ROHM BD6393FP_12

Stepping Motor Driver Series
Standard 36V
Stepping Motor Drivers
BD6393FP, BD6395FP
No.12009EAT05
●Description
BD6393FP,BD6395FP are the simple type that provides the minimum function for driving stepping motor and various
protection circuits.
As for its basic function, it is a low power consumption bipolar PWM constant current-drive driver with power upply’s rated
voltage of 36V and rated output current of 1.2A, 1.5A. There are excitation modes of FULL STEP & HALF STEP &,
QUARTER STEP mode. This series contributes to reduction of mounting area, cost down, safety design.
●Feature
1) Power supply: one system drive (rated voltage of 36V)
2) Rated output current: 0.8A, 1.2A, 1.5A
3) Low ON resistance DMOS output
4) Parallel IN drive mode
5) PWM constant current control (self oscillation)
6) Built-in spike noise cancel function (external noise filter is unnecessary)
7) FULL STEP, HALF STEP, QUARTER STEP
8) Power save function
9) Built-in logic input pull-down resistor
10) Power-on reset function
11) Thermal shutdown circuit (TSD)
12) Over current protection circuit (OCP)
13) Under voltage lock out circuit (UVLO)
14) Over voltage lock out circuit (OVLO)
15) Malfunction prevention at the time of no applied power supply (Ghost Supply Prevention)
16) Electrostatic discharge: 4kV (HBM specification)
17) FIN heat-radiating type HSOP package (BD6393FP/BD6395FP)
18) Pin-compatible line-up (BD6393FP/BD6395FP)
●Application
Laser beam printer, Scanner, Photo printer, FAX, Ink jet printer, Mini printer, Sewing machine, Toy, and Robot etc.
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1/8
2012.02 - Rev.A
Technical Note
BD6393FP, BD6395FP
●Absolute maximum ratings(Ta=25℃)
Item
Supply voltage
Symbol
VCC1,2
Power dissipation
Pd
Input voltage for control pin
RNF maximum voltage
Maximum output current
Operating temperature range
Storage temperature range
Junction temperature
VIN
VRNF
IOUT
Topr
Tstg
Tjmax
BD6393FP
BD6395FP
Unit
V
-0.2~+36.0
1
1.45※
※2
3.47
W
-0.2~+5.3
0.5
1.2※3
V
V
A/phase
℃
℃
℃
1.5※3
-25~+75
-55~+150
150
※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/℃ for operating above Ta=25℃.
※2 4-layer recommended board. Derating in done at 27.8mW/℃ for operating above Ta=25℃.
※3 Do not, however exceed Pd, ASO and Tjmax=150℃.
●Operating conditions(Ta= -25~+75℃)
Item
Supply voltage
Output current (DC)
Symbol
VCC1,2
IOUT
BD6393FP
BD6395FP
Unit
V
A/phase
16~28
0.8※4
1.2※4
※4 Do not however exceed Pd, ASO.
●Electrical characteristics
Applicable to all the series (Unless otherwise specified Ta=25℃, Vcc1,2=24V)
Limit
Item
Symbol
Min.
Typ.
Max.
Whole
Circuit current at standby
ICCST
0.45
2.00
Circuit current
ICC
3
10
Control input (PHASE1, I01, I11, PHASE2, I02, I12, PS)
H level input voltage
VINH
2.0
5.0
L level input voltage
VINL
0
0.8
Output (OUT1A, OUT1B, OUT2A, OUT2B)
Output ON resistance
RON
1.80
2.16
(BD6393FP)
Output ON resistance
RON
1.00
1.30
(BD6395FP)
Output leak current
ILEAK
10
Current control
RNFX input current
IRNFX
-40
-20
VREF input current
IVREF
-2.0
-0.1
VREF input voltage range
VREF
0
2
Comparator threshold
VCTHLL
0.340
0.400
0.460
100%
Comparator threshold
0.227
0.267
0.307
VCTHHL
67%
Comparator threshold
VCTHLH
0.113
0.133
0.153
33%
Minimum on time
tONMIN
0.3
0.7
1.2
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2/8
Unit
mA
mA
Condition
PS=L
PS=H, VREF=2V
V
V
Ω
Ω
IOUT =±0.6A
Sum of upper and lower
IOUT =±1.0A
Sum of upper and lower
μA
μA
μA
V
RNFX=0V
VREF=0V
V
VREF=2V,I0X=L,I1X=L
V
VREF=2V,I0X=H,I1X=L
V
VREF=2V,I0X=L,I1X=H
μs
R=39kΩ, C=1000pF
2012.02 - Rev.A
Technical Note
BD6393FP, BD6395FP
●Terminal function・ Block diagram・Application circuit diagram
BD6393FP/ BD6395FP
Pin
Pin name
Function
No.
1
PGND
2
OUT1B
3
Pin
Pin name
Function
No.
