Stepping Motor Driver Series Standard 36V Stepping Motor Drivers BD6393FP, BD6395FP No.12009EAT05 ●Description BD6393FP,BD6395FP are the simple type that provides the minimum function for driving stepping motor and various protection circuits. As for its basic function, it is a low power consumption bipolar PWM constant current-drive driver with power upply’s rated voltage of 36V and rated output current of 1.2A, 1.5A. There are excitation modes of FULL STEP & HALF STEP &, QUARTER STEP mode. This series contributes to reduction of mounting area, cost down, safety design. ●Feature 1) Power supply: one system drive (rated voltage of 36V) 2) Rated output current: 0.8A, 1.2A, 1.5A 3) Low ON resistance DMOS output 4) Parallel IN drive mode 5) PWM constant current control (self oscillation) 6) Built-in spike noise cancel function (external noise filter is unnecessary) 7) FULL STEP, HALF STEP, QUARTER STEP 8) Power save function 9) Built-in logic input pull-down resistor 10) Power-on reset function 11) Thermal shutdown circuit (TSD) 12) Over current protection circuit (OCP) 13) Under voltage lock out circuit (UVLO) 14) Over voltage lock out circuit (OVLO) 15) Malfunction prevention at the time of no applied power supply (Ghost Supply Prevention) 16) Electrostatic discharge: 4kV (HBM specification) 17) FIN heat-radiating type HSOP package (BD6393FP/BD6395FP) 18) Pin-compatible line-up (BD6393FP/BD6395FP) ●Application Laser beam printer, Scanner, Photo printer, FAX, Ink jet printer, Mini printer, Sewing machine, Toy, and Robot etc. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 1/8 2012.02 - Rev.A Technical Note BD6393FP, BD6395FP ●Absolute maximum ratings(Ta=25℃) Item Supply voltage Symbol VCC1,2 Power dissipation Pd Input voltage for control pin RNF maximum voltage Maximum output current Operating temperature range Storage temperature range Junction temperature VIN VRNF IOUT Topr Tstg Tjmax BD6393FP BD6395FP Unit V -0.2～+36.0 1 1.45※ ※2 3.47 W -0.2～+5.3 0.5 1.2※3 V V A/phase ℃ ℃ ℃ 1.5※3 -25～+75 -55～+150 150 ※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/℃ for operating above Ta=25℃. ※2 4-layer recommended board. Derating in done at 27.8mW/℃ for operating above Ta=25℃. ※3 Do not, however exceed Pd, ASO and Tjmax=150℃. ●Operating conditions(Ta= -25～+75℃) Item Supply voltage Output current (DC) Symbol VCC1,2 IOUT BD6393FP BD6395FP Unit V A/phase 16～28 0.8※4 1.2※4 ※4 Do not however exceed Pd, ASO. ●Electrical characteristics Applicable to all the series (Unless otherwise specified Ta=25℃, Vcc1,2=24V) Limit Item Symbol Min. Typ. Max. Whole Circuit current at standby ICCST 0.45 2.00 Circuit current ICC 3 10 Control input (PHASE1, I01, I11, PHASE2, I02, I12, PS) H level input voltage VINH 2.0 5.0 L level input voltage VINL 0 0.8 Output (OUT1A, OUT1B, OUT2A, OUT2B) Output ON resistance RON 1.80 2.16 (BD6393FP) Output ON resistance RON 1.00 1.30 (BD6395FP) Output leak current ILEAK 10 Current control RNFX input current IRNFX -40 -20 VREF input current IVREF -2.0 -0.1 VREF input voltage range VREF 0 2 Comparator threshold VCTHLL 0.340 0.400 0.460 100% Comparator threshold 0.227 0.267 0.307 VCTHHL 67% Comparator threshold VCTHLH 0.113 0.133 0.153 33％ Minimum on time tONMIN 0.3 0.7 1.2 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 2/8 Unit mA mA Condition PS=L PS=H, VREF=2V V V Ω Ω IOUT =±0.6A Sum of upper and lower IOUT =±1.0A Sum of upper and lower μA μA μA V RNFX=0V VREF=0V V VREF=2V,I0X=L,I1X=L V VREF=2V,I0X=H,I1X=L V VREF=2V,I0X=L,I1X=H μs R=39kΩ, C=1000pF 2012.02 - Rev.A Technical Note BD6393FP, BD6395FP ●Terminal function･ Block diagram･Application circuit diagram BD6393FP/ BD6395FP Pin Pin name Function No. 1 PGND 2 OUT1B 3 Pin Pin name Function No. Ground terminal 14 NC Non connection H bridge output terminal 15 GND Ground terminal VCC1 Power supply terminal 16 I02 Logic input terminal for DAC 4 RNF1 Connection terminal of resistor for output current detection 17 I12 Logic input terminal for DAC 5 NC Non connection 18 PHASE2 6 OUT1A H bridge output terminal 19 CR2 FIN FIN Fin terminal (used by connecting with GND) FIN FIN 7 CR1 Connection terminal of CR for setting PWM frequency 20 OUT2A 8 PHASE1 Logic input terminal 21 NC 9 I11 Logic input terminal for DAC 22 RNF2 Connection terminal of resistor for output current detection 10 I01 Logic input terminal for DAC 23 VCC2 Power supply terminal H bridge output terminal 11 VREF Output current value setting terminal 24 OUT2B 12 PS Power save terminal 25 NC 13 NC Non connection Set the PWM frequency. Setting range is C:470pF～4700pF R:10kΩ～100kΩ. OUT1A CR1 39kΩ 1000pF I01 ONE SHOT LOGIC Predriver Current