1/4 STRUCTURE: PRODUCT: Silicon Semiconductor integrated circuits Stereo Class D Speaker Amplifier TYPE: BD5451EFV PACKAGE: HTSSOP-B28 FEATURES: 1) This IC has one system of digital audio interface. 2 (I S format、SDATA: 16 / 20 / 24bit、LRCLK: 32kHz / 44.1kHz / 48kHz、BCLK: 64fs(fixed)、MCLK: 256fs(fixed)) 2) Low supply current at RESET mode. 3) The decrease in sound quality because of the change of the power supply voltage is prevented with the feedback circuitry of the output. In addition, a low noise and low distortion are achieved. Eliminate large electrolytic-capacitors for high performance of Power Supply Rejection. 4) S/N of the system can be optimized by adjusting the gain setting among 2 steps. (20dB / 26dB) 5) Available for Monaural mode. 6) Within the wide range of the power supply voltage, it is possible to operate in a single power supply. (10～18V) 7) It contributes to miniaturizing, making to the thin type, and the power saving of the system by high efficiency and low heat. 8) Eliminates pop noise generated when the power supply goes on/off, or when the power supply is suddenly shut off. High quality muting performance is realized by using the soft-muting technology. 9) This IC is a highly reliable design to which it has various protection functions. (High temperature protection, Under voltage protection, Output short protection, Output DC voltage protection and Clock stop protection, (MCLK, BCLK, LRCLK) 10) Small package (HTSSOP-B28 package) contributes to reduction of PCB area. ●Absolute maximum ratings (Ta=25℃) Item Supply voltage Symbol VCC Power dissipation Pd Input voltage VIN -0.3 ～ 4.5 V Pin 1～6, 13 Terminal voltage 1 VPIN1 -0.3 ～ 7.0 V Pin 8, 11, 12 ※1 Terminal voltage 2 VPIN2 -0.3 ～ 4.5 V Pin 9 ※1 Terminal voltage 3 VPIN3 22 V Pin 17, 18, 20～23, 25, 26 ※1 Open-drain terminal voltage VERR -0.3 ～ 22 V Pin 10 ※1 Operating temperature range Topr -25 ～ +85 ℃ Storage temperature range Tstg -55 ～ +150 ℃ Tjmax +150 ℃ Maximum junction temperature ※1 ※2 ※3 ※4 Limit 22 3.3 4.7 Unit V Conditions Pin 14, 15, 16, 27, 28 ※3 W ※4 The voltage that can be applied reference to GND (Pin 7, 19, 24). Do not, however exceed Pd and Tjmax=150℃. 70mm×70mm×1.6mm, FR4, 2-layer glass epoxy board (Copper on bottom layer : 70mm×70mm) Derating in done at 26.4mW/℃ for operating above Ta＝25℃. There are thermal via on the board. 70mm×70mm×1.6mm, FR4, 4-layer glass epoxy board (Copper on bottom layer : 70mm×70mm) Derating in done at 37.6mW/℃ for operating above Ta＝25℃. There are thermal via on the board. REV. A ※1 ※2 ※1 2/4 ●Operating conditions (Ta=25℃) Item VCC Minimum load impedance RL ※5 Limit 10 ～ 18 3.6 3.2 Symbol Supply voltage Unit V Ω Ω Conditions Pin 14, 15, 16, 27, 28 VCC≦18V VCC≦16V ※1 ※2 ※5 ※5 Do not, however exceed Pd. No radiation-proof design. ●Electrical characteristics （Unless otherwise specified Ta=25℃, VCC=12V, f=1kHz, RL=8Ω, RSTX=3.3V, MUTEX=3.3V, Gain=20dB, fs=48kHz, Output LC filter ： L=10μH, C=0.1μF） Limit Item Symbol Unit Conditions Min Typ Max Total circuit Pin 14, 15, 16, 27, 28、No load, Circuit current (Reset mode) ICC1 0.1 0.2 mA RSTX=0V, MUTEX=0V Pin 14, 15, 16, 27, 28、No load, Circuit current (Mute mode) ICC2 15 25 mA RSTX=3.3V, MUTEX=0V Pin 14, 15, 16, 27, 28、No load, Circuit current (Sampling mode) ICC3 50 80 mA RSTX=3.3V, MUTEX=3.3V Open-drain terminal VERR 0.8 V Pin 10, IO=0.5mA Low level voltage Regulator output voltage 1 VREG_G 4.7 5.0 5.3 V Pin 11 V 3.0 3.3 3.6 V Pin 9 Regulator output voltage 2 REG_3 VIH 2.0 3.3 V Pin 1～6, 13 High level input voltage 0 0.9 V Pin 1～6, 13 VIL Low level input voltage Input current (Input pull-down terminal) Speaker Output IIH 50 66 95 μA Maximum output power 1 PO1 - 10 - W Maximum output power 2 PO２ - 15 - W GV20 19 20 21 dB GV26 25 26 27 dB THD - 0.07 - % CT 66 80 - dB PSRR - 70 - dB VNO - 100 200 μVrms ｆPWM1 - 256 - kHz ｆPWM2 - 352.8 - kHz ｆPWM3 - 384 - kHz Voltage gain Total harmonic distortion Crosstalk PSRR Output noise voltage (Sampling mode) PWM sampling frequency ※6 Pin 1～6, 13, VIN = 3.3V THD+n=10%, Gain=20dB ※6 Vcc=15V, THD+n=10%, Gain=26dB ※6 Po=1W, Gain=20dB ※6 Po=1W, Gain=26dB ※6 PO=1W, BW=20～20kHz ※6 PO=1W, BW=IHF-A ※6 Vripple=1Vrms, f=1kHz ※6 －∞dBFS, BW=IHF-A ※6 fs=32kHz ※6 fs=44.1kHz ※6 fs=48kHz ※6 These items show the typical performance of device and depend