Ground terminal
14
NC
Non connection
H bridge output terminal
15
GND
Ground terminal
VCC1
Power supply terminal
16
I02
Logic input terminal for DAC
4
RNF1
Connection terminal of resistor for output
current detection
17
I12
Logic input terminal for DAC
5
NC
Non connection
18
PHASE2
6
OUT1A
H bridge output terminal
19
CR2
FIN
FIN
Fin terminal
(used by connecting with GND)
FIN
FIN
7
CR1
Connection terminal of CR for setting
PWM frequency
20
OUT2A
8
PHASE1
Logic input terminal
21
NC
9
I11
Logic input terminal for DAC
22
RNF2
Connection terminal of resistor for output
current detection
10
I01
Logic input terminal for DAC
23
VCC2
Power supply terminal
H bridge output terminal
11
VREF
Output current value setting terminal
24
OUT2B
12
PS
Power save terminal
25
NC
13
NC
Non connection
Set the PWM frequency.
Setting range is
C:470pF~4700pF
R:10kΩ~100kΩ.
OUT1A
CR1
39kΩ
1000pF
I01
ONE
SHOT
LOGIC
Predriver
Current
Limit
Comp.
PHASE2
CR2
39kΩ
1000pF
I02
ONE
SHOT
LOGIC
VREF
0.1uF
Predriver
100uF
OUT2B
RNF2
Bypass capacitor.
Setting range is
100uF~470uF(electrolytic)
0.01uF~0.1uF(multilayer ceramic etc.)
0.2Ω
OCP
Current
Limit
Comp.
TEST
Regulator
RESET
PGND
GND
Non connection
Be sure to short VCC1 & VCC2.
OUT2A
DAC
Buffer
Non connection
VCC2
I12
Set the PWM frequency.
Setting range is
C:470pF~4700pF
R:10kΩ~100kΩ.
H bridge output terminal
0.2Ω
OCP
I11
Fin terminal
(used by connecting with GND)
OUT1B
RNF1
DAC
Connection terminal of CR for setting
PWM frequency
Resistor for current.
detecting.
Setting range is
0.1Ω~0.3Ω.
VCC1
PHASE1
Logic input terminal
TSD
OVLO
Resistor for current.
detecting.
Setting range is
0.1Ω~0.3Ω.
PS
UVLO
Terminal for testing.
Please connect to
GND.
Fig.1 Block diagram & Application circuit diagram
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3/8
2012.02 - Rev.A
Technical Note
BD6393FP, BD6395FP
●Points to notice for terminal description
○PS/Power save terminal
PS can make circuit standby state and make motor output OPEN. Please be careful because there is a delay of
40μs(max.) before it is returned from standby state to normal state and the motor output becomes ACTIVE.
PS
State
L
H
Standby state (RESET)
ACTIVE
○PHASE1,PHASE2/Logic input terminal
These terminals decide output state.
PHASEX
OUTXA
L
H
L
H
OUTXB
H
L
○I01,I02,I11,I12/Logic input terminal for DAC
These terminals decide internal DAC output voltage for current limit.
Output current
I0X
I1X
level(%)
L
L
H
L
L
H
H
H
(I0X,I1X)=(H,H) : motor output are open.
100
67
33
0
●Protection Circuits
○Thermal Shutdown (TSD)
This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above
175℃ (Typ.), the motor output becomes OPEN. Also, when the temperature returns to under 150℃ (Typ.), it
automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added
externally, heat overdrive can lead to destruction.
○Over Current Protection (OCP)
This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are
shorted each other or Vcc-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN
condition when the regulated threshold current flows for 4μs (Typ.). It returns with power reactivation or a reset of the
PS terminal. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations
such as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should
not be designed to take into account this circuit’s functions. After OCP operating, if irregular situations continues and
the return by power reactivation or a reset of the PS terminal is carried out repeatly, then OCP operates repeatly and
the IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long,
after the over current has flowed and the output terminal voltage jumps up and the absolute maximum values may be
exceeded and as a result, there is a possibility of destruction. Also, when current which is over the output current rating
and under the OCP detection current flows, the IC can heat up to over Tjmax =150℃ and can deteriorate, so current
which exceeds the output rating should not be applied.
○Under Voltage Lock Out (UVLO)
This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply
under voltage. When the applied voltage to the Vcc terminal goes under 11V (Typ.), the motor output is set to OPEN.
This switching voltage has a 1V (Typ.) hysteresis to prevent false operation by noise etc. Please be aware that this
circuit does not operate during power save mode.
○Over Voltage Lock Out (OVLO)
This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over
voltage. When the applied voltage to the VCC terminal goes over 33V (Typ.), the motor output is set to OPEN. This
switching voltage has a 1V (Typ.) hysteresis and a 4μs (Typ.) mask time to prevent false operation by noise etc.
Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum
value for power supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Please be
aware that this circuit does not operate during power save mode.