Limit Comp. PHASE2 CR2 39kΩ 1000pF I02 ONE SHOT LOGIC VREF 0.1uF Predriver 100uF OUT2B RNF2 Bypass capacitor. Setting range is 100uF～470uF(electrolytic) 0.01uF～0.1uF(multilayer ceramic etc.) 0.2Ω OCP Current Limit Comp. TEST Regulator RESET PGND GND Non connection Be sure to short VCC1 & VCC2. OUT2A DAC Buffer Non connection VCC2 I12 Set the PWM frequency. Setting range is C:470pF～4700pF R:10kΩ～100kΩ. H bridge output terminal 0.2Ω OCP I11 Fin terminal (used by connecting with GND) OUT1B RNF1 DAC Connection terminal of CR for setting PWM frequency Resistor for current. detecting. Setting range is 0.1Ω～0.3Ω. VCC1 PHASE1 Logic input terminal TSD OVLO Resistor for current. detecting. Setting range is 0.1Ω～0.3Ω. PS UVLO Terminal for testing. Please connect to GND. Fig.1 Block diagram & Application circuit diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 3/8 2012.02 - Rev.A Technical Note BD6393FP, BD6395FP ●Points to notice for terminal description ○PS／Power save terminal PS can make circuit standby state and make motor output OPEN. Please be careful because there is a delay of 40μs(max.) before it is returned from standby state to normal state and the motor output becomes ACTIVE. PS State L H Standby state (RESET) ACTIVE ○PHASE1,PHASE2／Logic input terminal These terminals decide output state. PHASEX OUTXA L H L H OUTXB H L ○I01,I02,I11,I12／Logic input terminal for DAC These terminals decide internal DAC output voltage for current limit. Output current I0X I1X level(%) L L H L L H H H (I0X,I1X)=(H,H) : motor output are open. 100 67 33 0 ●Protection Circuits ○Thermal Shutdown (TSD) This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above 175℃ (Typ.), the motor output becomes OPEN. Also, when the temperature returns to under 150℃ (Typ.), it automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added externally, heat overdrive can lead to destruction. ○Over Current Protection (OCP) This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted each other or Vcc-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN condition when the regulated threshold current flows for 4μs (Typ.). It returns with power reactivation or a reset of the PS terminal. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to take into account this circuit’s functions. After OCP operating, if irregular situations continues and the return by power reactivation or a reset of the PS terminal is carried out repeatly, then OCP operates repeatly and the IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, after the over current has flowed and the output terminal voltage jumps up and the absolute maximum values may be exceeded and as a result, there is a possibility of destruction. Also, when current which is over the output current rating and under the OCP detection current flows, the IC can heat up to over Tjmax =150℃ and can deteriorate, so current which exceeds the output rating should not be applied. ○Under Voltage Lock Out (UVLO) This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply under voltage. When the applied voltage to the Vcc terminal goes under 11V (Typ.), the motor output is set to OPEN. This switching voltage has a 1V (Typ.) hysteresis to prevent false operation by noise etc. Please be aware that this circuit does not operate during power save mode. ○Over Voltage Lock Out (OVLO) This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over voltage. When the applied voltage to the VCC terminal goes over 33V (Typ.), the motor output is set to OPEN. This switching voltage has a 1V (Typ.) hysteresis and a 4μs (Typ.) mask time to prevent false operation by noise etc. Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value for power supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Please be aware that this circuit does not operate during power save mode. ○False operation prevention function in no power supply (Ghost Supply Prevention) If a logic control signal is input when there is no power supplied to this IC, there is a function which prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from the logic control input terminal to the Vcc, to this IC or to another IC’s power supply. Therefore, there is no malfunction of the circuit even when voltage is supplied to the logic control input terminal while there is no power supply. