Model B0809J50ATI

Model B0809J50ATI
Rev A
Impedance Matched Ultra Low profile 0805
Balun for TI CC1101/1100 chipset
(Anaren Application Note Ann-2005)
Description
The B0809J50ATI is a low cost, low profile sub-miniature unbalanced to
balanced transformer specifically designed for differential inputs and output
locations Texas Instruments CC1100 and CC1101 SoC Solution in an easy
to use surface mount package. The B0809J50ATI is ideal for high volume
manufacturing and delivers higher performance than traditional ceramic
baluns. This transformation enables single ended signals to be applied to
differential ports on the CC1100/CC1101. The output ports have equal
amplitude (-3dB) with 180 degree phase differential. The B0809J50ATI is
available on tape and reel for pick and place high volume manufacturing.
Detailed Electrical Specifications: Specifications subject to change without notice.
Features:
ROOM (25°°C)
• 850 – 915 MHz
Parameter
Min.
Typ.
Max
• Matched to TI CC1100 &
Frequency
850
915
CC1101 SoC
Unbalanced Port Impedance*
50
• 0.7mm Height Profile
• Low Insertion Loss
Balanced Port Impedance*
Matched
• Surface Mountable
Return Loss*
15.3
18.0
• Tape & Reel
Insertion Loss**
0.5
0.6
• Non-conductive Top Surface
Power Handling
2.0
• RoHS Compliant
• Zigbee, RF4CE
• Halogen Free
Operating Temperature
-55
+85
Unit
MHz
Ω
Ω
dB
dB
Watts
ºC
*Specification based on performance of unit properly installed on microstrip printed circuit boards according to Anaren application note Ann-2005.
** Insertion Loss stated at room temperature (Insertion Loss is approximately 0.1dB higher at +85°C
Outline Drawing
TOP VIEW (Near Side)
SIDE VIEW
BOTTOM VIEW (Far Side)
4x 0.37
2.04±0.10
0.70±0.05
3
2
1
2x 0.15
1.29±0.10
6x 0.98
Orientation Marker
Denotes Pin Location
Orientation Marker
Denotes Pin Location
6x
0.22
6
5
4
4x 0.65
Mechanical Outline
-Dimensions are in Millimeters
Pin
1
2
3
4
5
6
6x
0.30
Designation
GND
Unbalanced Port
GND
Balanced Port
NC
Balanced Port
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www.Anaren.com
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 432-8909
(800) 411-6596
+44 2392-232392
+86 512-62749282
Model B0809J50ATI
Rev A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and
ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the
transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying
pick and place equipment tolerances.
6x .41
4x .25
6x .33
.66
.04
3x Transmission
lines
2x Plated thru
holes to
ground
Circuit Pattern
Footprint Pad (s)
Solder Resist
Dimensions are in Millimeters
Mounting Footprint
Visit us at
www.Anaren.com
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 432-8909
(800) 411-6596
+44 2392-232392
+86 512-62749282
Model B0809J50ATI
Rev A
Packaging and Ordering Information
Parts are available in reel and are packaged per EIA 481-2. Parts are oriented in tape and reel as shown below. Minimum order
quantities are 4000 per reel. See Model Numbers below for further ordering information.
2.00
.81
4.00
1.75
3.50
8.00
1.60
4.00
2.41
.25
Visit us at
www.Anaren.com
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 432-8909
(800) 411-6596
+44 2392-232392
+86 512-62749282