○False operation prevention function in no power supply (Ghost Supply Prevention)
If a logic control signal is input when there is no power supplied to this IC, there is a function which prevents the false
operation by voltage supplied via the electrostatic destruction prevention diode from the logic control input terminal to
the Vcc, to this IC or to another IC’s power supply. Therefore, there is no malfunction of the circuit even when voltage is
supplied to the logic control input terminal while there is no power supply.
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4/8
2012.02 - Rev.A
Technical Note
BD6393FP, BD6395FP
●Power dissipation
○HSOP25 Package (BD6393FP/BD6395FP)
HSOP25 has a heat-dissipating FIN terminal on the IC side, but it is possible to greatly increase power dissipation by
taking a large heat dissipation pattern, such as with copper foil, on the back as well as the surface of the board. Also,
this terminal is a GND potential, therefore there is a possibility for malfunction or destruction if it is shorted with any
potential other than GND.
Measurement machine:TH156(Kuwano Electric)
Measurement condition:ROHM board
3
Board size:70*70*1.6mm
(With through holes on the board)
The exposed metal of the backside is connected to the board with
solder.
2
Board①:1-layer board(Copper foil on the back 0mm )
2
Board②:2-layer board(Copper foil on the back 15*15mm )
2
Board③:2-layer board(Copper foil on the back 70*70mm )
2
Board④:4-layer board(Copper foil on the back 70*70mm )
5.0
Power Dissipation:Pd[W]
4.0
3.0
3.47W
4
2.66W
3
2.0
1.79W
2
1.0
1.45W
1
Board①:θja =86℃/W
Board②:θja =70℃/W
Board③:θja =47℃/W
Board④:θja =36℃/W
0
100
125
Ambient Temperature:Ta[℃]
Fig. 2 HSOP25 Derating curve
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5/8
2012.02 - Rev.A
Technical Note
BD6393FP, BD6395FP
●Usage Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If
any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
(3) Power supply Lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals
to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, not that capacitance characteristic values are reduced at low temperatures.
(4) GND Potential
The potential of GND pin must be minimum potential in all operating conditions.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Users should be aware that BD6391EFV has been designed to expose their frames at the back of the package, and
should be used with suitable heat dissipation treatment in this area to improve dissipation. As large a dissipation pattern
should be taken as possible, not only on the front of the baseboard but also on the back surface. BD6393FP and
BD6395FP are both equipped with FIN heat dissipation terminals, but dissipation efficiency can be improved by applying
heat dissipation treatment in this area. It is important to consider actual usage conditions and to take as large a
dissipation pattern as possible.
(6) Inter-pin shorts and mounting errors
When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper
attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be
caused by foreign matter entering between outputs or an output and the power supply or GND.
(7) Operation in a strong electric field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(9) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax =150℃, and higher,
coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal
operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect
peripheral equipment.
TSD on temperature [℃] (Typ.)
175
Hysteresis Temperature [℃]
25
(Typ.)
(10) Inspection of the application board
During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility
that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a
measure again electrostatic discharge, it should be earthed during the assembly process and special care should be
taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power
supply should first be turned off and then removed before the inspection.
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6/8
2012.02 - Rev.A
Technical Note
BD6393FP, BD6395FP
(11) Input terminal of IC
This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate.
This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up.
For example, when the resistance and transistor are connected to the terminal as shown in figure 3,
○When GND>(Terminal A) at the resistance and GND>(Terminal B) at the transistor (NPN),
the P-N junction operates as a parasitic diode.
○Also, when GND>(Terminal B) at the transistor (NPN)
The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned
parasitic diode.
Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The
operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction.
Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage
that is lower than the GND (P substrate) to the input terminal.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
N
P+
N
P
P+
N
Pin B
B
E
N
Parasitic
element
P+
N
P
GND
P+
B
N
E
P substrate
P substrate
Parasitic element
C
Parasitic element
GND
GND
GND
Parasitic
element
Other adjacent elements
Fig.3 Pattern Diagram of Parasitic Element
(12) Ground Wiring Patterns
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern potential of any external components, either.
(13) TEST Terminal
Be sure to connect TEST pin to GND.
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2012.02 - Rev.A
Technical Note
BD6393FP/BD6395FP
●Ordering part number
B
D
6
3
9
1
E
F
V
パッケージ
EFV=HSOP25
形名
-
E2
包装、フォーミング仕様
E2: リール状エンボステーピング
HSOP25
<Tape and Reel information>
13.6 ± 0.2
(MAX 13.95 include BURR)
2.75 ± 0.1
0.3Min.
7.8 ± 0.3
1
13
2000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.25 ± 0.1
1.95 ± 0.1
S
0.11
1.9 ± 0.1
Embossed carrier tape
Quantity
14
5.4 ± 0.2
25
Tape
0.1 S
0.8
0.36 ± 0.1
12.0 ± 0.2
1pin
Reel
(Unit : mm)
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Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2012.02 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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R1120A