NLX2G04 Dual Inverter The NLX2G04 MiniGatet is an advanced high-speed CMOS dual inverter in ultra-small footprint. The NLX2G04 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. http://onsemi.com Features •High Speed: tPD = 1.8 ns (Typ) @ VCC = 5.0 V •Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C •Power Down Protection Provided on inputs •Balanced Propagation Delays •Overvoltage Tolerant (OVT) Input and Output Pins •Ultra-Small Packages •These are Pb-Free Devices MARKING DIAGRAMS 1 IN A1 1 GND 6 5 2 3 4 M OUT Y1 ULLGA6 1.45 x 1.0 CASE 613AF VCC 1 Q M IN A2 M Q ULLGA6 1.2 x 1.0 CASE 613AE M Q 1 Q ULLGA6 1.0 x 1.0 CASE 613AD = Device Marking = Date Code OUT Y2 Figure 1. Pinout (Top View) PIN ASSIGNMENT 1 IN A1 1 OUT Y1 IN A2 1 OUT Y2 IN A1 2 GND 3 IN A2 4 OUT Y2 5 VCC 6 OUT Y1 Figure 2. Logic Symbol FUNCTION TABLE A Y L H H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2008 March, 2008 - Rev. 0 1 Publication Order Number: NLX2G04/D NLX2G04 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage -0.5 to +7.0 V VIN DC Input Voltage -0.5 to +7.0 V DC Output Voltage -0.5 to +7.0 V VIN < GND -50 mA VOUT < GND -50 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range -65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL FR ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in Latchup Performance Above VCC and Below GND at 125 °C (Note 2) ±500 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Positive DC Supply Voltage VIN Digital Input Voltage VOUT Output Voltage TA Operating Free-Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V http://onsemi.com 2 Min Max Unit 1.65 5.5 V 0 5.5 V 0 5.5 V -55 +125 °C 0 0 0 20 10 5 ns/V NLX2G04 DC ELECTRICAL CHARACTERISTICS VCC (V) Min Typ TA = +855C Max Min Max TA = -555C to +1255C Min Max Symbol Parameter VIH Low-Level Input Voltage 1.65-1.95 0.75 x VCC 0.75 x VCC 0.75 x VCC 2.3 to 5.5 0.70 x VCC 0.70 x VCC 0.70 x VCC Low-Level Input Voltage 1.65-1.95 0.25 x VCC 0.25 x VCC 0.25 x VCC 2.3 - 5.5 0.30 x VCC 0.30 x VCC 0.30 x VCC VIL VOH VOL HighLevel Output Voltage Low-Level Output Voltage Conditions TA = 25 5C VIN = VIH or VIL IOH = -100 mA VIN = VIH or VIL IOH = -4 mA IOH = -8 mA IOH = -12 mA IOH = -16 mA IOH = -24 mA IOH = -32 mA VIN = VIH or VIL IOL = 100 mA 1.65 - 5.5 VCC0.1 VCC VCC0.1 VCC0.1 1.65 2.3 2.7 3.0 3.0 4.5 1.29 1.9 2.2 2.4 2.3 3.8 1.52 2.1 2.4 2.7 2.5 4.0 1.29 1.9 2.2 2.4 2.3 3.8 1.29 1.9 2.2 2.4 2.3 3.8 1.65 - 5.5 Unit V V V 0.1 0.1 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 V VIN = VIH or VIL IOH = -4 mA IOH = -8 mA IOH = -12 mA IOH = -16 mA IOH = -24 mA IOH = -32 mA 1.65 2.3 2.7 3.0 3.0 4.5 Input Leakage Current 0 v VIN v 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA IOFF Power-Off Output Leakage Current VIN or VOUT = 5.5 V 0 1.0 10 10 mA ICC Quiescent Supply Current 0 v VIN v VCC 5.5 1.0 10 10 mA IIN 0.08 0.2 0.22 0.28 0.38 0.42 http://onsemi.com 3 NLX2G04 AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 nS) Symbol tPLH, tPHL Parameter Propagation Delay, Input A to Output Y VCC (V) Test Condition 1.65 TA = -555C to +1255C TA = 25 5C Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 1.8 2.3 9.2 1.8 11 ns 1.8 RL = 1 MW, CL = 15 pF 1.8 4.4 7.6 1.2 8.4 2.3-2.7 RL = 1 MW, CL = 15 pF 1.2 3.0 5.1 1.2 5.6 3.0-3.6 RL = 1 MW, CL = 15 pF 0.8 2.2 3.4 0.8 3.8 RL = 500 W, CL = 50 pF 1.2 2.9 4.5 1.2 5.0 RL = 1 MW, CL = 15 pF 0.5 1.8 2.8 0.5 3.1 RL = 500 W, CL = 50 pF 0.8 2.3 3.6 0.8 4.0 4.5-5.5 CIN Input Capacitance 5.5 VIN = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (Note 3) 3.3 5.5 10 MHz VIN = 0 V or VCC 9 11 pF 3. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no-load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. http://onsemi.com 4 NLX2G04 VCC A or B 50% GND tPLH Y tPHL 50% VCC Figure 3. Switching Waveforms VCC PULSE GENERATOR DUT RT CL RL RT = ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† NLX2G04AMX1TCG ULLGA6, 1.45 x 1.0, 0.5P (Pb-Free) 3000 / Tape & Reel NLX2G04BMX1TCG ULLGA6, 1.2 x 1.0, 0.4P (Pb-Free) 3000 / Tape & Reel NLX2G04CMX1TCG ULLGA6, 1.0 x 1.0, 0.35P (Pb-Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NLX2G04 PACKAGE DIMENSIONS ULLGA6 1.0x1.0, 0.35P CASE 613AD-01 ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX --0.40 0.00 0.05 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 5X 0.48 6X 0.22 e 5X L NOTE 4 3 1 1.18 L1 0.53 6 4 6X b 0.05 C 0.35 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 1 PKG OUTLINE *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 6 NLX2G04 PACKAGE DIMENSIONS ULLGA6 1.2x1.0, 0.4P CASE 613AE-01 ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.35 0.45 5X 0.49 e 5X L 6X 0.26 NOTE 4 3 1 1.24 L1 6 4 0.53 6X b 0.10 C A B BOTTOM VIEW 0.05 C 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS NOTE 3 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NLX2G04 PACKAGE DIMENSIONS ULLGA6 1.45x1.0, 0.5P CASE 613AF-01 ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉ ÉÉÉ ÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW 5X C A1 e 5X L 0.49 NOTE 4 3 1 6X 0.30 1.24 L1 0.53 6 4 BOTTOM VIEW 6X b 0.10 C A B 0.05 C 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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