6 - 2.3 3 - 3.3 ns CL = 30 pF; RL = 100 kW 0.9 - 13.0 15.2 - 18.3 RL = 5 kW 1.1 to 1.3 - 10.0 13.1 - 15.2 RL = 5 kW 1.4 to 1.6 - 8.3 12.2 - 13.7 RL = 5 kW 1.65 to 1.95 - 6.1 8.6 - 9.7 RL = 5 kW 2.3 to 2.7 - 3.8 5 - 5.5 RL = 5 kW 3.0 to 3.6 - 2.9 3.8 - 4.2 http://onsemi.com 4 NL17SG125 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) (continued) TA = -555C to +1255C TA = 25 5C Symbol Parameter Test Condition tPHZ, tPLZ Output Disable Time, OE to Y CL = 10 pF; VCC (V) Min Typ Max Min Max Unit ns RL = 100 kW 0.9 - 100.4 - - - RL = 5 kW 1.1 to 1.3 - 9.1 14.4 - 22.4 RL = 5 kW 1.4 to 1.6 - 7.1 9.1 - 10.4 RL = 5 kW 1.65 to 1.95 - 6.5 8.3 - 9 RL = 5 kW 2.3 to 2.7 - 5.8 7.3 - 8.8 RL = 5 kW 3.0 to 3.6 - 5.4 6.9 - 7.6 ns CL = 15 pF; RL = 100 kW 0.9 - 122.2 - - - RL = 5 kW 1.1 to 1.3 - 9.8 15.3 - 25.1 RL = 5 kW 1.4 to 1.6 - 7.8 9.8 - 11.3 RL = 5 kW 1.65 to 1.95 - 7.2 9.2 - 10.6 RL = 5 kW 2.3 to 2.7 - 7 8.2 - 10.3 RL = 5 kW 3.0 to 3.6 - 6.6 7.7 - 9.5 RL = 100 kW 0.9 - 217.1 - - - RL = 5 kW 1.1 to 1.3 - 13.2 19.6 - 31.9 RL = 5 kW 1.4 to 1.6 - 12.2 13.5 - 14.9 RL = 5 kW 1.65 to 1.95 - 11.4 12.7 - 13.9 RL = 5 kW 2.3 to 2.7 - 11.3 12.2 - 13.5 RL = 5 kW 3.0 to 3.6 - 10.2 11.5 - 12.9 ns CL = 30 pF; CIN Input Capacitance 0 to 3.6 3 - - - pF CO Output Capacitance VO = GND 0 3 - - - pF CPD Power Dissipation Capacitance (Note 5) f = 10 MHz 0.9 to 3.6 4 - - - pF - Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 5 NL17SG125 Figure 5. Test Circuit Figure 6. tPLH, tPHL Waveforms Figure 7. tPLZ, tPHZ, tPZH, tPZL Waveforms http://onsemi.com 6 NL17SG125 ORDERING INFORMATION Package Shipping† NL17SG125P5T5G SOT−953 (Pb−Free) 8000 / Tape & Reel NL17SG125DFT2G SC−88A (Pb−Free) 3000 / Tape & Reel NL17SG125AMUTCG* UDFN6 1.45 x 1 mm (Pb−Free) 3000 / Tape & Reel NL17SG125CMUTCG* UDFN6 1 x 1 mm (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *In Development http://onsemi.com 7 NL17SG125 PACKAGE DIMENSIONS SOT−953 CASE 527AE ISSUE E X D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A Y 5 4 PIN ONE INDICATOR HE E 1 2 3 DIM A b C D E e HE L L2 L3 C TOP VIEW SIDE VIEW e L 5X 5X L3 MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.95 1.00 1.05 0.175 REF 0.05 0.10 0.15 −−− −−− 0.15 SOLDERING FOOTPRINT* 5X 0.35 5X 0.20 5X L2 5X BOTTOM VIEW b PACKAGE OUTLINE 0.08 X Y 1.20 1 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 NL17SG125 PACKAGE DIMENSIONS UDFN6 1.0x1.0, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉÉ ÉÉÉ ÉÉÉ E 0.10 C 2X 2X 0.10 C DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 5X e 5X 0.48 L 6X 0.22 3 1 L1 1.18 6 4 BOTTOM VIEW 6X b 0.10 M C A B 0.05 M C 0.53 1 PKG OUTLINE NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 NL17SG125 PACKAGE DIMENSIONS UDFN6 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D PIN ONE REFERENCE 0.10 C L1 ÉÉÉ ÉÉÉ DETAIL A E DIM A A1 A2 b D E e L L1 ÉÉ ÉÉ EXPOSED Cu DETAIL B MOLD CMPD DETAIL B 0.05 C 6X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. OPTIONAL CONSTRUCTIONS TOP VIEW 0.10 C L L OPTIONAL CONSTRUCTIONS A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT 0.05 C A1 A2 SIDE VIEW e 6X C 6X SEATING PLANE L 1.24 3 1 DETAIL A 6X 0.53 6 0.30 PACKAGE OUTLINE 4 BOTTOM VIEW 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 NL17SG125 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 J SOLDER FOOTPRINT* C 0.50 0.0197 H K 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 11 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NL17SG125/D