on board layout, parts, and power supply. The standard value is in mounting device and parts on surface of ROHM’s board directly. REV. A 3/4 ●Package outline BD5451EFV Lot No. (UNIT: mm) PKG: HTSSOP-B28 Drawing No: EX199-5002-1 ●Block diagram ●Pin No., Pin name 1 28 VCCP1 I/F 2 27 Driver FET 1P 3 4 I2S I/F 5 Feedback 6 GNDA 8 FILP 9 ×8 Over Sampling Digital Filter 22 21 Feedback 14 VCCA 19 GNDP2 18 Driver FET 2P FILA Gain Selector 20 Feedback GNDA REG_G 13 23 Driver FET 2N 10 12 24 GNDP1 PWM Modulator REG3 11 25 Feedback Driver FET 1N 7 26 Output Short Protection Output DC Voltage Protection 17 16 VCCP2 15 Under Voltage Protection Over Voltage Protection Clock Stop Protection High Temperature Protection REV. A Pin No. 1 2 3 4 5 6 7 8 9 10 11 Pin name RSTX MUTEX SDATA LRCLK BCLK MCLK GNDA FILP REG3 ERROR REG_G 12 FILA 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 GAIN VCCA VCCP2 OUT2P GNDP2 OUT2N OUT1N GNDP1 OUT1P VCCP1 4/4 ●Notes for use 1 ) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2 ) Power supply lines As return of current regenerated by back EMF of output coil happens, take steps such as putting capacitor between power supply and GND as a electric pathway for the regenerated current. Be sure that there is no problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. 3 ) GND potential（Pin 7, 19, 24）. Any state must become the lowest voltage about GND terminal and VSS terminal. 4 ) Input terminal The parasitic elements are formed in the IC because of the voltage relation. The parasitic element operating causes the wrong operation and destruction. Therefore, please be careful so as not to operate the parasitic elements by impressing to input terminals lower voltage than GND and VSS. Please do not apply the voltage to the input terminal when the power-supply voltage is not impressed. 5 ) Setting of heat Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. Class D speaker amplifier is high efficiency and low heat generation by comparison with conventional Analog power amplifier. However, In case it is operated continuously by maximum output power, Power dissipation (Pdiss) may exceed package dissipation. Please consider about heat design that Power dissipation (Pdiss) does not exceed Package dissipation (Pd) in average power (Poav). （Tjmax ：Maximum junction temperature=150℃, Ta ：Peripheral temperature[℃], θja ：Thermal resistance of package[℃/W], Poav：Average power[W], η：Efficiency） Package dissipation : Pd（W）=（Tjmax - Ta）／θja Power dissipation : Pdiss（W）= Poav ×（1／η- 1） 6 ) Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. 7 ) Thermal shutdown circuit This product is provided with a built-in thermal shutdown circuit. When the thermal shutdown circuit operates, the output transistors are placed under open status. The thermal shutdown circuit is primarily intended to shut down the IC avoiding thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax = 150℃. 8 ) Shorts between pins and misinstallation When mounting the IC on a board, pay adequate attention to orientation and placement discrepancies of the IC. If it is misinstalled and the power is turned on, the IC may be damaged. It also may be damaged if it is shorted by a foreign substance coming between pins of the IC or between a pin and a power supply or a pin and a GND. 9 ) Power supply on/off （Pin 14, 15, 16, 27, 28） In case power supply is started up, RSTX（Pin 1）and MUTEX(Pin 2) always should be set Low. And in case power supply is shut down, it should be set Low likewise. Then it is possible to eliminate pop noise when power supply is turned on/off. And also, all power supply terminals should start up and shut down together. 10 ) ERROR terminal（Pin 10） A error flag is outputted when Output short protection and DC voltage protection in the speaker are operated. These flags are the function which the condition of this product is shown in. 11) Precautions for Spealer-setting If the impedance characteristics of the speakers at high-frequency range while increase rapidly, the IC might not have stable-operation in the resonance frequency range of the LC-filter. Therefore, consider adding damping-circuit, etc., depending on the impedance of the speaker. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). 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