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 4/8 2012.02 - Rev.A Technical Note BD6393FP, BD6395FP ●Power dissipation ○HSOP25 Package (BD6393FP/BD6395FP) HSOP25 has a heat-dissipating FIN terminal on the IC side, but it is possible to greatly increase power dissipation by taking a large heat dissipation pattern, such as with copper foil, on the back as well as the surface of the board. Also, this terminal is a GND potential, therefore there is a possibility for malfunction or destruction if it is shorted with any potential other than GND. Measurement machine：TH156（Kuwano Electric） Measurement condition：ROHM board 3 Board size：70*70*1.6mm (With through holes on the board) The exposed metal of the backside is connected to the board with solder. 2 Board①：1-layer board(Copper foil on the back 0mm ) 2 Board②：2-layer board(Copper foil on the back 15*15mm ) 2 Board③：2-layer board(Copper foil on the back 70*70mm ) 2 Board④：4-layer board(Copper foil on the back 70*70mm ) 5.0 Power Dissipation：Pd[W] 4.0 3.0 3.47W 4 2.66W 3 2.0 1.79W 2 1.0 1.45W 1 Board①：θja =86℃/W Board②：θja =70℃/W Board③：θja =47℃/W Board④：θja =36℃/W 0 100 125 Ambient Temperature:Ta[℃] Fig. 2 HSOP25 Derating curve www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 5/8 2012.02 - Rev.A Technical Note BD6393FP, BD6395FP ●Usage Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. (3) Power supply Lines Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. (4) GND Potential The potential of GND pin must be minimum potential in all operating conditions. (5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. Users should be aware that BD6391EFV has been designed to expose their frames at the back of the package, and should be used with suitable heat dissipation treatment in this area to improve dissipation. As large a dissipation pattern should be taken as possible, not only on the front of the baseboard but also on the back surface. BD6393FP and BD6395FP are both equipped with FIN heat dissipation terminals, but dissipation efficiency can be improved by applying heat dissipation treatment in this area. It is important to consider actual usage conditions and to take as large a dissipation pattern as possible. (6) Inter-pin shorts and mounting errors When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be caused by foreign matter entering between outputs or an output and the power supply or GND. (7) Operation in a strong electric field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. (8) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (9) Thermal shutdown circuit The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax =150℃, and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment. TSD on temperature [℃] (Typ.) 175 Hysteresis Temperature [℃] 25 (Typ.) (10) Inspection of the application board During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power supply should first be turned off and then removed before the inspection. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 6/8 2012.02 - Rev.A Technical Note BD6393FP, BD6395FP (11) Input terminal of IC This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate. This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up. For example, when the resistance and transistor are connected to the terminal as shown in figure 3, ○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN), the P-N junction operates as a parasitic diode. ○Also, when GND＞(Terminal B) at the transistor (NPN) The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned parasitic diode. Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction. Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage that is lower than the GND (P substrate) to the input terminal. Resistor Transistor (NPN) Pin A Pin B C Pin A N P+ N P P+ N Pin B B E N Parasitic element P+ N P GND P+ B N E P substrate P substrate Parasitic element C Parasitic element GND GND GND Parasitic element Other adjacent elements Fig.3 Pattern Diagram of Parasitic Element (12) Ground Wiring Patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern potential of any external components, either. (13) TEST Terminal Be sure to connect TEST pin to GND. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 7/8 2012.02 - Rev.A Technical Note BD6393FP/BD6395FP ●Ordering part number B D 6 3 9 1 E F V パッケージ EFV=HSOP25 形名 - E2 包装、フォーミング仕様 E2: リール状エンボステーピング HSOP25 <Tape and Reel information> 13.6 ± 0.2 (MAX 13.95 include BURR) 2.75 ± 0.1 0.3Min. 7.8 ± 0.3 1 13 2000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.25 ± 0.1 1.95 ± 0.1 S 0.11 1.9 ± 0.1 Embossed carrier tape Quantity 14 5.4 ± 0.2 25 Tape 0.1 S 0.8 0.36 ± 0.1 12.0 ± 0.2 1pin Reel (Unit : mm) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 8/8 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2012.02 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. 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If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. R1120A